MPC8271CVRPIEA - PowerPC G2_LE MPU 300 MHz 516-PBGA | NXP
Teilenummer: MPC8271CVRPIEA ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $88.5 | $885,00 |
| 100 | $79 | $7.900,00 |
| 500 | $71.5 | $35.750,00 |
| 1.000 | $65 | $65.000,00 |
MPC8271CVRPIEA Übersicht
A microprocessor (MPU) is a single-chip CPU that integrates the central processing unit with cache, a memory controller and various system peripherals. The MPC82xx family specifically targets communications infrastructure by combining a PowerPC e600 core-derived G2_LE core with system interfaces such as PCI, local bus, UART, I2C, and SPI. Positioned in the broader taxonomy, this part sits within: MPU -> microprocessor -> embedded processor -> integrated circuit -> semiconductor.
Key features include the 32-bit PowerPC G2_LE core, on-chip L1 cache, integrated memory controller supporting DDR (per part derivative), 300 MHz core clock, 516-ball PBGA package, JTAG/OnCE debug interface, and hardware encryption acceleration via the SEC engine on cryptographic derivatives. The 570 MIPS rating indicates strong integer throughput for packet processing tasks.
Architecturally, the MPC8271 uses a multi-bus architecture with separate system, local, and peripheral buses. The peripheral block reuses the QUICC Engine technology widely deployed in telecom equipment, delivering DMA-driven serial protocol handling. This makes the device suitable for routers, switches, and industrial control where deterministic interrupt latency and protocol offload are required.
Typical applications include wired and wireless base stations, industrial networking gateways, line cards, RAID/storage controllers, and embedded telecommunications platforms. The wide peripheral set also benefits SOHO router and firewall designs replacing legacy PowerQUICC II implementations.
When designing with this device, note the 516-ball PBGA (27x27 mm) requires a multi-layer PCB with controlled-impedance routing for DDR memory and PCI buses. Verify thermal management using theta-JA from the datasheet and account for industrial temperature grade where applicable.
This page synthesizes distributor pricing, lifecycle notes, and practical design considerations not consolidated in the original NXP datasheet, alongside 516-PBGA cross-reference alternatives to support long-life industrial designs.
Drop-in-Alternativen für MPC8271CVRPIEA – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8271CVRPIEA (gleiche Bauform und Footprint) – abweichend in Package, Data Bus Width, Core Architecture, Performance.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8270CVRPIEA
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8280CVVUPEA
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8271CZUUPEA
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8271CVRMITA
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8271CVVPIEA
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8271CVRPIEA Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Family | MPC82xx PowerQUICC II |
| Core | PowerPC G2_LE (32-bit) |
| Number of Cores | 1 |
| Datenbusbreite | 32-bit |
| Maximale Taktfrequenz | 300 MHz |
| Performance | 570 MIPS |
| Instruction Set Architecture | PowerPC |
| Gehäuse | 516-PBGA (27x27 mm) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +85C (Industrial) |
| Integrated Peripherals | PCI, Local Bus, UART, I2C, SPI, DMA |
| Debug Interface | JTAG / OnCE |
| Encryption Accelerator | SEC engine (on cryptographic derivatives) |
MPC8271CVRPIEA Pin-Konfiguration
| Pin A1 | VDD — Core voltage supply (per datasheet) |
| Pin A2 | VSS — Ground |
| Pin B1 | PCI_AD0 — PCI bus address/data line 0 |
| Pin B2 | PCI_AD1 — PCI bus address/data line 1 |
| Pin C1 | PCI_AD2 — PCI bus address/data line 2 |
| Pin C2 | PCI_AD3 — PCI bus address/data line 3 |
| Pin D1 | PCI_FRAME — PCI cycle frame signal |
| Pin D2 | PCI_TRDY — PCI target ready signal |
| Pin E1 | PCI_IRDY — PCI initiator ready signal |
| Pin E2 | PCI_STOP — PCI stop signal |
| Pin F1 | PCI_DEVSEL — PCI device select signal |
| Pin F2 | PCI_IDSEL — PCI initialization device select |
| Pin G1 | PCI_REQ — PCI bus request |
| Pin G2 | PCI_GNT — PCI bus grant |
| Pin H1 | LBC_LA0 — Local bus address line 0 |
| Pin H2 | LBC_LA1 — Local bus address line 1 |
| Pin J1 | LBC_LD0 — Local bus data line 0 |
| Pin J2 | LBC_LD1 — Local bus data line 1 |
| Pin K1 | TCK — JTAG test clock |
| Pin K2 | TMS — JTAG test mode select |
Typische Anwendungen
MPC8271CVRPIEA ist geeignet für 6 Anwendungs: Wired Telecommunications Line Cards, Industrial Networking Gateways, Wireless Base Station Controllers, RAID and Storage Controllers, SOHO Routers and Firewalls, Embedded Industrial Control Platforms.
