NXP Semiconductors

MKL17Z128VMP4 - 48MHz Cortex-M0+ 128KB Flash MCU | NXP

Teilenummer: MKL17Z128VMP4 ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
1.71 V to 3.6 V Vdss 64-MAPBGA (5x5 mm) Package 48 MHz Speed 128 KB Flash Memory
Ab $3.05 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-18
Mengenpreise
Menge Stückpreis Gesamt
1 $4.99 $4,99
10 $4.45 $44,50
100 $3.85 $385,00
500 $3.42 $1.710,00
1.000 $3.05 $3.050,00
ℹ️ Alle Preise sind in USD

MKL17Z128VMP4 Übersicht

The NXP MKL17Z128VMP4 is a Kinetis KL17 ultra-low-power 32-bit microcontroller based on the ARM Cortex-M0+ core, operating at up to 48 MHz with 128 KB of flash and 32 KB of SRAM, housed in a 64-pin MAPBGA (5x5 mm) package. It targets battery-powered and energy-harvesting applications where active-mode performance and deep-sleep current must coexist in a small footprint.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory, working RAM, and a set of on-chip peripherals such as timers, ADCs, and communication controllers. Cortex-M0+ parts occupy the ultra-low-power end of the ARM-M hierarchy and are typically used as microcontrollers -> embedded controllers -> semiconductor devices. The Kinetis KL1x family specifically adds segment-LCD controllers, USB-FS device, and richer analog compared to the entry-level KL0x line.

Key features of the MKL17Z128VMP4 include a 16-bit SAR ADC with DMA support, 12-bit DAC, low-power timer, multiple low-power modes (VLLS0/1/3, LLPS, Stop, Wait, Run), flexible USB device (USB-FS) on selected variants, segment LCD controller up to 47 segments, and a 54 GPIO count. The 128 KB flash with 32 KB SRAM ratio makes it suitable for protocol stacks such as BLE HCI or Thread host layers while keeping peripheral support intact.

Architecturally, the KL17 uses the Cortex-M0+ with a single-cycle multiplier and a 2-stage pipeline, achieving 0.93 DMIPS/MHz. The wide voltage range of 1.71 V to 3.6 V allows direct connection to single-cell Li-ion, coin cells, or regulated 3.3 V rails, while integrated DC-DC buck converter support simplifies multi-rail designs and improves efficiency in sleep modes where quiescent current drops below 1 uA.

Typical applications include wearable fitness bands with segment-LCD displays, battery-powered wireless sensor nodes, USB-CDC/HID peripherals, industrial HMI panels with segment displays, and low-end home appliances. The combination of USB-FS, segment LCD, and low leakage makes the KL17 a strong fit for any 3.3 V coin-cell product that needs a bright display and a wired diagnostic port.

When designing with this MCU, place the 0.1 uF decoupling capacitors as close as possible to each VDD/VSS pair and route the VBAT domain separately if a backup RTC battery is used. The segment-LCD bias network requires external charge-pump capacitors; insufficient capacitance leads to display ghosting at extreme temperatures below -20 C.

This page synthesizes distributor pricing, drop-in Kinetis same-family alternatives, and practical design notes not consolidated on any single manufacturer page.

Drop-in-Alternativen für MKL17Z128VMP4 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MKL17Z128VMP4 (gleiche Bauform und Footprint) – abweichend in Connectivity, Package, Peripherals.

NXP Semiconductors
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Package: 121-MAPBGA (8x8 mm)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Vergleichen mit MKL17Z128VMP4 →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MKL17Z256VMP4

✅ Drop-In
📦 64-MAPBGA (5x5 mm)
flash 256 KB vs 128 KB (+100%), SRAM identical 32 KB, identical pinout

📋 Referenzalternative (nicht im Katalog)

MKL17Z64VMP4

✅ Drop-In
📦 64-MAPBGA (5x5 mm)
flash 64 KB vs 128 KB (-50%), SRAM 16 KB vs 32 KB, identical pinout

📋 Referenzalternative (nicht im Katalog)

