MPC8308VMADD - PowerQUICC II Pro 266MHz SoC | NXP
Teilenummer: MPC8308VMADD ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $42.85 | $42,85 |
| 10 | $39.5 | $395,00 |
| 100 | $35.1 | $3.510,00 |
| 500 | $31.2 | $15.600,00 |
| 1.000 | $28.45 | $28.450,00 |
MPC8308VMADD Übersicht
A PowerQUICC II Pro SoC is an integrated communications processor that combines a general-purpose Power Architecture CPU with hardware accelerators and high-speed serial interfaces, designed to consolidate what previously required a host CPU plus several interface ASICs into a single device. Compared with discrete CPU-plus-MAC or CPU-plus-PHY designs, an MPC8308-class SoC reduces board area, BOM cost, and power consumption by absorbing Gigabit Ethernet MACs, PCIe endpoint/root complex logic, DDR2 SDRAM control, and USB into one BGA package. The result is a turnkey platform for low-cost, networked embedded appliances.
Key features of the MPC8308VMADD include a 32-bit single-issue e300c3 core with MMU and separate 16 KB/16 KB instruction and data caches, hardware DDR2 SDRAM controller up to 266 MHz, dual integrated 10/100/1000 Mbps Ethernet MACs (RGMII), one PCI Express x1 link, USB 2.0 (Host or Device), local bus, and two UARTs. An integrated QUICC Engine block assists with TDM and packet processing, while security features include basic cryptographic accelerators. Industrial-grade variants (VMADx suffix) operate from 0 C to 105 C.
The MPC8308VMADD architecture connects the CPU to a multi-channel DDR2 memory controller via a 64-bit coherence fabric, with peripheral traffic arbitrated through configurable on-chip buses. The integrated Gigabit Ethernet MACs use RGMII to external PHYs, eliminating the need for an external switch IC in small-port gateways. Compared with higher-tier PowerQUICC II Pro parts, the MPC8308 drops the second CPU core and trims cache size, achieving lower power for cost-sensitive designs.
Typical applications include smart grid home energy gateways, industrial data concentrators, wireless LAN access points, wireless femto base stations, consumer printers, and industrial controllers. The 0 C to 105 C operating range (V variant) supports deployment in enclosed industrial cabinets without active cooling.
When designing with this device, allocate the bottom-side BGA escape region with at least 0.8 mm via-in-pad microvias and 4-layer stack-up to break out the 473-ball map. Multiple voltage rails (1.0 V core, 1.8 V DDR2 VTT, 2.5 V/3.3 V I/O) require careful sequencing - consult the NXP hardware specification for POR and reset timing.
Drop-in-Alternativen für MPC8308VMADD – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8308VMADD (gleiche Bauform und Footprint) – abweichend in Manufacturer, Memory Controller, Mounting Type, Operating Temperature, PCI Express.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8308CVMADD
✅ Drop-In✓ Auf Lager
$17.6 / Stück
Datenblatt ansehen →MPC8308VMAGDA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8308CVMAGDA
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8309VMAGDDA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8308VVADD
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8308VMADD Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors |
| Series / Family | PowerQUICC II Pro - MPC8308 |
| Core Architecture | Power Architecture e300c3 (32-bit) |
| Core Count | 1 |
| CPU Frequency | 266 MHz |
| Operating Voltage (Core) | 1.0 V |
| Operating Voltage (I/O) | 1.8 V / 2.5 V / 3.3 V |
| Process Technology | 0.09 um CMOS |
| Memory Controller | DDR2 SDRAM up to 266 MHz |
| Integrated Ethernet | 2 x 10/100/1000 Mbps MAC (RGMII) |
| PCI Express | 1 x PCIe x1 link |
| USB | USB 2.0 (Host/Device) |
| Gehäuse | 473-MAP-BGA (19x19 mm) |
| Betriebstemperatur | 0 C to +105 C (Industrial) |
| Montageart | Surface Mount (BGA) |
MPC8308VMADD 473-map-bga (19x19 mm) Pinbelegungsleitfaden
Pinbelegung für MPC8308VMADD (473-map-bga (19x19 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8308VMADD.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8308VMADD ist geeignet für 6 Anwendungs: Smart Grid Home Energy Gateway, Industrial Data Concentrator, Wireless Femto Base Station, Wireless LAN Access Point, Consumer Multi-Function Printer, Industrial Control and Factory Automation.
