MCIMX6U4AVM08AC - i.MX 6 DualLite 800MHz ARM Cortex-A9 MPU | NXP
Teilenummer: MCIMX6U4AVM08AC ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $28.75 | $287,50 |
| 100 | $25.1 | $2.510,00 |
| 500 | $22.4 | $11.200,00 |
| 1.000 | $19.85 | $19.850,00 |
MCIMX6U4AVM08AC Übersicht
What is an i.MX applications processor? The i.MX family is a series of multimedia applications processors built on ARM cores that combine CPU, GPU, multimedia acceleration, memory interfaces, and connectivity peripherals into a single system-on-chip. Within this taxonomy, the i.MX 6 sits between the lower-power i.MX 5x series and the higher-performance i.MX 7/8 families, scaling across single, dual, and quad core configurations for consumer, industrial, and automotive markets.
Key specifications for this variant include a dual-core ARM Cortex-A9 CPU at 800 MHz, an integrated 2D/3D GPU for graphics acceleration, support for LPDDR2/DDR3 memory, and a rich peripheral set including USB, Ethernet, MMC/SD, and display interfaces. The device operates across industrial temperature ranges, making it suitable for factory automation, HMI panels, and ruggedized embedded systems.
The i.MX 6 architecture leverages heterogeneous multi-core processing with the Cortex-A9 providing application-level processing while dedicated hardware blocks accelerate multimedia codecs and display pipelines. This integration reduces total BOM count and enables compact board designs in space-constrained industrial products.
Typical applications include industrial human-machine interfaces (HMIs), machine vision, point-of-sale terminals, automotive infotainment (consumer tier), and IoT gateways. The 800 MHz clock speed and dual-core architecture provide sufficient throughput for Linux-based user interfaces and mid-tier multimedia processing.
Designers should note that this part is NRND per NXP's product status page. New designs should evaluate the i.MX 7 or i.MX 8 series for active product longevity; existing designs can rely on long-term supply agreements or consider certified second-source distributors.
Drop-in-Alternativen für MCIMX6U4AVM08AC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MCIMX6U4AVM08AC (gleiche Bauform und Footprint) – abweichend in GPU, Memory Interface, Mounting Type, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCIMX6U7CVM08AC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCIMX6U4AVM08ACR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCIMX6U5AVM08AC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCIMX6U8AVM08AC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCIMX6DP4AVT08AC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCIMX6U4AVM08AC Grenzwerte & elektrische Eigenschaften
| Series | i.MX 6 |
| Core Processor | ARM Cortex-A9 |
| Number of Cores | 2 |
| Core Speed | 800 MHz |
| Datenbusbreite | 32-bit |
| Gehäuse | 624-MAPBGA (21x21 mm) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +125C (industrial) |
| GPU | Integrated 2D/3D graphics accelerator |
| Memory Interface | LPDDR2 / DDR3 / DDR3L |
| Connectivity | USB, Ethernet, MMC/SD, UART, SPI, I2C |
| Display Interfaces | Parallel RGB, LVDS, MIPI-DSI |
| RoHS-Status | Compliant |
| Lebenszyklusstatus | NRND (Not Recommended for New Designs) |
| Application Class | Industrial / Consumer |
MCIMX6U4AVM08AC 624-mapbga (21x21 mm) Pinbelegungsleitfaden
Pinbelegung für MCIMX6U4AVM08AC (624-mapbga (21x21 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MCIMX6U4AVM08AC.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MCIMX6U4AVM08AC ist geeignet für 7 Anwendungs: Industrial Human-Machine Interface (HMI), Machine Vision and Image Processing, Point-of-Sale (POS) Terminals, IoT Edge Gateways, Consumer Infotainment Systems, Automotive Telematics and Connectivity, Digital Signage Players.
Industrial Human-Machine Interface (HMI)
The MCIMX6U4AVM08AC fits industrial HMI applications because its 800 MHz dual-core Cortex-A9 processor delivers the throughput needed for Linux-based Qt and web interface rendering without saturating thermal limits. Integrated 2D/3D GPU and parallel RGB/LVDS/MIPI-DSI display interfaces allow direct connection to 7-15 inch industrial touchscreens. Industrial temperature range (-40C to +125C) and long-term BSP availability have made it a long-standing reference platform for factory-floor operator panels and SCADA terminals.
Empfohlen
Machine Vision and Image Processing
For machine vision systems, the MCIMX6U4AVM08AC provides sufficient CPU performance for camera pipeline preprocessing, defect detection algorithms, and barcode/QR code reading at moderate frame rates. The integrated parallel camera interface (CSI) accepts sensor data directly, while the dual-core Cortex-A9 enables concurrent tasks like image capture plus protocol conversion. Industrial-grade temperature tolerance supports deployment on factory production lines where vibration and ambient temperature variation are common.
Empfohlen
Point-of-Sale (POS) Terminals
Retail POS terminals leverage the MCIMX6U4AVM08AC's balance of processing power and power efficiency for cryptographic transactions, display rendering, and multi-peripheral connectivity. The integrated USB host, Ethernet MAC, and SD card interfaces eliminate external hub ICs, reducing BOM cost and PCB area. The Cortex-A9 core supports Linux-based POS middleware (Yocto, Buildroot) that has been validated across retail deployment cycles for transaction integrity and security compliance.
Empfohlen
IoT Edge Gateways
Industrial IoT gateways benefit from the MCIMX6U4AVM08AC's industrial temperature range, dual-core processing, and rich connectivity (Ethernet, USB, CAN). The processor runs containerized workloads for protocol translation (Modbus, MQTT, OPC-UA) while the dedicated peripherals handle real-time field-bus communication. Long-term BSP support ensures gateway firmware security patches are maintained for 10+ year industrial deployment cycles.
