MPC5741PK1AMLQ8R - Dual-Core 180MHz 1MB MCU | NXP
Teilenummer: MPC5741PK1AMLQ8R ✓ Aktiv| Menge | Stückpreis | Gesamt |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
MPC5741PK1AMLQ8R Übersicht
A microcontroller (MCU) is a compact integrated circuit that combines a processor core, memory, and programmable peripherals on a single die to govern a specific operation in an embedded system. The MPC5741PK1AMLQ8R is a 32-bit MCU, processing data in 32-bit chunks for higher performance and precision than 8-bit or 16-bit parts. It belongs to the MPC57xx family within NXP's automotive-grade microcontroller portfolio; per NXP documentation, MPC5741P-class devices are suitable for ISO 26262 ASIL-D chassis and safety applications, positioning them high in the vehicle functional-safety hierarchy.
Key features include the dual e200z4 cores enabling task partitioning between application and safety monitoring functions, 4x ADC modules for precise analog acquisition, 2x PWM modules for motor and power control, and 2x SENT interfaces for automotive sensor connectivity. These peripherals directly address the needs of engine management and chassis systems that must interleave control loops with safety diagnostics.
Technically, the e200z4 Power Architecture core is optimized for deterministic real-time execution, and the dual-core lockstep-capable architecture enhances reliability in safety-critical systems. The device operates from a 3.3V supply over a -40C to +125C automotive temperature range.
Typical applications include automotive engine control units (ECUs), transmission control, ADAS domain control, chassis and safety systems, and industrial automation requiring deterministic real-time control.
Design consideration: properly decouple the 3.3V supply and account for thermal dissipation at 180 MHz operation; use the integrated low-power modes to optimize energy efficiency in battery-connected systems. Pricing shown is as of 2026-08-29.
Drop-in-Alternativen für MPC5741PK1AMLQ8R – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
SPC5741PK1AMLQ8R
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SPC5741PK1AKLQ8R
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SPC5741PK1AMLQ8
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MPC5741PK1AMLQ8R Grenzwerte & elektrische Eigenschaften
| Core Processor | e200z4 (Power Architecture) |
| Number of Cores | 2 (Dual-Core) |
| Core Size | 32-Bit |
| Maximale Taktfrequenz | 180 MHz |
| Program Memory Size | 1MB (1M x 8) FLASH |
| RAM Size | 128KB (128K x 8) |
| NVM | 1MB |
| Versorgungsspannung | 3.3 V |
| ADC Modules | 4 x ADC |
| PWM Modules | 2 x PWM |
| SENT Interfaces | 2 x SENT |
| Connectivity | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART |
| Betriebstemperatur | -40C to +125C |
| Gehäuse | 144-LQFP (20x20 mm) |
| Montageart | Surface Mount |
| Safety Standard Suitability | ISO 26262 ASIL-D chassis and safety applications |
MPC5741PK1AMLQ8R 144-lqfp (20x20 mm) Pinbelegungsleitfaden
Pinbelegung für MPC5741PK1AMLQ8R (144-lqfp (20x20 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC5741PK1AMLQ8R.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC5741PK1AMLQ8R ist geeignet für 6 Anwendungs: Automotive Engine Control Units (ECU), Chassis and ASIL-D Safety Systems, Transmission Control, ADAS Domain and Sensor Fusion Control, Industrial Automation and Motor Control, Gateways and Networked Control Nodes.
Automotive Engine Control Units (ECU)
The MPC5741PK1AMLQ8R fits engine control because its dual e200z4 cores at 180 MHz deliver the deterministic real-time throughput needed for crank-angle-synchronized injection and ignition control, while 4x ADC modules sample wideband oxygen, knock, and pressure sensors with low latency. The 2x SENT interfaces connect modern automotive sensors directly, and the 2x PWM modules drive injectors or throttle actuators. In the ECU powertrain topology, the MCU sits between the sensor front end and gate/pre-driver stages, with CANbus and FlexRay linking it to the vehicle network; the 1MB flash holds calibration-rich control code without external memory.
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Chassis and ASIL-D Safety Systems
NXP documentation designates the MPC5741P family as suitable for ISO 26262 ASIL-D chassis and safety applications. The dual e200z4 architecture enables one core to execute control software while the second performs safety monitoring, a fundamental ASIL-D partitioning scheme. The 180 MHz core speed closes high-rate control loops for braking, steering, and stability systems, while the -40C to +125C operating range covers underhood and chassis mounting points. Communication via CANbus and FlexRay provides redundant message channels typical of safety architectures, and the 1MB flash supports code with diagnostics and end-to-end protection layers included.
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Transmission Control
Automatic and dual-clutch transmissions demand simultaneous solenoid current control, speed/position decoding, and network communication, all served by the MPC5741PK1AMLQ8R peripheral set: 2x PWM modules drive solenoid drivers, 4x ADC channels measure currents and pressures, and CAN interfaces exchange torque requests with the engine ECU. The 128KB SRAM accommodates adaptive shift-schedule data structures, while the 180 MHz dual cores separate clutch control from diagnostics tasks deterministically. Operating from a 3.3V supply with -40C to +125C ratings suits the harsh transmission-mounted electronic environment.
