MPC8572VTAULD - PowerQUICC III Dual-Core e500 1.333GHz MPU | NXP
Teilenummer: MPC8572VTAULD ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $295 | $295,00 |
| 10 | $278.5 | $2.785,00 |
| 100 | $245 | $24.500,00 |
| 500 | $218.75 | $109.375,00 |
| 1.000 | $192 | $192.000,00 |
MPC8572VTAULD Übersicht
A PowerQUICC III processor belongs to the PowerPC-based microprocessor family, which combines a general-purpose CPU subsystem with on-chip networking peripherals to offload protocol processing from the host CPU. The MPC85xx family sits at the intersection of microprocessors and communications SoCs, derived from Freescale's earlier PowerQUICC II architecture but with a much higher integration level including dedicated hardware accelerators for encryption, pattern matching, and queue management.
Key features include dual e500 cores with 32 KB L1 instruction and 32 KB L1 data caches per core, a unified 1 MB L2 cache, an integrated DDR2/DDR3 SDRAM controller with ECC support, four 10/100/1000 Mbps Ethernet MACs, two PCI Express interfaces, two Serial RapidIO endpoints, and a security engine supporting AES, DES, 3DES, SHA-1/SHA-256, and public-key cryptography. The device operates from 1.0 V core / 1.8 V / 2.5 V / 3.3 V I/O rails and supports industrial temperature ranges.
The MPC8572E integrates the above with an additional enhanced security block, distinguishing it from the MPC8572 base part. The 'VT' speed-grade designation indicates the 1.333 GHz core frequency bin, while the 'AULD' suffix encodes the FCBGA-1023 package, lead-free RoHS compliance, and the extended-temperature qualification. The architecture exposes a 64-bit local bus and supports boot from NOR flash, NAND flash, I2C EEPROM, and PCI Express to accommodate a wide range of system topologies.
Typical applications include multi-service routers, line cards for carrier Ethernet switches, IP DSLAMs, RAID storage controllers, and industrial automation controllers requiring deterministic Ethernet and RapidIO fabric connectivity. The integrated security engine also enables IPSec/SSL acceleration in unified SBC, ADC, and protocol-offload appliances.
When designing with the MPC8572VTAULD, careful attention must be paid to PCB layout for the FCBGA package: a high-density substrate, controlled-impedance routing for DDR2/DDR3 traces, and matched-length SERDES lanes are required to meet signal-integrity budgets. Decoupling capacitors must be placed as close as possible to every power pin, with a star-ground topology recommended for the analog PLL supplies.
This page synthesizes distributor stock and pricing snapshots, package-level drop-in alternatives drawn from the same MPC8572 family, and practical PCB thermal and SERDES layout notes that complement the NXP datasheet without replacing it.
Drop-in-Alternativen für MPC8572VTAULD – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8572VJAULE
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8572VTAULE
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8572VTAULD Grenzwerte & elektrische Eigenschaften
| Core Architecture | PowerPC e500 (dual-core) |
| Number of Cores | 2 |
| Datenbusbreite | 32-bit |
| Maximum Core Frequency | 1.333 GHz |
| Process Technology | 90 nm CMOS |
| L1 Cache (per core) | 32 KB I-cache + 32 KB D-cache |
| L2 Cache | 1 MB unified |
| Memory Controller | DDR2/DDR3 SDRAM with ECC |
| Ethernet MACs | 4 x 10/100/1000 Mbps |
| PCI Express Interfaces | 2 |
| Serial RapidIO Interfaces | 2 |
| Security Engine | AES, DES/3DES, SHA-1/SHA-256, public-key |
| Versorgungsspannung | 1.0 V core / 1.8 V / 2.5 V / 3.3 V I/O |
| Gehäuse | 1023-FCBGA (33x33 mm) |
| Montageart | Surface Mount |
| RoHS-Status | ROHS3 Compliant |
| Betriebstemperatur | Extended (per 'AULD' suffix) |
| Local Bus | 64-bit |
| Boot Sources | NOR flash, NAND flash, I2C EEPROM, PCI Express |
MPC8572VTAULD 1023-fcbga (33x33 mm) Pinbelegungsleitfaden
Pinbelegung für MPC8572VTAULD (1023-fcbga (33x33 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8572VTAULD.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8572VTAULD ist geeignet für 7 Anwendungs: Carrier-Grade Multi-Service Routers, RAID Storage Controllers and NAS, Industrial Automation Controllers, IP DSLAM and Access Aggregation, Wireless Base-Station Baseband Processing, Embedded Avionics and Defense Networking, Printers and Imaging Controllers.
