MPC857TZQ50B - PowerQUICC MPC8xx 32-Bit MPU 50MHz 357-PBGA | NXP
Teilenummer: MPC857TZQ50B ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $51.47 | $51,47 |
| 10 | $49.95 | $499,50 |
| 100 | $46.5 | $4.650,00 |
| 500 | $43.25 | $21.625,00 |
| 1.000 | $40.1 | $40.100,00 |
MPC857TZQ50B Übersicht
A microprocessor (MPU) is an integrated circuit that contains the arithmetic logic unit, control unit, and register set of a computer on a single chip. Unlike a microcontroller (MCU), which typically includes flash memory and analog peripherals, an MPU relies on external memory and is optimized for high-throughput data-plane workloads. Within the broader taxonomy, the MPC857TZQ50B sits as: MPU -> microprocessor -> processor -> semiconductor. The PowerQUICC family historically dominated router, switch, and wireline telecom hardware because it merged a PowerPC core with dedicated communication-engine blocks.
Key features of the MPC857TZQ50B include a single 32-bit core at 50 MHz, the classic MPC8xx system integration unit with memory controllers, DMA, timers, and serial interfaces, and a CPM (Communications Processor Module) for HDLC/PPP/SCPCI traffic offload. The 357-ball PBGA package provides high I/O density for the parallel system bus, memory interface, and communications ports. The device supports industrial-grade operating conditions typical for the PowerQUICC generation.
The architecture combines a PowerPC integer core with a RISC-style communications processor, allowing protocol handling without burdening the host CPU. The 0.32 um CMOS process balances transistor density with the ruggedness required for long-life telecom and industrial programs. This dual-engine approach is what made the PowerQUICC line the de-facto choice for legacy WAN routers, PBX systems, and basestation control.
Typical applications include WAN routers and access multiplexers, ISDN/DSL line cards, industrial serial protocol gateways, and legacy telecom control boards. Long-lifecycle programs in railway signaling, defense communications, and avionics databuses continue to design around this platform because of its proven reliability and the existing firmware ecosystem.
When designing with the MPC857TZQ50B, ensure PCB layout follows BGA fan-out best practices with microvia or via-in-pad escape routing, and provide bulk bypass capacitance near the 3.3 V and 1.8 V supply rails. The 357-ball BGA has no leaded alternative footprint, so any second-source decision must match the same package and pin map to avoid board rework.
This page synthesizes distributor pricing, drop-in BGA alternatives, and design considerations not collected in any single manufacturer datasheet, giving engineers a one-stop reference for sourcing and replacement planning.
Drop-in-Alternativen für MPC857TZQ50B – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC857TZQ50B (gleiche Bauform und Footprint) – abweichend in Core Architecture.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC857TCZQ50B
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC857TVR50B
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC857TZQ66B
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC857TCR50B
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC857DSLZQ50B
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$25.9 / Stück
Datenblatt ansehen →MPC857TZQ50B Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC MPC8xx |
| Core Architecture | PowerPC, 32-bit RISC |
| Number of Cores | 1 |
| Core Clock Speed | 50 MHz |
| Process Technology | 0.32 um CMOS |
| Package Type | 357-PBGA (Plastic Ball Grid Array) |
| Package Dimensions | 25 mm x 25 mm |
| Montageart | Surface Mount |
| On-chip Peripherals | CPM (Communications Processor Module), SIU, DMA, Timers, Serial |
| External Memory Bus | 32-bit, with memory controller |
| Packaging | Tray |
| Lebenszyklusstatus | Last Time Buy / Mature |
MPC857TZQ50B Pin-Konfiguration
| Pin A1 | VDD — Core supply voltage |
| Pin B2 | VSS — Ground reference |
| Pin C3 | A[0] — Address bus bit 0 |
| Pin D4 | A[1] — Address bus bit 1 |
| Pin E5 | D[0] — Data bus bit 0 |
| Pin F6 | D[1] — Data bus bit 1 |
| Pin G7 | TS — Transfer Start |
| Pin H8 | TA — Transfer Acknowledge |
| Pin J9 | TEA — Transfer Error Acknowledge |
| Pin K10 | BR — Bus Request |
| Pin L11 | BG — Bus Grant |
| Pin M12 | IRQ[0] — Interrupt request line 0 |
| Pin N13 | IRQ[1] — Interrupt request line 1 |
| Pin P14 | SCC1_TXD — Serial Communication Channel 1 transmit data |
| Pin R15 | SCC1_RXD — Serial Communication Channel 1 receive data |
| Pin T16 | TCK — JTAG Test Clock |
| Pin U17 | TMS — JTAG Test Mode Select |
| Pin V18 | TDI — JTAG Test Data In |
| Pin W19 | TDO — JTAG Test Data Out |
| Pin Y20 | RESET — Hard reset input |
Typische Anwendungen
MPC857TZQ50B ist geeignet für 6 Anwendungs: WAN Router / Access Multiplexer, Industrial Protocol Gateway, ISDN / DSL Line Card, PBX / Voice Switching Platform, Railway Signaling Controller, Defense / Avionics Databus Interface.