Smart Grid Home Energy Gateway
The MPC8308VMADD fits smart-grid home energy gateways because its dual Gigabit Ethernet MACs support the home-area network backhaul plus WAN uplink, while the QUICC Engine accelerates metering protocol termination (DLMS/COSEM, IEC 61850 fragments). The 1.0 V core and 1.8 V DDR2 controller keep idle power under typical residential deployment budgets. The 473-MAP-BGA footprint supports fanless industrial enclosures in the 0 C to +105 C industrial range, suitable for utility-meter basements where ambient temperatures climb in summer.
Empfohlen
Industrial Data Concentrator
As an industrial data concentrator, the MPC8308VMADD aggregates Modbus/TCP, PROFINET, and EtherNet/IP traffic across its PCIe x1 link and dual GbE MACs, offloading protocol parsing to the e300c3 core running at 266 MHz. The integrated DDR2 controller up to 266 MHz accommodates 256 MB to 1 GB of buffering for machine-floor telemetry burst capture. Industrial temperature grade (0 C to 105 C) plus the legacy local bus support legacy PLC interfaces without an external bridge IC.
Empfohlen
Wireless Femto Base Station
For wireless femto-cell base stations, the MPC8308VMADD handles 3G/4G small-cell PHY pre-processing on the e300c3 32-bit core clocked at 266 MHz while the QUICC Engine terminates TDM-over-packet backhaul. The USB 2.0 link serves the femto-radio module and the integrated PCIe x1 link connects to a host DSP. The single 473-MAP-BGA PCB footprint reduces the femto-cell footprint to a 50 mm square board, supporting the small-cell industry's ultralow-power, fanless design targets.
Empfohlen
Wireless LAN Access Point
The MPC8308VMADD is well-suited to enterprise wireless LAN access points because its PCIe x1 link connects to a Wi-Fi 5/6 chipset while the dual GbE MACs provide 2.4 GHz and 5 GHz radio backhaul uplinks. The DDR2 memory controller handles encryption throughput for WPA3/AES-GCMP at line rate, and the QUICC Engine offloads MAC housekeeping. The 0 C to 105 C industrial temperature rating supports ceiling-mounted AP deployments in warehouses and factories with elevated ambient temperatures.
Empfohlen
Consumer Multi-Function Printer
In networked multi-function printers (MFPs), the MPC8308VMADD acts as the printer system controller, driving the dual GbE MACs for gigabit print-server bandwidth, USB 2.0 for direct-print/USB-host scanner functions, and PCIe to the scanner ASIC. The DDR2 memory controller exposes 128 MB of scan-buffer RAM for high-DPI scan jobs. The 473-MAP-BGA with 0.09 um process keeps total power under 6 W typical - critical for ENERGY STAR compliant consumer printers.
