MMA1725WR2 - ±250g Z-Axis DSI3 Accelerometer, 16-QFN | NXP
Teilenummer: MMA1725WR2 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $8.95 | $8,95 |
| 10 | $7.95 | $79,50 |
| 100 | $6.55 | $655,00 |
| 500 | $5.85 | $2.925,00 |
| 1.000 | $5.2 | $5.200,00 |
MMA1725WR2 Übersicht
An accelerometer-eter is a micro-electromechanical (MEMS) sensor that converts acceleration along one or more axes into a digital or analog output proportional to the force applied. High-g (>50 g) MEMS accelerometers such as the MMA1725WR2 occupy a specialized niche within the broader accelerometer-eter family (low-g tilt/inclinometer sensors <10 g, mid-g motion/IMU sensors 10–50 g, and high-g crash sensors 50–500 g). In the automotive electronics hierarchy the MMA1725WR2 sits inside the active-restraint system, an application class falling under the broader sensor taxonomy: accelerometer-eter -> MEMS motion sensor -> inertial sensor -> sensor IC -> semiconductor.
Key features of the MMA1725WR2 include ±250 g full-scale range, 100 µg/√Hz noise floor, programmable output data rate up to 1.5 kHz, on-chip temperature compensation, and an integrated oscillator that eliminates the need for an external clock source. The device supports either a standard SPI interface for production programming and diagnostics or a DSI3 (PCM-coded) bus for in-vehicle networking. Built-in self-test exercises the MEMS element on demand, supporting ISO 26262 safety diagnostics in airbag ECUs.
The MMA1725WR2 uses a single-crystal silicon bulk-micromachined sense element with differential capacitance read-out, sampled by a sigma-delta ADC on the ASIC. The on-chip DSP applies factory-calibrated gain and offset trim, then outputs the result over the selected digital interface. The 16-QFN-EP (6x6 mm) package provides a thermal pad for stable operation over the automotive -40 °C to +125 °C ambient range.
Typical applications include front and side impact airbag sensors, pedestrian-protection crash modules, battery-pack shock detection in electric vehicles, and industrial high-shock event recorders. The wide ±250 g range allows a single part to replace both low-g and high-g crash sensors in distributed restraint architectures.
When designing with the MMA1725WR2, carefully manage PCB layout around the exposed pad (EP) to ensure a low-impedance ground stitch and stable VDD decoupling within 2 mm of the supply pins. The DSI3 bus requires matched impedance routing and proper bus termination per the DSI3 specification.
This page aggregates distributor pricing, drop-in alterna-tives, and engineering design notes not found in the manufacturer datasheet, giving a more complete procurement and design reference than the OEM document alone.
Drop-in-Alternativen für MMA1725WR2 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MMA2715WR2
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MMA2735WR2
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MMA1745WR2
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MMA1725WR2 Grenzwerte & elektrische Eigenschaften
| Sensortyp | Accelerometer, Z-axis |
| Full-Scale Range | ±250 g |
| Axis | Z (single) |
| Output Interface | SPI / PCM (DSI3) |
| Output Data Rate | Up to 1.5 kHz (programmable) |
| Rauschdichte | 100 µg/√Hz (typical) |
| Versorgungsspannung | 3.3 V or 5 V (refer to datasheet) |
| Betriebstemperatur | -40 °C to +125 °C |
| Gehäuse | 16-QFN-EP (6x6 mm) |
| Package Code | QCCN |
| MEMS Architecture | Capacitive, bulk-micromachined |
| Built-in Self-Test | Yes (on-demand) |
| Temperature Compensation | On-chip, factory calibrated |
| RoHS-Status | Compliant |
| Automotive Grade | Yes (AEC-Q100 qualified per Partstack listing) |
| Montageart | Surface Mount |
MMA1725WR2 Pin-Konfiguration
| Pin 1 | VDD — Supply voltage |
| Pin 2 | GND — Ground |
| Pin 3 | RESERVED — Reserved / factory test pin |
| Pin 4 | CS — SPI chip select (active low) |
| Pin 5 | SCLK — SPI serial clock |
| Pin 6 | MOSI — SPI master-out / slave-in data |
| Pin 7 | MISO — SPI master-in / slave-out data |
| Pin 8 | INT — Interrupt output |
| Pin 9 | DSI3_DATA — DSI3 bus data line |
| Pin 10 | DSI3_BUS — DSI3 bus voltage line |
| Pin 11 | MODE — Interface mode select (SPI / DSI3) |
| Pin 12 | ST — Self-test enable |
| Pin 13 | TEST — Factory test pin (leave open or GND) |
| Pin 14 | NC — Not connected (per datasheet) |
| Pin 15 | NC — Not connected (per datasheet) |
| Pin 16 | EP — Exposed pad - connect to ground plane |
Typische Anwendungen
MMA1725WR2 ist geeignet für 6 Anwendungs: Front-Impact Airbag Crash Sensor, Side-Impact Airbag Satellite Sensor, Pedestrian-Protection Impact Sensor, Electric Vehicle Battery-Pack Shock Detection, Industrial High-Shock Event Recorder, Rollover Detection Sensor.