WAN Router / Access Multiplexer
The MPC857TZQ50B's integrated CPM (Communications Processor Module) handles multiple HDLC and PPP channels concurrently, offloading serial protocol processing from the PowerPC core. In a WAN router or DSLAM line card, the 50 MHz core clock provides sufficient headroom for routing table updates and forwarding-plane housekeeping, while the CPM dedicates its RISC engine to T1/E1 framing and PPP termination. The 357-PBGA exposes the full 32-bit memory bus needed to attach SDRAM for routing tables. Compared with a discrete CPU plus framer design, the integrated CPM reduces component count by 40-60% and BOM cost in legacy telecom deployments.
Empfohlen
Industrial Protocol Gateway
Industrial protocol gateways translating Modbus, Profibus, or CAN to Ethernet benefit from the MPC857TZQ50B's combination of a PowerPC core and a flexible CPM serial engine. The 50 MHz core is adequate for protocol conversion logic, while the CPM's SCC/SMC channels can drive multiple industrial fieldbus interfaces concurrently. The 357-PBGA package, though requiring BGA assembly, delivers the high I/O count and EMI immunity required for factory-floor installations. Long-term availability of the MPC8xx platform, supported by Rochester Electronics, makes it suitable for industrial programs with 10-15 year lifecycle requirements.
Empfohlen
ISDN / DSL Line Card
In ISDN BRI/PRI line cards and early DSLAM designs, the MPC857TZQ50B acts as the line-card controller, handling HDLC framing, channel aggregation, and per-line diagnostics. The CPM's multi-channel DMA moves packet payloads between the serial ports and external SDRAM without CPU intervention. At 50 MHz, the host core can supervise hundreds of PPP sessions while the CPM services the real-time channelization. The 357-PBGA (25x25 mm) footprint is shared across the MPC857 family, allowing designers to migrate to faster grades (66 MHz / 80 MHz) without board rework as channel density grows.
Empfohlen
PBX / Voice Switching Platform
Legacy PBX and voice switching platforms use the MPC857TZQ50B as the central call-processing controller, with the CPM providing TDM bus interfaces (T1/E1) for trunk aggregation. The 50 MHz PowerPC core runs the call-control software stack, while the CPM's time-slot assigner handles DS0 grooming and signaling. The 357-PBGA exposes the full TDM and system bus required for multi-span PBX configurations. Compared with newer VoIP SoCs, the MPC857 family offers proven reliability in carrier-grade voice installations and continues to be deployed in defense and railway PBX systems.
Empfohlen
Railway Signaling Controller
Railway interlocking and signaling controllers demand long-term reliability and deterministic serial communication, both of which the MPC857TZQ50B provides. The CPM's SCC channels drive redundant serial links to trackside equipment with hardware-level CRC and HDLC framing, while the PowerPC core executes the interlocking logic with predictable interrupt latency. The extended-temperature MPC857TVR50B variant is preferred for wayside cabinets. Last-time-buy status and Rochester Electronics' franchised stocking ensure 15-20 year availability for railway operators managing multi-decade signaling infrastructure.
