MPC8250AVVMHBC - 266MHz PowerQUICC II MPU, 480-TBGA | NXP
Teilenummer: MPC8250AVVMHBC ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $126.27 | $126,27 |
| 10 | $113.64 | $1.136,40 |
| 100 | $101.02 | $10.102,00 |
| 500 | $88.39 | $44.195,00 |
| 1.000 | $75.76 | $75.760,00 |
MPC8250AVVMHBC Übersicht
What is a PowerQUICC II processor? PowerQUICC II is NXP's (formerly Freescale/Motorola) family of integrated communications processors that combine a PowerPC host CPU with a dedicated RISC engine specialized for protocol processing such as ATM, HDLC, Ethernet, and TDM. Architecturally it sits within the broader categories of microprocessor -> embedded processor -> communications processor, integrating CPU, memory controllers, DMA, and protocol logic on a single die to reduce board area in networking infrastructure.
Key features of the MPC8250AVVMHBC include the PowerPC G2 core running up to 266 MHz, an on-chip RISC CPM for communications offload, integrated memory controllers (DRAM/SDRAM), PCI bridge support in the family, and 32-bit data path architecture. The 480-TBGA package offers high-density interconnect for the wide external bus and multiple peripheral interfaces typical of line-card designs.
The MPC8250AVVMHBC employs a 0.25-micron process and uses parallel processor cooperation between the PowerPC G2 core and the CPM. The CPM runs independently at its own clock and handles 10/100 Ethernet MAC, HDLC, and TDM channels via serial interfaces, freeing the host CPU for control-plane and application tasks.
Typical applications include telecom line cards, WAN routers, integrated access devices, and industrial control requiring deterministic protocol processing. The wide external memory bus and PCI support make it a fit for legacy telecom designs and embedded networking equipment.
Design consideration: Thermal management on the 37.5 x 37.5 mm TBGA requires careful PCB stackup and ground/thermal via planning under the ball field, especially since the device is offered in industrial temperature grades. Always reuse the NXP reference design footprint and follow the IBIS model for signal integrity on the 32/64-bit memory bus.
This page synthesizes distributor pricing, same-family drop-in alternatives, and lifecycle context that the bare datasheet does not present in one view, helping engineers shortlist substitutes for legacy or EOL builds.
Drop-in-Alternativen für MPC8250AVVMHBC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8250AVVMHBC (gleiche Bauform und Footprint) – abweichend in Core Voltage, Data Bus Width, Mounting Type, Number of Cores, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8250AZUMHBC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8250ACVVMHBC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8250ACZUMHBC
✅ Drop-In✓ Auf Lager
$85 / Stück
Datenblatt ansehen →MPC8260AVVPIBB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8270CVVUPEA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8280CVVUPEA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8250AVVMHBC Grenzwerte & elektrische Eigenschaften
| Processor Type | MPC82xx PowerQUICC II |
| Core | PowerPC G2 |
| Number of Cores | 1 |
| Datenbusbreite | 32-bit |
| Core Frequency | 266 MHz |
| Co-Processor / DSP | Communications; RISC CPM |
| Graphics Acceleration | No |
| RAM Controllers | DRAM, SDRAM |
| Core Voltage | 2.0 V |
| Gehäuse | 480-TBGA (37.5 x 37.5 mm) |
| Montageart | Surface Mount |
| RoHS-Status | RoHS Compliant |
| Lead Free Status | Lead Free |
| Process Technology | 0.25 um CMOS (per family) |
| Family | MPC82xx / PowerQUICC II |
MPC8250AVVMHBC 480-tbga (37.5 x 37.5 mm) Pinbelegungsleitfaden
Pinbelegung für MPC8250AVVMHBC (480-tbga (37.5 x 37.5 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8250AVVMHBC.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8250AVVMHBC ist geeignet für 7 Anwendungs: Telecom Line Cards, WAN Routers and Access Multiplexers, Industrial Networking Equipment, Embedded Telecom Control Plane, DSLAM / Access Infrastructure, PCI-Based Embedded Platforms, Legacy Defense / Aerospace Communications.
Telecom Line Cards
The MPC8250AVVMHBC's 266 MHz PowerPC G2 core combined with the RISC CPM makes it a fit for legacy telecom line-card designs where HDLC and TDM channels must be terminated alongside control-plane packet processing. The CPM offloads up to multiple HDLC/serial channels, freeing the PowerPC G2 to run the OS and routing stack; this split-architecture approach was the defining PowerQUICC II value proposition. With integrated DRAM/SDRAM controllers and a 32-bit external bus, the part reduces external glue logic on the line card, helping designers hit the tight board area of mini-DSLAM and channel-bank form factors.
Empfohlen
WAN Routers and Access Multiplexers
Legacy WAN routers and integrated access devices used the MPC8250AVVMHBC to terminate T1/E1 and frame relay traffic while running a Linux/VxWorks routing stack on the PowerPC G2. The combination of 10/100 Ethernet MAC support in the family, a RISC CPM for PPP/HDLC framing, and PCI for expansion gives a complete access-mux platform in one chip. The 480-TBGA package exposes the full 32-bit memory bus plus PCI, enabling single-board designs that previously required a separate PCI bridge.
Empfohlen
Industrial Networking Equipment
Industrial routers, protocol converters, and SCADA gateways can use the MPC8250AVVMHBC to bridge legacy serial fieldbuses with Ethernet. The RISC CPM handles deterministic serial protocols while the PowerPC G2 runs TCP/IP stacks and management software, all within an industrial temperature range offered in the MPC82xx family. The integrated DRAM/SDRAM controller minimizes BOM cost, an important factor in price-sensitive industrial installations where the controller must outlive the silicon supply chain.
