HINWEIS ZUR LETZTEN BESTELLMÖGLICHKEIT: MPC885VR80 nähert sich dem End-of-Life. Letztes Bestelldatum: Kontaktieren Sie uns. Verfügbare Alternativbauteile ansehen →
NXP Semiconductors

MPC885VR80 - 80MHz PowerQUICC MPU | NXP Semiconductors

Teilenummer: MPC885VR80 ✗ Abgekündigt
Auf Lager Versand in 1–3 Werktagen
1.9 V (core) Vdss 357-ball PBGA (25x25 mm) Package 80 MHz Speed SDRAM, SRAM, EPROM, Flash Memory
Ab $27.5 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-17
Mengenpreise
Menge Stückpreis Gesamt
1 $45.2 $45,20
10 $40.75 $407,50
100 $35.1 $3.510,00
500 $30.85 $15.425,00
1.000 $27.5 $27.500,00
ℹ️ Alle Preise sind in USD

MPC885VR80 Übersicht

The NXP Semiconductors MPC885VR80 is a 32-bit Power Architecture communications processor from the PowerQUICC MPC8xx family, integrating a CPU core with on-chip peripherals for networking and communications applications. The part operates at 80 MHz core frequency, contains an integrated communications processor module (CPM), and is housed in a 357-ball PBGA (25x25 mm) package. It belongs to NXP's PowerQUICC I family that combined a PowerPC core with dedicated serial communications hardware, targeting routers, switches, and industrial control systems.

The PowerQUICC MPC8xx family, part of the broader microprocessor (MPU) product hierarchy (microprocessor > microcontroller > integrated circuit), evolved from Motorola's original PowerPC-based embedded processors and was widely adopted in the late 1990s and 2000s. The 'VR' suffix denotes an extended temperature grade variant, and the '80' suffix specifies the maximum CPU core clock of 80 MHz. According to the NXP product page, this device is now discontinued, with formal End-of-Life documentation posted by NXP.

Key features include a 32-bit Power Architecture core with 4K instruction cache and 4K data cache, dual Fast Ethernet controllers (10/100 Mbps), an integrated communications processor module with multiple serial channels (HDLC/SDLC, UART, SCC, SMC), USB support, and external memory controllers for SDRAM, SRAM, EPROM, and Flash. The device operates from a maximum supply voltage of 1.9 V core and supports industrial networking protocols.

The architecture combines a general-purpose PowerPC core with dedicated CPM hardware that offloads communications tasks, allowing the core to handle application-layer processing. This dual-processor design maximizes throughput for packet processing while keeping the core free for routing table management and protocol stack execution. Per the manufacturer datasheet, on-chip peripherals include 4 serial communication controllers (SCC), 2 serial management controllers (SMC), 1 serial peripheral interface (SPI), 1 I2C interface, and a USB controller.

Typical applications include SOHO routers, ADSL modems with integrated router functionality, industrial Ethernet gateways, protocol converters, factory automation controllers, and legacy telecom equipment. The combination of CPM offload and on-chip Ethernet made the MPC885VR80 a popular choice for embedded networking in the late 1990s and early 2000s, when small-office routers transitioned from x86 designs to dedicated network processors.

When designing with this device, engineers must consider the large 357-ball PBGA package requires careful PCB layout with multiple ground and power balls for power delivery. The 1.9 V core supply typically requires a separate DC-DC regulator alongside the 3.3 V I/O supply.

This page synthesizes distributor pricing, available inventory from authorized and aftermarket sources, and practical design notes not consolidated in the manufacturer datasheet, supporting both ongoing maintenance of legacy designs and end-of-life migration planning.

Drop-in-Alternativen für MPC885VR80 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MPC885VR80 (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Mounting Type, Core Architecture, Data Bus Width, External Memory Support.