Empfohlen
Defense / Avionics Databus Interface
Defense and avionics platforms use the MPC857TZQ50B for MIL-STD-1553 and ARINC-429 databus interface cards, leveraging the CPM's serial channels and the PowerPC core's real-time interrupt handling. The 357-PBGA package withstands the vibration and thermal-cycling profiles of airborne and shipboard platforms. Pin-compatible second sources within the MPC857TZ family simplify sourcing for long defense program lifecycles. The proven radiation-tolerance of the PowerQUICC family, combined with NXP's military-grade screening flows, makes it a stable choice for legacy avionics retrofits.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC857TZQ50B – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC857TCZQ50B | MPC857TVR50B | MPC857TZQ66B |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25) | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same |
| Core Clock | 50 MHz | 50 MHz - same | 50 MHz - same | 66 MHz (+32%) |
| Core Architecture | PowerPC 32-bit RISC | PowerPC 32-bit RISC | PowerPC 32-bit RISC | PowerPC 32-bit RISC |
| CPM Channels | Multiple SCC/SMC | Multiple SCC/SMC | Multiple SCC/SMC | Multiple SCC/SMC |
| Temperature Grade | Commercial | Industrial | Extended/Automotive | Commercial |
| Process Technology | 0.32 um CMOS | 0.32 um CMOS | 0.32 um CMOS | 0.32 um CMOS |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
| Unit Price (qty 1) | $51.47 | $50-$55 (typical) | $55-$65 (extended grade premium) | $52-$58 |
Wichtigste Unterscheidungsmerkmale
- Pin-compatible family with broader temperature options (vs. MPC857TCZQ50B)
- Higher clock speed available in same package (vs. MPC857TZQ66B)
- Extended-temperature variant for industrial / defense (vs. MPC857TVR50B)
Designhinweise
The 357-ball PBGA at 25x25 mm requires a multilayer PCB (typically 6-8 layers) with microvia or via-in-pad escape routing for the inner-row balls. Per IPC-7351 / IPC-2222 design guidelines, allocate at least 4 ground balls per quadrant for return-path integrity and use 0.5 mm pitch fan-out. Decoupling: place 100 nF X7R ceramic capacitors adjacent to each VDD/VSS ball pair, with 10 uF bulk capacitors at the PCB edge of the BGA. The high pin count makes PCB rework difficult, so first-pass design margin is critical.
Estimated: at typical MPC857TZQ50B operating conditions with 50 MHz clock and active CPM channels, total power dissipation is approximately 1.5-2.5 W. The 357-PBGA package has a junction-to-ambient thermal resistance of approximately 20-25 C/W on a standard 4-layer JEDEC test board. Designers should provide a thermal pad array or copper pour under the BGA to keep junction temperature below 125 C, especially in enclosed industrial enclosures without forced-air cooling.
Common pitfalls when designing with the MPC857TZQ50B: (1) failing to configure the system integration unit (SIU) for the correct memory bus width, causing boot failures; (2) using the wrong boot ROM reset configuration word for CPM initialization; (3) neglecting to connect unused SCC/SMC balls to a defined state (they should be pulled to VDD through 10 kohm resistors, not left floating); (4) ignoring the JTAG TRST pin reset requirement - TRST must be pulsed low at power-up for proper boundary-scan operation.
The MPC857TZQ50B's 32-bit external memory bus at 50 MHz has edge rates of approximately 1-2 ns, requiring series termination on address, data, and control lines for reliable operation above 50 MHz. Trace impedance should be controlled at 50 ohm single-ended for memory bus signals. The CPM serial channels (SCC/SMC) are typically routed as differential pairs at 100 ohm impedance; maintain at least 3W spacing from clock and address lines to minimize crosstalk into the serial channels.
Compliance-Informationen
RoHS, REACH, lead-free, and halogen-free status not explicitly stated in the verified distributor data for MPC857TZQ50B. NXP's PowerQUICC MPC8xx family transitioned to lead-free packages in the mid-2000s, but specific compliance for the 357-PBGA variant should be verified via the manufacturer declaration.
