MPC8347CZQAGDB-FR - 400MHz PowerQUICC II Pro MPU | NXP
Teilenummer: MPC8347CZQAGDB-FR ✗ AbgekündigtMPC8347CZQAGDB-FR Übersicht
What is a PowerQUICC II Pro? PowerQUICC II Pro is a family of communications processors from NXP (originally Freescale) designed for wired and wireless networking equipment, combining a Power Architecture CPU core with communications peripherals on a single die. The architecture hierarchy is: e300 core -> PowerQUICC II Pro -> MPC83xx series -> communications processor -> microprocessor -> semiconductor IC.
Key features include 400 MHz e300 core frequency, hardware MMU and double-precision FPU, dual 10/100/1000 Mbps Ethernet with GMII/RGMII/TBI support, dual PCI 2.3 controllers (one 64-bit/66 MHz, one 32-bit/66 MHz), Hi-Speed USB 2.0 host/device/OTG, DDR1/DDR2 SDRAM controller up to 333 MHz, four DMA channels, and an operating temperature range of -40C to +105C. The -FR suffix indicates a lead-free (Pb-free) TEPBGA II package per the Freescale/NXP package designation system.
The e300 core is a single-issue, seven-stage pipeline with hardware multiply/divide and 32 KB instruction + 32 KB data L1 caches. The integrated communications engine (QUICC Engine) offloads protocol processing for HDLC, ATM, Ethernet, and other telecom protocols. The 620-ball TEPBGA II package exposes the full peripheral set including two RGMII/GMII Ethernet interfaces, two PCI buses, dedicated DDR data/address/control balls, USB differential pairs, JTAG, and the QUICC Engine serial interfaces.
Typical applications include industrial routers, secure VPN gateways, enterprise class Ethernet switches, DSLAM line cards, wireless base station controllers, networked industrial automation, and Power-over-Ethernet (PoE) access points. The combination of dual GbE and dual PCI is particularly suited for SMB router/UTM platforms, where the CPU handles control-plane routing and the QUICC Engine handles wire-speed protocol encapsulation.
When designing with this device, allocate at least 6 PCB layers to maintain signal integrity on the DDR2 and RGMII interfaces. Provide bulk decoupling of 100 uF near the core supply and 10 uF/0.1 uF pairs adjacent to each supply ball. Ensure JTAG is accessible for production boundary-scan. The lead-free TEPBGA package has a peak reflow temperature of 260C per JEDEC J-STD-020.
This page synthesizes distributor pricing, drop-in alternatives within the MPC83xx family, and PCB-level design notes that complement (but do not replace) the manufacturer hardware specifications document.
Drop-in-Alternativen für MPC8347CZQAGDB-FR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8347CZQAGDB-FR (gleiche Bauform und Footprint) – abweichend in Ethernet, Operating Temperature, PCI, Package, USB.
Für dieses Produkt sind keine Drop-in-Alternativen verfügbar.
Alternativen anfordernMPC8347CZQAGDB-FR Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | MPC83xx (PowerQUICC II Pro) |
| Core Processor | PowerPC e300 |
| Number of Cores | 1 |
| Datenbusbreite | 32-bit |
| Core Frequency | 400 MHz |
| Bus Speed | 133 MHz (per core spec) |
| L1 Cache (I/D) | 32 KB / 32 KB |
| FPU | Double-precision hardware FPU |
| MMU | Yes (hardware) |
| RAM Controllers | DDR1 / DDR2 (up to 333 MHz) |
| Ethernet | 2x 10/100/1000 Mbps (GMII/RGMII/TBI) |
| PCI | 2x PCI 2.3 (1x 64-bit/66 MHz, 1x 32-bit/66 MHz) |
| USB | Hi-Speed USB 2.0 (Host/Device/OTG) |
| Gehäuse | 620-TEPBGA II (29x29 mm, 1 mm pitch) |
| Height | 2.46 mm max |
| Supply Voltage (Core) | 1.2 V |
| Betriebstemperatur | -40C to +105C |
| Montageart | Surface Mount (BGA) |
| Lead Free | Yes (FR suffix) |
| RoHS-Status | Compliant |
| QUICC Engine | Yes (HDLC/ATM/Ethernet offload) |
MPC8347CZQAGDB-FR 620-tepbga ii (29x29 mm, 1 mm pitch) Pinbelegungsleitfaden
Pinbelegung für MPC8347CZQAGDB-FR (620-tepbga ii (29x29 mm, 1 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8347CZQAGDB-FR.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8347CZQAGDB-FR ist geeignet für 7 Anwendungs: Industrial VPN Router, Enterprise Ethernet Switch Line Card, DSLAM Line Card Controller, Wireless Base Station Controller, Networked Industrial Automation Controller, PoE Access Point / Wireless Gateway, Secure Network Appliance (UTM / NGFW).