Wired Telecommunications Line Cards
The MPC8271CVRPIEA fits wired telecommunications line cards because its PowerPC G2_LE core delivers 570 MIPS at 300 MHz for packet forwarding, while the integrated PCI and local-bus interfaces connect directly to framer and PHY ASICs without external bridge chips. Per the NXP PowerQUICC II architecture, the CPM block handles serial protocols (UART, I2C, SPI) with DMA offload, freeing the CPU core for higher-layer processing. The 516-PBGA package and industrial -40C to +85C temperature grade allow deployment in CO (central office) and outdoor DSLAM cabinets. Same-family pin-compatible alternatives ease lifecycle extension once the standard part is obsolete.
Empfohlen
Industrial Networking Gateways
The MPC8271CVRPIEA serves industrial networking gateways by combining 300 MHz CPU throughput with hardware DMA on serial interfaces, which is essential for deterministic protocol conversion between Ethernet, RS-485, and CAN-style fieldbuses. The 32-bit PowerPC G2_LE core runs Linux or VxWorks BSPs validated across long product lifecycles in factory automation. The 516-PBGA package supports multi-layer PCBs with controlled impedance for Ethernet PHY connections, and the industrial temperature grade handles factory floor thermal stress. Pin-compatible NXP MPC8270/MPC8280 variants allow multi-SKU product lines sharing one PCB layout.
Empfohlen
Wireless Base Station Controllers
The MPC8271CVRPIEA suits wireless base station controllers where its 570 MIPS integer throughput and PowerQUICC II peripheral set accelerate MAC-layer processing and timing-critical baseband hand-off. The integrated PCI bus connects to DSP co-processors while the local bus glues to ASIC/FPGA accelerators. Per the NXP datasheet, the 516-PBGA package thermal envelope supports extended operation in climate-controlled base-station enclosures. Drop-in compatibility with the MPC8280 family lets designers scale CPM feature sets without PCB rework as base-station roadmaps evolve.
Empfohlen
RAID and Storage Controllers
The MPC8271CVRPIEA's 300 MHz PowerPC core, 32-bit data path, and PCI/local-bus interfaces make it appropriate for RAID and storage controller cards managing multiple SAS/SATA channels. The integrated DMA engines from the QUICC Engine block offload block-level data movement from the CPU, increasing IOPS while keeping the main core available for metadata and caching algorithms. The 516-PBGA 27x27 mm footprint accommodates dense PCB layouts with multiple PCIe-to-PCI bridge chips and DDR memory. Same-family NXP drop-ins ease second-source qualification for long-lifecycle storage platforms.
Empfohlen
SOHO Routers and Firewalls
The MPC8271CVRPIEA powers SOHO router and firewall appliances by combining the 32-bit PowerPC G2_LE core with hardware-accelerated packet inspection and multiple UART/Ethernet interfaces. The 570 MIPS performance is sufficient for stateful inspection up to gigabit wire speeds when paired with external PHY and switch ASICs. The 516-PBGA package allows compact appliance form factors while the industrial temperature option supports deployment in non-temperature-controlled wiring closets. Cross-reference alternatives from the MPC8270/MPC8280 family simplify BOM risk management for consumer-grade volumes.
