P1014NXN5DFA - QorIQ P1014 32-Bit SoC 533MHz 425-TEPBGA | NXP
Teilenummer: P1014NXN5DFA ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $32.37 | $32,37 |
| 10 | $30.2 | $302,00 |
| 100 | $27.55 | $2.755,00 |
| 500 | $24.8 | $12.400,00 |
| 1.000 | $22.1 | $22.100,00 |
P1014NXN5DFA Übersicht
A communications processor is a specialized system-on-chip (SoC) that integrates one or more CPU cores with networking peripherals, security engines and memory controllers on a single die. In the wider semiconductor taxonomy it sits below general-purpose microprocessors and above simple microcontrollers, optimized for protocol processing, packet inspection and secure networking. The QorIQ family is NXP's line of Power Architecture-based SoCs targeting routers, switches, industrial gateways and embedded networking equipment.
Key features include the e500v2 single-issue core with integrated SEC 4.x crypto block supporting DES, 3DES, AES, SHA and RSA, dual 10/100/1000 Ethernet MACs with IEEE 1588 timestamping, two USB 2.0 controllers (host + device/OTG), two SATA 2.0 interfaces, three PCIe Gen2 controllers and a 32-bit DDR3/DDR3L SDRAM controller with ECC support. The -40 C to +105 C temperature range qualifies the part for industrial and extended-temperature networking deployments.
Typical applications include industrial Ethernet routers, secure IoT gateways, factory automation controllers, smart-grid concentrators, substation communication equipment and embedded networking modules. The integrated peripherals remove the need for discrete Ethernet PHYs, SATA controllers and crypto ASICs, reducing board area and BOM cost in space-constrained designs.
Design considerations focus on power sequencing of the multiple supply rails (core, I/O, DDR PHY, Ethernet PHYs), thermal dissipation via the package's exposed die region, JTAG boundary-scan test access, and careful PCB layout to maintain DDR3 signal integrity at 533 MHz. The SEC engine offloads cryptographic workloads from the main core, freeing CPU cycles for application logic and protocol stacks.
Drop-in-Alternativen für P1014NXN5DFA – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit P1014NXN5DFA (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Core Architecture, Package, Memory Controller, SATA.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
P1014NXN5HFA
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$47.1 / Stück
Datenblatt ansehen →P1014NSE5DFA
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$27.8 / Stück
Datenblatt ansehen →P1010NSE5HHA
✅ Drop-In✓ Auf Lager
$24.1 / Stück
Datenblatt ansehen →P1010NXN5HFA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1014NXN5DFA Grenzwerte & elektrische Eigenschaften
| Core Architecture | Power Architecture e500v2, 32-bit |
| Core Count | 1 |
| Maximum CPU Frequency | 533 MHz (P1014 family up to 800 MHz) |
| L1 Cache | 32 KB instruction + 32 KB data per core |
| Memory Controller | 32-bit DDR3/DDR3L SDRAM with ECC |
| Ethernet MACs | 2x 10/100/1000 Mbps with IEEE 1588 |
| USB Interfaces | 2x USB 2.0 (host + device/OTG) |
| SATA Interfaces | 2x SATA 2.0 (3 Gbps) |
| PCIe Controllers | 3x PCIe Gen2 |
| Security Engine | SEC 4.x (DES, 3DES, AES, SHA, RSA, ECC) |
| Betriebstemperatur | -40 C to +105 C |
| Gehäuse | 425-TEPBGA I, 19x19 mm |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant (per NXP product page) |
| Lead-Free | Yes |
P1014NXN5DFA 425-tepbga i, 19x19 mm Pinbelegungsleitfaden
Pinbelegung für P1014NXN5DFA (425-tepbga i, 19x19 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für P1014NXN5DFA.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
P1014NXN5DFA ist geeignet für 6 Anwendungs: Industrial Ethernet Router, Secure IoT Gateway, Factory Automation Controller, Smart Grid Concentrator, Substation Communication Equipment, Embedded Networking Module.
Industrial Ethernet Router
The P1014NXN5DFA's dual Gigabit Ethernet MACs with IEEE 1588 hardware timestamping make it well-suited to industrial routers requiring deterministic packet forwarding and PTP synchronization. The integrated SEC 4.x engine offloads IPsec and MACsec at line rate, freeing the e500v2 core for routing-table lookup and QoS processing. The -40 C to +105 C temperature rating supports deployment in factory-floor cabinets and outdoor DIN-rail enclosures without thermal derating.
Empfohlen
Secure IoT Gateway
The P1014NXN5DFA integrates AES, SHA, RSA in the SEC engine alongside dual GbE, USB 2.0 and PCIe, enabling a single-chip secure gateway that aggregates sensor traffic, encrypts upstream data and exposes local services. Per NXP's QorIQ documentation, the SEC block sustains multi-gigabit IPsec throughput while the DDR3 controller supports up to 1 GB of attachable memory for TLS session caching. The 425-TEPBGA package fits a compact gateway footprint.
Empfohlen
Factory Automation Controller
The P1014NXN5DFA's combination of PCIe for industrial-master cards, dual GbE for PROFINET/EtherCAT bridging, USB for HMI touchscreens, and DDR3 with ECC for deterministic real-time control makes it a strong fit for factory automation controllers. The industrial temperature grade supports cabinet-mounted operation. According to NXP's reference designs, the part pairs naturally with external FPGAs over PCIe for high-speed deterministic I/O expansion.