Industrial VPN Router
The MPC8347CZQAGDB-FR is well suited to industrial VPN routers because its dual Gigabit Ethernet MACs support one WAN port and one LAN port with hardware IPsec/SSL offload via the QUICC Engine. At 400 MHz the e300 core delivers sufficient CPU throughput to handle stateful firewall, NAT, and IKE key exchange at wire speed on gigabit links. The -40C to +105C industrial temperature grade allows deployment in uncontrolled environments such as factory floors and outdoor enclosures. Two PCI 2.3 controllers can host a hardware crypto accelerator card or a 3G/4G modem. Power dissipation at full load is typically below 2.5 W, enabling fanless operation. The DDR2 controller supports 333 MHz operation, providing sufficient memory bandwidth for routing tables and connection state.
Empfohlen
Enterprise Ethernet Switch Line Card
In an enterprise Ethernet switch line card, the MPC8347CZQAGDB-FR functions as the management/control processor. The dual PCI 2.3 controllers (one 64-bit/66 MHz, one 32-bit/66 MHz) connect to the switch fabric ASIC and to a management Ethernet PHY, while the QUICC Engine handles Spanning Tree BPDU processing, IGMP snooping, and LLDP frame parsing. The e300 core runs the management stack (CLI, SNMP, web UI) without burdening the data-plane ASIC. The 620-TEPBGA II package with 1 mm pitch is compatible with standard switch-card PCB stackups (8-12 layers). Industrial temperature rating supports deployment in non-climate-controlled telecom closets. JTAG accessibility via perimeter balls simplifies board-level test.
Empfohlen
DSLAM Line Card Controller
DSLAM line cards use the MPC8347CZQAGDB-FR as the uplink aggregation processor, where the QUICC Engine handles ATM/HDLC segmentation and reassembly across hundreds of subscriber lines. The dual Gigabit Ethernet ports aggregate upstream traffic to the central office switch, while PCI connects to the DSL PHY array. The hardware MMU and double-precision FPU allow the e300 core to run quality-of-service queuing and traffic shaping algorithms in software. Industrial -40C to +105C operation handles the elevated ambient temperatures of central-office equipment racks. The DDR2 controller at 333 MHz sustains the burst bandwidth required for aggregated uplink traffic. Long-term availability through NXP authorized distributors supports 10+ year DSLAM deployments.
Empfohlen
Wireless Base Station Controller
The MPC8347CZQAGDB-FR is used in 2G/3G wireless base station controllers as the Abis/Ater interface processor. The QUICC Engine offloads HDLC framing for E1/T1 links, freeing the e300 core to handle Layer 3 control signaling. Two PCI controllers interface to baseband DSP cards and to the backhaul Ethernet. The 400 MHz e300 core provides sufficient processing for cell-site management, alarm handling, and O&M telemetry. Industrial temperature rating ensures operation in outdoor cabinet deployments. Lead-free TEPBGA package meets RoHS requirements for telecom OEM customers in EU jurisdictions. The 620-ball footprint supports integrated thermal management with bottom-side heat spreaders.
Empfohlen
Networked Industrial Automation Controller
Industrial automation controllers use the MPC8347CZQAGDB-FR as the communications gateway between factory floor networks and enterprise systems. The dual Gigabit Ethernet ports provide ring-network redundancy with sub-50 ms failover, while the QUICC Engine handles deterministic fieldbus protocols (EtherCAT, PROFINET) via the HDLC offload. Hi-Speed USB 2.0 supports local HMI panels and programming interfaces. The industrial -40C to +105C temperature rating tolerates proximity to motors, drives, and other heat-generating equipment. PCI slots accept real-time Ethernet cards (EtherCAT slave, PROFINET IRT). The DDR2 controller sustains deterministic memory access for time-critical control loops. Watchdog timer and ECC on DDR memory support functional-safety requirements.
Empfohlen
PoE Access Point / Wireless Gateway
Enterprise PoE access points and wireless gateways use the MPC8347CZQAGDB-FR as the main processor. The dual Gigabit Ethernet ports split between upstream (WAN) and downstream PoE-switched LAN ports, while the QUICC Engine handles 802.1X EAPoL processing. Hi-Speed USB 2.0 connects to the Wi-Fi radio module. PCI hosts additional radios (Bluetooth, Zigbee) or storage. The e300 core at 400 MHz runs a Linux-based access-point stack with packet filtering, VLAN tagging, and captive portal handling. Industrial temperature rating supports outdoor APs in weatherproof enclosures. The 620-TEPBGA II package allows compact PCB designs that fit within AP housing thermal constraints.
