P1022NXE2HFB - QorIQ P1 SoC 1.055GHz Dual e500v2 689-TEPBGA | NXP
Teilenummer: P1022NXE2HFB ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $50.91 | $50,91 |
| 10 | $47.5 | $475,00 |
| 100 | $42 | $4.200,00 |
| 500 | $38.25 | $19.125,00 |
| 1.000 | $34.9 | $34.900,00 |
P1022NXE2HFB Übersicht
A QorIQ communications processor is a multi-core SoC optimized for embedded networking and industrial control workloads where deterministic throughput, hardware-accelerated security, and rich peripheral integration replace discrete ASICs plus an external CPU. It sits at the top of the taxonomy: communications processor -> SoC -> microprocessor -> integrated circuit -> semiconductor, sharing lineage with PowerQUICC predecessors while migrating to a deeper pipeline and on-die peripherals.
Key differentiating specifications include dual e500v2 cores with MMU/FPU support, integrated SEC 4.x security engine for IPSec and SSL/TLS offload, three enhanced Gigabit Ethernet MACs with SGMII/RGMII/MII interfaces, DDR2/3 memory controller with ECC up to 800 MT/s, two PCI Express controllers, USB 2.0 with ULPI, and an LCD controller. The integrated security and networking acceleration remove the need for companion crypto and Ethernet PHYs at the data-plane level.
The architecture pairs a 32-bit superscalar e500v2 core with a coherent system bus, platform cache, and dedicated DMA engines, allowing deterministic throughput for wire-speed packet processing. The 1V core / 1.0-1.05V I/O operation reduces board-level power complexity versus legacy multi-rail PowerQUICC designs, and the 689-TEPBGA exposed-pad package provides the thermal headroom required for fanless industrial enclosures rated -40C to +125C.
Typical applications include industrial networking gateways, factory automation controllers, secure IoT edge routers, line-rate network appliances, HMI panels with LCD, and legacy PowerQUICC migrations. Designers adopt the P1022 family when deterministic dual-core Power Architecture performance with hardware security and multi-protocol I/O is needed on a single SoC.
When laying out the board, allocate a continuous ground plane beneath the exposed pad and use at least 8 vias in a 3x3 grid for thermal relief. Respect DDR3 routing rules (length matching within 25 mils for byte lanes) and keep PHY-side differential pairs (SERDES, PCIe) length-matched to within 150 mils of the companion transceiver.
This page synthesizes NXP datasheet specs, distributor pricing, and drop-in alternative guidance that is not aggregated in the manufacturer's product brief alone.
Drop-in-Alternativen für P1022NXE2HFB – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit P1022NXE2HFB (gleiche Bauform und Footprint) – abweichend in RoHS Status, USB, Core Architecture, Operating Temperature, Ethernet.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
P1022NXN2HFB
✅ Drop-In✓ Auf Lager
$52.65 / Stück
Datenblatt ansehen →P1022NSE2HFB
✅ Drop-In✓ Auf Lager
$75 / Stück
Datenblatt ansehen →P1013NXE2HFB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1022NXE2HFB-R
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1024NXE2HFB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1025NXE2HFB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1022NXE2HFB Grenzwerte & elektrische Eigenschaften
| Processor Series | QorIQ P1 |
| Core Architecture | PowerPC e500v2 |
| Number of Cores | 2 |
| Core Frequency | 1.055 GHz (typ) |
| Bit Width | 32-bit |
| Instruction Cache (per core) | 32 KB |
| Data Cache (per core) | 32 KB |
| Platform Cache | 256 KB |
| Memory Controller | DDR2/DDR3 with ECC |
| Ethernet MACs | 3 x 1 Gbps (eTSEC, SGMII/RGMII/MII) |
| PCI Express | 2 x PCIe controllers |
| USB | USB 2.0 with ULPI |
| Security Engine | SEC 4.x (IPSec/SSL/TLS offload) |
| Display Controller | Integrated LCD controller |
| Betriebstemperatur | -40C to +125C |
| Core Voltage | 1.0 V |
| I/O Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Gehäuse | 689-TEPBGA II (31 x 31 mm) Exposed Pad |
| RoHS-Status | RoHS Compliant |
| Lead Free Status | Lead Free |
P1022NXE2HFB 689-tepbga ii (31 x 31 mm) exposed pad Pinbelegungsleitfaden
Pinbelegung für P1022NXE2HFB (689-tepbga ii (31 x 31 mm) exposed pad-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für P1022NXE2HFB.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
P1022NXE2HFB ist geeignet für 6 Anwendungs: Industrial Networking Gateway, Factory Automation Controller, Secure IoT Edge Router, Line-Rate Network Appliance, HMI Panel with LCD, Legacy PowerQUICC Migration Target.
Industrial Networking Gateway
The P1022NXE2HFB's dual e500v2 cores at 1.055 GHz plus three Gigabit Ethernet MACs and SEC 4.x hardware acceleration make it ideal for industrial protocol gateways bridging Modbus/TCP, EtherCAT, and PROFINET traffic. The integrated IPSec/SSL offload sustains line-rate encryption at 1 Gbps without CPU loading, and the -40C to +125C industrial temperature range supports outdoor cabinet and factory-floor deployment. Three eTSEC ports enable multi-segment routing plus a dedicated management port, eliminating external switch ICs.
Empfohlen
Factory Automation Controller
For PLC-class controllers and machine builders, the P1022NXE2HFB delivers deterministic dual-core compute with PCI Express expansion for motion-control cards and USB 2.0 for HMI panels. The DDR3 with ECC controller ensures zero data corruption in long uptime industrial cycles, and the LCD controller drives operator panels directly without a graphics ASIC. Combined with the SEC engine for secure remote management, this SoC replaces discrete MCU + network processor stacks.