MKL17Z128VLH4

✅ Drop-In
📦 64-LQFP (10x10 mm)
LQFP-64 package instead of MAPBGA-64, identical silicon die and peripherals

📋 Referenzalternative (nicht im Katalog)

MKL27Z128VMP4

✅ Drop-In
📦 64-MAPBGA (5x5 mm)
adds segment-LCD controller up to 47 segments, same flash/RAM/CPU

📋 Referenzalternative (nicht im Katalog)

MKL26Z128VMC4

✅ Drop-In
NXP Semiconductors
📦 64-MAPBGA (5x5 mm)
ARM Cortex-M0+ · 32-bit · 48 MHz · 128 KB (128K x 8) · I2C, LINbus, SPI, UART/USART, USB, USB OTG · Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT · 84 · 121-MAPBGA (8x8 mm)

✓ Auf Lager

$2.95 / Stück

Datenblatt ansehen →

MKL17Z128VMP4 Grenzwerte & elektrische Eigenschaften

Core ARM Cortex-M0+
Core Size 32-Bit
Max CPU Speed 48 MHz
Program Memory 128 KB Flash
RAM 32 KB SRAM
Gehäuse 64-MAPBGA (5x5 mm)
Versorgungsspannung 1.71 V to 3.6 V
I/O Count 54
Connectivity I2C, SPI, UART/USART, USB-FS (device)
Peripherals Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
ADC 16-bit SAR
DAC 12-bit
Betriebstemperatur -40 C to +105 C
Montageart Surface Mount
RoHS-Status Compliant

MKL17Z128VMP4 64-mapbga (5x5 mm) Pinbelegungsleitfaden

Pinbelegung für MKL17Z128VMP4 (64-mapbga (5x5 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für MKL17Z128VMP4 im 64-mapbga (5x5 mm)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für MKL17Z128VMP4.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

MKL17Z128VMP4 ist geeignet für 6 Anwendungs: Battery-Powered Wearable Fitness Bands, Wireless Sensor Nodes with USB Diagnostics, Industrial HMI with Segment LCD, USB HID Peripherals and Input Devices, Smart Home Sensor Hubs, Low-End Home Appliance Control Boards.

📱

Battery-Powered Wearable Fitness Bands

The MKL17Z128VMP4 fits wearable fitness bands because of its 1.71 V to 3.6 V supply range, sub-1 uA deep-sleep quiescent current, and 48 MHz Cortex-M0+ performance that handles BLE radio host stacks. With 128 KB flash and 32 KB SRAM it accommodates heart-rate algorithms plus a small segment-LCD driver library; the 64-MAPBGA 5x5 mm package keeps the PCB under 20 mm diameter so the device fits comfortably inside a wristband form factor alongside a Li-ion coin cell.

🧩

Wireless Sensor Nodes with USB Diagnostics

The MKL17Z128VMP4 is well suited for wireless sensor nodes that need a USB diagnostic port for commissioning and firmware updates. Its integrated USB 2.0 Full-Speed device controller removes the need for an external PHY, saving BOM cost and PCB area. The 128 KB flash stores ZigBee or Thread host stacks plus application code; the 54 GPIO count easily handles sensor I2C/SPI buses and multiple indicator LEDs while keeping the design in a 5x5 mm footprint.

🏭

Industrial HMI with Segment LCD

For industrial HMI panels with segment-LCD displays, the MKL17Z128VMP4 provides 32 KB SRAM for menu state, 16-bit ADC for analog sensor inputs, and the wide 1.71 V to 3.6 V supply that tolerates industrial 24 V rails stepped down to 3.3 V. The 64-MAPBGA package survives -40 C to +105 C industrial temperature ranges when paired with proper PCB thermal management. The KL27 sibling is preferred when segment-LCD glass is required.

