P1011NXE2FFB - QorIQ P1 800MHz e500v2 SoC | NXP Semiconductors
Teilenummer: P1011NXE2FFB ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132 | $1.320,00 |
| 100 | $115 | $11.500,00 |
| 500 | $99 | $49.500,00 |
| 1.000 | $88 | $88.000,00 |
P1011NXE2FFB Übersicht
What is a QorIQ communications processor? QorIQ is NXP's Power Architecture-based SoC platform, evolved from the PowerQUICC line, designed for networking, telecom, and industrial control. Within this hierarchy, P1 series SoCs sit between the Layerscape LS1 family and the higher-tier P2/P3 multicore variants, offering integration of CPU, memory controller, and networking peripherals for value-priced embedded networking applications.
Key features of the P1011NXE2FFB include a single e500v2 core at 667/800 MHz with 32 KB L1 instruction and data caches plus 256 KB L2 platform cache, dual integrated Gigabit Ethernet MACs supporting SGMII and RGMII, a 64-bit DDR2/DDR3 SDRAM controller with ECC, three PCI Express controllers, two USB 2.0 controllers (host + device/host), two TDM interfaces, and an integrated SEC 2.0 security engine for IPSec, SSL/TLS, and SRTP acceleration.
The P1011NXE2FFB uses a high-performance superscalar e500v2 core built on 45 nm CMOS, with integrated L1/L2 cache hierarchy and a coherent system bus to on-chip peripherals. The on-chip SEC engine accelerates bulk cryptography without burdening the CPU, while the integrated GbE MACs eliminate external PHY glue logic for many router/switch designs.
Typical applications include industrial Ethernet routers, secure gateways, industrial control PLCs, smart-grid concentrators, factory automation controllers, and defense/aerospace networking equipment requiring extended temperature operation. The rich peripheral mix allows a single P1011NXE2FFB to replace separate MCU + network processor + crypto co-processor designs.
Design consideration: the 689-ball TEBGA II package requires a multi-layer PCB with matched-impedance routing for the DDR3 and PCIe lanes. Thermal management must account for up to 7 W TDP at peak workload; a thermal pad and copper pour are recommended per the NXP hardware design guide.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für P1011NXE2FFB – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit P1011NXE2FFB (gleiche Bauform und Footprint) – abweichend in Core Architecture, L1 Cache (per core), Memory Controller, Operating Temperature, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
P1021NXE2FFB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1011NXE2HFB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1011NSE2FFB
✅ Drop-In✓ Auf Lager
$52.75 / Stück
Datenblatt ansehen →LS1021ASE7MNLB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LS1028ASE7MNLB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1011NXE2FFB Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | QorIQ P1 |
| Core Architecture | Power Architecture e500v2, 32-bit |
| Core Count | 1 |
| Max Core Frequency | 800 MHz |
| Core Frequency (per variant ordering code) | 667 MHz |
| Process Technology | 45 nm CMOS |
| L1 Cache (per core) | 32 KB instruction + 32 KB data |
| L2 Platform Cache | 256 KB |
| Memory Controller | 64-bit DDR2/DDR3 with ECC |
| Ethernet | 2x Gigabit Ethernet (SGMII/RGMII) |
| PCI Express | 3x PCIe controllers |
| USB | 2x USB 2.0 (host + device/host) |
| TDM | 2x TDM interfaces |
| Security Engine | SEC 2.0 (IPSec/SSL/SRTP) |
| Gehäuse | 689-ball TEBGA II (31x31 mm) with exposed pad |
| Betriebstemperatur | -40 °C to +125 °C |
| RoHS-Status | RoHS Compliant |
| Lead-Free Status | Lead Free |
| Packaging | Tray |
| Revision | Rev 1.1 |
P1011NXE2FFB 689-ball tebga ii (31x31 mm) with exposed pad Pinbelegungsleitfaden
Pinbelegung für P1011NXE2FFB (689-ball tebga ii (31x31 mm) with exposed pad-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für P1011NXE2FFB.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
P1011NXE2FFB ist geeignet für 6 Anwendungs: Industrial Ethernet Router, Secure VPN Gateway, Factory Automation Controller, Smart Grid Concentrator, Defense and Aerospace Networking, Multi-Service Access Router.
Industrial Ethernet Router
The P1011NXE2FFB fits industrial Ethernet router designs because its dual integrated GbE MACs provide WAN/LAN ports without external switch silicon, while the SEC 2.0 engine accelerates IPsec VPN tunnels at line rate. With -40 to +125 °C operation and DDR3 with ECC for Linux OS reliability, it survives factory floor, outdoor cabinet, and substation deployments. Compared to a discrete MCU+network-processor approach, the P1011's 800 MHz e500v2 single core delivers sufficient packet throughput for 200+ Mbps routing with QoS filtering, reducing BOM cost and PCB area.
Empfohlen
Secure VPN Gateway
The P1011NXE2FFB is ideal for secure VPN gateways thanks to its hardware SEC 2.0 engine that performs AES, 3DES, SHA, and public-key operations at wire speed without CPU intervention. The 800 MHz e500v2 core runs the Linux networking stack (IPsec/IKE/SSL daemons) while the SEC engine offloads bulk encryption, sustaining 300+ Mbps IPsec throughput. DDR3 with ECC prevents memory-bit-flips from corrupting routing tables in mission-critical deployments. The wide -40 to +125 °C temperature range supports outdoor and roadside cabinet installations.
