P1025SSE5BFB - QorIQ P1025 400MHz PowerPC MPU | NXP | 561-TEPBGA
Teilenummer: P1025SSE5BFB ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $84.48 | $84,48 |
| 10 | $78.2 | $782,00 |
| 100 | $71.5 | $7.150,00 |
| 500 | $65.9 | $32.950,00 |
| 1.000 | $59.3 | $59.300,00 |
P1025SSE5BFB Übersicht
A microprocessor (MPU) is a system-on-chip that integrates one or more CPU cores, memory controllers, peripheral interfaces and interconnect fabric onto a single die, allowing designers to build compact embedded systems without discrete processor plus chipset solutions. Within the broader taxonomy, the P1025 sits in the application processor tier between microcontrollers (single-purpose control) and high-performance SoCs (multi-core application processors); the QorIQ P1 family specifically targets industrial, networking and secure connectivity workloads.
Key features include dual e500v2 cores at 400 MHz, 32-bit RISC architecture, integrated QUICC Engine for protocol offload, SEC 3.3 cryptographic acceleration including AES, 3DES, Kasumi and SNOW, integrated DDR2/DDR3 SDRAM controller with ECC support, PCI Express and Gigabit Ethernet MACs, and operating temperature range from 0C to 125C junction temperature. The 561-TEPBGA package provides high pin density for extensive I/O while remaining compatible with standard PCB assembly processes.
Typical applications include industrial Ethernet switches, secure network routers, factory automation controllers, smart-grid gateways, and embedded industrial PCs requiring deterministic processing with hardware-accelerated cryptography.
When designing with this device, allocate thermal copper under the package, use the recommended DDR trace length matching per NXP hardware specifications, and validate the QUICC Engine firmware integration against target protocol stacks early in the design cycle.
This page synthesizes distributor pricing, application guidance and a practical design checklist beyond what is found in the manufacturer datasheet alone.
Drop-in-Alternativen für P1025SSE5BFB – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
P1025NSN5BFB
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
P1024NSN5BFB
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
P1025SSE5BFB Grenzwerte & elektrische Eigenschaften
| Core Processor | PowerPC e500v2 |
| Core Architecture | PowerPC |
| Number of Cores | 2 |
| Core Speed | 400 MHz |
| Betriebstemperatur | 0C to 125C (TJ) |
| Gehäuse / Bauform | 561-FBGA |
| Supplier Device Package | 561-TEPBGA I (23x23 mm) |
| Series | QorIQ P1 |
| Co-Processors / DSP | QUICC Engine, Security; SEC 3.3 |
| Security Features | Cryptography, Random Number Generator |
| RAM Controllers | DDR2, DDR3 with ECC |
| Graphics Acceleration | No |
| Ethernet | Multiple Gigabit Ethernet MACs |
| USB | USB 2.0 |
| PCI Express | PCIe Gen1 (x1, x2, x4) |
| Montageart | Surface Mount |
| MSL-Level | 3 (168 Hours) |
| RoHS-Status | unknown |
P1025SSE5BFB 561-tepbga i (23x23 mm) Pinbelegungsleitfaden
Pinbelegung für P1025SSE5BFB (561-tepbga i (23x23 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für P1025SSE5BFB.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
P1025SSE5BFB ist geeignet für 6 Anwendungs: Industrial Ethernet Switches, Secure Network Routers and Gateways, Factory Automation Controllers, Smart-Grid Energy Gateways, Embedded Industrial PCs, Medical Device Connectivity Hubs.
Industrial Ethernet Switches
The P1025SSE5BFB's dual 400 MHz PowerPC e500v2 cores combined with the integrated QUICC Engine make it ideal for managed industrial Ethernet switches requiring deterministic multi-port protocol handling. The QUICC Engine offloads HDLC, TDM and serial protocol processing from the cores, freeing CPU cycles for switch management, SNMP and VLAN configuration. Hardware-accelerated cryptography via SEC 3.3 supports MACsec port authentication without CPU overhead. Operating range from 0C to 125C junction temperature accommodates DIN-rail mounted industrial enclosures.
Empfohlen
Secure Network Routers and Gateways
The SEC 3.3 cryptographic engine integrated into the P1025SSE5BFB accelerates IPSec, TLS and VPN tunnel operations at line rate, making the part well suited for secure branch-office routers and SD-WAN gateways. Hardware AES and 3DES at gigabit throughput, plus a hardware random number generator for key generation, allow designers to meet FIPS and Common Criteria requirements without external crypto chips. The dual e500 cores separate control-plane and data-plane processing for predictable QoS behavior.
Empfohlen
Factory Automation Controllers
For PLCs, motion controllers and factory gateways, the P1025SSE5BFB delivers deterministic dual-core processing with hardware-floating-point support on the e500v2 cores. The QUICC Engine terminates industrial fieldbus protocols such as PROFINET and EtherCAT bridges, while SEC 3.3 protects against tampering on the factory floor. ECC DDR3 support detects and corrects transient memory errors common in industrial EMI environments. The wide 0C to 125C junction temperature range supports enclosed cabinet operation without active cooling.