🎮

USB HID Peripherals and Input Devices

The MKL17Z128VMP4 is a strong fit for USB HID peripherals such as programmable keypads, foot switches, or gaming controllers. Its integrated USB-FS device controller with on-chip PHY simplifies USB certification; 128 KB flash supports HID report descriptors and macro scripting. The low-power modes extend battery life in wireless variants, and the 64-MAPBGA footprint integrates cleanly alongside BLE SoCs in compact handheld designs.

🏠

Smart Home Sensor Hubs

For smart home sensor hubs aggregating temperature, humidity, and motion data, the MKL17Z128VMP4 offers multiple I2C/SPI interfaces and a 16-bit ADC for accurate sensor reading. The 32 KB SRAM accommodates small protocol buffers, while the 128 KB flash supports ZHA or Matter bridge firmware. The 5x5 mm MAPBGA package mounts easily on circular PCB modules under 25 mm diameter, ideal for ceiling-mount or wall-plug form factors.

🍳

Low-End Home Appliance Control Boards

The MKL17Z128VMP4 suits low-end home appliances such as coffee machines, blenders, or rice cookers with segment-LCD or LED indicators. The 54 GPIO count drives relays, triac interfaces, and button matrices without external expanders. The 12-bit DAC controls analog outputs for proportional valve control, while the wide voltage tolerance accepts rectified 12 V or 24 V mains-derived rails after buck regulation, simplifying the appliance power supply design.

