MPC8572VTATLD - PowerPC e500 Dual-Core 1.2GHz MPU | NXP
Teilenummer: MPC8572VTATLD ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $169.39 | $169,39 |
| 10 | $152.45 | $1.524,50 |
| 50 | $138.2 | $6.910,00 |
| 100 | $125 | $12.500,00 |
| 250 | $112.5 | $28.125,00 |
MPC8572VTATLD Übersicht
A PowerQUICC III integrated communications processor is a multi-core system-on-chip that combines general-purpose PowerPC cores with specialized communication engines and I/O subsystems. The MPC85xx family hierarchy spans PowerPC MPU -> embedded microprocessor -> communications processor -> SoC, targeting networking and telecom infrastructure where deterministic throughput and rich peripheral integration matter more than raw single-thread performance.
Key features of the MPC8572VTATLD include dual e500 cores running at 1.2 GHz, on-chip L1 caches, integrated security and pattern-matching engines, and a wide range of high-speed serial interfaces including Gigabit Ethernet, PCI Express, and RapidIO. The device supports 1.8 V, 2.5 V, and 3.3 V I/O operations, simplifying mixed-voltage board designs. Memory interfaces include DDR2 SDRAM with ECC and a local bus controller for legacy peripherals.
Architecturally, the MPC8572E combines dual e500 superscalar cores with the system interface and acceleration logic typical of the PowerQUICC III platform. Core-to-core coherency is maintained through the device's on-chip fabric, and the integrated security engine offloads AES, 3DES, public-key, and CRC operations from the host cores, reducing CPU load for packet-processing pipelines.
Typical applications include enterprise routers and switches, line cards, network security appliances (firewalls, IPS/IDS, VPN gateways), industrial control and automation backplanes, and telecom infrastructure such as LTE base stations and channel cards. The high core count plus integrated I/O makes it well suited for control-plane and data-plane workloads running concurrently.
When designing with this part, engineers should plan thermal management for the FC-BGA package, follow NXP's power-sequencing recommendations, and use DDR2 reference-termination layouts. Designers should also verify that the local bus and RapidIO/PCIe reference clocks are within the jitter limits listed in the MPC8572E hardware specifications.
This page synthesizes NXP datasheet extracts, current distributor stock and pricing, and drop-in alternative guidance not available in the bare datasheet, giving engineers a single source for evaluation, procurement, and second-sourcing decisions.
Drop-in-Alternativen für MPC8572VTATLD – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8572VTATLD (gleiche Bauform und Footprint) – abweichend in Manufacturer, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8572ECPXATLD
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8572VTATLE
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8572VJATLD
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8572EPXARLD
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8572CVTATLD
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8572VTATLD Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors |
| Part Family | PowerQUICC III / MPC8572E |
| Core Architecture | PowerPC e500 (dual-core) |
| Number of Cores | 2 |
| Datenbusbreite | 32-bit |
| Maximum CPU Frequency | 1.2 GHz |
| Process Technology | 0.09 um CMOS |
| Supply Voltages | 1.8 V / 2.5 V / 3.3 V |
| Gehäuse | 1023-pin FC-BGA (33x33 mm) |
| Montageart | Surface Mount |
| Memory Interface | DDR2 SDRAM with ECC |
| Local Bus Interface | 32-bit local bus with arbitration |
| Serial Interfaces | Gigabit Ethernet, PCI Express, RapidIO |
| Integrated Security Engine | AES, 3DES, public key, CRC accelerators |
| RoHS-Status | Compliant (Pb-Free) |
| Pb-Free | Yes (CSM Pb-Free 1200) |
MPC8572VTATLD Pin-Konfiguration
| Pin BGA pin | 1023 balls (FC-BGA) — Full pinout defined by NXP MPC8572E hardware specifications; refer to datasheet page-level ball map for power, ground, DDR2, PCIe, RapidIO, SGMII, local-bus, JTAG, and GPIO ball assignments |
Typische Anwendungen
MPC8572VTATLD ist geeignet für 8 Anwendungs: Enterprise Routers and Switches, Network Security Appliances (Firewall / IPS / VPN), Industrial Control and Automation Backplanes, Telecom Infrastructure (LTE base-station channel cards, UEs), Storage Area Network Controllers and iSCSI Bridges, Imaging and Imaging-Server Boards, Single-board Computers and ATCA Platforms, Powerline Communication Concentrators.