Carrier-Grade Multi-Service Routers
The MPC8572VTAULD fits carrier-grade multi-service routers because it pairs dual PowerPC e500 cores at 1.333 GHz with four Gigabit Ethernet MACs, two PCI Express lanes, and two Serial RapidIO ports, all needed for wireline aggregation equipment. The hardware cryptography engine accelerates IPSec/SSL tunnels, while the integrated DDR2/DDR3 controller with ECC supports line-rate forwarding tables without external memory. Compared to a discrete CPU + switch-ASIC solution, the MPC8572 reduces board area by roughly 40 percent and BOM cost by 20 to 30 percent. Placed on a line card with 4x GbE PHY and a layer-2 switch fabric, it delivers deterministic QoS scheduling for voice, video, and data services. Trade-off: at 1.0 V core and 1.333 GHz the device dissipates substantial power, so a thermal-via array under the FCBGA is required.
Empfohlen
RAID Storage Controllers and NAS
The MPC8572VTAULD is widely used in RAID storage controllers because its dual e500 cores can dedicate one core to the host-facing PCI Express interface and the second to the SATA/SAS disk channels and parity calculation. The 1 MB L2 cache plus integrated DDR2/DDR3 controller with ECC handles multi-terabyte rebuild operations without external cache memory, lowering BOM cost. Hardware XOR and RAID-6 engines offload parity computation that would otherwise saturate the CPU. A typical 24-bay 6 Gbps SAS controller card uses one MPC8572 plus a PCI Express switch and SAS expander. The FCBGA-1023 package and 1.0 V core supply make it suited to compact 2.5-inch SSD backplane designs where PCB real estate is scarce.
Empfohlen
Industrial Automation Controllers
In industrial automation the MPC8572VTAULD enables deterministic EtherCAT, PROFINET, or SERCOS III master controllers thanks to its four Gigabit Ethernet MACs and hardware-assisted IEEE 1588 timestamping. Dual e500 cores at 1.333 GHz run the real-time motion-control loop on one core while the second core executes the IEC 61131-3 PLC runtime, eliminating the need for two processors. The extended-temperature 'D' suffix allows deployment in factory-floor enclosures without active cooling beyond a heatsink. Serial RapidIO links connect to local I/O racks at deterministic sub-microsecond latency. Compared to ARM Cortex-A9 solutions, the MPC8572 offers a longer product-lifecycle commitment (15+ years) required by industrial OEMs.
Empfohlen
IP DSLAM and Access Aggregation
The MPC8572VTAULD is well suited for IP DSLAM line cards that aggregate ADSL2+/VDSL2 subscribers onto an upstream Gigabit Ethernet uplink. Its PCI Express x4 can host a multi-port VDSL2 DSP front-end, while the four GbE MACs handle upstream switching and link-aggregation groups (LAG). Hardware encryption secures per-subscriber IPSec tunnels for business-VPN services. The DDR2/DDR3 controller with ECC reliably stores routing and ACL tables across 1024+ subscribers per line card. Compared to discrete x86 solutions, the MPC8572 reduces power consumption by 50 percent and eliminates active fans in customer-premises cabinets. The 1023-ball FCBGA requires careful high-speed trace routing for SERDES signals.
Empfohlen
Wireless Base-Station Baseband Processing
The MPC8572VTAULD fits wireless base-station baseband processing because its dual e500 cores can run the Layer-2/Layer-3 protocol stack on one core while the second executes the O&M (Operations and Maintenance) agent. The two Serial RapidIO interfaces connect to the radio-unit (RRH) over the CPRI or OBSAI fronthaul, with hardware encryption securing the backhaul. The integrated DDR2/DDR3 controller with ECC provides the bandwidth needed for pico-cell scheduling tables. Compared to ASIC-only basebands, the programmable e500 cores allow late-stage firmware updates for new 3GPP releases. Power dissipation at 1.333 GHz requires a forced-air cooled heatsink, but this is standard in base-station chassis.
Empfohlen
Embedded Avionics and Defense Networking
The MPC8572VTAULD supports embedded avionics and defense networking because of its extended-temperature qualification, dual-core redundancy for safety-critical functions, and Serial RapidIO fabric that is widely adopted in DO-254 certified systems. The hardware cryptography engine accelerates Link-16 and tactical-radio encryption. The FCBGA-1023 package, while high-density, provides the mechanical robustness required for MIL-STD-810 vibration profiles when mounted with underfill and corner staking. Compared to newer ARM Cortex-A53 processors, the MPC8572 remains attractive in long-life defense programs that already have VxWorks 6.x BSPs certified. Designers should budget for thermal vias under the BGA and for ±10 percent core-voltage tolerance.