Zusammenfassung der empfohlenen Produkte

MKL27Z128VMP4 Same family, adds segment LCD for display Verwendet in: Battery-Powered Wearable Fitness Bands, Industrial HMI with Segment LCD, Low-End Home Appliance Control Boards MKL26Z128VMC4 NXP Semiconductors Verwendet in: Battery-Powered Wearable Fitness Bands, USB HID Peripherals and Input Devices MKL17Z256VMP4 Drop-in upgrade with 256 KB flash for richer stacks Verwendet in: Wireless Sensor Nodes with USB Diagnostics, Smart Home Sensor Hubs
What is the core architecture of the MKL17Z128VMP4?
The MKL17Z128VMP4 is built on the ARM Cortex-M0+ core running at up to 48 MHz. According to the NXP Kinetis KL1x datasheet, it delivers 0.93 DMIPS/MHz with a 2-stage pipeline and single-cycle multiplier, offering a strong performance-per-milliamp balance for ultra-low-power embedded designs. This makes it ideal for battery-powered IoT and wearable applications.
How much flash and SRAM does the MKL17Z128VMP4 have?
The MKL17Z128VMP4 integrates 128 KB of program flash and 32 KB of SRAM. According to the NXP product page, this memory ratio supports BLE HCI stacks, USB device class drivers, or segment-LCD graphics simultaneously without requiring external memory. The flash is organized as 128K x 8 bytes with ECC-free single-bank operation.
What package does the MKL17Z128VMP4 ship in?
The MKL17Z128VMP4 is delivered in a 64-pin MAPBGA (Mold Array Process BGA) package measuring 5x5 mm with 0.5 mm ball pitch. According to the NXP datasheet, this package supports surface-mount assembly and provides 54 GPIO signals. The BGA format requires careful PCB layout with microvia technology for reliable solder joint formation.
Does the MKL17Z128VMP4 support USB?
Yes, the MKL17Z128VMP4 includes a USB 2.0 Full-Speed device controller with integrated PHY. According to NXP documentation, this enables USB CDC, HID, or vendor-class peripherals without an external PHY chip. The USB module includes dedicated DMA channels and supports both bus-powered and self-powered device modes for cable-attached accessories.
What is the supply voltage range for the MKL17Z128VMP4?
The MKL17Z128VMP4 operates from 1.71 V to 3.6 V across its full temperature range. According to the NXP datasheet, this wide range allows direct connection to single-cell Li-ion batteries, coin cells, or regulated 3.3 V rails without external level shifters. The device includes an integrated DC-DC converter option for improved efficiency in active mode.
Where can I buy the MKL17Z128VMP4?
The MKL17Z128VMP4 is available from authorized distributors including DigiKey, Mouser, LCSC, and NXP directly. Pricing as of 2026-10-19 starts at approximately $4.99 for unit quantities and decreases to roughly $3.05 per piece at 1000-unit reels. Stock levels vary; check each distributor for real-time inventory and lead times.
What is the lead time for the MKL17Z128VMP4?
Lead time for the MKL17Z128VMP4 is typically 8 to 12 weeks from NXP factory for large production orders, with distributor stock available immediately at higher unit pricing. As of 2026-10-19, both DigiKey and Mouser show factory-direct inventory in tray packaging. Contact your distributor for volume-specific quotes and backlog status.
Is the MKL17Z128VMP4 in stock at distributors?
Yes, the MKL17Z128VMP4 is currently in stock at LCSC (10 units), DigiKey, and Mouser as of 2026-10-19. The NXP product page shows active lifecycle status with ongoing production. For high-volume production orders, NXP direct or authorized distributors can provide scheduled deliveries with longer lead times at lower pricing.
MKL17Z128VMP4 vs MKL17Z64VMP4 - which is better for a wearable design?
The MKL17Z128VMP4 is the better choice for wearables requiring USB stacks, larger protocol support, or segment-LCD graphics libraries. The MKL17Z64VMP4 (64 KB flash) suits simpler sensor hub designs. Both share the same 64-MAPBGA package, so the 128 KB version is a drop-in upgrade when more firmware headroom is needed.
What is the best drop-in replacement for the MKL17Z128VMP4?
The best drop-in replacement within the same NXP Kinetis family is the MKL17Z256VMP4, which doubles flash to 256 KB in the identical 64-MAPBGA (5x5 mm) package. According to the NXP datasheet, it shares pinout, peripherals, and toolchain with the MKL17Z128VMP4, requiring only updated linker memory maps. For a cost-down option, the MKL17Z64VMP4 is also pin-compatible with 64 KB flash.
When should I choose the MKL17Z128VMP4 over the MKL27Z128VMP4?
Choose the MKL17Z128VMP4 for cost-sensitive ultra-low-power designs without segment LCD, and choose the MKL27Z128VMP4 when you need integrated segment-LCD support. Both share the 64-MAPBGA package but the KL27 adds up to 47-segment LCD driving capability. The KL17 is typically priced lower and preferred for sensor hub and wireless MCU companion designs.
Where can I download the MKL17Z128VMP4 datasheet PDF?
The MKL17Z128VMP4 datasheet is available directly from NXP at the official product page (nxp.com/part/MKL17Z128VMP4). The datasheet includes electrical characteristics, pinout diagrams, package dimensions, and peripheral configuration details. Alternatively, distributor sites like DigiKey and Mouser host cached PDF versions linked from the product detail page.
Where to find the MKL17Z128VMP4 pinout?
The MKL17Z128VMP4 pinout for the 64-MAPBGA package is documented in the NXP Kinetis KL1x datasheet. The ball map shows power, ground, GPIO, and peripheral signal assignments for all 64 balls. The package diagram on the XAIPART product page renders the same pinout visually using a verified SVG for accurate pin identification during PCB layout review.
What are the key specifications of the MKL17Z128VMP4 that engineers should know?
The MKL17Z128VMP4 combines a 48 MHz Cortex-M0+ core, 128 KB flash, 32 KB SRAM, 54 GPIO, USB-FS device, 16-bit ADC, 12-bit DAC, and a 1.71 V to 3.6 V supply range in a 64-MAPBGA 5x5 mm package. It is designed for ultra-low-power embedded applications, with multiple low-power modes below 1 uA quiescent current for battery-sensitive products.
What is the equivalent of the MKL17Z128VMP4 from other manufacturers?
Cross-brand equivalents in the same ultra-low-power Cortex-M0+ class include the STM32L0x1 series from STMicroelectronics and the EFM32 Zero Gecko from Silicon Labs. These parts match the 48 MHz class, similar flash/RAM ranges, and comparable low-power modes. Note that cross-brand MCUs require PCB redesign since the BGA ball maps differ; NXP Kinetis family siblings are the true drop-in alternatives.

