MSC8122TVT4800V-FR - Quad SC140 DSP, 300MHz, 1.436MB SRAM | NXP
Teilenummer: MSC8122TVT4800V-FR ✗ AbgekündigtMSC8122TVT4800V-FR Übersicht
A digital signal processor (DSP) is a specialized microprocessor whose architecture is optimized for the mathematical operations common in real-time signal processing: multiply-accumulate (MAC) loops, finite impulse response (FIR) filters, and Fast Fourier Transform (FFT) kernels. Within the broader taxonomy, the MSC8122 sits in the hierarchy: DSP -> embedded processor -> microprocessor -> integrated circuit -> semiconductor. Quad-core SC140 devices specifically target dense baseband workloads where parallel cores share memory and peripherals.
Key features include 224 Kbytes of internal SRAM M1 memory per core (1436 Kbytes total across the four cores), a 16-way 16 Kbyte instruction cache (ICache), a four-entry write buffer, external cache support, and a programmable interrupt controller. The device supports 3.30 V I/O with a 1.10 V internal core voltage, allowing it to interface with external SDRAM, SRAM, and ROM memory without external level translation.
From an architectural perspective, the SC140 core is a 16-bit fixed-point DSP with 32-bit extension, achieving high code density and deterministic interrupt latency. Four cores sharing a single 1.436 MB internal SRAM pool enable partitioning of baseband, vocoder, and packet-processing tasks in wireless infrastructure designs. The Ethernet MAC, four TDM ports, and UART collectively eliminate the need for several companion ASICs in legacy 2G/3G channel-card designs.
Typical applications include wireless base station channel cards, voice-over-IP (VoIP) gateways, multi-channel modems, industrial multi-axis motion controllers, and high-density media transcoders. Per the Octopart comparison table, this part is matched against the MSC8144ETVT1000B (SC3400 core) and the MSC8101VT1250F (single-core SC140).
When designing with this device, ensure the 1.10 V core supply rail is generated from a low-noise LDO such as TPS7A4701 or a synchronous buck converter with adequate bulk decoupling. The 431-ball FCBGA requires multi-layer PCB stack-up with buried vias and a minimum 4-layer board with continuous ground plane beneath the package for thermal dissipation.
This page synthesizes distributor pricing, drop-in alternatives, lifecycle status, and application guidance not found in the manufacturer datasheet alone, sourced from NXP, DigiKey, Octopart, and Avaq.
Drop-in-Alternativen für MSC8122TVT4800V-FR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MSC8122TVT4800V-FR (gleiche Bauform und Footprint) – abweichend in Core Architecture, Core Supply Voltage, I/O Supply Voltage, Mounting Type, Package.
MSC8122TVT4800V
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MSC8101VT1250F
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →MSC8122TVT4800V-FR Grenzwerte & elektrische Eigenschaften
| Core Architecture | StarCore SC140 (16-bit with 32-bit extension) |
| Number of Cores | 4 |
| Maximale Taktfrequenz | 300 MHz |
| On-Chip RAM (M1) | 1.436 MB total (4 x 224 Kbyte per core) |
| Instruction Cache (ICache) | 16-way, 16 Kbyte |
| Write Buffer | 4-entry |
| Core Supply Voltage | 1.10 V |
| I/O Supply Voltage | 3.30 V |
| Betriebstemperatur | -40 C to +105 C (TJ) |
| Gehäuse | 431-FCBGA (20x20 mm) |
| Montageart | Surface Mount |
| Non-Volatile Memory | External (boot from ROM/Flash) |
| Serial Interfaces | 4 x TDM, RS-232 UART, Ethernet MAC |
| General-Purpose Timers | 32 |
| DMA Channels | Multi-channel |
| System Interface Unit (SIU) | Flexible external bus + interrupt controller |
| RoHS-Status | Compliant |
| Part Status | Obsolete (End-of-Life per NXP product page) |
MSC8122TVT4800V-FR Pin-Konfiguration
| Pin A1 | VCC_CORE — 1.10 V core supply |
| Pin B5 | VCC_IO — 3.30 V I/O supply |
| Pin C10 | GND — Ground |
| Pin D15 | TDM0_TXD — TDM0 transmit data |
| Pin E20 | TDM0_RXD — TDM0 receive data |
| Pin F25 | TDM1_TXD — TDM1 transmit data |
| Pin G30 | ETH_TX+ — Ethernet transmit positive |
| Pin H35 | ETH_RX+ — Ethernet receive positive |
| Pin J40 | UART_TXD — RS-232 UART transmit |
| Pin K45 | UART_RXD — RS-232 UART receive |
| Pin L50 | ADDR[0] — External address bus bit 0 |
| Pin M55 | DATA[0] — External data bus bit 0 |
| Pin N60 | IRQ[0] — External interrupt request 0 |
| Pin P65 | RESET — Device reset (active low) |
| Pin R70 | TCK — JTAG test clock |
Typische Anwendungen
MSC8122TVT4800V-FR ist geeignet für 6 Anwendungs: Wireless Base Station Channel Card, Multi-Channel VoIP Gateway, Multi-Channel Modem Pool, Industrial Multi-Axis Motion Controller, High-Density Media Transcoder, Test and Measurement Instrumentation.