Empfohlen
Printers and Imaging Controllers
The MPC8572VTAULD fits high-end production-print engines because one e500 core drives the print pipeline (PDF rasterization, halftoning) while the second handles the Gigabit Ethernet network stack and the operator panel. The hardware cryptography engine authenticates secure-print jobs and supports FIPS 140-2 validated firmware load. The DDR2/DDR3 controller with ECC reliably buffers 1200 dpi full-color pages without corruption, and the PCI Express interface connects to high-speed scan engines. Compared to ARM-based printer controllers, the MPC8572 offers deterministic real-time response needed for paper-feed synchronization. The 1023-ball FCBGA requires an 8-layer PCB with continuous ground planes for EMI control.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8572VTAULD – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8572VJAULE | MPC8572VTAULE |
|---|---|---|---|
| Package | 1023-FCBGA (33x33 mm) | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500 dual-core | PowerPC e500 dual-core - same | PowerPC e500 dual-core - same |
| Core Frequency | 1.333 GHz | 1.2 GHz (-10%) | 1.333 GHz - same |
| L2 Cache | 1 MB unified | 1 MB - same | 1 MB - same |
| Gigabit Ethernet MACs | 4 | 4 - same | 4 - same |
| PCI Express Lanes | 2 | 2 - same | 2 - same |
| Serial RapidIO Ports | 2 | 2 - same | 2 - same |
| Hardware Cryptography | AES/DES/SHA + PKA | AES/DES/SHA + PKA - same | AES/DES/SHA + PKA - same |
| Operating Temperature Grade | Extended ('D' suffix) | Extended ('E' suffix) | Standard ('E' suffix) |
Wichtigste Unterscheidungsmerkmale
- Highest available core frequency in the MPC8572 family (vs. MPC8572VJAULE)
- Dual-core architecture for parallel control/data-plane workloads (vs. MPC8548ECPXAUJC)
- Integrated hardware cryptography engine (vs. MPC8568VTAUJJ)
Designhinweise
The 1023-ball FCBGA at 33x33 mm demands an 8-layer (or thicker) PCB with continuous ground planes directly under the package. BGA escape routing must use 0.4 mm-pitch micro-via-in-pad construction with 1 oz copper plating, per the NXP MPC8572E design guide. All SERDES lanes (PCI Express, Serial RapidIO, SGMII) require 100 ohm differential impedance with intra-pair skew under 5 mils. Failure to follow these rules typically causes bit-error rates above 10^-12 on SERDES links.
Estimated: at 1.0 V core and 1.333 GHz with typical 8 W core power dissipation, the FCBGA-1023 junction temperature rises roughly 25 to 30 C above ambient on a 6-layer PCB without thermal vias. A thermal-via array (0.3 mm pitch, 12 mil diameter, filled-and-capped) directly under the die flag is mandatory for production designs operating in sealed enclosures. Designers targeting the 'D' temperature suffix should derate Tj to 100 C maximum. Confirm exact theta_JA values against the MPC8572E datasheet thermal table.
Use a sequencing controller such as the LTC2974 to enforce the MPC8572 power-on order: 3.3 V first, then 2.5 V, then 1.8 V, then 1.0 V core with a 10 ms monotonic ramp. Place 0.1 uF X7R decoupling capacitors within 2 mm of every power pin and four 10 uF bulk capacitors adjacent to each supply plane. The PLL analog supply (typically AVDD_PLL1/2) requires a ferrite-bead filter and a star-ground connection back to the main ground plane to minimize jitter on the GbE and RapidIO SERDES outputs.
Do not confuse the MPC8572VTAULD (dual-core, 1.333 GHz, FCBGA-1023) with the lower-pin-count MPC8568 (single-core, FCBGA-783) - they are NOT pin-compatible and require different PCB layouts. The boot-configuration strapping pins (cfg_rcw[0:N]) must be pulled either high or low with 4.7 K resistors and never left floating, or the device may fail to enumerate the DDR memory correctly. Finally, the security engine requires a separate battery-backed RTC supply (VDD_RTC) that must remain powered during system reset for secure-boot key continuity.
Compliance-Informationen
ROHS3 compliant per NXP product page and authorized-distributor listings. AEC-Q100 is not applicable for this communications-processor class. Halogen-free status was not provided in the verified web data.