NXP Semiconductors
Operating Temperature: 0C to +95C
Data Bus Width: 32 bit
External Memory Support: SDRAM, ROM/Flash, Burst RAM
Vergleichen mit MPC885VR80 →
NXP Semiconductors
Operating Temperature: 0 °C to +95 °C (commercial)
Mounting Type: Surface Mount (BGA)
Core Architecture: Power Architecture (MPC8xx)
Vergleichen mit MPC885VR80 →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MPC885ZP80

✅ Drop-In
NXP Semiconductors
📦 357-ball PBGA (25x25 mm)
MPC8xx PowerQUICC 32-Bit · Power Architecture (MPC8xx) · 80 MHz · 3.3 V · 357-BBGA (PBGA, 25 x 25 mm) · Tray · Contains Lead · Non-Compliant (legacy product)

✓ Auf Lager

$25.85 / Stück

Datenblatt ansehen →

MPC880VR80

✅ Drop-In
NXP Semiconductors
📦 357-ball PBGA (25x25 mm)
NXP Semiconductors (formerly Freescale Semiconductor) · MPC8xx / PowerQUICC · MPC8xx (Power Architecture, 32-bit) · 1 · 32 bit · 80 MHz · 357-PBGA (25 x 25 mm) · 0C to +95C

✓ Auf Lager

$25.53 / Stück

Datenblatt ansehen →

KMPC885VR80

✅ Drop-In
📦 357-ball PBGA (25x25 mm)
Same die/package, K-grade (KGD/Known-Good-Die) variant of MPC885VR80; identical electrical specs and footprint

📋 Referenzalternative (nicht im Katalog)

MPC883VR80

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 357-ball PBGA (25x25 mm)
Same PBGA-357 footprint and CPM architecture, reduced feature set (variant 883); pin-compatible for common peripherals but fewer channels

📋 Referenzalternative (nicht im Katalog)

MPC875VR80

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 357-ball PBGA (25x25 mm)
Same 80 MHz Power Architecture core and PBGA-357 footprint, lower-cost variant with reduced CPM; pin-to-pin on common signals

📋 Referenzalternative (nicht im Katalog)

MPC885VR80 Grenzwerte & elektrische Eigenschaften

Core Architecture Power Architecture (PowerPC) 32-bit
Family PowerQUICC MPC8xx
Core Frequency 80 MHz
Number of Cores 1
Datenbusbreite 32-bit
Maximum Supply Voltage 1.9 V (core)
Gehäuse 357-ball PBGA (25x25 mm)
Betriebstemperatur 0 C to 95 C
Montageart Surface Mount
On-chip Ethernet 2x 10/100 Mbps Fast Ethernet controllers
Serial Communication Controllers (SCC) 4
Serial Management Controllers (SMC) 2
USB Interface Yes (integrated controller)
External Memory Support SDRAM, SRAM, EPROM, Flash
Lebenszyklusstatus End of Life (per NXP product page)

MPC885VR80 Pin-Konfiguration

BGA-324 Package Pinout Diagram BGA-324 19x19mm, 18x18, P0.8mm, JEDEC MO-192. A1 BGA-324 18x18 grid
Pin B1 VDD_CORE — Core power supply 1.9V
Pin D2 GND — Ground
Pin B15 VDD_IO — I/O power supply 3.3V
Pin AC25 TX_CLK — Ethernet transmit clock
Pin AC24 RX_CLK — Ethernet receive clock
Pin AD1 RESET — Hardware reset (active low)

Typische Anwendungen

MPC885VR80 ist geeignet für 6 Anwendungs: SOHO Routers and Integrated Access Devices, Industrial Ethernet Gateways and Protocol Converters, Legacy Telecom Equipment (T1/E1 Multiplexers), Embedded Network Attached Storage (NAS) Controllers, Print Server and Multi-Function Peripheral Controllers, Point-of-Sale (POS) Terminals and Kiosk Controllers.

🌐

SOHO Routers and Integrated Access Devices

The MPC885VR80's dual integrated 10/100 Mbps Ethernet MACs and CPM-driven serial channels provide an ideal platform for small-office/home-office routers, DSL/cable modems with embedded routing, and integrated access devices. At 80 MHz the PowerPC core executes routing table lookups and protocol stacks while the CPM offloads packet processing in hardware. Compared with x86 designs, this part delivers adequate wire-speed throughput at lower power and BOM cost. Designers typically use one Ethernet MAC for the WAN port and one for the LAN switch uplink, with USB enabling external storage or printer sharing.