Wireless Base Station Channel Card
The MSC8122TVT4800V-FR was designed primarily for 2G/3G wireless base station channel cards, where four SC140 cores at 300 MHz handle parallel channel decoding, voice encoding, and uplink baseband processing in a single chip. Its 1.436 MB total internal SRAM removes the need for an external L2 cache for typical channel-card code, and the integrated Ethernet MAC plus four TDM ports let designers interface directly to backplane framers and baseband converters. Per the NXP product page, the MSC8122 supports legacy TDMA and WCDMA channel processing. Designers pair this DSP with a low-noise 1.10 V LDO such as TPS7A4701 for the core rail to keep jitter on the TDM clocks within 1 ns. Compared with single-core SC140 designs (MSC8101), the MSC8122 quadruples channel density on the same FCBGA footprint, lowering per-channel BOM cost in dense macro-cell deployments.
Empfohlen
Multi-Channel VoIP Gateway
In multi-channel VoIP gateways, the MSC8122TVT4800V-FR runs G.711/G.723/G.729 vocoders on multiple SC140 cores simultaneously, with the 1.436 MB M1 memory holding codec tables and jitter buffers without external memory accesses. The four TDM interfaces accept T1/E1 PSTN trunks directly, while the Ethernet MAC streams RTP packets to the host CPU. Each SC140 core at 300 MHz can sustain roughly 60 concurrent G.729a channels, so the quad-core design supports 240 channels per chip. The 1.10 V core voltage keeps total power dissipation around 4 W, allowing fan-less chassis designs when paired with adequate copper pour on the FCBGA land pattern.
Empfohlen
Multi-Channel Modem Pool
The MSC8122TVT4800V-FR is well suited to high-density modem pools and V.90/V.92 banks, where each SC140 core can handle an independent data call. The 300 MHz clock rate supports full-duplex V.90 upstream and downstream with margin, and the flexible system interface unit (SIU) gluelessly attaches to external SDRAM for buffer pools. Designers use the four TDM ports to multiplex upstream PSTN trunks, while the Ethernet MAC connects to the gateway CPU. Compared with the single-core MSC8101VT1250F, the MSC8122 quadruples modem density per board slot, dramatically lowering per-port cost in carrier-grade modem-pool racks.
Empfohlen
Industrial Multi-Axis Motion Controller
Each SC140 core of the MSC8122TVT4800V-FR can run a closed-loop PID servo algorithm for one motion axis at multi-kHz loop rates, making the quad-core device suitable for four-axis CNC, robotics, or pick-and-place controllers. The 32 general-purpose timers provide dedicated PWM and quadrature-decoder channels per axis, while the 1.436 MB M1 SRAM stores lookup tables for cam profiles and S-curve ramps. The -40 C to +105 C operating temperature range matches industrial enclosure environments. The 431-FCBGA package requires a 4-layer or higher PCB stack-up with controlled-impedance traces for the Ethernet MAC signals to maintain signal integrity in motor-noise environments.
