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NXP Semiconductors

MPC8535AVJANGA - PowerQUICC III 800MHz SoC MPU | NXP

Teilenummer: MPC8535AVJANGA ⚠ Letzte Bestellmöglichkeit
Auf Lager Versand in 1–3 Werktagen
FC-PBGA (29 mm x 29 mm) Package 800 MHz Speed DDR2/DDR3 with ECC Memory
Ab $66.5 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-17
Mengenpreise
Menge Stückpreis Gesamt
1 $95 $95,00
10 $87.5 $875,00
100 $78 $7.800,00
250 $72 $18.000,00
500 $66.5 $33.250,00
ℹ️ Alle Preise sind in USD

MPC8535AVJANGA Übersicht

The NXP MPC8535AVJANGA is a PowerQUICC III integrated communications processor based on the e500 Power Architecture core, delivering up to 800 MHz of complex application processing performance in a 783-pin FC-PBGA package measuring 29 mm x 29 mm. It integrates an e500 processor core with enhanced peripherals and high-speed interconnect technology to balance CPU performance with I/O throughput for IP network and advanced media processing applications.

A PowerQUICC III SoC is a system-on-chip that combines a Power Architecture processor core with dedicated communications engines and rich peripheral IP, bridging general-purpose compute with packet processing and high-speed serial I/O. It sits in the product hierarchy MPU -> microprocessor -> integrated processor -> SoC -> semiconductor, and is widely deployed in networking and telecom equipment where deterministic throughput and integrated memory and I/O controllers reduce bill-of-materials cost.

Key features include hardware support for DDR2/DDR3 memory with ECC, integrated SDHC, PCI and PCI Express interfaces, SATA, Gigabit Ethernet, USB 2.0, and an IEEE 1149.1 JTAG boundary-scan interface. The device is fabricated in a 90 nm copper CMOS process and supports core voltages of 1.5 V, 1.8 V, 2.5 V, and 3.3 V with industrial temperature grade 0 C to 90 C. According to the NXP product brief, the MPC8535E targets routers, switches, wireless base stations, and industrial imaging or printing applications that require gigahertz-class processing.

The architecture pairs the e500 superscalar core with a high-bandwidth system bus and dedicated DMA and security accelerators, allowing wire-speed packet handling on GbE and PCI Express ports. The integrated memory controller supports up to DDR3 with ECC for high-availability systems, and the on-chip peripherals expose multiple RGMII/SGMII Ethernet paths plus USB and SATA ports for storage and peripheral attachment.

Typical applications include enterprise and SMB routers, multi-layer switches, network attached storage, wireless base-station control-plane processing, and industrial automation controllers. The combination of Power Architecture compatibility and integrated SerDes-based I/O makes it a long-life workhorse for embedded networking designs.

When designing with this device, ensure proper PCB stack-up for the 783-ball FC-PBGA, provision adequate bulk decoupling around the DDR memory interface, and follow the reference schematics in the NXP hardware specifications document. JTAG boundary scan via IEEE 1149.1 is strongly recommended for production board test.

This page consolidates NXP datasheet specifications, distributor availability, and drop-in compatible alternatives for engineers sourcing the MPC8535AVJANGA in long-life or last-time-buy programs.

Drop-in-Alternativen für MPC8535AVJANGA – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8535AVJANGA (gleiche Bauform und Footprint) – abweichend in RoHS Status, Core Architecture, Data Bus Width, Series, Operating Temperature.

NXP Semiconductors
RoHS Status: Compliant (lead-free)
Core Architecture: PowerPC e500 (Book E)
Data Bus Width: 32-bit
Vergleichen mit MPC8535AVJANGA →
NXP Semiconductors
RoHS Status: Compliant (per distributor listing context)
Data Bus Width: 32-bit
Operating Temperature: 0C to 105C (industrial)
Vergleichen mit MPC8535AVJANGA →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MPC8535AVTANGA

✅ Drop-In
NXP Semiconductors
📦 FC-PBGA-783 (29x29)
PowerPC e500 (Book E) · 1 · 32-bit · 800 MHz · 783-FCPBGA (29x29 mm) · PowerQUICC III (MPC85xx) · DDR2/DDR3 with ECC · 4x GbE (SGMII)

✓ Auf Lager

$92.5 / Stück

Datenblatt ansehen →

MPC8535BVJANGA

✅ Drop-In
NXP Semiconductors
📦 FC-PBGA-783 (29x29)
PowerQUICC III (MPC8535E) · Power Architecture e500 · 1 · 32-bit · 800 MHz · DDR2 / DDR3 with ECC (64-bit) · 32 KB / 32 KB · Up to 256 KB

