MPC8272VRPIEA557 - PowerQUICC II MPC8272 MPU 300MHz | NXP
Teilenummer: MPC8272VRPIEA557 ✗ AbgekündigtMPC8272VRPIEA557 Übersicht
A PowerQUICC II microprocessor is a member of the Power Architecture microprocessor family designed for embedded communications. It sits in the hierarchy of communications SoCs alongside the larger PowerQUICC III family, combining a general-purpose PowerPC 603e core with dedicated hardware acceleration for ATM, HDLC, Fast Ethernet MAC, and PCI bridging. This integration lets designers replace a host CPU plus multiple communication coprocessors with a single chip, simplifying board layout and lowering bill-of-materials cost in mid-range networking equipment.
Key features of the MPC8272VRPIEA557 include dual 10/100 Mbps Fast Ethernet controllers, a 32-bit PCI 2.2 interface, USB 2.0 (full-speed) with on-chip PHY, 60x bus to external memory, DDR SDRAM controller, and an FCC (Fast Communications Controller) bank that supports up to three HDLC/PPP/ATM channels. The on-chip 16 KB instruction cache and 16 KB data cache reduce external memory bandwidth pressure, and a dedicated CPM RISC engine offloads protocol processing from the main CPU.
Architecturally, the device combines a PowerPC 603e integer unit (single-issue, 7-stage pipeline) with the dedicated CPM co-processor clocked independently. This heterogeneous design optimizes throughput: the main CPU handles control plane and exception processing, while the CPM executes data-plane protocol engines. The integrated dual Fast Ethernet MACs and USB 2.0 controller shorten design cycles for SOHO router, DSLAM line card, and industrial gateway products.
Typical applications include integrated access devices (IADs), SOHO/SMB routers, DSL/cable modem gateways, VoIP media gateways, and industrial control with Ethernet. It is also used in legacy telecom line cards where deterministic serial channelization and PCI host bridging are required in a single device.
The 516-pin PBGA package has a thermal resistance that demands a multi-layer PCB with a thermal via array and adequate copper heatsinking under sustained full load. Designers should follow the AN2834 layout guide and ensure the DDR reference clock and 60x bus are length-matched per the MPC8272 hardware specifications to guarantee signal integrity above 100 MHz.
This page synthesizes current distributor stock, parametric alternatives, and datasheet-derived design notes not consolidated on a single manufacturer reference page.
Drop-in-Alternativen für MPC8272VRPIEA557 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
MPC8272CVRPIEA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8272VRPIEAA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8280VVPIEA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8272CZDIELA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8347EZUAGD
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1020NSE2HFB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8272VRPIEA557 Grenzwerte & elektrische Eigenschaften
| Part Number | MPC8272VRPIEA557 |
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC II |
| Core Architecture | PowerPC 603e + CPM |
| Core Clock Speed | 300 MHz |
| Operating Voltage - Core | 1.5 V |
| Operating Voltage - I/O | 3.3 V |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| Gehäuse / Bauform | 516-BFBGA, PBGA |
| Montageart | Surface Mount |
| Betriebstemperatur | 0C to +70C |
| Ethernet | 10/100 Mbps (2 MACs) |
| USB | USB 2.0 full-speed (1 port) |
| PCI | PCI 2.2, 32-bit |
| Serial Interfaces | FCC (HDLC/PPP), UART, SPI, I2C |
| Memory Controller | DDR SDRAM, 60x bus |
| RoHS-Status | Compliant (lead-free PBGA) |
MPC8272VRPIEA557 516-bfbga, pbga Pinbelegungsleitfaden
Pinbelegung für MPC8272VRPIEA557 (516-bfbga, pbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8272VRPIEA557.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8272VRPIEA557 ist geeignet für 6 Anwendungs: SOHO/SMB Router, DSLAM / Access Line Card, VoIP Media Gateway, Industrial Ethernet Gateway, Cable Modem Termination System Edge Card, Legacy Telecom Line Card.
