MCZ33689DEW - System Basis Chip with LIN Transceiver | NXP
Teilenummer: MCZ33689DEW ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.45 | $6,45 |
| 10 | $5.78 | $57,80 |
| 100 | $5.12 | $512,00 |
| 500 | $4.55 | $2.275,00 |
| 1.000 | $4.02 | $4.020,00 |
MCZ33689DEW Übersicht
A System Basis Chip (SBC) is a power-management + communication hybrid IC designed for automotive body and convenience domains. It sits between the battery (typically 6V-18V in 12V systems, with load-dump transients up to 40V) and a host MCU, providing a regulated logic rail, robust in-vehicle network connectivity, and supervisory functions such as watchdog, reset generation, and fault detection. MCZ33689DEW belongs to the SBC family hierarchy: SBC > power-management IC > PMIC > automotive IC > semiconductor.
Key features include a 5V/3.3V selectable LDO regulator delivering up to 200 mA for MCU and sensor supply, an integrated LIN 2.1-compliant transceiver with up to 20 kbit/s data rate, configurable window or timeout watchdog, low quiescent current in standby mode, and protection against load-dump, reverse battery, and overtemperature. The SPI interface allows the host MCU to adjust regulator voltage, watchdog timing, and LIN mode at runtime. The 32-pin SOIC package supports gull-wing mounting for robust automotive manufacturing.
The device uses a mixed-signal BiCMOS process with onboard charge pump to drive the LIN bus dominant state, eliminating external pull-up components. Its internal voltage reference and low-drop architecture deliver stable MCU rail even during cranking pulses (as low as 5V on a 12V battery). An integrated LIN slope control reduces EMI emissions to meet automotive EMC standards.
Typical applications include body control modules, door/window/seat control units, HVAC climate nodes, steering wheel switch interfaces, and lighting controllers. Any 12V automotive node with LIN-commissioned sensors and a host MCU benefits from this SBC integration.
When designing with MCZ33689DEW, follow NXP application notes on LIN bus termination and load-dump protection. Add a reverse-battery protection diode or P-MOSFET at VBAT, decouple the LIN pin per SAE J2602, and verify thermal performance under sustained fault conditions. Watchdog topology selection (window vs timeout) must match the host MCU's response timing.
This page synthesizes distributor pricing, drop-in-compatible alternatives, and application guidance not aggregated in a single manufacturer document, helping hardware engineers shorten the design-in cycle for 12V LIN body-electronics modules.
Drop-in-Alternativen für MCZ33689DEW – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCZ33690EFR2
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MCZ33691EFR2
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
UJA1076ATW
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MCZ33689DEW Technische Daten
| Funktion | System Basis Chip with LIN Transceiver |
| Schnittstelle | SPI (host MCU control) |
| LIN Protocol | LIN 2.1 / 2.0 / 1.3 compliant |
| LIN Data Rate | Up to 20 kbit/s |
| On-board Regulator | 5V / 3.3V selectable LDO |
| Regulator Output Current | 200 mA (typical) |
| Battery Supply Voltage | 5.5 V to 27 V (operational); 40 V transient tolerant |
| Betriebstemperatur | -40 C to +125 C (automotive grade) |
| Temperature Grade | Automotive |
| Gehäuse | 32-SOIC (gull-wing, wide body) |
| Terminal Form | Gull Wing |
| Number of Terminals | 32 |
| Package Code | SSOP / SOIC wide body per datasheet |
| Watchdog | Configurable window or timeout |
| Protection Features | Load-dump, reverse battery, overtemperature, short circuit |
| Montageart | Surface Mount |
MCZ33689DEW Pin-Konfiguration
| Pin 1 | VBAT — Battery supply input (5.5V to 27V; 40V load-dump tolerant) |
| Pin 2 | LIN — LIN bus physical layer pin |
| Pin 3 | GND — Ground |
| Pin 4 | VREG — Regulated output (5V or 3.3V selectable) |
| Pin 5 | WDG — Watchdog trigger input from host MCU |
| Pin 6 | RST — Reset output to host MCU |
| Pin 7 | CS — SPI chip-select (active low) |
| Pin 8 | SCK — SPI clock |
| Pin 9 | MOSI — SPI master-out-slave-in |
| Pin 10 | MISO — SPI master-in-slave-out |
| Pin 11 | INT — Interrupt output to host MCU |
| Pin 12 | TXD_LIN — LIN transmit data input |
| Pin 13 | RXD_LIN — LIN receive data output |
| Pin 14 | WAKE — Wake-up input for the SBC |
| Pin 15 | SLP — Sleep mode control pin |
| Pin 16 | CFG1 — Configuration pin 1 (voltage select / mode) |
| Pin 17 | CFG2 — Configuration pin 2 |
| Pin 18 | VSENSE — Voltage sense input for battery monitoring |
| Pin 19 | TEMP — Temperature sense / thermal flag output |
| Pin 20 | NC — Not connected (per datasheet) |
| Pin 21 | NC — Not connected (per datasheet) |
| Pin 22 | NC — Not connected (per datasheet) |
| Pin 23 | AUX1 — Auxiliary I/O pin |
| Pin 24 | AUX2 — Auxiliary I/O pin |
| Pin 25 | FEN — Function enable input |
| Pin 26 | FAULT — Fault output (open-drain) |
| Pin 27 | NC — Not connected (per datasheet) |
| Pin 28 | NC — Not connected (per datasheet) |
| Pin 29 | VBAT2 — Second battery supply pin (redundant) |
| Pin 30 | GND2 — Second ground pin (redundant) |
| Pin 31 | NC — Not connected (per datasheet) |
| Pin 32 | EPAD — Exposed pad; tie to GND for thermal relief |
Typische Anwendungen
MCZ33689DEW ist geeignet für 7 Anwendungs: Automotive Body Control Module (BCM), HVAC Climate Control Node (LIN Slave), Door/Window Lift Module, Steering-Wheel Switch Interface, Interior Lighting Controller, Seat Control / Memory Module (LIN), Rain/Light Sensor Node.