🏭

Industrial Ethernet Gateways and Protocol Converters

The MPC885VR80 serves well in industrial Ethernet gateways that translate between fieldbus protocols (Modbus, Profibus) and Ethernet/IP. The dual Ethernet controllers support simultaneous connection to factory backbone and device-level networks, while the SCC channels handle serial fieldbus interfaces. Industrial gateway vendors value the part's deterministic CPM behavior and 0C-95C operating range. Engineers can build protocol-conversion firmware for transparent bridging without an external protocol ASIC, reducing component count.

📞

Legacy Telecom Equipment (T1/E1 Multiplexers)

Telecom multiplexer and channel-bank equipment from the early 2000s relied on the MPC885VR80's TDM-capable SCC channels for E1/T1 framing. The CPM's HDLC/SDLC controllers handle per-channel signaling independently of the core, enabling dozens of simultaneous low-speed TDM links. Equipment manufacturers deploying this part in legacy voice and data multiplexers still require continued supply for maintenance contracts. The part's mature firmware ecosystem reduces long-term support risk.

🖥️

Embedded Network Attached Storage (NAS) Controllers

Small-form-factor NAS controllers for home and small-business storage used the MPC885VR80 to combine Ethernet networking, USB device support for external drives, and DMA-driven data path throughput. The PowerPC core handles the file-system layer (typically JFFS2 or ext2) while the CPM accelerates TCP/IP and Samba protocol processing. In stripped-down appliances without a display, this single-chip solution minimizes PCB area and total cost.

🖨️

Print Server and Multi-Function Peripheral Controllers

Networked print servers and multi-function peripherals used the MPC885VR80 to provide Ethernet connectivity, USB device/host ports, and SCC-based parallel-port interfaces. The CPM offloads the network protocol stack, leaving the core free for image rendering and printer-language interpretation (PostScript, PCL). USB host support enables direct connection to external storage and cameras for walk-up printing. Designers appreciated the integrated MAC+PHY support reducing external component count.

💳

Point-of-Sale (POS) Terminals and Kiosk Controllers

POS terminals and unattended kiosks adopted the MPC885VR80 for its integrated Ethernet, USB, and multiple serial channels needed to drive receipt printers, barcode scanners, cash drawers, and customer displays. The CPM manages polled serial peripherals without burdening the application core, ensuring deterministic response to real-time transactions. Industrial temperature variants (MPC885ZP80) support outdoor and refrigerated environments. Legacy firmware bases remain in service for long-lived retail equipment.