Empfohlen
Consumer Infotainment Systems
Although this part targets consumer infotainment per its datasheet classification, the MCIMX6U4AVM08AC's integrated display controllers and audio interfaces support in-seat entertainment and audio head units where higher reliability is needed than typical consumer tablets. Hardware-accelerated video decoding (multi-format) and dual-core Cortex-A9 reduce BOM cost versus separate DSP + host designs. Reference designs from NXP include touch overlay I2C controllers and HDMI transmitter ICs.
Empfohlen
Automotive Telematics and Connectivity
Telematics control units (TCUs) deploy the MCIMX6U4AVM08AC for GPS aggregation, wireless gateway bridging, and CAN bus integration in fleet and connected-vehicle applications. The 800 MHz dual core runs the telematics application stack while dedicated peripherals manage cellular modem connectivity. While this part is the consumer tier, automotive-qualified variants (MCIMX6U7CVM08AC) share the same silicon and package, enabling risk-managed migration paths.
Empfohlen
Digital Signage Players
Digital signage media players use the MCIMX6U4AVM08AC to drive HDMI/DisplayPort signage displays at 1080p resolution across retail and transportation hubs. The GPU handles composited multi-zone video while the Cortex-A9 cores run signage CMS clients and scheduled content updates over Ethernet. Industrial temperature grade enables deployment in outdoor enclosures and transit hub cabinets. Reference designs illustrate SD card and eMMC booting for unattended operation.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCIMX6U4AVM08AC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCIMX6U7CVM08AC | MCIMX6U4AVM08ACR | MCIMX6U5AVM08AC | MCIMX6U8AVM08AC | MCIMX6DP4AVT08AC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 624-MAPBGA (21x21 mm) | 624-MAPBGA (21x21) - same | 624-MAPBGA (21x21) - same | 624-MAPBGA (21x21) - same | 624-MAPBGA (21x21) - same | 624-MAPBGA (21x21) - same |
| Core Processor | ARM Cortex-A9 dual-core | ARM Cortex-A9 dual-core | ARM Cortex-A9 dual-core | ARM Cortex-A9 dual-core | ARM Cortex-A9 dual-core | ARM Cortex-A9 dual-core |
| Core Speed | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| Qualification Tier | Industrial / Consumer | Automotive | Industrial / Consumer (reel) | Industrial / Consumer | Industrial / Consumer | Industrial / Consumer |
| Number of Cores | 2 | 2 | 2 | 2 | 2 | 2 |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
Wichtigste Unterscheidungsmerkmale
- Established dual-core Cortex-A9 platform with mature Linux BSP support (vs. MCIMX6U7CVM08AC)
- Pin-compatible migration path to higher feature tiers (vs. MCIMX6DP4AVT08AC)
- Industrial temperature range coverage (vs. Consumer-grade i.MX 6 parts)
Designhinweise
The 624-MAPBGA (21x21 mm) package requires careful thermal management for sustained CPU workloads. Reference designs typically use a multi-layer PCB with internal ground planes and via-in-pad construction beneath the BGA thermal balls to provide ~10-15 C/W theta_JB. Estimated: at 0.9 W typical TDP with no active cooling, junction temperature rise is approximately 18-25C above ambient using a 4-layer 1oz copper board. For sealed enclosures or industrial temperature operation, derate the CPU to 528 MHz via DVFS to maintain thermal margins.
BGA escape routing demands a microvia build-up PCB stack-up for the inner-row signal balls. Use a 4-layer 1+N+1+ or 6-layer 2+N+2+ stack with 0.4 mm pitch microvias. Route differential pairs (USB, Ethernet, MIPI-DSI) with matched lengths within 0.5 mm and 90 ohm differential impedance. Place the DDR3L memory within 50 mm trace length with matched fly-by routing topology to maintain signal integrity at 800 MHz memory clock rates.
The i.MX 6DualLite requires a sequenced multi-rail power delivery network with core, GPU, DDR, and peripheral rails. Use the NXP MC34674 or equivalent PMIC to handle power-up/power-down sequencing. Estimated: at 800 MHz dual-core loading, the core rail (1.1V) draws approximately 600-900 mA, while the DDR I/O (1.5V) ranges 300-500 mA depending on memory density. Decouple each rail with 1 uF + 0.1 uF ceramic caps placed within 2 mm of the BGA balls to suppress switching noise.
Common design pitfalls include incorrect boot configuration strap values, missing reset hold time on POR_B, and improperly terminated REF_CLK. Configure the BOOT_MODE[1:0] pins via dedicated GPIO strapping resistors before first boot. Maintain POR_B low for at least 1 ms after all rails reach regulation. Use a crystal with series ESR below 50 ohms and route the oscillator traces within 5 mm; failing this results in intermittent boot failures. Reference NXP hardware design guides for SABRE-based reference boards.
The MIPI-DSI and parallel RGB display interfaces require carefully designed PCB stack-up to avoid signal integrity issues. MIPI-DSI lanes should be routed over a continuous reference ground plane with matched lengths within 0.5 mm and intra-pair skew less than 10 ps. For the parallel RGB bus operating at 75 MHz, use controlled impedance with 50 ohm single-ended lines and place 33 ohm series termination resistors within 25 mm of the source. Source-synchronous clocks should have match lengths within 100 ps of data lines.
Compliance-Informationen
RoHS compliant per NXP product page. Not AEC-Q100 qualified - automotive applications should use the MCIMX6U7CVM08AC variant which carries the same silicon. NRND status indicates NXP is steering new designs to i.MX 8M Mini or i.MX 7 series.