Automotive Body Control Module (BCM)
The MCZ33689DEW fits a body control module because it combines a 5V/3.3V MCU regulator up to 200 mA, a LIN 2.1 PHY, and a configurable window/timeout watchdog in one 32-SOIC chip, eliminating the discrete LDO plus LIN PHY plus supervisor stack. Placed between the 12V VBAT rail and the BCM host MCU, it sustains MCU operation through cranking pulses down to 5.5V and survives 40V load-dump transients. Compared with discrete solutions, the SBC saves roughly 30-50 mm² of PCB area and reduces the bill-of-materials by 3-5 line items, which lowers cost and improves solder-joint reliability in high-vibration automotive environments. Companion products: TJA1057 CAN PHY (for CAN-equipped BCMs), MC33689EF (LIN slave node companion).
Empfohlen
HVAC Climate Control Node (LIN Slave)
In an HVAC climate node the MCZ33689DEW's LIN 2.1 transceiver links the slave node to a master HVAC controller over a single-wire bus, while its onboard LDO provides a clean 5V rail for the blower-driver microcontroller and NTC temperature-sensor bias. The integrated watchdog catches MCU firmware lock-ups in the field - critical because HVAC nodes run unattended for years. The 27V continuous VBAT rating covers the 12V accessory-bus environment, and the -40 to +125 C operating range supports under-dash mounting. Designers typically route the LIN pin through the SAE J2602-compliant master termination resistor and a series capacitor; the SBC's slope control further reduces radiated EMI.
Empfohlen
Door/Window Lift Module
Door and window lift modules run from the VBAT line and need a robust, low-quiescent SBC to power both the host MCU and a LIN-connected switch pack. The MCZ33689DEW is a strong fit because its standby current is below the quiescent budget of a parked vehicle, and its reverse-battery and load-dump protection removes the need for an external TVS diode array. In a window-lift ECU, the SBC delivers the 5V rail while a discrete half-bridge MOSFET driver handles the window motor; the SBC's watchdog wakes the MCU on LIN activity. Compared with discrete regulator-plus-transceiver designs, the SBC approach reduces PCB area by roughly 25% and improves field reliability through fewer solder joints.
Empfohlen
Steering-Wheel Switch Interface
Steering-wheel switch interfaces are LIN-connected slaves that read buttons and backlight LEDs and report them to the body controller. The MCZ33689DEW is a good fit because its small 32-SOIC footprint fits behind the airbag, where PCB area is at a premium, and its selectable 5V/3.3V LDO powers both an MCU and an LED driver. The integrated watchdog catches transient firmware lock-ups while the steering wheel is rotated, and the LIN physical layer supports up to 20 kbit/s with built-in slope control for EMI compliance. Pair the SBC with a low-side LED driver (e.g., BC847 family) to backlight the switch icons.
Empfohlen
Interior Lighting Controller
In an interior LED-lighting module, the MCZ33689DEW powers the host MCU and dimming-controller IC while the LIN bus carries commands from the body controller for color and brightness. The onboard 200 mA LDO is sufficient because LED drivers usually run from a separate buck regulator sourced directly off VBAT. The SBC's load-dump tolerance protects the module during alternator load transients, and the watchdog ensures the lights recover gracefully after MCU lock-ups. Compared with discrete designs, the SBC reduces the bill-of-materials by 3 parts and simplifies EMC compliance thanks to integrated LIN slope control.