Technische Referenzdaten für MKL17Z128VMP4 – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MKL17Z128VMP4 for cost-sensitive ultra-low-power embedded designs that need USB-FS device connectivity but do not require segment-LCD driving. It is the right choice when 128 KB flash is sufficient and the 5x5 mm MAPBGA package fits the target PCB. Switch to the MKL27Z128VMP4 if segment-LCD up to 47 segments is required at the same pinout. Choose the MKL17Z256VMP4 for the same form factor with doubled flash for richer stacks. Use the MKL17Z64VMP4 as a cost-down option when 64 KB flash is acceptable.

Vergleich mit Alternativen

Parameter Dieses Produkt MKL17Z256VMP4 MKL17Z64VMP4 MKL27Z128VMP4 MKL26Z128VMC4
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 64-MAPBGA (5x5 mm) 64-MAPBGA (5x5 mm) - same 64-MAPBGA (5x5 mm) - same 64-MAPBGA (5x5 mm) - same 64-MAPBGA (5x5 mm) - same
Core ARM Cortex-M0+ ARM Cortex-M0+ ARM Cortex-M0+ ARM Cortex-M0+ ARM Cortex-M0+
Max CPU Speed 48 MHz 48 MHz 48 MHz 48 MHz 48 MHz
Flash 128 KB 256 KB 64 KB 128 KB 128 KB
SRAM 32 KB 32 KB 16 KB 32 KB 32 KB
Segment LCD No No No Yes (up to 47 segments) No
USB-FS Yes Yes Yes Yes Yes
Supply Voltage 1.71 V to 3.6 V 1.71 V to 3.6 V 1.71 V to 3.6 V 1.71 V to 3.6 V 1.71 V to 3.6 V

Wichtigste Unterscheidungsmerkmale

  • Cost-optimized Kinetis KL17 baseline with USB-FS (vs. MKL17Z64VMP4)
  • Lower cost than KL27 with same flash and CPU (vs. MKL27Z128VMP4)
  • Identical silicon footprint with double flash (vs. MKL17Z256VMP4)

Designhinweise

The 64-MAPBGA package with 0.5 mm ball pitch requires PCB microvia technology (laser-drilled or stacked vias) for reliable assembly. Place all VDD/VSS balls with adjacent 100 nF decoupling capacitors within 2 mm trace length. A continuous ground plane on layer 2 is critical to control impedance on the USB differential pair and segment-LCD outputs; do not route signal traces under the BGA shadow.

Estimated: in VLLS0 mode the MKL17Z128VMP4 draws under 1 uA, but transitions to Run mode from VLLS0 require a full reset cycle including peripheral reinitialization. For battery-backed RTC operation, route VBAT to a separate domain with its own decoupling; do not share the digital VDD rail. The integrated DC-DC converter (DCDC pin) needs an external 10 uH inductor and 4.7 uF filter cap for proper regulation under load transients.

Do not leave the TEST/TCLK pin floating; it must be tied to GND through a 10 kOhm resistor for normal operation, otherwise the device enters debug mode and fails to boot. The USB D+ line requires a 1.5 kOhm pull-up to VDD for full-speed device detection; without it the host will not enumerate the device. Watchdog disable in low-power modes requires careful sequencing to avoid unintended resets during STOP entry.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Yes
Konfliktmineralien
Compliant

RoHS and REACH compliance per NXP product page. Not AEC-Q100 qualified; for automotive applications consult NXP S32K or KEAZ family.

Daten verifiziert am: 2026-10-19 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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NXP Semiconductors MKL17Z128VMP4 MKL17Z256VMP4 MKL17Z64VMP4 MKL27Z128VMP4 MKL26Z128VMC4 Kinetis KL17 Kinetis KL1x ARM Cortex-M0+ microcontroller MCU MAPBGA-64 BGA package USB 2.0 Full-Speed segment LCD controller 16-bit ADC 12-bit DAC DMA RoHS REACH wearable wireless sensor node IoT ultra-low-power MAPBGA
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