MCIMX31CVMN4C - i.MX31 ARM1136 400MHz MPU, MAPBGA-473 | NXP
Teilenummer: MCIMX31CVMN4C ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $28.75 | $287,50 |
| 100 | $24.1 | $2.410,00 |
| 500 | $19.95 | $9.975,00 |
| 1.000 | $17.4 | $17.400,00 |
MCIMX31CVMN4C Übersicht
An MPU (Microprocessor Unit) in this class combines a high-performance CPU core with on-chip peripherals such as memory controllers, display and image-sensing interfaces, and connectivity IPs to form a system-on-chip. The i.MX31 sits in NXP's i.MX applications-processor family and is widely deployed as the host processor in human-machine interface (HMI), telematics, and portable multimedia products. Its ARM1136JF-S core implements the ARMv6 instruction set with Jazelle Java acceleration and is supported by the standard ARM toolchain, which lowers firmware-development risk for new designs.
Key features include 400 MHz core clock, ARM1136JF-S CPU with Jazelle technology, integrated peripherals for LCD, image-sensing, and connectivity, plus a wide industrial temperature grade suitable for harsh-environment products. The MCIMX31C variant includes the on-chip graphics processing engine that the lower-cost MCIMX31LC lacks, which is important for video and 2D graphics acceleration.
The device uses a stacked architecture with DDR/DDR2 memory controller, NAND flash controller, and multiple serial interfaces, enabling a complete system with a minimum of external components. Because of the package's ITB-imposed trade restrictions, the BGA-packaged i.MX31 family is subject to US International Trade Commission order limitations that affect certain export destinations.
Typical applications include industrial HMI panels, automotive infotainment and telematics, portable medical devices, point-of-sale terminals, and consumer multimedia products. Engineers should evaluate the i.MX31 family carefully against newer i.MX28/i.MX6 series for new designs, as this part is now in end-of-life status. The wide operating temperature range also makes it suitable for outdoor signage and industrial-control panels.
Drop-in-Alternativen für MCIMX31CVMN4C – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MCIMX31CVMN4C (gleiche Bauform und Footprint) – abweichend in Mounting Type, Core Architecture, Data Bus Width, RoHS Status, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCIMX31LCVMN4C
✅ Drop-In✓ Auf Lager
$10.5 / Stück
Datenblatt ansehen →MCIMX31CJMN4C
✅ Drop-In✓ Auf Lager
$27.85 / Stück
Datenblatt ansehen →MCIMX31CVMN4D
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCIMX31LCVMN4D
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCIMX31CVMN4C
✅ Drop-In✓ Auf Lager
$17.4 / Stück
Datenblatt ansehen →MCIMX31CVMN4C Grenzwerte & elektrische Eigenschaften
| Core Architecture | ARM1136JF-S (ARMv6, 32-bit) |
| Maximum Core Clock | 400 MHz |
| Core Count | 1 |
| Bit Width | 32-bit |
| Gehäuse | 473-LFBGA / MAPBGA-473, 19 x 19 mm |
| Product Family | i.MX31 (Multimedia Applications Processor) |
| Variant | MCIMX31C (with on-chip graphics engine) |
| Jazelle Technology | Yes (Java bytecode acceleration) |
| Memory Controller | DDR / DDR2 SDRAM, NAND flash |
| Display Interface | Integrated LCD controller |
| Image Sensor Interface | CSI (Camera Sensor Interface) |
| Connectivity | Multiple serial interfaces (UART, SPI, I2C, USB) |
| Betriebstemperatur | -40C to +85C (industrial) |
| Montageart | Surface Mount (BGA) |
| ITAR / Trade Restriction | Subject to US ITC order (BGA-packaged i.MX31 family) |
MCIMX31CVMN4C 473-lfbga / mapbga-473, 19 x 19 mm Pinbelegungsleitfaden
Pinbelegung für MCIMX31CVMN4C (473-lfbga / mapbga-473, 19 x 19 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MCIMX31CVMN4C.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MCIMX31CVMN4C ist geeignet für 7 Anwendungs: Industrial Human-Machine Interface (HMI) Panels, Automotive Infotainment and Telematics, Portable Medical Devices, Point-of-Sale (POS) Terminals, Consumer Multimedia Devices, Outdoor Digital Signage, General Embedded Control Systems.
Industrial Human-Machine Interface (HMI) Panels
The MCIMX31CVMN4C's 400 MHz ARM1136JF-S core, integrated LCD controller, and image-sensing interface make it a strong host processor for industrial HMI panels with touch input. Designers can pair it with the integrated LCD controller to drive WVGA TFT displays directly and use the CSI interface to attach an external camera for vision-assisted operator stations. The industrial -40C to +85C temperature range suits factory-floor and outdoor cabinet installations, and the on-chip DDR/DDR2 controller reduces external component count, enabling compact panel designs.
Empfohlen
Automotive Infotainment and Telematics
The MCIMX31CVMN4C's on-chip graphics engine, LCD controller, and multimedia-capable ARM1136JF-S core suit in-vehicle infotainment (IVI) and telematics head units. The device's automotive-grade temperature rating and AEC-Q100-style screening (where applicable to the part suffix) make it suitable for cabin and dashboard environments with wide temperature swings. Pairing the device with NXP's automotive PHY transceivers enables CAN/LIN connectivity, while the integrated display pipeline drives the central stack display.
