MK50DX256ZCLQ10 - 100MHz Cortex-M4 MCU | NXP | Industrial Control
Teilenummer: MK50DX256ZCLQ10 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
MK50DX256ZCLQ10 Übersicht
A microcontroller is a programmable semiconductor that integrates a processor core, memory, peripherals, and communication interfaces into one device. The ARM Cortex-M4 core provides real-time control processing, while the K50 family combines digital control with mixed-signal measurement resources. This places the device in the hierarchy of MCU, embedded processor, semiconductor, and connected industrial-control component.
Key verified attributes include a 100 MHz operating frequency, ARM Cortex-M4 architecture, 256 KB Flash, 64 KB SRAM, full-speed USB support, and a 144-LQFP package. The product listing describes support for 1.8 V, 2.5 V, and 3.3 V operating variants. Its integrated security and analog measurement capabilities make it relevant to industrial instruments, medical equipment, data acquisition systems, and USB-connected embedded controls.
The MK50DX256ZCLQ10 belongs to the Kinetis K50 performance MCU family, which is designed for applications requiring more computation and measurement capability than a basic control MCU. Its USB device interface can simplify connection to a host computer, service interface, or peripheral system when the firmware and board design support the required USB class and protocol.
Typical applications include industrial data loggers, portable medical instruments, USB-connected measurement equipment, industrial control modules, and embedded test systems. The 144-LQFP package provides a relatively large pin count for external connectivity and mixed-signal integration, but it requires a PCB footprint with adequate routing and thermal-management capability.
For a new design, engineers should confirm the exact NXP datasheet pin assignments, electrical limits, memory map, USB implementation, and package dimensions before layout. Because the verified search results identify the part as NRND, production sourcing should include confirmation of current availability and lifecycle planning.
This page consolidates verified distributor and manufacturer information, focused application guidance, lifecycle context, and a conservative replacement assessment. Because no manufacturer PDF was exposed in the supplied results, unverified technical details remain marked for data completion rather than inferred.
Drop-in-Alternativen für MK50DX256ZCLQ10 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MK50DX256ZCLQ10 (gleiche Bauform und Footprint) – abweichend in Package, ADC, Core Architecture, DAC, SRAM.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MK50DX256CMC7
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$11.04 / Stück
Datenblatt ansehen →MK51DX128CLK7
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$5.45 / Stück
Datenblatt ansehen →MK51DX256ZCLL10
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$8.5 / Stück
Datenblatt ansehen →MK51DN512ZAB10R
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MK50DN512CLQ10
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$10.21 / Stück
Datenblatt ansehen →MK50DX256ZCLQ10 Grenzwerte & elektrische Eigenschaften
| Architecture | 32-bit ARM Cortex-M4 |
| Maximum CPU Frequency | 100 MHz |
| Flash Memory | 256 KB |
| SRAM | 64 KB |
| Product Type | ARM Microcontroller - MCU |
| Series | Kinetis K50 |
| Operating Voltage Variants | 1.8 V / 2.5 V / 3.3 V |
| USB Support | Full-Speed USB |
| Integrated Security | Security features specified in product information |
| Analog Measurement Engine | Integrated operational amplifiers and trans-impedance amplifiers |
| ADC | High-resolution ADC module specified in family description |
| DAC | DAC module specified in family description |
| Gehäuse | 144-LQFP |
| Package Dimensions | 20 mm x 20 mm |
| Montageart | Surface Mount |
| Terminal Finish | Matte Tin (Sn) |
| Moisture Sensitivity Level | MSL 3 |
| Peak Reflow Temperature | 260 C |
| Maximum Time At Peak Reflow Temperature | 40 s |
| Lebenszyklusstatus | NRND |
MK50DX256ZCLQ10 20 mm x 20 mm Pinbelegungsleitfaden
Pinbelegung für MK50DX256ZCLQ10 (20 mm x 20 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MK50DX256ZCLQ10.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MK50DX256ZCLQ10 ist geeignet für 6 Anwendungs: Industrial USB Data Logger, Portable Medical Measurement Instrument, Industrial Control Module, USB-C-connected Test and Measurement Unit, Connected Sensor Hub, Embedded Communication Controller.
Industrial USB Data Logger
The MK50DX256ZCLQ10 fits a USB-connected industrial data logger because its verified 100 MHz ARM Cortex-M4 core can manage sampling, buffering, control logic, and host communication while 256 KB Flash supports firmware and configuration storage. Full-speed USB device support can reduce the need for a separate interface controller when the board includes the required USB routing and power implementation. The 64 KB SRAM provides working memory for acquisition buffers and protocol processing, although the final buffer depth must be checked against the application’s sampling rate. Before layout, confirm exact USB pins, supply requirements, clock configuration, and analog input limits in the NXP datasheet.
Empfohlen
Portable Medical Measurement Instrument
The MK50DX256ZCLQ10 is relevant to portable measurement instruments because the Kinetis K50 family description identifies integrated operational amplifiers, trans-impedance amplifiers, and high-resolution ADC and DAC modules alongside a 100 MHz Cortex-M4 core. Those resources can support signal conditioning, sensor acquisition, control, and calibration in a compact embedded design. The 256 KB Flash and 64 KB SRAM are suitable for firmware, tables, and working data, but the application must verify medical-grade qualification, isolation, leakage, noise, and operating-temperature requirements. The supplied data does not confirm a medical certification, so this is an engineering fit assessment rather than a compliance claim.
