MPC852TZT80A - 80MHz PowerQUICC MPU, 32-Bit, 256-PBGA | NXP
Teilenummer: MPC852TZT80A ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $48.5 | $48,50 |
| 10 | $42.75 | $427,50 |
| 100 | $37.2 | $3.720,00 |
| 250 | $33.1 | $8.275,00 |
| 500 | $29.95 | $14.975,00 |
MPC852TZT80A Übersicht
A PowerQUICC microprocessor is a member of the communications-processing MPU category that combines a Power Architecture core with on-chip peripheral controllers; its place in the broader taxonomy runs MPU -> microprocessor -> integrated circuit -> semiconductor. PowerQUICC devices evolved from the MC68360 QUICC family and were widely adopted in routers, DSLAMs, and industrial control where the integrated CPM (Communications Processor Module) offloaded serial and networking tasks from the CPU.
Key features highlighted on NXP and distributor listings include the 80 MHz core frequency, 32-bit Power Architecture core, 256-pin PBGA package, 3.3 V I/O, and an operating temperature grade of 0 °C to 95 °C (commercial). The integrated peripheral set typically includes UART, SCC/SMC serial channels, I²C, SPI, parallel I/O, timers, and a memory controller for SDRAM, ROM/Flash, and bus peripherals, giving designers a single-chip solution for bridging a host CPU to physical-layer devices.
Architecturally, the MPC852T combines a PowerPC-style execution core with a CPM co-processor, allowing DMA-driven serial handling without burdening the main core. This separation is what made PowerQUICC a preferred choice for multi-port WAN, ISDN, and frame-relay designs through the late 2000s, and it remains useful for long-life industrial and legacy telecom products.
Typical applications include SOHO routers, ISDN terminal adapters, industrial serial concentrators, and protocol-bridging gateways. The 80 MHz grade suits designs that need Ethernet plus serial-channel throughput without paying for the higher-clocked 100 MHz or 133 MHz PowerQUICC variants.
Designers should plan for a 4-layer PCB with short, impedance-controlled traces from the 256-ball BGA, provide bulk and decoupling capacitance per the hardware specifications, and confirm JTAG boundary-scan access during board bring-up. The non-RoHS designation noted by some distributors means a Pb-bearing solder profile is required if the original lead finish is preserved.
This page synthesizes distributor availability, drop-in alternative guidance, and design considerations for the MPC852TZT80A that go beyond the manufacturer datasheet, helping engineers verify sourcing and plan redesigns around long-lifecycle PowerQUICC platforms.
Drop-in-Alternativen für MPC852TZT80A – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC852TZT80A (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, RoHS Status, Manufacturer, Supply Voltage.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC852TCZT100A
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC852TCVR100A
✅ Drop-In✓ Auf Lager
$16.25 / Stück
Datenblatt ansehen →MPC852TZT100A
✅ Drop-In✓ Auf Lager
$31.1 / Stück
Datenblatt ansehen →MPC859TCVR100A
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$42.45 / Stück
Datenblatt ansehen →MPC860TCVR50A
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC852TZT80A Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | PowerQUICC, MPC8xx |
| Core | MPC8xx (32-bit Power Architecture) |
| Core Count | 1 |
| Core Frequency | 80 MHz |
| Process Technology | 0.18 µm CMOS |
| Versorgungsspannung | 3.3 V |
| Betriebstemperatur | 0 °C to +95 °C |
| Package Type | 256-PBGA (Plastic Ball Grid Array) |
| Package Dimensions | 23 x 23 mm |
| Montageart | Surface Mount (BGA) |
| Tray Packaging | Tray (per distributor listing) |
| Product Category | Microprocessors (MPU) |
| RoHS-Status | Non-Compliant (legacy part) |
| Lead Finish | Contains lead (SnPb or lead-bearing solder profile) |
MPC852TZT80A 23 x 23 mm Pinbelegungsleitfaden
Pinbelegung für MPC852TZT80A (23 x 23 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC852TZT80A.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC852TZT80A ist geeignet für 6 Anwendungs: SOHO Router and Gateway Platform, ISDN Terminal Adapter and PRI Controller, Industrial Serial Concentrator, Legacy Protocol-Bridging Gateway, Embedded Networking Appliance (10/100 Mbps), Long-Lifecycle Industrial Controller.
SOHO Router and Gateway Platform
The MPC852TZT80A's 80 MHz PowerQUICC core and integrated CPM co-processor make it a strong fit for SOHO routers and integrated access gateways. At this clock grade, the device can drive Ethernet MAC, WAN serial channels, and basic routing without off-chip ASICs, and the 256-PBGA package keeps the BOM compact for a 4-layer SOHO motherboard. The 3.3 V supply simplifies power-tree design versus 5 V legacy MCUs. Compared with the 100 MHz PowerQUICC grade, the 80 MHz part offers adequate throughput for sub-100 Mbps WAN scenarios while reducing power draw, suiting fanless plastic enclosures in home gateways.
Empfohlen
ISDN Terminal Adapter and PRI Controller
ISDN terminal adapters and PRI controllers benefit from the MPC852TZT80A's PowerQUICC CPM, which offloads HDLC framing from the CPU. The 80 MHz core is sufficient for one or two PRI spans plus packetization, and the integrated SCC/SMC serial channels map directly to ISDN transceivers. The 256-PBGA footprint supports dense BGA escape routing on a 4-layer board, which keeps the PCB small enough for desktop terminal adapters. Designers porting from PowerQUICC I parts gain a faster CPM and lower power per channel, while the part's long-lifecycle status suits telecom carriers with multi-decade support commitments.