Empfohlen
Embedded Industrial Control Platforms
The MPC8271CVRPIEA is well-matched to embedded industrial control platforms where deterministic real-time response, industrial temperature range, and long-life BSP support are priorities. Its rich peripheral block (UART, I2C, SPI, DMA, PCI) drives motor controllers, sensor concentrators, and human-machine interfaces from a single IC, reducing BOM cost and PCB complexity. The 516-PBGA 27x27 mm footprint fits into compact industrial enclosures while supporting multi-layer PCB stack-ups required for signal integrity. Same-package NXP alternatives give procurement teams multi-source options for 10+ year deployments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8271CVRPIEA – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8270CVRPIEA | MPC8280CVVUPEA | MPC8271CZUUPEA | MPC8271CVRMITA | MPC8271CVVPIEA |
|---|---|---|---|---|---|---|
| Package | 516-PBGA (27x27 mm) | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE |
| Maximum Clock Frequency | 300 MHz | 200 MHz (lower) | 300 MHz (same) | 300 MHz (same) | 300 MHz (same) | 300 MHz (same) |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Encryption Accelerator (SEC) | Per suffix variant | Per suffix variant | Per suffix variant | Per suffix variant | Per suffix variant | No SEC (non-crypto variant) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Integrated Peripherals | PCI, Local Bus, UART, I2C, SPI, DMA | PCI, Local Bus, UART, I2C, SPI, DMA | PCI, Local Bus, UART, I2C, SPI, DMA, extended CPM | PCI, Local Bus, UART, I2C, SPI, DMA | PCI, Local Bus, UART, I2C, SPI, DMA | PCI, Local Bus, UART, I2C, SPI, DMA |
| Lifecycle Status | Obsolete (Rochester continued supply) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Highest-frequency standard variant in the MPC8271 family (300 MHz) (vs. MPC8270CVRPIEA)
- Extended CPM feature set vs base MPC8271 (vs. MPC8280CVVUPEA)
- PowerQUICC II instruction-set compatibility across the 516-PBGA platform (vs. QorIQ P1010 (cross-package))
Designhinweise
The 516-PBGA (27x27 mm) package has a fine ball pitch that requires 6-layer or 8-layer PCB stack-up with via-in-pad technology. Per the NXP layout guidelines, escape routing uses dog-bone or microvia fan-outs from each BGA ball to inner layers. Allocate at least 4 solid power/ground planes to deliver clean 1.5V core and 3.3V I/O rails while suppressing switching noise. Matched-length impedance routing for DDR and PCI buses is critical to avoid timing violations.
At 300 MHz the MPC8271CVRPIEA dissipates up to approximately 5W under typical industrial workloads. Estimated: with theta-JA around 12 C/W (still-air PBGA), junction temperature rises roughly 60C above ambient - within the 85C industrial limit at 25C ambient. For sealed enclosures with no airflow, the package thermal pad must be soldered to a copper heat spreader tied to inner ground planes. Compute fresh values from the latest datasheet before sign-off.
Do not assume the SEC crypto engine is present - it depends on the suffix letter (P-derivative without SEC, C-derivative with SEC). Verify HRESET, SRESET, and PORESET sequencing in hardware before firmware boot to avoid lock-up states common on cold PowerPC boards. JTAG/OnCE pins TCK, TMS, TDI, TDO must be accessible for production board testing, and unused peripheral pins should be tri-stated through the RCW (Reset Configuration Word) rather than left floating.
Compliance-Informationen
Compliance details vary by date code and order code suffix; original datasheet markings and Rochester Electronics' continued-manufacturing documentation should be consulted for specific lot RoHS/lead-free status.