Empfohlen
Industrial Control Module
The MK50DX256ZCLQ10 can serve as the central controller in a compact industrial module because its 100 MHz Cortex-M4 processing speed supports real-time control loops, state machines, communications, and supervisory logic. The Kinetis K50 analog measurement resources can reduce the surrounding signal-conditioning burden when their electrical limits match the sensor and actuator interfaces. Its 144-LQFP package offers many external pins for power, communications, digital I/O, analog channels, and debug access, but that footprint also demands careful routing and adequate ground distribution. Confirm isolation, ESD protection, environmental ratings, and regulator headroom in the final reference design.
Empfohlen
USB-C-connected Test and Measurement Unit
The MK50DX256ZCLQ10 fits a USB-connected test instrument when the product needs local control, data acquisition, and host communication in one MCU. The verified 100 MHz Cortex-M4 core can sequence measurements, process results, and maintain USB communication, while the Kinetis K50 family’s analog resources support sensor and signal paths. Full-speed USB is appropriate for many control and data-transfer workloads, but actual throughput depends on firmware, descriptors, endpoint configuration, host software, and connector implementation. Designers should reserve time for USB enumeration, suspend behavior, ESD protection, and power-supply design, and should verify the exact USB pin assignments before PCB routing.
Empfohlen
Connected Sensor Hub
The MK50DX256ZCLQ10 can serve as a connected sensor hub when an application requires local signal processing, USB communication, and embedded security. The verified product information identifies integrated security, 256 KB Flash, 64 KB SRAM, and a 100 MHz Cortex-M4 core, allowing the MCU to aggregate sensor inputs and format data before transmission. The K50 family’s ADC, DAC, operational-amplifier, and trans-impedance-amplifier resources may support analog sensor conditioning, but each channel must be checked for input range, bandwidth, accuracy, and leakage. Power sequencing, sensor excitation, grounding, and EMI filtering are especially important in compact mixed-signal systems.
Empfohlen
Embedded Communication Controller
The MK50DX256ZCLQ10 is appropriate for an embedded communication controller when a product combines protocol handling with peripheral control and USB connectivity. Its 100 MHz Cortex-M4 core provides processing headroom for packet handling, state management, buffering, and application logic, while full-speed USB provides a defined device interface for configuration or data transfer. The target is not a network processor, so Ethernet or high-speed wireless functions should not be inferred from the supplied data. Any communications design must verify protocol timing, buffer requirements, clocking, signal integrity, and connector or transceiver support separately from the MCU selection.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MK50DX256ZCLQ10 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MK50DX256CMC7 | MK51DX128CLK7 | MK51DX256ZCLL10 | MK51DN512ZAB10R | MK50DN512CLQ10 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP | 144-LQFP | 144-LQFP | 144-LQFP | 144-LQFP | 144-LQFP |
Wichtigste Unterscheidungsmerkmale
- 100 MHz Cortex-M4 control with K50 measurement resources (vs. MK51DX128CLK7)
- 256 KB Flash target configuration (vs. MK50DN512CLQ10)
- Full-speed USB device connectivity (vs. MK50DX256CMC7)
- NRND product planning signal (vs. MK50DX256CMC7)
Designhinweise
Start the layout by downloading the current NXP package drawing and pin table. The verified source identifies a 144-LQFP package measuring 20 mm x 20 mm, but the supplied data does not provide pin names or pin-to-pin compatibility details. Route power and ground first, keep analog and digital return paths controlled, and place required decoupling close to the corresponding pins. Do not assume that a 144-LQFP footprint alone guarantees compatibility with a related MCU.
Plan the supply network for the target’s operating-voltage variant and USB-connected load profile. The verified listings identify 1.8 V, 2.5 V, and 3.3 V variants, but they do not provide complete current, regulator, startup, or brownout limits. Confirm the exact power architecture from the official datasheet and validate startup sequencing, analog-sensor supply noise, USB bus-power behavior, and regulator transient response on prototypes.
Treat analog and USB routing as separate high-value signal paths. The Kinetis K50 family description identifies integrated analog resources, while the target is described as supporting full-speed USB. Keep sensor inputs away from switching nodes and high-current return paths, provide clean references for analog ground, and follow the official USB layout guidance. Exact trace lengths, impedance, ESD, and connector requirements are not included in the supplied data and must be taken from the manufacturer documentation.
Do not rely on generic Cortex-M4 or Kinetis-family assumptions when replacing MK50DX256ZCLQ10. Memory size, pin assignment, USB routing, analog-channel availability, package suffix, and lifecycle grade can change between related devices. Also do not treat the NRND status as proof of unrestricted future supply. Before schematic release, compare the target and candidate against the official pin tables, electrical limits, memory map, USB implementation, and production-availability records.
Compliance-Informationen
The supplied manufacturer and distributor results do not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. Packaging data identifies matte tin terminal finish, MSL 3, and 260 C peak reflow temperature, but those handling attributes are not compliance certifications.