✓ Auf Lager

$95.1 / Stück

Datenblatt ansehen →

MPC8535CVJANGA

✅ Drop-In
📦 FC-PBGA-783 (29x29)
highest speed bin in MPC8535 family vs 800 MHz AVJANGA; same FC-PBGA-783 footprint

📋 Referenzalternative (nicht im Katalog)

MPC8535AVJANGA-R2

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 FC-PBGA-783 (29x29)
tape-and-reel packaging variant of AVJANGA; identical silicon and pinout

📋 Referenzalternative (nicht im Katalog)

MPC8535EAVJANGA

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 FC-PBGA-783 (29x29)
MPC8535E enhanced peripheral subset, same die revision 1; same FC-PBGA footprint

📋 Referenzalternative (nicht im Katalog)

MPC8535AVJANGA Grenzwerte & elektrische Eigenschaften

Core Architecture Power Architecture e500
Core Count 1
Datenbusbreite 32 bit
Maximum Core Frequency 800 MHz
Process Technology 90 nm CMOS
Memory Interface DDR2/DDR3 with ECC
Memory Card Support SDHC
PCI Interface PCI / PCI Express
Storage Interface SATA
Network Interface Gigabit Ethernet (RGMII/SGMII)
USB Interface USB 2.0
Betriebstemperaturbereich 0 C to 90 C
JTAG Support IEEE 1149.1 boundary scan
Package Type FC-PBGA (29 mm x 29 mm)
Pin/Ball Count 783
Series PowerQUICC III (MPC8535E)
Revision Rev 1
Montageart Surface Mount (BGA)
RoHS-Status Compliant
Lead-Free Yes

MPC8535AVJANGA fc-pbga (29 mm x 29 mm) Pinbelegungsleitfaden

Pinbelegung für MPC8535AVJANGA (fc-pbga (29 mm x 29 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für MPC8535AVJANGA im fc-pbga (29 mm x 29 mm)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für MPC8535AVJANGA.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

MPC8535AVJANGA ist geeignet für 6 Anwendungs: Enterprise and SMB Routers, Multi-Layer Managed Switches, Network Attached Storage Controllers, Wireless Base Station Control-Plane Processing, Industrial Automation Controllers, Network Printers and Imaging Platforms.

🌐

Enterprise and SMB Routers

The MPC8535AVJANGA fits enterprise and SMB router designs by combining the e500 core at 800 MHz with integrated Gigabit Ethernet, PCI Express, and security accelerators. Its DDR2/DDR3 memory controller with ECC supports high-availability forwarding tables, while the integrated RGMII/SGMII ports remove the need for an external PHY controller. Designers benefit from the Power Architecture software ecosystem, including NXP Linux SDK and VxWorks BSP support, which shortens time to market for new branch-office and edge-router products.

🖥️

Multi-Layer Managed Switches

Multi-layer managed switches leverage the MPC8535AVJANGA's integrated GbE interfaces, PCI Express lanes, and high-bandwidth DDR memory controller to implement Layer 2/3 forwarding and management-plane processing on a single SoC. The JTAG boundary scan and ECC memory support enable high-MTBF designs for carrier-grade switches, and the 783-ball FC-PBGA package exposes enough GPIO and SerDes lanes to drive external switch fabrics. The 800 MHz core provides headroom for ACL processing and management-plane software stacks.

💾

Network Attached Storage Controllers

Network attached storage (NAS) controllers benefit from the MPC8535AVJANGA's integrated SATA, Gigabit Ethernet, USB 2.0, and DDR2/DDR3 memory controller with ECC. The 800 MHz e500 core plus DMA accelerators move file-system traffic at wire speed, while the SDHC port supports boot and metadata storage. Engineers can reuse the existing Linux/BSD NAS software ecosystem, and the 783-ball FC-PBGA package fits standard 2.5-inch and 3.5-inch NAS motherboard layouts.

📡

Wireless Base Station Control-Plane Processing

Wireless base-station control-plane processing relies on the MPC8535AVJANGA's deterministic e500 core, ECC memory, and PCI Express fabric for backhaul and baseband coordination. The integrated GbE and PCIe interfaces connect to radio cards and backhaul modems, while the 0 C to 90 C temperature range suits controlled-environment base-station enclosures. Power Architecture RTOS support (VxWorks, Green Hills INTEGRITY) enables deterministic control-plane scheduling demanded by telecom OEMs.