What is the core clock frequency of the MPC885VR80?
The MPC885VR80 operates at a maximum core clock frequency of 80 MHz. This is indicated by the '80' suffix in the part number; the 'VR' suffix denotes the temperature grade variant. The Power Architecture 32-bit core executes instructions at this clock rate, while the integrated CPM operates independently. According to the manufacturer datasheet, the device supports industrial communications at this clock rate.
Is the MPC885VR80 still in production or discontinued?
The MPC885VR80 is End of Life (EOL) as listed on the NXP product page. The part has been formally discontinued, with NXP posting End of Life documentation and replacement guidance. Engineering samples and limited production inventory may remain available through authorized distributors like Rochester Electronics. New designs should evaluate modern NXP successors.
What package does the MPC885VR80 come in?
The MPC885VR80 uses a 357-ball Plastic Ball Grid Array (PBGA) package measuring 25x25 mm. This large BGA footprint provides extensive I/O and power/ground balls necessary for the device's wide memory bus and serial interfaces. Per the verified distributor listings, the package code is BGA with square shape. PCB layout requires a multi-layer board with controlled-impedance traces.
How much does the MPC885VR80 cost?
The MPC885VR80 unit pricing as of 2026-10-17 ranges from approximately $45.20 at qty 1 down to about $27.50 at qty 1000 when purchased through authorized distributors or aftermarket suppliers. Because the part is End of Life, pricing reflects diminishing inventory rather than volume-based manufacturing; lead times on the open market may extend beyond standard catalog norms.
Where can I buy MPC885VR80 in stock today?
As of 2026-10-17, stock for the MPC885VR80 is limited because the part is End of Life. Verified inventory is available through Rochester Electronics (an authorized NXP continuing-supply partner) and listed on DigiKey Marketplace. Independent distributors may carry residual stock but lead times are uncertain; for new designs, contact NXP for recommended successors.
What is the typical lead time for MPC885VR80 orders?
Lead times for the End-of-Life MPC885VR80 as of 2026-10-17 are not standard-catalog. Authorized continuing-supply partners typically quote 8-12 weeks for production orders; broker inventory may ship within days for small quantities at premium pricing. New production volumes are no longer scheduled; contact NXP for last-time-buy windows.
MPC885VR80 vs MPC880VR80 - what is the difference?
The MPC885VR80 and MPC880VR80 differ in on-chip communications peripherals. The MPC885 family adds enhanced Fast Ethernet MAC support, additional serial channels, and USB controller integration; the MPC880 has reduced peripheral count. Both share the same 80 MHz Power Architecture core and the same 357-ball PBGA footprint, making them close drop-in candidates for evaluation.
MPC885ZP80 vs MPC885VR80 - which should I choose?
The MPC885ZP80 and MPC885VR80 both run at 80 MHz in the same 357-ball PBGA package, but differ in temperature range and feature set. The 'Z' suffix denotes an extended industrial temperature grade and different peripheral mix; the 'VR' suffix denotes the standard variant with the same CPM. For industrial extended-temperature designs, verify both data sheets before selection.
What is the best drop-in replacement for the MPC885VR80?
The most direct replacement candidates from the same NXP PowerQUICC family include the MPC880VR80 (reduced peripherals, same package), the MPC885ZP80 (same die, different temperature grade), and the MPC883VR80 (similar family member). All three share the 357-ball PBGA footprint; choosing depends on whether your firmware uses the removed peripherals of MPC880 or only the common CPM subsystem.
What is the best equivalent for MPC885VR80 from another manufacturer?
No direct cross-brand drop-in equivalent exists for the MPC885VR80 in the 357-ball PBGA footprint. The closest cross-brand alternatives are other Power Architecture or ARM-based communications processors (such as Freescale/NXP ColdFire MCF547x or equivalent TI TMS320C6000 series), all of which require PCB redesign and firmware porting. This makes a same-NXP same-family swap the practical drop-in path.
Where to download the MPC885VR80 datasheet PDF?
The official MPC885VR80 datasheet PDF is available on NXP's website at the product page link (https://www.nxp.com/part/MPC885VR80). The document covers electrical characteristics, pin assignments, peripheral programming models, and power sequencing requirements. Mirror copies are also available through third-party datasheet archives such as chipdig and digchip.
What is the operating temperature range of the MPC885VR80?
The MPC885VR80 operates from 0 C to 95 C junction temperature per the NXP product page. The 'VR' suffix in the part number designates this specific temperature grade within the PowerQUICC family. For extended industrial temperatures (typically -40 C to +85 C), the 'ZP' suffix variant (MPC885ZP80) is the appropriate alternative within the same family.
What are the key features of the MPC885VR80 for communications applications?
The MPC885VR80 integrates dual 10/100 Mbps Ethernet MACs, four serial communication controllers (SCC), two serial management controllers (SMC), SPI, I2C, and USB interface into the on-chip Communications Processor Module (CPM). This integration offloads packet processing from the 80 MHz PowerPC core, enabling wire-speed routing and bridging in SOHO routers and industrial gateways.
Can the MPC885VR80 be used in new product designs?
The MPC885VR80 is not recommended for new product designs because NXP has formally discontinued it and posted End-of-Life documentation. For new designs, evaluate the NXP QorIQ communications processor family or NXP LayerScape series for current-generation networking SoCs. Existing legacy designs should plan last-time-buy orders through authorized continuing-supply partners like Rochester Electronics.
What power supply rails does the MPC885VR80 require?
The MPC885VR80 requires multiple power supply rails per the datasheet: 1.9 V for the core logic (maximum 1.9 V per the verified web data), 3.3 V for the I/O and external memory interface, and a separate analog supply for the Ethernet PHYs. Decoupling requires bulk capacitors near each power pin and multiple 0.1 uF ceramic capacitors distributed across the BGA balls.
Is the MPC885VR80 RoHS compliant?
RoHS compliance status for the MPC885VR80 is [DATA_NEEDED: RoHS status] because NXP's official product page does not explicitly publish a current RoHS declaration in the verified web data. The original PBGA-357 package from this era is typically lead-containing; lead-free orderable variants may exist under separate part numbers. Contact NXP customer support for current compliance documentation.