Empfohlen
Smart Grid Concentrator
The P1014NXN5DFA's extended -40 C to +105 C operating range and hardware SEC engine support substation concentrator units that aggregate data from smart meters over Ethernet and forward it to the utility head-end via encrypted uplink. The dual GbE MACs provide redundant uplink paths, while SATA enables local logging of meter data. The DDR3 with ECC ensures data integrity for billing-grade information processing.
Empfohlen
Substation Communication Equipment
The P1014NXN5DFA supports IEC 61850 substation communication protocols through its deterministic GbE MACs and IEEE 1588 timestamping, which are required for synchronized phasor measurement and GOOSE messaging. The integrated PCIe enables connection to digital fault-recorder mezzanines, and the SEC engine handles authentication for secure substation-to-control-center links. The 19x19 mm TEPBGA package supports compact, sealed substation enclosures.
Empfohlen
Embedded Networking Module
The P1014NXN5DFA's highly integrated feature set - dual GbE, USB, SATA, PCIe, DDR3 controller and crypto engine - makes it ideal for compact SoM (system-on-module) designs targeting OEM networking equipment. Per NXP's QorIQ documentation, the part boots from NAND or SPI flash and runs a wide variety of embedded Linux distributions. The TEPBGA package supports reflow soldering on standard FR-4 stackups used in SoM baseboards.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für P1014NXN5DFA – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | P1014NXN5HFA | P1014NSE5DFA | P1010NSE5HHA | P1010NXN5HFA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 425-TEPBGA I (19x19 mm) | 425-TEPBGA I (19x19 mm) - same | 425-TEPBGA I (19x19 mm) - same | 425-TEPBGA I (19x19 mm) - same | 425-TEPBGA I (19x19 mm) - same |
| CPU Architecture | Power Architecture e500v2, 32-bit | Power Architecture e500v2, 32-bit | Power Architecture e500v2, 32-bit | Power Architecture e500v2, 32-bit | Power Architecture e500v2, 32-bit |
| Maximum Frequency | 533 MHz (family up to 800 MHz) | 800 MHz | 533 MHz | 1.0 GHz | 800 MHz |
| Core Count | 1 | 1 | 1 | 1 | 1 |
| Ethernet MACs | 2x 10/100/1000 + IEEE 1588 | 2x 10/100/1000 + IEEE 1588 | 2x 10/100/1000 + IEEE 1588 | 2x 10/100/1000 + IEEE 1588 | 2x 10/100/1000 + IEEE 1588 |
| PCIe Controllers | 3x PCIe Gen2 | 3x PCIe Gen2 | 3x PCIe Gen2 | 3x PCIe Gen2 | 3x PCIe Gen2 |
| Security Engine | SEC 4.x | SEC 4.x | SEC 4.x (enhanced) | SEC 4.x | SEC 4.x |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C |
Wichtigste Unterscheidungsmerkmale
- Integrated dual GbE with IEEE 1588 hardware timestamping (vs. P1010NSE5HHA)
- Highest-speed 800 MHz option in same package (vs. P1014NSE5DFA)
- Single-chip secure networking SoC (vs. Discrete CPU + external crypto ASIC)
Designhinweise
The P1014NXN5DFA requires multiple independent supply rails (core VDD, DDR PHY, GbE PHY I/O, USB PHY, SERDES) that must be sequenced per the NXP datasheet power-up requirements. Use a PMIC such as the NXP PF0100 or discrete load switches with PG (power-good) feedback to enforce the sequence. Failing to honor the sequence can latch-up the SERDES or cause permanent DDR3 interface damage during power-up transitions.
The 425-TEPBGA 19x19 mm package requires 8-layer or 10-layer stackup for proper DDR3 signal integrity at 533 MHz. Route the DDR3 byte lanes with matched-length traces (per-byte matching within 25 mil), reference to a solid ground plane and use the IBIS model in pre-layout simulation. Per NXP's hardware design guide, length-matching across all DDR3 signals including address/command is mandatory; violation causes write/read errors at temperature extremes.
Estimated: At 533 MHz core frequency with all peripherals active, the P1014NXN5DFA dissipates roughly 3-5 W depending on workload. With the 425-TEPBGA package's theta_JA of approximately 15-20 C/W on a 4-layer JEDEC board, junction temperature rise is 45-100 C above ambient. For continuous operation at +105 C ambient, provide thermal vias under the exposed die region and ensure airflow or heatsink attachment to keep Tj below +125 C maximum.
Do not reuse the P1010 firmware binary on the P1014 without verifying the SERDES configuration and the SEC engine feature mask; the parts have similar but not identical peripheral subsets. Confirm that the JTAG boundary-scan chain order matches the BSDL model downloaded from NXP before relying on production test coverage. Lastly, validate reset circuit timing against the NXP reference design - insufficient reset hold time after power-up is a common boot failure cause.
Compliance-Informationen
RoHS and REACH compliant per NXP product environmental declarations. Not AEC-Q100 qualified (industrial/extended temp grade only). Lead-free BGA balls per NXP packaging specification.