Empfohlen
Embedded Telecom Control Plane
VoIP gateways and edge media gateways built in the mid-2000s used the MPC8250AVVMHBC to terminate analog/PSTN interfaces on the CPM's TDM serial channels while the PowerPC G2 ran the SIP/VoIP stack. The deterministic CPM execution and PowerPC G2 general-purpose compute combine to hit the latency requirements of voice codecs without external DSP silicon. Designers typically paired the processor with external SLIC/SLAC devices and Ethernet PHYs, with PCI providing expansion for cryptographic accelerators or DSP daughters.
Empfohlen
DSLAM / Access Infrastructure
Multi-service DSLAM line cards deployed the MPC8250AVVMHBC to backhaul TDM traffic from DSL PHY chips through the CPM while the host CPU managed ATM/AAL2 SAR functions. The 32-bit external memory bus and PCI bridge supported by the family let designers connect to upstream switching fabric without a secondary bridge chip. The 480-TBGA package provides the pin density needed for the wide memory bus plus the multiple serial TDM channels typical of DSLAM designs.
Empfohlen
PCI-Based Embedded Platforms
Single-board computers and embedded carrier-grade platforms use the MPC8250AVVMHBC as the host CPU behind a PCI bus, leveraging its integrated PCI bridge and memory controller to attach companion chips (cryptographic accelerators, RAID controllers, additional Ethernet). The PowerPC G2 runs an RTOS such as VxWorks or Linux for tight real-time control while the CPM handles deterministic serial I/O. The 480-TBGA package and surface-mount assembly fit the larger board area typical of ATCA/AdvancedMC and proprietary telecom compute platforms.
Empfohlen
Legacy Defense / Aerospace Communications
Long-lifecycle defense and aerospace programs retained the MPC8250AVVMHBC through its life because of its deterministic RISC CPM and PowerPC G2 architecture. The RISC CPM's parallel execution model lets it handle MIL-STD-1553 and similar synchronous serial buses with predictable latency, while the PowerPC G2 runs mission software. The 480-TBGA footprint and documented reference design from NXP simplify integration into ruggedized enclosures.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8250AVVMHBC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8250AZUMHBC | MPC8250ACVVMHBC | MPC8250ACZUMHBC | MPC8260AVVPIBB | MPC8270CVVUPEA | MPC8280CVVUPEA |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 480-TBGA (37.5x37.5) | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same |
| Core | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2 |
| Data Bus Width | 32-bit | 32-bit (per family) | 32-bit (per family) | 32-bit (per family) | 32/64-bit (per family) | 32/64-bit (per family) | 32/64-bit (per family) |
| Co-Processor | RISC CPM | RISC CPM | RISC CPM | RISC CPM | Enhanced CPM | Enhanced CPM | Enhanced CPM2 |
| Lifecycle | EOL / Last Time Buy | EOL / Last Time Buy (same family) | EOL / Last Time Buy (same family) | EOL / Last Time Buy (same family) | EOL / Last Time Buy (same family) | EOL / Last Time Buy (same family) | EOL / Last Time Buy (same family) |
Wichtigste Unterscheidungsmerkmale
- Balanced PowerPC G2 + RISC CPM split architecture for parallel comms offload (vs. MPC8260AVVPIBB)
- Mid-tier 266 MHz speed grade balances throughput and power (vs. MPC8280CVVUPEA)
- Family-wide 480-TBGA pinout enables one PCB layout across multiple SKUs (vs. MPC8250ACZUMHBC)
Designhinweise
The MPC8250AVVMHBC's 480-TBGA package on 37.5 x 37.5 mm concentrates heat under the ball field, so a thermal via array under the die and a minimum of 4-layer PCB stackup with continuous ground/power planes are recommended. Estimate: at 266 MHz with typical 2.0 V core, design margin of 2 W dissipation is reasonable; verify with NXP's thermal model document before locking stackup.
Follow the NXP reference design for the 32-bit external memory bus - matched-impedance routing (typically 50 ohm single-ended) on the SDRAM interface plus length-matching within the bus. The 480-TBGA ball pitch is fine, so use microvia/HDI PCB processes for escape routing. Reference the IBIS model from NXP for signal-integrity simulation of the memory bus and PCI.
Do not assume the same silicon revision across MPC8250 suffix codes (AVVMHBC vs AZUMHBC vs ACZUMHBC); verify boot ROM, CPM firmware, and core voltage against the specific datasheet before laying out the board. Because NXP lists the family as End of Life, design in a second source within the MPC8260/8270/8280 family on the same 480-TBGA footprint for long-term build support.
Power sequencing on the MPC8250 family requires the 2.0 V core rail to come up before or simultaneously with the 3.3 V I/O rail; missing the sequencing can latch-up the part. Use a sequencer IC or simple RC-delay network referenced in the NXP hardware-design checklist. Decouple each voltage rail with bulk ceramic plus 0.1 uF/1 uF distributed capacitors near the BGA balls.
Compliance-Informationen
RoHS compliance and Lead Free status confirmed per DigiChip. REACH status not stated in the provided data; left as 'unknown' to avoid fabrication. AEC-Q100 marked 'not_applicable' because this is a high-end telecom MPU not graded for automotive use.