Enterprise Routers and Switches
The MPC8572VTATLD's dual 1.2 GHz e500 cores plus multiple Gigabit Ethernet interfaces make it a strong fit for mid-range enterprise routers and Layer-2/3 switches. The chip concurrently runs control-plane routing protocols (OSPF, BGP, MPLS) on one core and forwarding-plane packet processing on the second core, while the DDR2-with-ECC controller handles routing-table lookups without stalling either core. Hardware-accelerated AES/3DES frees core cycles for deep packet inspection, and the wide mix of high-speed serial I/O (PCIe, RapidIO, SGMII) lets designers aggregate uplinks and connect line cards directly. Compared with discrete control-plane/dispatch solutions, the MPC8572VTATLD reduces BOM cost and PCB area while meeting the deterministic throughput that enterprise networks require.
Empfohlen
Network Security Appliances (Firewall / IPS / VPN)
In firewall, intrusion-prevention and VPN gateway appliances, the MPC8572VTATLD's integrated security engine accelerates AES, 3DES, and public-key operations, allowing encrypted traffic to be inspected at line rate without burdening the e500 cores. Dual cores partition stateful-flow tracking and crypto operations cleanly, while the PCI Express lanes interface with NIC/smart-NIC expansion cards for 10+ Gbps uplinks. The 32-bit local bus can bridge legacy crypto accelerators or FPGAs, and ECC-protected DDR2 holds large connection-state tables reliably. Compared with software-only security stacks, the MPC8572VTATLD approach reduces CPU overhead and latency, helping appliances sustain high throughput under deep-inspection loads typical in modern threat-defense products.
Empfohlen
Industrial Control and Automation Backplanes
Industrial backplanes and SCADA controllers benefit from the MPC8572VTATLD's high I/O bandwidth and deterministic core performance. The PCI Express and RapidIO interfaces communicate with backplane FPGA fabrics and remote I/O modules, while the local bus connects to legacy parallel peripherals such as PLD-controlled GPIO and timer ICs. Dual e500 cores run a deterministic real-time OS on one core and management/control software on the other, simplifying the safety case for IEC-61850 or similar industrial protocols. The FC-BGA package is suitable for rugged backplane environments when the PCB stack-up, thermal vias, and conformal coating follow NXP reference design. Compared with discrete MCU + ASIC solutions, the integrated platform reduces board complexity and qualification effort.
Empfohlen
Telecom Infrastructure (LTE base-station channel cards, UEs)
The MPC8572VTATLD fits telecom channel cards requiring Fast-Path DSP offload, error correction, and high-throughput backhaul. Dual e500 cores handle Layer-2/3 protocol termination while the integrated security engine accelerates cipher suites used in 3G/4G backhaul protection, and PCI Express brings baseband data in from RF ASICs. ECC-protected DDR2 satisfies the high reliability targets of telecom-grade silicon. Designers typically pair the device with an FPGA for PHY-layer handling and a network processor for fast-path flows; the MPC8572VTATLD serves as the system controller and slow-path processor. Compared with x86+ASIC designs, this heterogeneous approach meets cost and power targets of compact LTE small-cell hardware.
Empfohlen
Storage Area Network Controllers and iSCSI Bridges
The MPC8572VTATLD is a natural fit for SAN controllers and iSCSI bridges that need to bridge Ethernet, Fibre Channel and Serial-ATA domains with offloaded RAID functions. Dual cores parallelize iSCSI login/authentication and data pathing, while the PCI Express and Serial-RapidIO interfaces connect to multi-gigabit Storage IO controllers. The on-chip security engine accelerates IPsec and CHAP-style authentication, and ECC DDR2 buffers metadata for RAID rebuild operations. Compared with purely host-managed bridges, the MPC8572VTATLD approach lowers host CPU load and enables single-controller appliances with redundant storage paths.
Empfohlen
Imaging and Imaging-Server Boards
Medical imaging concentrators and high-speed imaging servers benefit from the MPC8572VTATLD's combination of Gigabit Ethernet and PCI Express to aggregate imaging data from modalities (CT, MRI, ultrasound). Dual cores run DICOM-related stacks and image preprocessing concurrently, while the security engine protects patient data in transit (TLS/IPsec). FC-BGA mounting plus ECC DDR2 gives the reliability platform required by IEC-60601-1 and similar safety standards for medical equipment. Compared with general-purpose computing modules, the MPC8572VTATLD-based design compresses interface count and improves determinism, both of which matter when consolidating imaging feeds in real time.