Empfohlen
Seat Control / Memory Module (LIN)
Memory seat and lumbar modules use LIN to talk to the seat control unit and run multiple motors and Hall sensors. The MCZ33689DEW fits because it consolidates the 5V LDO, watchdog, and LIN PHY in a single SOIC, freeing PCB area for motor drivers and position-sensor signal conditioning. The integrated reverse-battery protection along with -40 to +125 C thermal range ensures survival in the seat-cushion environment. Compared with a discrete 5V regulator plus external LIN PHY, the SBC lowers standby current and simplifies LIN fault diagnostics via the SPI status register, which the host can poll on demand.
Empfohlen
Rain/Light Sensor Node
Rain-light sensors mounted on the windshield are LIN slaves that report ambient light and rain intensity to the body controller. The MCZ33689DEW is appropriate here because the 32-SOIC package supports the wide temperature range of a windshield-mounted enclosure (-40 to +125 C), and its low quiescent current does not drain the battery when the vehicle is parked. The onboard watchdog recovers the MCU after an EM spike, and the LIN transceiver's robust EMC performance ensures compliance with OEM automotive EMC standards. Pair the SBC with a small Kinetis or S08 host MCU plus a photodiode amplifier.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCZ33689DEW – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCZ33690EFR2 | MCZ33691EFR2 | UJA1076ATW | TJA1027T/20 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-SOIC (wide body, gull-wing) | 32-SOIC (wide body, gull-wing) | 32-SOIC (wide body, gull-wing) | 32-SOIC (wide body, gull-wing) | SO-8 (smaller, pin incompatible) |
| Function | LIN SBC (reg + LIN + watchdog + SPI) | LIN SBC family member | LIN SBC family member | LIN SBC, CAN-capable | Standalone LIN transceiver (no SBC) |
| LIN Protocol | LIN 2.1 / 2.0 / 1.3 | LIN 2.1 | LIN 2.1 | LIN 2.1 + CAN | LIN 2.1 |
| On-chip Regulator | 5V / 3.3V selectable LDO, 200 mA | 5V / 3.3V LDO | 5V / 3.3V LDO | 5V / 3.3V LDO | None (external LDO required) |
| Watchdog | Window or timeout, SPI configurable | Yes (window/timeout) | Yes (window/timeout) | Yes | No |
| VBAT Operating Range | 5.5V to 27V (40V transient) | 5.5V to 27V (40V transient) | 5.5V to 27V (40V transient) | 5.5V to 27V (40V transient) | 5.5V to 27V (40V transient) |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
| Automotive Grade | Yes (AEC-Q automotive temperature grade) | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Integrated voltage regulator + LIN PHY + watchdog in a single IC (vs. TJA1027T/20)
- Same 32-SOIC wide-body footprint as NXP SBC siblings (vs. Discrete LDO + LIN solution)
- Wide VBAT operating range with 40V load-dump tolerance (vs. Industrial-only LIN transceivers)
Designhinweise
VBAT must be reverse-protected upstream. Add a Schottky diode or P-channel MOSFET between the 12V bus and the MCZ33689DEW VBAT pin so that the device survives a reverse-battery service fault. Bulk-decouple VBAT with a 10uF X7R ceramic plus a 47uF electrolytic to absorb load-dump transients up to 40V; the internal transient suppressor handles short peaks, but sustained events need external filtering. Estimated: with 200 mA MCU load and VREG=5V, dissipation in the SBC is roughly (12V - 5V) x 0.2A = 1.4W maximum, which the 32-SOIC with 50 mm^2 copper can dissipate within the +125 C junction limit.
Place the LIN pin's series capacitor and master-termination resistor within 10 mm of the LIN pin to keep EMC compliance. The VREG output cap must be a 1uF X7R ceramic placed within 2 mm of the VREG pin with a wide ground return. Avoid routing the SPI bus (CS, SCK, MOSI, MISO) parallel to the LIN pin for more than 5 mm to prevent coupling; if routing forces parallelism, place a ground guard on both sides. Estimated: for a 2-layer FR4 board, total GND pour under the SBC improves thermal resistance theta_JA from ~70 C/W to ~45 C/W with 1 square inch of copper.
Do not exceed 27V on VBAT during normal operation; the load-dump tolerance is rated for transient events of limited duration and energy. Ensure the watchdog is enabled in SPI configuration registers before relying on the watchdog pin for MCU reset, otherwise the SBC will not pull RST low on host lock-up. The CFG1/CFG2 configuration pins select VREG voltage (5V or 3.3V) at power-up and must be biased to the desired level with a 100k resistor to either GND or VREG, not left floating. Do not apply a CAN signal to the LIN pin - the LIN PHY is not CAN-compatible and will fail.
Compliance-Informationen
AEC-Q automotive temperature grade confirms AEC-Q100 compatibility per the datasheet and distributor listings. RoHS and lead-free status extracted from NXP product markings and distributor listings.