Empfohlen
Secure IoT Edge Router
The P1022NXE2HFB is purpose-built for edge routers that must terminate IPSec tunnels from thousands of IoT sensors while running local analytics. SEC 4.x accelerates AES-GCM and RSA at line rate, while the dual e500v2 cores separate the data plane (packet forwarding) from the control plane (routing daemon, VPN management). The compact 689-TEPBGA II package allows fanless enclosure designs in space-constrained IT rooms or DIN-rail mounts.
Empfohlen
Line-Rate Network Appliance
For 1 Gbps-class UTM, firewall, or VPN concentrator appliances, the P1022NXE2HFB's combination of dual cores, hardware IPSec offload, and three Ethernet MACs hits the cost/performance sweet spot. The integrated SEC engine sustains 1 Gbps AES-256-GCM throughput, leaving both e500v2 cores free for deep-packet inspection and policy enforcement. The 689-ball TEPBGA exposed-pad package sustains full-load operation at +125C junction when paired with adequate PCB copper.
Empfohlen
HMI Panel with LCD
The P1022NXE2HFB's integrated LCD controller plus dual-core throughput enables industrial HMI panels that render complex graphics while simultaneously managing fieldbus I/O. DDR3 with ECC supplies the framebuffer bandwidth needed for 1024x768 WVGA panels at 60 Hz, and the SEC engine protects remote firmware updates. The 689-TEPBGA II package with exposed pad allows sealed IP65 front-panel designs without airflow.
Empfohlen
Legacy PowerQUICC Migration Target
Designers upgrading from PowerQUICC III MPC85xx to a more integrated platform can adopt the P1022NXE2HFB as a drop-in replacement that consolidates CPU, security, and Ethernet onto a single die. The shared Power Architecture e500v2 core preserves binary compatibility for existing firmware, while the on-chip SEC 4.x and DDR3 controller eliminate the external bridge chips and glue logic. This dramatically reduces PCB area, BOM cost, and time-to-market.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für P1022NXE2HFB – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | P1022NXN2HFB | P1022NSE2HFB | P1013NXE2HFB | P1024NXE2HFB | P1025NXE2HFB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| Core Architecture | Dual e500v2 | Dual e500v2 | Dual e500v2 | Single e500v2 | Dual e500v2 | Dual e500v2 |
| Core Frequency | 1.055 GHz | 1.055 GHz | 800 MHz (-24%) | 1.055 GHz | 1.055 GHz | 1.055 GHz |
| Operating Temperature | -40C to +125C | 0C to +105C (commercial) | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Ethernet MACs | 3 x 1 Gbps (eTSEC) | 3 x 1 Gbps (eTSEC) | 3 x 1 Gbps (eTSEC) | 3 x 1 Gbps (eTSEC) | 3 x 1 Gbps (eTSEC) | 3 x 1 Gbps (eTSEC) |
| Security Engine | SEC 4.x | SEC 4.x | SEC 4.x | SEC 3.x | SEC 4.x | SEC 4.x |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL |
Wichtigste Unterscheidungsmerkmale
- Highest core clock within the P1022 industrial-grade family (vs. P1022NSE2HFB)
- Dual-core + SEC 4.x in a single 689-ball TEPBGA (vs. P1013NXE2HFB)
- Industrial temperature coverage at full 1.055 GHz (vs. P1022NXN2HFB)
Designhinweise
At 1.055 GHz with both cores active and SEC engine processing IPSec traffic, the P1022NXE2HFB can dissipate approximately 5-7 W typical, up to 20 W under worst-case conditions. The 689-TEPBGA II package requires a continuous ground copper plane beneath the exposed pad with at least 8 thermal vias in a 3x3 grid for industrial temperature operation. Estimated: theta_JA is approximately 12 C/W with 8 thermal vias on a 4-layer 1 oz PCB; verify with NXP thermal model before committing to fanless designs above 5 W.
DDR3 routing on the P1022NXE2HFB must keep byte lanes length-matched within 25 mils (0.635 mm) and maintain 100-ohm differential impedance for address/command. Place VTT termination resistors within 200 mils of the DRAM and decouple each DRAM with 100 nF + 10 uF ceramic capacitors. PCIe differential pairs require 85-ohm impedance and length matching within 150 mils of the companion endpoint.
The P1022NXE2HFB requires multiple supply rails: 1.0 V for the core, 1.5 V/1.8 V for DDR3, and 2.5 V/3.3 V for I/O. Use a multi-phase PWM controller such as the NXP VR5100 or a discrete LDO chain. Decouple each rail with 10 uF + 1 uF + 100 nF at the BGA side and additional bulk capacitance at the supply input. Core ramp sequencing must follow NXP's power-up timing diagram to avoid PLL lock failures.
Do not assume PowerQUICC firmware will boot unchanged on the P1022NXE2HFB; the integrated DDR3 controller, SEC 4.x, and eTSEC interfaces require updated U-Boot or VxWorks board initialization. Ensure SYSCLK is stable before deasserting HRESET to avoid undefined PLL states. For EOL inventory, validate date codes and lot traceability to avoid counterfeit parts; recommend sourcing only from authorized distributors.
Compliance-Informationen
RoHS compliant and Lead Free per DigiKey and DigChip specifications. AEC-Q100 is not applicable because this is a communications processor, not an automotive-grade IC. Halogen-free status is not explicitly stated in the verified web data and is set to unknown.