Empfohlen
Secure Network Appliance (UTM / NGFW)
Unified Threat Management (UTM) and next-generation firewall appliances use the MPC8347CZQAGDB-FR as the control-plane processor alongside a hardware data-plane ASIC. The e300 core handles policy enforcement, deep packet inspection metadata analysis, and management UI rendering, while the data-plane ASIC performs wire-speed packet classification. The dual PCI controllers interface with the data-plane ASIC and with hardware crypto accelerators (AES, RSA, SHA). The QUICC Engine handles link-level encryption for VPN tunnels. The DDR2 controller at 333 MHz buffers large session tables and DPI signature databases. Industrial temperature rating and long-term NXP availability support 7-10 year appliance deployments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8347CZQAGDB-FR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8347CZQAGDB | MPC8347ECZQAGDB | MPC8347EZQAGDB | MPC8347CVRAGDB | MPC8347EVRAGDB | MPC8343CVRAGDB |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 620-TEPBGA II (29x29 mm) | 620-TEPBGA II (29x29 mm) - same | 620-TEPBGA II (29x29 mm) - same | 620-TEPBGA II (29x29 mm) - same | 620-TEPBGA II (29x29 mm) - same | 620-TEPBGA II (29x29 mm) - same | 620-TEPBGA II (29x29 mm) - same |
| Core Frequency | 400 MHz | 400 MHz | 533 MHz | 533 MHz | 400 MHz | 667 MHz | 400 MHz |
| Ethernet | 2x 10/100/1000 Mbps | 2x GbE | 2x GbE | 2x GbE | 2x GbE | 2x GbE | 1x GbE (reduced) |
| PCI Controllers | 2 (1x 64-bit + 1x 32-bit) | 2 | 2 | 2 | 2 | 2 | 1 (reduced) |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | 0C to +70C (commercial) | -40C to +105C | -40C to +105C | -40C to +105C |
| Lead-Free / RoHS | Yes (-FR suffix) | No (leaded) | No (leaded) | No (leaded) | Yes (-VR suffix) | Yes (-VR suffix) | Yes (-VR suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Industrial -40C to +105C temperature grade at 400 MHz (vs. MPC8347EZQAGDB (commercial 0C to +70C))
- Lead-free (-FR) finish is RoHS compliant (vs. MPC8347CZQAGDB (leaded, non-RoHS))
- Dual Gigabit Ethernet + dual PCI 2.3 vs single GbE + single PCI (vs. MPC8343CVRAGDB)
Designhinweise
Use a minimum 6-layer PCB stackup for the MPC8347CZQAGDB-FR. Route the DDR2 interface on inner layers with 50 ohm single-ended and 100 ohm differential impedance; length-match the DDR2 data byte lanes within +/- 25 mils and match the address/command traces within +/- 100 mils of the clock. Place the 1.2 V core bulk capacitors (100 uF polymer or ceramic) within 25 mm of the BGA, with 0.1 uF / 1 nF / 10 nF ceramic decouplers adjacent to each supply ball cluster. Provide a continuous ground plane on layer 2 directly beneath the BGA for thermal dissipation and signal return.
Estimated: At 400 MHz with both Ethernet ports active and DDR2 at 333 MHz, the MPC8347CZQAGDB-FR dissipates approximately 1.8 W to 2.5 W from the 1.2 V core rail. Using an estimated theta_JA of 18 C/W (620-TEPBGA II on a 6-layer board with bottom-side thermal pad), junction temperature rise above ambient is roughly 32C to 45C, keeping Tj well below the 105C limit at 70C ambient. For sealed enclosures with no airflow, add a copper heat spreader on the bottom side of the PCB or thermal vias under the BGA thermal balls. Always verify with a thermal probe of an actual production unit.
The RGMII and GMII Ethernet interfaces require source-series termination on the transmit clock and data lines to suppress reflections on the 1.2 ns rise-time edges. Place the GMII PHY within 50 mm of the BGA, with via count minimized on the clock pair. For the dual PCI 2.3 buses running at 66 MHz, route the 64-bit PCI on inner layers with controlled impedance and length-match the clock to within +/- 50 mils of the longest data line. Use IBIS-AMI simulation (available from NXP) to validate PCI signal integrity before committing to PCB layout.
Do not confuse the MPC8347 (dual GbE + dual PCI) with the MPC8343 (single GbE + single PCI) - although both share the 620-TEPBGA II footprint on some speed grades, the unused peripheral balls are not guaranteed to be No-Connect on all SKUs. Always cross-check the exact ball map for the substitute part before PCB reuse. Note that the -FR (lead-free), -VR (lead-free RoHS), and standard (leaded) suffixes differ in ball plating chemistry, which affects solder profile and rework. Finally, the JTAG TCK pin requires a 10 kohm pull-up to VCC; missing this causes boundary-scan failures in production.
Power sequencing for the MPC8347CZQAGDB-FR requires 1.2 V core to come up before or simultaneously with the 3.3 V I/O supply, but the core must stabilize within 100 ms of the I/O rail reaching its nominal value. Use a common power-good signal or a sequenced PGOOD chain from the PMIC. The 1.2 V core supply must deliver at least 3 A peak (inrush during DDR2 initialization) with less than 50 mVpp ripple. A buck regulator with at least 6 A rating and 1% output accuracy is recommended; NXP's MMPF0100 PMIC is a validated choice for the full MPC83xx family.
Compliance-Informationen
RoHS compliance indicated by -FR suffix (lead-free TEPBGA II finish). Not AEC-Q100 qualified (industrial grade only, not automotive). REACH and conflict-minerals compliance per NXP product documentation; halogen-free status not stated in verified data and marked unknown.