Empfohlen
Portable Medical Devices
The MCIMX31CVMN4C's low-power ARM1136JF-S core and integrated peripherals suit portable patient-monitoring devices such as pulse oximeters, blood-pressure monitors, and portable ultrasound carts. The device's integrated LCD controller drives bedside or handheld displays, while the CSI interface accepts image-sensor data from camera-based diagnostic probes. The on-chip DDR controller reduces external component count, which is critical for battery-powered designs where PCB area and BOM cost matter.
Empfohlen
Point-of-Sale (POS) Terminals
The MCIMX31CVMN4C's graphics acceleration, LCD controller, and integrated connectivity suit retail POS terminals that require touch-screen UI, barcode-scanner interfaces, and receipt-printer support. The 400 MHz ARM1136JF-S core runs Windows CE / Linux / QNX-based POS application software, while the integrated DDR/DDR2 controller supports the in-memory database and transaction-logging workloads typical of retail checkout systems. The industrial temperature rating supports deployments in non-climate-controlled retail environments.
Empfohlen
Consumer Multimedia Devices
The MCIMX31CVMN4C's ARM1136JF-S core with Jazelle Java acceleration, integrated graphics engine, and LCD controller suit portable media players, digital photo frames, and set-top box auxiliary processors. The integrated display pipeline handles video decode and 2D graphics overlay, while the CSI interface supports image capture for digital cameras and camcorders. The device's multimedia feature set was a key selling point at launch and remains suitable for cost-sensitive consumer designs.
Empfohlen
Outdoor Digital Signage
The MCIMX31CVMN4C's industrial -40C to +85C temperature rating and integrated LCD controller suit outdoor digital-signage displays deployed in transit stations, retail windows, and roadside information boards. The ARM1136JF-S core drives content playback for static images and video loops, while the integrated NAND flash controller and DDR/DDR2 memory interface support content buffering. Pairing with a wide-brightness-range TFT panel and optical-bonding stack creates a sunlight-readable signage module.
Empfohlen
General Embedded Control Systems
The MCIMX31CVMN4C's integrated peripheral set (UART, SPI, I2C, USB) and on-chip memory controllers suit general-purpose embedded systems such as building-automation gateways, industrial-control panels, and energy-metering concentrators. The 400 MHz ARM1136JF-S core runs embedded Linux or RTOS firmware, while the integrated connectivity peripherals reduce the need for external bridge chips. The wide operating temperature range supports deployment in uncontrolled industrial environments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCIMX31CVMN4C – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCIMX31LCVMN4C | MCIMX31CJMN4C | MCIMX31CVMN4D | MCIMX31LCVMN4D |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 473-LFBGA / MAPBGA-473 | 473-LFBGA / MAPBGA-473 - same | 473-LFBGA / MAPBGA-473 - same | 473-LFBGA / MAPBGA-473 - same | 473-LFBGA / MAPBGA-473 - same |
| Core Architecture | ARM1136JF-S 400 MHz | ARM1136JF-S 400 MHz | ARM1136JF-S 400 MHz | ARM1136JF-S 400 MHz | ARM1136JF-S 400 MHz |
| Graphics Engine | Yes (included) | No (excluded) | Yes (included) | Yes (included) | No (excluded) |
| Silicon Revision | C | C | C | D | D |
| Bit Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Wichtigste Unterscheidungsmerkmale
- Includes on-chip graphics engine (vs. MCIMX31LCVMN4C)
- Drop-in alternative in same package (vs. MCIMX31CVMN4D)
- Industrial temperature grade in MAPBGA (vs. MCIMX31CJMN4C)
Designhinweise
The MCIMX31CVMN4C in the 473-ball MAPBGA package has a theta-JA of approximately 15-20 C/W depending on PCB layout. At 400 MHz core clock with graphics engine active, typical power dissipation reaches 1-1.5 W, requiring thermal vias under the BGA and adequate copper pour on inner PCB layers. Use a minimum 4-layer PCB with continuous GND planes under the device to spread heat, and consider thermal simulation at 85C ambient for automotive-grade deployments.
The 473-ball MAPBGA package requires fanout routing on multiple PCB layers with microvia or stacked-via technology for the inner rows. Per NXP design guidelines, route signals on the top layer under the BGA using escape vias, with the DDR/DDR2 memory placed as close to the device as possible (under 2 inches trace length) to maintain signal integrity. Use matched-impedance routing for DDR signals and reference planes on adjacent layers for all high-speed buses.
BGA-packaged i.MX31 devices are subject to a US International Trade Commission order that restricts certain export destinations - verify destination-country eligibility before shipping. Also note that the MCIMX31C variant requires firmware that initializes the on-chip graphics engine, while the MCIMX31LC variant skips that initialization - do not swap C and LC variants without confirming firmware compatibility. Power-rail sequencing must follow the datasheet order to avoid latch-up during power-up.
Compliance-Informationen
Compliance certifications not explicitly stated in the verified web data. BGA-packaged i.MX31 devices are subject to US International Trade Commission order restricting certain export destinations. Mark RoHS / REACH / AEC-Q100 as [DATA_NEEDED] pending official NXP declaration retrieval.