SOHO/SMB Router
The MPC8272VRPIEA557's dual integrated 10/100 Fast Ethernet MACs, USB 2.0 host port, and PCI 2.2 interface make it an ideal host processor for SOHO/SMB router designs. The PowerPC 603e core at 300 MHz runs an embedded Linux networking stack, while the dedicated CPM offloads packet forwarding and PPPoE termination, freeing the main CPU for firewall/NAT processing. The on-chip DDR SDRAM controller removes the need for an external memory bridge, and the integrated USB 2.0 host enables plug-and-play 3G/LTE modem dongles without a companion chip. Compared to a discrete host CPU plus communication coprocessor solution, this single-chip architecture reduces BOM cost, PCB area, and firmware complexity.
Empfohlen
DSLAM / Access Line Card
Inside a DSLAM or central-office access line card, the MPC8272VRPIEA557 serves as the control-plane processor with up to three FCC channels aggregating HDLC/PPP/ATM traffic from subscriber lines. The 300 MHz core handles management and per-subscriber QoS shaping, while the CPM hardware engines deliver deterministic line-rate throughput with deterministic jitter. The 32-bit PCI 2.2 interface connects to upstream DSL framer chipsets, and the 60x bus links to shared DDR SDRAM for packet buffering. Compared to software-only solutions, the integrated CPM offload keeps the line card within its thermal budget while maintaining 256+ subscriber line density.
Empfohlen
VoIP Media Gateway
VoIP media gateways benefit from the MPC8272VRPIEA557's combination of dual Fast Ethernet MACs, USB host, FCC/HDLC channels, and PCI expansion for telephony interface cards. The PowerQUICC II architecture dedicates the CPM block to DSP-like time-critical voice packet processing, while the CPU runs the SIP/RTP stack and call control logic. A 300 MHz core comfortably handles 32+ concurrent G.711/G.729 voice channels with hardware RTP timestamp insertion. Compared to a discrete DSP plus ARM host design, the integrated approach simplifies the firmware build and reduces bill-of-materials cost by 25-35% in mid-range gateway products.
Empfohlen
Industrial Ethernet Gateway
Industrial protocol gateways (Modbus TCP, EtherNet/IP, PROFINET bridges) use the MPC8272VRPIEA557's dual Ethernet MACs to terminate both the industrial field-network and the supervisory LAN simultaneously. The FCC controllers and UART/SPI/I2C channels interface directly to industrial sensors and motor drives without external protocol converters. The 0C-to-70C commercial temperature range covers most factory floor enclosures; for harsh environments, the extended -40C-to-85C variant (suffix 'CV'/'CZDIELA') can be substituted as a drop-in. Compared to a generic ARM Cortex-A5 design, the PowerQUICC II silicon offers superior deterministic real-time response due to its hardware-protocol offload and dedicated CPM engine.
Empfohlen
Cable Modem Termination System Edge Card
Edge cards in a CMTS headend use the MPC8272VRPIEA557 to terminate downstream DOCSIS MAC channels, offload downstream encryption, and aggregate upstream burst traffic from cable subscribers. The USB 2.0 host enables local diagnostics via USB peripherals and field-service test gear. The 300 MHz core combined with the hardware HDLC offload in CPM delivers line-rate performance for DOCSIS 2.0/3.0 channel bonding, while keeping power dissipation within the line-card thermal envelope. Compared to a fan-cooled x86 edge card, the PowerQUICC II solution operates fan-less at elevated ambient temperatures.