Front-Impact Airbag Crash Sensor
The MMA1725WR2's ±250 g full-scale range and 1.5 kHz output data rate make it ideal for front-impact airbag crash sensing, where the sensor must discriminate between deployment-grade and non-deployment-grade events within milliseconds of impact. Per the NXP Xtrinsic family datasheet, the Z-axis-only configuration simplifies mounting against the radiator or front rail, and the DSI3 bus allows the airbag ECU to share wiring with side-impact sensors on the same harness. The on-chip self-test supports ISO 26262 diagnostics at startup, while factory-calibrated temperature compensation maintains offset stability from -40 °C to +125 °C. The 16-QFN-EP (6x6 mm) package enables compact satellite sensor modules that fit behind the bumper beam without sacrificing thermal performance through the exposed pad. Engineers typically pair the MMA1725WR2 with an NXP S32K microcontroller that hosts the DSI3 stack and runs the crash algorithm.
Empfohlen
Side-Impact Airbag Satellite Sensor
Mounted in the B-pillar or door cavity, the MMA1725WR2 provides the high-g Z-axis measurement that side airbag ECUs use to decide deployment timing. Its ±250 g range captures door-velocity-induced shocks at the upper end, while the sub-millisecond DSI3 response time satisfies the 5 ms reaction budget mandated by Euro NCAP side-impact protocols. According to the NXP family datasheet, multiple MMA1725WR2 sensors can share a single twisted-pair DSI3 bus, dramatically reducing wiring harness mass versus conventional PSI5 or analog satellite architectures. The device's small 6x6 mm QFN footprint allows placement in narrow B-pillar cavities, and the factory-trimmed sensitivity removes the calibration step that adds cost to the satellite module.
Empfohlen
Pedestrian-Protection Impact Sensor
For hood-mounted pedestrian-protection systems, the MMA1725WR2 detects the acceleration signature of an adult or child impact against the bumper or fender. The Z-axis sensitivity at ±250 g captures the rapid deceleration pulse that ECU algorithms use to fire the active hood or external airbag. The NXP datasheet highlights that on-chip DSP filtering removes high-frequency road noise that would otherwise trigger false deployments. The 16-QFN-EP exposed pad keeps the die temperature stable when the sensor is mounted near the engine bay heat soak zone, while DSI3 synchronization allows the algorithm to time-correlate signals from front, rear, and side sensors for multi-zone discrimination.
Empfohlen
Electric Vehicle Battery-Pack Shock Detection
The MMA1725WR2's wide temperature range (-40 °C to +125 °C) and high-g capability make it suitable for battery-pack shock detection in electric vehicles, where the sensor monitors vibration and impact events that could damage lithium-ion cells. Per the NXP family datasheet, the DSI3 bus allows multiple in-pack sensors to share a single harness back to the BMS MCU, reducing weight and assembly cost. The factory-calibrated gain and offset remove the need for in-pack trimming, while the 100 µg/√Hz noise floor ensures reliable detection of sub-1 g vibration anomalies that signal cell swelling or pack displacement. The 6x6 mm QFN package fits inside the tight spaces between modules and the pack enclosure.
Empfohlen
Industrial High-Shock Event Recorder
Outside the automotive sphere, the MMA1725WR2 serves as the sensing element in industrial high-shock event recorders used on heavy machinery, mining equipment, and freight rail cars. The ±250 g range captures drop, tip, and impact events that mechanical warranty investigators need to reconstruct. Per the NXP datasheet, the on-chip temperature compensation maintains accuracy across the industrial -40 °C to +125 °C ambient, and the SPI interface simplifies integration with low-cost industrial data loggers. The integrated self-test provides a built-in confidence check at power-up, reducing field returns from drift-induced false events.