🏭

Industrial Automation Controllers

Industrial automation controllers leverage the MPC8535AVJANGA for deterministic real-time control with GbE uplink, PCI Express expansion, and ECC-protected memory for safe operation. The integrated USB and SDHC ports simplify touch-panel HMI attachment, and the JTAG boundary scan enables production board test for high-reliability factory systems. Power Architecture software reuse plus long-life NXP/Freescale silicon support reduce validation effort in long-lifecycle industrial programs.

🖨️

Network Printers and Imaging Platforms

High-end network printers and imaging platforms use the MPC8535AVJANGA for page-rendering pipelines, network protocol stacks, and engine-control interfacing. The integrated Gigabit Ethernet, USB 2.0, and SDHC ports cover the connectivity needs of office MFPs, while the 800 MHz e500 core handles PostScript/PDF rendering at print-engine speeds. The 783-ball FC-PBGA package is well established in imaging reference designs, simplifying board layout for OEM engineers.

Zusammenfassung der empfohlenen Produkte

MPC8535AVTANGA NXP Semiconductors Verwendet in: Enterprise and SMB Routers, Wireless Base Station Control-Plane Processing, Industrial Automation Controllers MPC8536CVJAULA Higher-frequency upgrade in same PowerQUICC III family Verwendet in: Enterprise and SMB Routers, Network Attached Storage Controllers MPC8535BVJANGA NXP Semiconductors Verwendet in: Multi-Layer Managed Switches, Network Printers and Imaging Platforms MPC8544VJALFA Sibling PowerQUICC III with RapidIO for fabric interconnect Verwendet in: Multi-Layer Managed Switches, Wireless Base Station Control-Plane Processing MPC8535EAVJANGA Enhanced peripheral variant of same family Verwendet in: Network Attached Storage Controllers, Network Printers and Imaging Platforms MPC8535CVJANGA Performance upgrade for compute-heavy control loops Verwendet in: Industrial Automation Controllers
What is the MPC8535AVJANGA?
The MPC8535AVJANGA is an NXP PowerQUICC III integrated communications processor based on the 800 MHz e500 Power Architecture core, integrating DDR2/DDR3 memory controllers, PCI Express, SATA, Gigabit Ethernet, USB 2.0, and SDHC peripherals in a 783-ball FC-PBGA package measuring 29 mm x 29 mm. According to the NXP product brief, it targets IP network routers, switches, and embedded media processing applications.
What is the operating temperature range of MPC8535AVJANGA?
The MPC8535AVJANGA is specified for an operating temperature range of 0 C to 90 C, which is the commercial/industrial grade for the PowerQUICC III family. For extended -40 C to +85 C industrial operation, designers should consult NXP for available variants. The 0 C to 90 C range is confirmed in the Mouser and DigiKey product descriptions for this MPN.
Is the MPC8535AVJANGA still in production?
No, the MPC8535AVJANGA is at the end of its lifecycle. The NXP product page indicates an End of Life Overview with a Discontinuance and Replacement Product Change Notice. Engineers should plan for last-time-buy sourcing or migrate to a successor device; Rochester Electronics is shown as an authorized stock source for existing inventory.
Where can I buy MPC8535AVJANGA and what is the price?
MPC8535AVJANGA is available from Rochester Electronics via the DigiKey marketplace and from authorized NXP distributors. Pricing as of 2026-10-17 begins around $95 for single-unit quantities, scaling down to approximately $66.50 at 500-piece quantities. Lead times are typically 8-12 weeks because the part is at end-of-life.
What is the difference between MPC8535AVJANGA and MPC8535AVTANGA?
The MPC8535AVJANGA and MPC8535AVTANGA share the same e500 core at 800 MHz and the same 783-ball FC-PBGA package, but differ in operating temperature grade: the AVJANGA part is 0 C to 90 C while the AVTANGA part extends the range for industrial or extended-temperature use. The two are functionally similar per the FindIC comparison page and can be substituted when temperature grade is acceptable.
What is the difference between MPC8535AVJANGA and MPC8536CVJAULA?
The MPC8536CVJAULA is a higher-tier PowerQUICC III variant with a faster core frequency (up to 1.5 GHz) and additional peripheral integration compared with the 800 MHz MPC8535AVJANGA. According to the ETEI comparison page, both share the same FC-PBGA family footprint but differ in core speed, peripheral mix, and voltage levels. The MPC8536 can replace the MPC8535 in designs that need more compute headroom, but is not a pin-for-pin drop-in for every ballout.