Empfohlen
Industrial Serial Concentrator
The MPC852TZT80A is widely deployed as a serial concentrator that aggregates multiple UART, RS-485, and RS-232 links into a single Ethernet uplink. With its SCC/SMC serial channels and integrated DMA-driven CPM, the part can handle 8–16 serial ports without CPU intervention at typical industrial baud rates. The 256-PBGA is well suited to industrial SBCs that already allocate a BGA footprint for legacy reasons, and the 3.3 V supply matches most industrial Ethernet PHYs. Compared with a discrete MCU plus external PHY, the PowerQUICC approach simplifies firmware, reduces component count, and improves long-term support for factory-automation lifecycles.
Empfohlen
Legacy Protocol-Bridging Gateway
For protocol-bridging gateways that interconnect legacy fieldbus, SCADA, or proprietary serial links with TCP/IP networks, the MPC852TZT80A delivers a balanced mix of CPU, CPM, and I/O. The 80 MHz core handles TCP/IP stack plus bridging logic, while the CPM offloads serial DMA. The 256-PBGA supports the BGA escape required for high-density bus routing, and the 3.3 V I/O simplifies connection to industrial PHY and transceiver chips. New designs targeting energy, water, or transportation SCADA often pick this part because it remains available through long-lifecycle distributors.
Empfohlen
Embedded Networking Appliance (10/100 Mbps)
Embedded networking appliances that need only 10/100 Mbps Ethernet plus a few serial ports can use the MPC852TZT80A without moving to a higher-tier PowerQUICC or QorIQ device. The integrated Ethernet MAC, CPM, and memory controller eliminate the need for an external switch ASIC in single-port designs. The 256-PBGA package suits compact appliance form factors and supports the thermal envelope of a fanless metal chassis. Power dissipation is low enough at 80 MHz that no heatsink is required on a properly designed 4-layer board.
Empfohlen
Long-Lifecycle Industrial Controller
Designers maintaining long-lifecycle industrial controllers — for example, substation equipment, rail signaling, or building-automation masters — favor the MPC852TZT80A for its proven PowerQUICC reliability and ongoing distributor support. The 256-PBGA and 3.3 V supply are compatible with mature 4-layer stack-ups used in industrial designs. The 80 MHz grade balances compute headroom with low enough power dissipation to operate in sealed enclosures, and the part's NRND/long-life status matches industrial procurement windows of 10–20 years.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC852TZT80A – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC852TCZT100A | MPC852TCVR100A | MPC852TZT100A | MPC859TCVR100A | MPC860TCVR50A |
|---|---|---|---|---|---|---|
| Package | 256-PBGA (23x23) | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 80 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 50 MHz |
| Core Family | PowerQUICC MPC8xx | PowerQUICC MPC8xx | PowerQUICC MPC8xx | PowerQUICC MPC8xx | PowerQUICC MPC8xx | PowerQUICC MPC8xx |
| Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| RoHS Status | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant |
Wichtigste Unterscheidungsmerkmale
- Pin-compatible 100 MHz upgrade path (vs. MPC852TCZT100A)
- Long-lifecycle distributor support (vs. Generic industrial MPU)
- Integrated CPM offloads serial DMA (vs. MCF5275CVM166 ColdFire MPU)
Designhinweise
Estimated: the MPC852TZT80A at 80 MHz draws in the low single-digit watt range under typical CPM load with all serial channels active. A 4-layer PCB with a continuous ground plane and at least 4 square inches of top-side copper is sufficient to keep the junction temperature within the 0 °C to +95 °C operating window without a heatsink. Validate with a thermal probe during worst-case firmware load before finalizing the chassis design.
The 256-PBGA requires a 4-layer or higher stack-up with micro-vias or via-in-pad to escape the dense inner-row balls. Place bulk and decoupling capacitors on the same side as the BGA and within 100 mil of the balls to limit switching-noise injection. Keep impedance-controlled traces short and matched for the SDRAM and Ethernet interfaces, and provide a clean JTAG TAP chain for boundary-scan bring-up.
Do not assume pin compatibility between PowerQUICC I (MPC860) and PowerQUICC II (MPC852T) variants — the 256-PBGA ball map differs across generations and is not 1:1 swappable. Confirm the exact part marking, the silicon revision, and the hardware specifications revision before substituting an alternative. Also confirm the RoHS status of any proposed alternative because some PowerQUICC siblings remain non-RoHS for legacy reasons.
Route the address and data buses with matched lengths and 50 Ω controlled impedance to avoid setup-and-hold violations on the SDRAM interface. Keep analog supplies (PLL, references) isolated from digital switching returns, and provide a guard ring around the PLL power pin. The 256-PBGA's ground balls must be stitched together with vias to the internal ground plane every 200 mil to maintain a low-impedance return path.
Compliance-Informationen
RoHS Non-Compliant per distributor listings; REACH, halogen, and conflict-mineral status not stated in verified web data. AEC-Q100 not applicable (industrial/communications MPU, not automotive grade).