Empfohlen
Industrial Control and Factory Automation
Within industrial control cabinets, the MPC8308VMADD integrates deterministic EtherNet/IP gateways via the integrated GbE MACs, real-time fieldbus bridging on the local bus, and secure boot firmware loadable over PCIe to external SPI NOR flash. The 0.09 um CMOS process yields low thermal dissipation, allowing full industrial load (0 C to +105 C) inside sealed IP67 enclosures without active cooling. The Power Architecture ISA plus legacy QUICC Engine provides drop-in continuity for legacy MPC860/MPC8260 code.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8308VMADD – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8308CVMADD | MPC8308VMAGDA | MPC8308CVMAGDA | MPC8309VMAGDDA | MPC8308VVADD |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 473-MAP-BGA (19x19) | 473-MAP-BGA (19x19) - same | 473-MAP-BGA (19x19) - same | 473-MAP-BGA (19x19) - same | 473-MAP-BGA (19x19) - same | 473-MAP-BGA (19x19) - same |
| CPU Core | e300c3 (32-bit) | e300c3 (32-bit) | e300c3 (32-bit) | e300c3 (32-bit) | e300c3 (32-bit) | e300c3 (32-bit) |
| CPU Frequency | 266 MHz | 266 MHz | 266 MHz | 266 MHz | 333 MHz | 266 MHz |
| Core Voltage | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V |
| Memory Controller | DDR2 up to 266 MHz | DDR2 up to 266 MHz | DDR2 up to 266 MHz | DDR2 up to 266 MHz | DDR2 up to 333 MHz | DDR2 up to 266 MHz |
| Ethernet MACs | 2 x 10/100/1000 (RGMII) | 2 x 10/100/1000 (RGMII) | 2 x 10/100/1000 (RGMII) | 2 x 10/100/1000 (RGMII) | 2 x 10/100/1000 (RGMII) | 2 x 10/100/1000 (RGMII) |
| PCIe Lanes | 1 x PCIe x1 | 1 x PCIe x1 | 1 x PCIe x1 | 1 x PCIe x1 | 1 x PCIe x1 | 1 x PCIe x1 |
| Operating Temperature | 0 C to +105 C (Industrial) | 0 C to +70 C (Commercial) | 0 C to +105 C (Industrial) | 0 C to +70 C (Commercial) | 0 C to +105 C (Industrial) | 0 C to +105 C (Industrial) |
Wichtigste Unterscheidungsmerkmale
- Industrial 0 C to +105 C temperature grade out of the box (vs. MPC8308CVMADD)
- Higher CPU throughput than entry-tier MPC8308 commercial parts (vs. MPC8308VVADD)
- Same package and lower CPU clock than higher-tier variant (vs. MPC8309VMAGDDA)
Designhinweise
Estimated: The 473-ball MAP-BGA package at 19x19 mm has a typical 0.8 mm ball pitch. Break out the BGA on at least a 4-layer PCB using 0.2 mm microvias in pad (or 0.25 mm dogbone fanouts) and 0.4 mm trace/space geometry on the top layer. Route DDR2, RGMII, and PCIe as length-matched groups with the reference impedance per the NXP hardware specification; allocate a continuous ground plane on layer 2 beneath the ball grid to suppress return-path discontinuities. Estimated cost increase for 6-layer vs 4-layer microvia is ~15%, but 6-layer gives a more robust solution.
Use a multi-rail sequencing PMIC (such as the LTC3567 or MAX1778) to enforce the required 1.0 V core before 1.8 V/2.5 V/3.3 V I/O ramp per the NXP power-on reset sequence. Place at least one 22 uF tantalum polymer + 100 nF X7R bypass pair within 5 mm of each Vdd island; the DDR2 VTT rail requires an isolated 0.5 A source or proper fly-by termination referenced to the on-chip VTT regulator disable. Power good on each rail must be OR-gated into the PORRESETn input to prevent e300c3 latch-up during cold start.
Estimated: At 1.0 V core with typical 6 W total SoC power, dissipation in still-air at 25 C on a 60x60 mm 4-layer PCB is approximately 50 C junction rise with no heatsink. In sealed enclosures running at full industrial 105 C ambient, derate Ethernet throughput or reduce CPU duty cycle to keep Tj below the maximum. Add 20-30 mm of copper pad heatsinking or a 1 mm pin-fin heatsink for outdoor deployments where ambient climb exceeds 85 C.
Do not populate the DDR2 VTT regulator unless your chosen memory topology requires it (the part supports internal VTT terminator mode). Boot ROM configuration pins are sampled only at POR - changing them requires full power cycling, not just reset. The USB PHY on this SoC shares the PCIe PHY's transceiver block; never enable both simultaneously on adjacent pins without proper impedance isolation, or signal integrity degrades above 250 MHz.
Compliance-Informationen
RoHS compliance not explicitly stated in the Verified Web Data; the FindIC datasheet entry shows 473-pin MAP-BGA but does not specify lead-free or RoHS status. Contact NXP via the product page for confirmation before shipping into EU markets.
