MCIMX357CVM5B - i.MX35 ARM11 MPU 532MHz | NXP 400-LFBGA
Teilenummer: MCIMX357CVM5B ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.95 | $2.895,00 |
| 500 | $24.8 | $12.400,00 |
| 1.000 | $21.5 | $21.500,00 |
MCIMX357CVM5B Übersicht
An applications processor (AP) is a system-on-chip (SoC) designed to run a full operating system and complex user applications, in contrast to a microcontroller which typically runs bare-metal or RTOS code. The i.MX35 family belongs to the ARM11 generation of processors, sitting hierarchically between Cortex-A5/A7 entry-level APs and Cortex-A9/A53 mid-range APs. It combines a CPU core, memory controller, graphics accelerator, and I/O peripherals on a single die, simplifying board design while supporting Linux, Windows Embedded, and other high-level operating systems.
Key features include the ARM1136JF-S core with Jazelle and floating-point support, a maximum CPU clock of 532 MHz, dedicated OpenVG 1.1 hardware acceleration for 2D vector graphics, an integrated Image Processing Unit (IPU) for camera and display pipelines, dual USB 2.0 OTG/Host ports, 10/100 Ethernet MAC, and a mobile DDR/DDR2 memory controller. The part is rated for industrial temperature operation, and the integrated IPU simplifies LCD panel and CMOS sensor interfacing.
The i.MX357 uses a hierarchical AHB/AXI bus matrix to interconnect the CPU, L2 cache, graphics engine, and peripherals, enabling concurrent display refresh, camera capture, and user-interface processing. The hardware OpenVG 1.1 accelerator offloads vector-graphics operations from the ARM core, sustaining fluid UI rendering even at relatively modest CPU clock rates and freeing the ARM core for application logic and connectivity stacks.
Typical applications include human-machine interface (HMI) panels, industrial control terminals, portable medical devices, point-of-sale terminals, and graphical IoT gateways. The combination of OpenVG acceleration, an image processing unit, and Linux support makes the i.MX357 well suited to products that require polished vector UIs alongside camera or display functionality.
When designing with this part, allocate the boot configuration straps, supply rails, and DDR memory layout per the reference manual, and use the NXP BSP (LTIB or Yocto) to bring up Linux quickly. Engineers should also verify the PCB supports the 0.8 mm BGA pitch required by the 400-LFBGA package and provide adequate thermal relief given the LFBGA thermal resistance.
This page synthesizes distributor pricing, drop-in i.MX35 family alternatives, and practical design considerations not consolidated in the manufacturer datasheet, with all data last verified as of 2026-10-17.
Drop-in-Alternativen für MCIMX357CVM5B – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MCIMX357CVM5B (gleiche Bauform und Footprint) – abweichend in Core Architecture, Package, USB, Graphics Accelerator, Ethernet.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCIMX357CVM5B-R
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCIMX357CJP5B
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MCIMX353CVM5B
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MCIMX357CJP5BR
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MCIMX357CVM5BR2
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MCIMX357CVM5B Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors |
| Family | i.MX35 Applications Processors |
| Core | ARM1136JF-S |
| Core Architecture | ARM11 |
| Datenbusbreite | 32-bit |
| Maximum CPU Clock | 532 MHz |
| Graphics Accelerator | OpenVG 1.1 hardware accelerator |
| Image Processing Unit | Yes (IPU) |
| Betriebstemperatur | -40C to +85C (industrial) |
| Gehäuse | 400-LFBGA (MAPBGA-400) |
| Package Size | 17 x 17 mm |
| Ball Pitch | 0.8 mm |
| USB | 2 x USB 2.0 (OTG + Host) |
| Ethernet | 10/100 MAC |
| Memory Interface | Mobile DDR / DDR2 controller |
| RoHS-Status | Compliant |
| Lebenszyklusstatus | End of Life (Last Time Buy) - per NXP product page |
MCIMX357CVM5B 17 x 17 mm Pinbelegungsleitfaden
Pinbelegung für MCIMX357CVM5B (17 x 17 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MCIMX357CVM5B.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MCIMX357CVM5B ist geeignet für 6 Anwendungs: Industrial HMI Panels, Point-of-Sale Terminals, Portable Medical Devices, Building Automation Controllers, Graphical IoT Gateways, Multimedia Kiosks.
Industrial HMI Panels
The MCIMX357CVM5B's ARM1136JF-S core at 532 MHz combined with the OpenVG 1.1 hardware accelerator is well matched to industrial human-machine interface (HMI) panels that run Linux or Windows Embedded. The integrated Image Processing Unit drives TFT LCDs directly and accepts CMOS sensor input for cameras embedded in operator terminals. The -40C to +85C industrial temperature rating allows deployment in factory-floor enclosures without additional thermal conditioning, and the dual USB 2.0 ports simplify touch-screen controller and external storage integration.
Empfohlen
Point-of-Sale Terminals
Retail point-of-sale (POS) terminals benefit from the MCIMX357CVM5B's combination of OpenVG acceleration for crisp menu and barcode rendering, the 10/100 Ethernet MAC for LAN connectivity, and the dual USB 2.0 ports for barcode scanners, receipt printers, and customer displays. The 400-LFBGA package fits compact terminal mainboards, and NXP's Linux BSP provides reference stacks for payment and inventory applications. Compared with discrete microcontroller-based designs, the integrated MPU shrinks BOM and accelerates time-to-market.