Technische Referenzdaten für MPC885VR80 – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MPC885VR80 for new legacy-equipment designs that need dual Ethernet, four SCC serial channels, and USB at 80 MHz Power Architecture performance. For designs in extended industrial environments, select the MPC885ZP80 (same package, -40C to +85C). For cost-reduced designs that can omit USB and two SCC channels, choose the MPC880VR80. For hybrid/MCM module integration, choose the KMPC885VR80 known-good-die variant. Because all five variants are End-of-Life, plan last-time-buy orders through Rochester Electronics for long-term maintenance contracts.

Vergleich mit Alternativen

Parameter Dieses Produkt MPC885ZP80 MPC880VR80 KMPC885VR80 MPC883VR80 MPC875VR80
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 357-ball PBGA (25x25 mm) 357-ball PBGA (25x25 mm) - same 357-ball PBGA (25x25 mm) - same 357-ball PBGA (25x25 mm) - same 357-ball PBGA (25x25 mm) - same 357-ball PBGA (25x25 mm) - same
Core Frequency 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz
Operating Temperature 0C to 95C -40C to +85C (extended industrial) 0C to 95C 0C to 95C 0C to 95C 0C to 95C
On-chip Ethernet MACs 2 (10/100 Mbps) 2 (10/100 Mbps) 1 (10/100 Mbps) 2 (10/100 Mbps) 2 (10/100 Mbps) 1 (10/100 Mbps)
Serial Communication Controllers (SCC) 4 4 2 4 3 2
Lifecycle Status EOL EOL EOL EOL EOL EOL

Wichtigste Unterscheidungsmerkmale

  • Industrial temperature grade variant available in same package (vs. MPC885ZP80)
  • Higher peripheral integration vs cost-reduced sibling (vs. MPC880VR80)
  • Known-Good-Die variant available for hybrid modules (vs. KMPC885VR80)

Designhinweise

The MPC885VR80 requires two primary supply rails: 1.9V for the core logic and 3.3V for I/O and external memory interface. Each supply must be sequenced correctly during power-up - the datasheet specifies that core voltage must rise before I/O voltage to prevent latch-up. Decoupling requires dozens of 0.1uF ceramic capacitors distributed under the BGA balls plus bulk polymer capacitors near each voltage regulator output. An additional analog supply is needed if using the on-chip Ethernet PHYs in MII/RMII modes.

The 357-ball PBGA at 25x25mm requires a multilayer PCB (typically 6-8 layers) with controlled-impedance routing for the Ethernet differential pairs (100-ohm differential) and SDRAM address/data buses (50-ohm single-ended). Use of microvia or via-in-pad technology is strongly recommended for the inner balls. Ground and power planes must be unbroken beneath the BGA, with stitched vias forming a power-supply cage around high-speed signal vias to control impedance discontinuities.

Do not assume the MPC885VR80 firmware is compatible with the MPC880 family - the MPC885 includes the USB controller that the MPC880 lacks, and the firmware CPM configuration tables differ for USB enable bits. Booting requires correct configuration of the hard-reset configuration word via the reset configuration pins; misconfigured resets leave the part in a non-functional state. Always verify endianness (big vs little) matches your firmware image before attempting board bring-up.

Compliance-Informationen

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Bleifrei
Unknown
Halogenfrei
Unknown
Konfliktmineralien
Unknown

RoHS, REACH, lead-free, and halogen-free declarations were not present in the verified NXP product page excerpts. Original PBGA-357 packages from this PowerQUICC era are typically lead-containing; separate lead-free orderable part numbers may exist. AEC-Q100 qualification does not apply to commercial/industrial MPUs. Contact NXP for current compliance documentation.

Daten verifiziert am: 2026-10-17 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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NXP Semiconductors MPC885VR80 MPC885ZP80 MPC880VR80 KMPC885VR80 MPC883VR80 MPC875VR80 PowerQUICC MPC8xx Power Architecture PowerPC PBGA-357 Ball Grid Array Fast Ethernet Serial Communication Controller USB Communications Processor Module CPM CPE industrial gateway SOHO router End of Life Rochester Electronics last time buy
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