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ADAS Domain and Sensor Fusion Control
In ADAS domain controllers, the MPC5741PK1AMLQ8R acts as the real-time safety companion to high-throughput vision or radar processors. Its dual e200z4 cores at 180 MHz execute sensor-fusion state machines and safety monitoring, while Ethernet and CAN connectivity bridge high-bandwidth and legacy in-vehicle networks. The 2x SENT interfaces accept raw automotive sensor data, and the -40C to +125C range plus ASIL-D suitability meet the deployment constraints of front-camera and radar modules. The 1MB flash retains fail-operational code paths critical for ADAS availability requirements.
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Industrial Automation and Motor Control
Industrial drives and factory automation benefit from the MPC5741PK1AMLQ8R's deterministic Power Architecture cores and rich peripheral mix. The 2x PWM modules generate inverter switching patterns for motor control, 4x ADCs sample phase currents and bus voltage, and the 180 MHz dual cores run field-oriented control in one core while a second handles fieldbus protocol stacks. Ethernet, CAN, and UART/USART interfaces integrate the node into industrial networks, and the 144-LQFP footprint enables compact drive boards. The -40C to +125C range supports cabinet and outdoor environments alike.
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Gateways and Networked Control Nodes
The MPC5741PK1AMLQ8R serves as a gateway MCU where CANbus, FlexRay, LINbus, and Ethernet must be bridged: its communication subsystem handles multiple protocol stacks concurrently on the dual 180 MHz e200z4 cores, one core per network domain for isolation. The 1MB flash stores protocol firmware and diagnostic data, and the 128KB SRAM buffers message queues. Typical implementations place the MCU between transceiver stages for each bus, with the -40C to +125C rating supporting underhood or exterior mounted modules. The 3.3V supply simplifies integration with standard automotive power trees.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC5741PK1AMLQ8R – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | SPC5741PK1AMLQ8R | SPC5741PK1AKLQ8R | SPC5741PK1AMLQ8 |
|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Frequency | 2 x e200z4, 180 MHz | 2 x e200z4, 180 MHz | 2 x e200z4, 180 MHz | 2 x e200z4, 180 MHz |
| Flash Memory | 1MB (1M x 8) | 1MB (1M x 8) | 1MB (1M x 8) | 1MB (1M x 8) |
| SRAM | 128KB | 128KB | 128KB | 128KB |
| Peripherals | 4x ADC, 2x PWM, 2x SENT | 4x ADC, 2x PWM, 2x SENT | 4x ADC, 2x PWM, 2x SENT | 4x ADC, 2x PWM, 2x SENT |
| Device Grade | M grade (per MPN suffix) | M grade, reel packaging | K grade (different temp/speed bin) | M grade, tray packaging |
| Lifecycle Status | Active | Active (DigiKey stock) | Active (DigiKey stock) | Active (Mouser stock) |
Wichtigste Unterscheidungsmerkmale
- Dual-core e200z4 architecture for ASIL-D safety partitioning (vs. SPC5741PK1AKLQ8R)
- Broadest in-class connectivity set (CAN, Ethernet, FlexRay, LIN, SPI, UART) (vs. SPC5741PK1AMLQ8)
- Honest cross-brand limitation: no pin-compatible competitor exists (vs. Infineon SAK-TC297TP (AURIX))
Designhinweise
The MPC5741PK1AMLQ8R operates from a 3.3V supply, but MPC57xx-class devices typically also require additional core and IO rails per the reference manual power tree. Use a dedicated automotive safety PMIC or sequenced LDO/buck chain and follow NXP's recommended power sequencing to avoid latch-up during startup. Place 100nF ceramic decoupling capacitors at each supply pin pair plus bulk capacitance near the package; verify rail ripple against the datasheet VDD limits at 180 MHz operation where dynamic current peaks occur.
At 180 MHz dual-core operation, the 144-LQFP (20x20 mm) package dissipates heat primarily through its leads. The operating range is -40C to +125C junction, so compute worst-case junction temperature from your application current draw and ambient using the package theta-JA from the MPC5741P datasheet. For underhood ECUs near the +125C ambient limit, minimize concurrent peripheral activity or reduce core clock in thermal folds; provide thermal vias and 2oz copper pours on the PCB to spread heat.
The MPC5741PK1AMLQ8R and SPC5741PK1AMLQ8R are the same silicon under different naming; always confirm which designation your supplier ships. The K-grade SPC5741PK1AKLQ8R is footprint-identical but has a different device grade - do not substitute grades in safety applications without re-qualification. For ISO 26262 ASIL-D designs, follow the MPC5741P safety manual lockstep/partitioning guidelines and enable both e200z4 cores' safety mechanisms; a single-core configuration invalidates the assumed safety concept.
Compliance-Informationen
The SPC-prefix designation (SPC5741PK1AMLQ8R) indicates NXP automotive-qualified product; specific RoHS/REACH declarations should be pulled from the NXP product page ecodata. Per Alldatasheet listing, the family is suitable for ISO 26262 ASIL-D chassis and safety applications.