Empfohlen
Portable Medical Devices
Portable diagnostic and patient-monitoring devices use the MCIMX357CVM5B for its low-power ARM11 core, integrated IPU for camera-driven imaging, and Mobile DDR controller for low-RAM-cost designs. OpenVG 1.1 acceleration enables smooth rendering of anatomical graphics on color displays, while the image processing pipeline supports CMOS image sensors used in endoscopes or skin-imaging accessories. The industrial temperature rating suits clinical and ambulatory environments, and NXP's long-life BSP maintains regulatory-grade software traceability.
Empfohlen
Building Automation Controllers
Building automation controllers and graphical thermostats leverage the MCIMX357CVM5B's OpenVG accelerator to render animated floor plans and HVAC schematics, while the Ethernet MAC and USB ports connect to BACnet, Modbus, and Z-Wave/Zigbee gateway subsystems. The industrial temperature envelope supports unconditioned mechanical rooms, and the integrated LCD controller drives 4- to 7-inch TFT panels typically used in modern control interfaces. Linux BSPs from NXP accelerate integration with open-source automation frameworks.
Empfohlen
Graphical IoT Gateways
Industrial IoT gateways with local touchscreens use the MCIMX357CVM5B to consolidate protocol translation, edge analytics, and operator visualization on a single SoC. The ARM1136JF-S core runs containerized workloads (e.g., Docker on Linux), while OpenVG acceleration powers local dashboards. Dual USB 2.0 ports support Wi-Fi/Bluetooth dongles and external storage, and the 10/100 Ethernet MAC connects to plant networks. The 400-LFBGA footprint is compatible with prior i.MX35 designs, simplifying board revisions.
Empfohlen
Multimedia Kiosks
Interactive kiosks for retail, transit, and self-service use the MCIMX357CVM5B's OpenVG 1.1 hardware accelerator for fluid 2D vector menu rendering and the integrated IPU for camera-based user sensing. The 400-LFBGA package supports fanless thermal designs at moderate clock rates, and the rich peripheral set (USB, Ethernet, LCD controller) keeps the bill of materials compact. Linux and Windows Embedded CE BSPs from NXP provide reference kiosk application stacks.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCIMX357CVM5B – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCIMX357CVM5B-R | MCIMX357CJP5B | MCIMX353CVM5B | MCIMX357CJP5BR | MCIMX357CVM5BR2 |
|---|---|---|---|---|---|---|
| Package | 400-LFBGA (17x17 mm) | 400-LFBGA (17x17 mm) - same | 400-LFBGA (17x17 mm) - same | 400-LFBGA (17x17 mm) - same | 400-LFBGA (17x17 mm) - same | 400-LFBGA (17x17 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S |
| Maximum CPU Clock | 532 MHz | 532 MHz | 532 MHz | 532 MHz | 532 MHz | 532 MHz |
| OpenVG 1.1 Accelerator | Yes | Yes | Yes | No | Yes | Yes |
| Image Processing Unit | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +70C (commercial) | -40C to +85C (industrial) | 0C to +70C (commercial) | -40C to +85C (industrial) |
| Lifecycle Status | Last Time Buy (EOL) | Last Time Buy (EOL) | Last Time Buy (EOL) | Last Time Buy (EOL) | Last Time Buy (EOL) | Last Time Buy (EOL) |
Wichtigste Unterscheidungsmerkmale
- Integrated OpenVG 1.1 hardware graphics accelerator (vs. MCIMX353CVM5B)
- Last-time-buy status indicates broader design risk (vs. i.MX6 series successors)
- Pin-compatible variants within the same family (vs. MCIMX357CVM5B-R)
Designhinweise
The 400-LFBGA package uses a 0.8 mm ball pitch on a 17 x 17 mm body. PCB designers must use laser-drilled or chemically-etched microvias in the land pattern, and provide at least 4 (preferably 6) routing layers for fan-out. Power and ground planes should be continuous under the package to deliver the high transient currents demanded by the i.MX35 core, and a thermal pad array tied to the inner ground plane improves heat spreading for fanless designs.
Estimated: at 532 MHz CPU clock and 1.0 V core supply, the i.MX35 core can draw on the order of 500 mA to 800 mA. Total system current including DDR1, I/O, and IPU clocks can exceed 1.5 A. Use a multi-rail PMIC with sequencing (e.g., NXP PF3000 or equivalent) and place 22 uF + 0.1 uF decoupling within 5 mm of each supply pin pair to suppress switching transients.
Route the Mobile DDR / DDR2 interface as a matched-length, impedance-controlled bus (typically 50 ohm single-ended) with length matching within 25 mils (0.635 mm) on the byte lanes. Keep reference voltages (VREF) and DDR clock traces short, and isolate the analog PLL supply (VDDA_PLL) with an LC pi-filter to minimize jitter that would otherwise degrade the USB and display interfaces.
Do not substitute the i.MX353 for the i.MX357 in designs that depend on OpenVG 1.1 hardware acceleration - the i.MX353 omits the OpenVG block. Also, the last-time-buy lifecycle status means new designs should plan for NXP's recommended migration path (typically i.MX6x28) rather than relying on long-term availability of the i.MX35 family.
Compliance-Informationen
RoHS and lead-free status confirmed from NXP product page. AEC-Q100 is not applicable to applications processors in this category. Halogen-free status not stated in provided data.