What is the difference between MPC8535AVJANGA and MPC8544VJALFA?
The MPC8544VJALFA is a member of the PowerQUICC III family with a different peripheral mix, supporting DDR2 memory, PCI Express, and Serial RapidIO, while the MPC8535AVJANGA adds integrated SATA, USB 2.0, and SDHC. Per the ETEI comparison reference, they share similar packaging but are not pin-compatible drop-in replacements; software familiarity transfers between the two.
When should I choose MPC8535AVJANGA over a newer alternative?
Choose the MPC8535AVJANGA when you need an exact match for an existing PowerQUICC III board design at end-of-life, when NXP/Freescale software investments already exist, or when you have a long-life program that has already qualified this exact 783-ball FC-PBGA footprint. For new designs, prefer the MPC8536 or MPC8544 for higher performance, or evaluate newer QorIQ families for better long-term support.
What is the best drop-in replacement for MPC8535AVJANGA?
The closest drop-in replacements are other speed-grade and temperature-grade variants in the MPC8535E family - including MPC8535AVTANGA (same die, extended temperature) and MPC8535BVJANGA (same family, slight speed bin). Both share the 783-ball FC-PBGA package per NXP ordering information. Designers should confirm the exact ballout against the NXP hardware specifications document before substituting.
Can MPC8536CVJAULA replace MPC8535AVJANGA?
The MPC8536CVJAULA can functionally replace the MPC8535AVJANGA in many applications because both are PowerQUICC III devices, but it is not a true pin-for-pin drop-in. The MPC8536 operates at higher frequencies (up to 1.5 GHz) and has different voltage and peripheral mappings. Verify against the NXP datasheet pin assignments before using the MPC8536 as a substitute on an existing MPC8535 board.
Where can I download the MPC8535AVJANGA datasheet PDF?
The official MPC8535AVJANGA datasheet is published by NXP under document number MPC8535EEC (Hardware Specifications, Rev. 7, July 2015). It can be retrieved from the NXP product page at nxp.com/docs/en/product-information/MPC8535EEC.pdf or from authorized distributors such as DigiKey, Mouser, and the Rochester Electronics datasheet repository.
What is the MPC8535AVJANGA pinout and package?
The MPC8535AVJANGA uses a 783-ball FC-PBGA (flip-chip plastic BGA) measuring 29 mm x 29 mm. Per the NXP hardware specifications document, the pinout covers the e500 core debug signals, DDR memory interface, PCI Express lanes, RGMII/SGMII Ethernet, SATA, USB 2.0, SDHC, and JTAG test ports. A complete ball map is provided in section 2 of the MPC8535EEC datasheet.
Is the MPC8535AVJANGA RoHS compliant?
Yes, the MPC8535AVJANGA is RoHS compliant per the distributor product descriptions and NXP material composition declarations. The lead-free finish is a standard feature of the 783-ball FC-PBGA package family supplied by NXP. REACH compliance status should be confirmed against the latest NXP environmental declaration if required by your supply chain policy.
What is the lead time for MPC8535AVJANGA orders?
Lead times for MPC8535AVJANGA are typically 8-12 weeks because the part is at end-of-life and only available through Rochester Electronics and authorized stock channels. For new production programs, NXP advises using the Discontinuance and Replacement PCN to qualify an active MPC8535 family member or migrate to a successor device such as the MPC8536.
What is a good cross-brand equivalent for MPC8535AVJANGA?
The MPC8535AVJANGA does not have a true cross-brand pin-compatible drop-in equivalent; the PowerQUICC III platform is NXP/Freescale-specific. Comparable functionality is offered by the NXP QorIQ P-series processors (P1020, P2020) and by competing communications SoCs from vendors like Marvell (Armada) and Intel (Xeon D), but those require different packages and software stacks and are not drop-in.

Technische Referenzdaten für MPC8535AVJANGA – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose MPC8535AVJANGA when you need an 800 MHz PowerQUICC III SoC with integrated SATA/USB/SDHC peripherals for an existing board design at the end of its lifecycle. Choose MPC8535AVTANGA for industrial deployments that require -40 C to +85 C temperature grade instead of the AVJANGA's 0 C to 90 C. Choose MPC8535BVJANGA or MPC8535CVJANGA for slightly higher frequency bins without changing the FC-PBGA-783 footprint. Avoid MPC8536CVJAULA and MPC8544VJALFA unless you are willing to redesign the board - they share the FC-PBGA family but not pin assignments.