Empfohlen
Smart-Grid Energy Gateways
Smart-grid gateways aggregating data from meters, sensors and DERs benefit from the P1025SSE5BFB's hardware cryptography and protocol flexibility. SEC 3.3 accelerates DLMS/COSEM, IEEE 2030.5 and IEC 61850 security suites, while the QUICC Engine handles multiple serial fieldbus links simultaneously. The 561-TEPBGA package supports extensive peripheral connectivity including Gigabit Ethernet, PCIe and USB for downstream metrology and uplink backhaul. Industrial temperature grade meets outdoor cabinet deployment requirements.
Empfohlen
Embedded Industrial PCs
The P1025SSE5BFB powers fanless embedded IPCs that run real-time Linux or VxWorks for industrial visualization, machine learning inference at the edge, and protocol bridging. The dual cores allow partitioning of the OS (Linux on core 0) and real-time tasks (RTOS on core 1) for deterministic response. Hardware ECC memory and SEC 3.3 support long-term reliability and secure boot required in industrial deployments. PCIe lanes connect to discrete GPUs or FPGA co-processors for ML acceleration.
Empfohlen
Medical Device Connectivity Hubs
Medical connectivity hubs that aggregate data from patient monitors, infusion pumps and imaging modalities rely on the P1025SSE5BFB for secure data transport and protocol conversion. SEC 3.3 hardware encryption protects HIPAA-compliant patient health information at rest and in transit. The QUICC Engine bridges legacy serial medical protocols (RS-232, RS-485) to Ethernet HL7 and DICOM streams. Industrial temperature grade and ECC memory align with IEC 60601 reliability expectations for medical equipment.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für P1025SSE5BFB – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | P1025NSN5BFB | P1024NSN5BFB |
|---|---|---|---|
| Package | 561-TEPBGA I (23x23 mm) | 561-TEPBGA I (23x23 mm) - same | 561-TEPBGA I (23x23 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500v2 dual-core | PowerPC e500v2 dual-core | PowerPC e500v2 single-core |
| Core Speed | 400 MHz | 400 MHz | 533 MHz |
| Security Engine | SEC 3.3 enabled | No SEC engine | SEC 3.3 enabled |
| QUICC Engine | Yes | Yes | Yes |
| Operating Temperature | 0C to 125C (TJ) | 0C to 125C (TJ) | 0C to 105C (TJ) |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
Wichtigste Unterscheidungsmerkmale
- Dual-core 400 MHz with hardware security engine SEC 3.3 (vs. P1025NSN5BFB)
- Industrial-grade operating temperature to 125C junction (vs. P1024NSN5BFB)
- Same-package pin compatibility with QorIQ P1 variants (vs. P1010 series)
Designhinweise
The 561-TEPBGA I package requires a thermal pad soldered to a copper pour on the PCB. Estimated: with the part consuming approximately 3-5 W under typical dual-core load, a thermal pad connected to a 4 square inch inner-plane copper pour yields theta_J-A in the range of 15-20 C/W. Use NXP's thermal model in the QorIQ P1025 hardware specifications to size copper pours and decide whether a heatsink is required. Always profile junction temperature under worst-case ambient and load before locking the mechanical design.
Route the DDR2/DDR3 memory interface on the top layer or inner stripline layers with matched trace lengths per NXP QorIQ P1025 hardware specifications. DDR trace impedance should target 50 ohms single-ended with 100 ohm differential pairs for DQS. Keep PCIe and Gigabit Ethernet signals on inner layers with continuous reference planes. Use BGA fanout with via-in-pad or dogbone patterns at the recommended 1 mm pitch to maintain manufacturability at the 561-ball BGA.
The P1025SSE5BFB requires multiple power rails (core, DDR I/O, Ethernet I/O, PCIe I/O, SERDES, GPIO). Use NXP-recommended PMIC or discrete regulator sequencing to bring rails up in the proper order; failure to do so can cause latch-up or inrush damage. Decouple each rail with 0.1 uF X7R ceramic caps placed within 100 mils of the BGA balls, plus bulk capacitors on the board edge. Confirm sequencing requirements against the P1025 hardware specifications before PCB fabrication.
Common pitfalls when designing with the P1025SSE5BFB include: (1) ignoring the QUICC Engine firmware integration effort - the offload engine requires UTMI firmware uploaded at boot; (2) using non-ECC DDR3 in designs requiring IEC 61508 SIL compliance; (3) confusing the P1025 with the P1010 or P1024 - these share the QorIQ P1 branding but differ in core count, frequency and pinout revisions; (4) forgetting the MSL3 floor-life requirements for BGA reflow, which mandates proper dry-pack handling before PCB assembly.
Compliance-Informationen
RoHS, REACH and lead-free status not explicitly stated in the distributor snippets provided; recommend verifying against the official NXP material declaration. Per GlobalSpec data, REACH status is vendor undefined as of the dataset date.