Empfohlen
Legacy Telecom Line Card
For legacy T1/E1 line cards and PBX backhaul, the MPC8272VRPIEA557 provides the serial TDM channels, HDLC controllers, and time-slot assigners required to bridge legacy PSTN circuits to packet networks. The integrated FCC block replaces up to three external framer chips with on-chip support for PPP/MLPPP, reducing both PCB area and BOM cost. The PowerPC 603e core runs the call-processing software stack while the CPM executes the real-time channelization. Compared to legacy designs using discrete PowerPC 860 plus multi-chip glue logic, the MPC8272VRPIEA557 integrates everything into one BGA-516 package, simplifying manufacturing and field service.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8272VRPIEA557 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8272CVRPIEA | MPC8272VRPIEAA | MPC8280VVPIEA | MPC8272CZDIELA | MPC8347EZUAGD | P1020NSE2HFB |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-BFBGA (PBGA) | 516-BFBGA (PBGA) - same | 516-BFBGA (PBGA) - same | 516-BFBGA (PBGA) - same | 516-BFBGA (PBGA) - same | 516-BFBGA (PBGA) - same | 516-BFBGA (PBGA) - same |
| Core Clock | 300 MHz | 300 MHz | 300 MHz | 333 MHz | 300 MHz | 266-400 MHz | 800 MHz dual-core |
| Core Architecture | PowerPC 603e + CPM | PowerPC 603e + CPM | PowerPC 603e + CPM | PowerPC 603e + CPM | PowerPC 603e + CPM | e300 + QUICC Engine | e500 dual-core |
| Ethernet | 2x 10/100 Mbps | 2x 10/100 Mbps | 2x 10/100 Mbps | 1x 10/100 + 1x Gbit | 2x 10/100 Mbps | Up to 3x Gbit (QUICC Engine) | 2x Gbit w/ TSEC |
| USB | USB 2.0 FS host | USB 2.0 FS host | USB 2.0 FS host | USB 2.0 FS host | USB 2.0 FS host | USB 2.0 (via ULPI/UTMI) | USB 2.0 + ULPI |
| PCI | PCI 2.2, 32-bit | PCI 2.2, 32-bit | PCI 2.2, 32-bit | PCI 2.2, 32-bit | PCI 2.2, 32-bit | PCI/PCI-X | PCIe + PCI |
| Operating Temperature | 0C to +70C | 0C to +70C | 0C to +70C | 0C to +70C | -40C to +85C | 0C to +70C | -40C to +105C |
| Lifecycle | NRND | NRND | NRND | NRND | NRND | Active | Active |
Wichtigste Unterscheidungsmerkmale
- Integrated dual Fast Ethernet MAC plus USB 2.0 host on a single 300 MHz PowerQUICC II die (vs. MPC8280VVPIEA)
- Drop-in 516-PBGA footprint across the MPC8272 family including 300/333 MHz variants (vs. P1020NSE2HFB)
- Industrial-temperature drop-in via -40C to +85C variant on the same BGA-516 land pattern (vs. MPC8272CVRPIEA)
Designhinweise
Estimated: at 1.5 V core supply drawing 1.8 A (typical 300 MHz PowerQUICC II load) and 3.3 V I/O at 250 mA, total power dissipation under worst-case I/O toggling is approximately 3.5 W. The 516-PBGA package dissipates this through the die flag to a thermal via array - allocate at least a 25 mm x 25 mm copper land array and 16-25 vias under the die, plus 100 mm^2 of inner-layer keepout. A small clip-on heatsink is recommended for fan-less edge-card designs. Place the IC near the airflow inlet if active cooling is used.
Follow NXP application note AN2834 (PowerQUICC II design guide) for BGA fan-out: use a 0.8 mm pitch microvia stack-up (4-2-4 minimum layer count), with the die flagged to a continuous ground plane on layer 2. Keep DDR address/command traces within 25 mm, length-matched to +/- 1 mm; data lines to +/- 0.5 mm. Place the 60x bus termination resistors at the IC end and the SDRAM end with a stub length under 5 mm. The USB 2.0 DP/DM lines require 90-ohm differential routing and ESD protection such as USBLC6-2SC6 near the connector.
Do not skip the core 1.5 V decoupling - the MPC8272VRPIEA557 requires 4x 0.1 uF X7R capacitors + 2x 10 uF ceramic bulk plus one 220 uF tantalum/poly electrolytic within 5 mm of the core supply pins, with separate ground vias. Also, the USB 2.0 controller shares pins with FCC1; if your design uses both peripherals on the same port you must program the pin-mux register correctly in U-Boot prior to USB enumeration. Validate the JTAG chain against BSDL on first prototype builds to detect BGA solder defects early.
Compliance-Informationen
Per NXP product page the part is supplied in lead-free PBGA-516 and RoHS compliant. REACH and halogen-free declarations should be requested via NXP's compliance portal. Not AEC-Q100; this is a commercial/industrial networking processor.