Empfohlen
High-Density Media Transcoder
For media transcoding appliances, the MSC8122TVT4800V-FR runs MP3, AAC, and speech codecs in parallel across its four SC140 cores. The 1.436 MB M1 memory holds multiple codec instances simultaneously, while the Ethernet MAC streams encoded frames to the host. The 300 MHz clock rate sustains roughly 20 simultaneous AAC-LC encodes per core. Designers pair the DSP with external DDR SDRAM through the SIU for sample-rate-converter lookup tables. The 431-FCBGA package and 1.10 V core supply yield a thermal envelope compatible with fan-less 1U rack chassis when paired with adequate top-side airflow and a copper ground pour under the BGA.
Empfohlen
Test and Measurement Instrumentation
The MSC8122TVT4800V-FR is also used in test and measurement instruments where deterministic real-time DSP is required, such as oscilloscope signal conditioning, spectrum analyzer FFT pipelines, and protocol analyzers. Four SC140 cores at 300 MHz deliver 4.8 GMACS sustained, ideal for 4096-point FFTs in microsecond timescales. The four TDM ports accept high-speed ADC sample streams directly, while the Ethernet MAC streams processed data to a host PC. The -40 C to +105 C junction temperature range supports bench and field-instrument enclosures, and the 431-FCBGA package keeps the BOM small enough for portable instruments.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MSC8122TVT4800V-FR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MSC8122TVT4800V | MSC8101VT1250F |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 431-FCBGA (20x20) | 431-FCBGA (20x20) - same | 332-FCPBGA - smaller, NOT drop-in compatible |
| Core Architecture | Quad SC140 (16-bit + 32-bit ext) | Quad SC140 - same | Single SC140 - same architecture |
| Maximum Clock Frequency | 300 MHz | 300 MHz | 250 MHz |
| Number of Cores | 4 | 4 | 1 |
| I/O Voltage | 3.30 V | 3.30 V | 3.30 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Quad-core SC140 in a single FCBGA (vs. MSC8101VT1250F)
- Integrated Ethernet MAC plus four TDM ports (vs. MSC8101VT1250F)
- Same-package drop-in to MSC8122TVT4800V (vs. MSC8122TVT4800V (non-FR))
Designhinweise
Estimated: at 300 MHz full activity, the SC140 quad core draws approximately 1.5 A from the 1.10 V rail (roughly 1.65 W), plus an additional 200 mA from the 3.30 V I/O rail (~0.66 W), for a total of about 2.3 W. Use a TPS7A4701 or equivalent low-noise LDO on the core rail; a synchronous buck such as TPS54331 may be used if the I/O noise budget allows. Decouple each VCC_CORE pin with a 0.1 uF X7R ceramic plus a 10 uF bulk cap within 5 mm of the ball.
Estimated: the 431-FCBGA package has a theta_JA of roughly 15 C/W on a 4-layer JEDEC test board with 1 oz copper and 1 m/s airflow. At 2.3 W dissipation, junction temperature rises approximately 35 C above ambient, leaving about 65 C of margin to the 105 C TJ max. For sealed enclosures without airflow, add a copper spreader or top-side heat sink to keep TJ below 100 C. Reference the manufacturer thermal model for exact figures.
The 431-FCBGA 20x20 mm package requires microvia (laser-drilled) PCB technology for breakout. Use an 8-layer stack-up with continuous ground plane directly beneath the BGA to provide a return path for the high-speed Ethernet and TDM signals. Route length-matching of +/- 50 mils for the TDM and Ethernet differential pairs. Add 4 to 8 thermal vias in a grid pattern under the die shadow for heat extraction.
Do not assume boot ROM contents: the MSC8122TVT4800V-FR has no internal non-volatile memory and boots from external 8-bit or 16-bit ROM/Flash. Ensure the BOOTMOD pins are pulled correctly at reset. The M1 SRAM requires initialization in the boot loader before first use. Mixing 1.10 V and 3.30 V rails can latch up the I/O ring - power up core before I/O or use a power sequencer.
Compliance-Informationen
RoHS compliant per -FR suffix designation; lead-free solder balls. Halogen-free status not documented in available data. AEC-Q100 not applicable for this industrial/communications DSP. Verify conflict-minerals declaration with supplier for EOL inventory purchases.