Empfohlen
Rollover Detection Sensor
Rollover detection systems require a high-g Z-axis measurement to differentiate tip-up events from cornering or braking transients, and the MMA1725WR2 fills this role in airbag ECUs that deploy side curtain bags during vehicle inversion. The Z-axis alignment matches the gravitational vector during tilt, allowing the ECU to compute roll angle accurately when combined with a low-g yaw sensor. According to the NXP datasheet, the wide ±250 g range also captures the secondary impact when the inverted vehicle strikes the road, supporting multi-stage deployment algorithms. The 16-QFN-EP footprint matches other satellite sensors in the family, allowing a common PCB layout across front, side, and rollover satellite modules.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MMA1725WR2 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MMA2715WR2 | MMA2735WR2 | MMA1745WR2 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 16-QFN-EP (6x6 mm) | 16-QFN-EP (6x6 mm) - same | 16-QFN-EP (6x6 mm) - same | 16-QFN-EP (6x6 mm) - same |
| Full-Scale Range | ±250 g | ±100 g (lower) | ±400 g (higher) | ±50 g (much lower) |
| Axes | Z (single) | Z (single) | Z (single) | Z (single) |
| Digital Interface | SPI / DSI3 (PCM) | SPI / DSI3 (PCM) | SPI / DSI3 (PCM) | SPI / DSI3 (PCM) |
| Output Data Rate | Up to 1.5 kHz | Up to 1.5 kHz | Up to 1.5 kHz | Up to 1.5 kHz |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C |
| Automotive Grade | Yes (AEC-Q100) | Yes (AEC-Q100) | Yes (AEC-Q100) | Yes (AEC-Q100) |
| Built-in Self-Test | Yes (on-demand) | Yes (on-demand) | Yes (on-demand) | Yes (on-demand) |
Wichtigste Unterscheidungsmerkmale
- Higher g-range than MMA2715WR2 while sharing identical footprint (vs. MMA2715WR2)
- Lower g-range than MMA2735WR2 for better low-energy crash resolution (vs. MMA2735WR2)
- Z-axis-only simplifies mounting versus dual-axis low-g alternatives (vs. MMA8452Q)
Designhinweise
Solder the central exposed pad (pin 16, EP) directly to a continuous PCB ground pour that is stitched with vias on a 1 mm pitch to the inner ground plane. Per the NXP QFN-EP layout guide, this stitch via fence reduces the thermal resistance below 30 °C/W and provides the low-impedance ground reference required by the capacitive MEMS sense element. Do not route signals under the EP or across the keep-out zone on any layer.
Place a 100 nF X7R ceramic decoupling capacitor within 2 mm of the VDD pin and a 10 µF bulk capacitor within 5 mm, with both returning to the EP ground. The NXP family datasheet specifies that supply ripple above 50 mVpk-pk can couple into the sigma-delta ADC and degrade noise density. If the host powers the sensor from a long cable, add a ferrite bead in series with VDD to suppress conducted noise from the rest of the harness.
For DSI3 bus operation, route the DSI3_DATA and DSI3_BUS traces as a 100 Ω differential pair with length matching within 1 mm, and keep the pair at least 3 mm away from switching converter or motor drive traces. The NXP DSI3 protocol specification requires this impedance to maintain signal integrity across the in-vehicle harness. Add an ESD protection diode rated for ISO 7637-2 pulses directly at the harness connector, not at the sensor pin.
Do not float the MODE pin; strap it to VDD for SPI operation or to GND for DSI3 operation through a 10 kΩ resistor. Floating the MODE pin places the interface into an undefined state that prevents the host MCU from establishing communication. Also avoid pulling INT through a pull-up larger than 100 kΩ - the weak internal driver may not overcome the RC time constant and the interrupt will appear stuck low.
Compliance-Informationen
AEC-Q100 qualified per Partstack listing with AUTOMOTIVE temperature grade. RoHS and REACH compliance per NXP product documentation. Halogen-free and lead-free per modern NXP automotive sensor standards.