Empfohlen
Single-board Computers and ATCA Platforms
The MPC8572VTATLD is a strong candidate for ATCA/AMC and AdvancedTCA boards used in carrier-grade platforms, where slot power, thermal envelopes, and IPMI are critical. The PCI Express fabric connects to AMC bays and ATCA backplanes, while the SGMII Ethernet ports implement control-plane networking. Dual cores run the carrier OS and management agents (IPMI, SNMP, telemetry) in parallel, simplifying real-time monitoring. ECC memory and Parity protection on internal structures meet NEBS/ETSI certification goals. Compared with general-purpose server CPUs, the MPC8572VTATLD form factor enables compact, low-power AMC modules suitable for distributed telecom and edge deployments.
Empfohlen
Powerline Communication Concentrators
Sub-station automation and smart-grid concentrators can use the MPC8572VTATLD for combining multi-rate PLC modems with broadband backhaul. Dual cores handle protocol conversion (DLMS/COSEM, IEC 61850) on one core and metering-data aggregation on the other, while ECC memory preserves meter records against single-event upsets common in sub-station environments. PCI Express links to single-pair HPGP or G3-PLC modems, and the on-chip security engine supports key rotation for the metering mesh. Compared with discrete MCU+LAN solutions, this approach improves throughput and certification velocity for utilities needing both legacy and modern metering endpoints.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8572VTATLD – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8572ECPXATLD | MPC8572VTATLE | MPC8572VJATLD | MPC8572EPXARLD | MPC8572CVTATLD |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCBGA (33x33 mm) | 1023-FCBGA (33x33 mm) | 1023-FCBGA (33x33 mm) | 1023-FCBGA (33x33 mm) | 1023-FCBGA (33x33 mm) | 1023-FCBGA (33x33 mm) |
| Core Architecture | PowerPC e500 dual-core | PowerPC e500 dual-core | PowerPC e500 dual-core | PowerPC e500 dual-core | PowerPC e500 dual-core | PowerPC e500 dual-core |
| Security Engine | Standard (AES, 3DES, CRC) | Extended (adds public-key) | Standard | Standard | Extended (EPXA suffix) | Standard |
| Memory Interface | DDR2 with ECC | DDR2 with ECC | DDR2 with ECC | DDR2 with ECC | DDR2 with ECC | DDR2 with ECC |
| Serial Interfaces | SGMII / PCIe / RapidIO / Local bus | SGMII / PCIe / RapidIO / Local bus | SGMII / PCIe / RapidIO / Local bus | SGMII / PCIe / RapidIO / Local bus | SGMII / PCIe / RapidIO / Local bus | SGMII / PCIe / RapidIO / Local bus |
| RoHS | Compliant (Pb-Free) | Compliant | Compliant | Compliant | Compliant | Compliant |
Wichtigste Unterscheidungsmerkmale
- Dual-core integration in a single FC-BGA (vs. MPC8548ECPXAUJC)
- Standard security engine footprint match (vs. MPC8572ECPXATLD)
- Flexible mixed-voltage I/O on a single device (vs. MPC8572VJATLD)
Designhinweise
The 1023-ball FC-BGA at 33x33 mm concentrates heat in a small region. Designers must follow NXP's FC-BGA reference PCB stack-up with thermal vias directly under the die and at least 2 oz copper for the core power plane. Without proper thermal relief the junction-to-ambient temperature rise can prevent the device from booting reliably, particularly in enclosed ATCA or compact platforms where airflow is limited.
The MPC8572VTATLD requires a precisely sequenced power-up with 1.8 V (core), 2.5 V (DDR2), and 3.3 V (I/O) supplied in the order documented in the MPC8572E hardware specifications. Use a power management IC such as those from NXP's compatible PMIC portfolio. Assert HRESET only after the last rail is stable and the POR signal has been confirmed - this latch sequence is a frequent cause of field failures if misused.
Routing DDR2 with the MPC8572VTATLD requires matched-length traces for signal/DQS pairs within the skew tolerance in the datasheet, plus matched impedance of 50-ohm single-ended and 100-ohm differential for the high-speed serial links. Following NXP's routing guidelines is essential for signal integrity, particularly for the SGMII and PCI Express SerDes lanes. Always run simulations or use the platform reference design as a baseline.
Common pitfalls include omitting the required RC termination on HRESET configuration pins, using an unsupported boot configuration word, and applying incorrect JTAG boundary-scan patterns that latch up the device. Always validate the bootloader against the official NXP reference firmware, and verify that pull-up/down resistors on local-bus pins match the reference BOM.
Compliance-Informationen
Pb-Free designation noted in CSM Pb-Free 1200 marking. RoHS compliance confirmed in distributor listings. REACH, halogen-free, and conflict-mineral declarations should be verified against the latest NXP compliance documentation for the relevant reporting period.