Empfohlen
Factory Automation Controller
The P1011NXE2FFB fits factory automation controllers needing deterministic Ethernet plus general-purpose processing. Its dual GbE MACs support EtherCAT, PROFINET, or Modbus TCP slave implementations via the TDM interfaces for industrial fieldbus bridging. The 800 MHz e500v2 handles motion control math, while DDR3 with ECC ensures long-term reliability in 24/7 operation. Industrial temperature grade (-40 to +125 °C) supports deployment near motors, drives, and other heat-generating equipment without active cooling.
Empfohlen
Smart Grid Concentrator
The P1011NXE2FFB serves smart-grid concentrators that aggregate data from multiple PLC or smart-meter endpoints over Ethernet or powerline. Its e500v2 core processes metering protocols (DLMS/COSEM, IEC 61850) while hardware crypto secures customer data per NIST/utility standards. The integrated GbE MACs provide upstream WAN and downstream LAN connectivity, while the SEC engine accelerates TLS handshakes with thousands of endpoint meters. Industrial temperature rating and ECC memory support decades of unattended substation operation.
Empfohlen
Defense and Aerospace Networking
The P1011NXE2FFB supports defense and aerospace networking equipment due to its extended temperature range, hardware security engine, and ruggedized TEBGA package. The SEC 2.0 engine accelerates Type-1 cryptography and TLS for tactical radio and mission-comms links. DDR3 with ECC provides single-event-upset tolerance for avionics and high-altitude deployments. The integrated USB, PCIe, and TDM interfaces connect to radio front-ends, GPS receivers, and military display peripherals in size-constrained platforms.
Empfohlen
Multi-Service Access Router
The P1011NXE2FFB fits multi-service access routers that deliver combined voice, video, and data over Ethernet uplinks. Its TDM interfaces support legacy T1/E1 PBX connections for voice trunking, while the e500v2 core runs a Linux router OS with QoS and traffic shaping. The SEC engine accelerates SRTP for VoIP media encryption, and DDR3 with ECC ensures high availability for service-provider deployments. The compact 689-ball TEBGA enables fanless designs in wall-mount or DIN-rail enclosures.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für P1011NXE2FFB – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | P1021NXE2FFB | P1011NXE2HFB | P1011NSE2FFB | LS1021ASE7MNLB | LS1028ASE7MNLB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| Core Architecture | Power e500v2 32-bit, single core | Power e500v2 32-bit, dual core | Power e500v2 32-bit, single core | Power e500v2 32-bit, single core | ARM Cortex-A7 dual-core | ARM Cortex-A53 dual-core |
| Max Core Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 1000 MHz | 1300 MHz |
| Integrated GbE MACs | 2 | 2 | 2 | 2 | 2 | 2 (with TSN switch) |
| Security Engine | SEC 2.0 | SEC 2.0 | SEC 2.0 | Different variant (no NXE SEC) | SEC 5.0 | SEC 5.0 |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR3L/LPDDR3 with ECC | DDR4/LPDDR4 with ECC |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +105 °C | -40 °C to +105 °C |
| Lifecycle Status | EOL / Discontinued | EOL / Discontinued | Obsolete | EOL / Discontinued | Active | Active |
Wichtigste Unterscheidungsmerkmale
- Drop-in dual-core upgrade path within same package (vs. P1011NXE2FFB vs P1021NXE2FFB)
- Migration path to active ARM Layerscape family (vs. P1011NXE2FFB vs LS1021ASE7MNLB)
- Integrated SEC engine eliminates crypto coprocessor cost (vs. P1011NXE2FFB vs discrete e500 + external crypto chip)
Designhinweise
Estimated: at 800 MHz peak workload and 1.0 V core voltage, the P1011NXE2FFB draws approximately 7 W TDP. The 689-ball TEBGA II package requires a thermal pad soldered to a top-layer copper pour (at least 25x25 mm with thermal vias to internal planes) to keep junction temperature within the -40 to +125 °C rating. For sealed enclosures without airflow, derate core frequency or use the P1011NXE2FFB's spread-spectrum clocking mode to reduce dissipation.
The 689-ball TEBGA II requires a minimum 6-layer PCB stackup with via-in-pad microvias for signal breakout. DDR3 traces must be length-matched within 25 mils and routed on a dedicated inner layer with reference ground planes above and below for 85 ohm impedance. PCI Express lanes need 100 ohm differential impedance and AC-coupling capacitors on the TX side. The exposed thermal pad must use an array of thermal vias (0.3 mm drill, 1.2 mm pitch) for heat extraction.
The P1011NXE2FFB requires multiple power rails (1.0 V core, 1.5 V DDR3, 2.5 V Ethernet PHY, 3.3 V I/O) with strict sequencing per the datasheet. Use a multi-rail PMIC with power-good output cascaded to subsequent enable pins to prevent latch-up. Place 10 µF and 0.1 µF ceramic decoupling capacitors within 5 mm of every power pin, and add bulk polymer capacitors near the DDR3 supply pin to handle burst currents.
Do not substitute the FFB lead-free variant with the HFB leaded variant in designs that have not qualified lead-free reflow profiles. Avoid routing DDR3 signals across plane splits or under noisy components like DC-DC inductors. The SEC 2.0 engine requires firmware initialization in U-Boot or a hardware boot sequencer to function; without proper init, IPsec operations fall back to software and cripple throughput. Always verify the RCW (Reset Configuration Word) settings match the hardware boot source before mass production.
Compliance-Informationen
RoHS and lead-free per NXP product page datasheet snippet. AEC-Q100 not applicable to networking SoC. Halogen-free status not specified in provided data.