Vergleich mit Alternativen

Parameter Dieses Produkt MPC8535AVTANGA MPC8535BVJANGA MPC8535CVJANGA MPC8535AVJANGA-R2 MPC8535EAVJANGA
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package FC-PBGA-783 (29x29) FC-PBGA-783 (29x29) - same FC-PBGA-783 (29x29) - same FC-PBGA-783 (29x29) - same FC-PBGA-783 (29x29) - same FC-PBGA-783 (29x29) - same
Core Architecture Power Architecture e500 Power Architecture e500 Power Architecture e500 Power Architecture e500 Power Architecture e500 Power Architecture e500
Core Frequency 800 MHz 800 MHz ~833 MHz (slightly higher bin) ~1 GHz (highest bin) 800 MHz 800 MHz
Operating Temperature 0 C to 90 C -40 C to +85 C (extended) 0 C to 90 C 0 C to 90 C 0 C to 90 C 0 C to 90 C
DDR Memory Interface DDR2/DDR3 with ECC DDR2/DDR3 with ECC DDR2/DDR3 with ECC DDR2/DDR3 with ECC DDR2/DDR3 with ECC DDR2/DDR3 with ECC
Integrated Peripherals PCIe, SATA, GbE, USB, SDHC PCIe, SATA, GbE, USB, SDHC PCIe, SATA, GbE, USB, SDHC PCIe, SATA, GbE, USB, SDHC PCIe, SATA, GbE, USB, SDHC Enhanced peripheral subset
Lifecycle Status End of Life / Last Time Buy End of Life / Last Time Buy End of Life End of Life End of Life End of Life
Series PowerQUICC III MPC8535E PowerQUICC III MPC8535E PowerQUICC III MPC8535E PowerQUICC III MPC8535E PowerQUICC III MPC8535E PowerQUICC III MPC8535E

Wichtigste Unterscheidungsmerkmale

  • Integrated communications peripherals reduce external chip count (vs. MPC8544VJALFA)
  • Higher operating frequency than AVJANGA in same package (vs. MPC8535CVJANGA)
  • True NXP silicon drop-in replacement without portfolio reshuffle (vs. MPC8536CVJAULA)

Designhinweise

The 783-ball FC-PBGA package at 29 mm x 29 mm requires a high-density multilayer PCB stack-up (typically 8-10 layers) with controlled-impedance routing for the DDR2/DDR3, PCI Express, and RGMII/SGMII signals. Per the NXP hardware specifications, follow the reference schematics for power-plane decoupling, including 0.1 uF MLCC capacitors adjacent to each power ball and bulk tantalum or ceramic caps at the voltage regulator outputs. Estimated: thermal dissipation at 800 MHz core is typically 5-7 W, which must be validated against the layout's thermal resistance.

Do not confuse the MPC8535AVJANGA (commercial 0-90 C) with the MPC8535AVTANGA (extended temperature) - substituting one for the other in industrial deployments will cause out-of-spec junction temperatures. Also, the MPC8535 is NOT pin-compatible with the MPC8536 - although they share the FC-PBGA family, the ball assignments differ and the wrong part will fail to boot. Always confirm ballout against the latest NXP hardware specifications before board respins.

The DDR2/DDR3 interface runs at hundreds of MHz and requires matched-length routing, 50-ohm controlled impedance, and proper termination per the NXP reference design. PCI Express and Serial RapidIO links also require length-matched pairs with characteristic impedance of 85 ohms differential. JTAG boundary scan via IEEE 1149.1 should be brought to a dedicated header for board test access in production.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

RoHS compliant per distributor product pages. Lead-free finish confirmed. Halogen-free status not explicitly listed in distributor data. AEC-Q100 not applicable for networking SoCs.

Daten verifiziert am: 2026-10-17 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Verwandte Bauteile & Begriffe

NXP Semiconductors MPC8535AVJANGA MPC8535AVTANGA MPC8535BVJANGA MPC8535CVJANGA MPC8535EAVJANGA MPC8536CVJAULA MPC8544VJALFA PowerQUICC III e500 core Power Architecture MPU system-on-chip FC-PBGA-783 DDR2 DDR3 PCI Express SATA Gigabit Ethernet USB 2.0 SDHC IEEE 1149.1 JTAG RoHS end-of-life
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