P2010NSE2KHC - QorIQ P2010 e500v2 MPU 1.2GHz 689-TEBGA II | NXP
Teilenummer: P2010NSE2KHC ⚠ Letzte BestellmöglichkeitP2010NSE2KHC Übersicht
The QorIQ P2 platform is an evolution of the PowerQUICC communications-processor family. A QorIQ MPU (microprocessor unit) is a SoC that combines one or more Power Architecture cores with the memory controllers, serial interfaces and packet-processing engines required by routers, switches, base stations and other networking infrastructure equipment. The P2010 sits at the entry of the P2 series, occupying a 4.5x aggregate frequency range within the same pinout as the dual-core P2020 up to 1.33 GHz and the smaller P1 (P1011 at 533 MHz) devices.
Key features include an integrated DDR2/DDR3 memory controller with ECC support, dedicated security engine (SEC 3.3) for bulk encryption, two GbE controllers with TCP/IP offload, two PCIe Gen 1 controllers and a single USB 2.0 interface. The device operates across the 0 C to 125 C junction temperature range as required by NXP's industrial/extended-temperature specifications, making it suitable for outdoor or thermally-constrained telecom environments.
The architecture pairs an e500v2 core with NXP's enhanced peripheral set, including dual I2C, dual UART, SD/MMC host and a 16-bit local bus. The 689-TEBGA II package supports high-speed SERDES and DDR3 traces while exposing a thermal pad that, when soldered to a properly-sized copper land pattern, keeps junction temperature within safe limits across the full operating range.
Typical applications include entry-level edge routers, industrial control gateways, single-board computers for railway and energy systems, networked printing and imaging equipment, and secure communications appliances in industrial and defense systems where deterministic processing and hardware-accelerated encryption are valued.
When designing with this device, engineers must implement a 6-layer PCB at minimum to route the DDR3 controller and SERDES lanes cleanly. The exposed thermal pad must be soldered to a continuous copper pour with thermal vias; failure to do so triggers thermal shutdown above the rated temperature. Designers reusing P1011, P2020 or P2010 layouts in the same TEBGA II footprint should follow NXP's hardware specifications for SERDES reference clock jitter and DDR3 length-matching, since the same footprint spans three performance grades.
This page synthesizes distributor inventory, NXP datasheet specifications, drop-in compatible QorIQ P1/P2 siblings and practical design notes that go beyond the manufacturer datasheet, helping engineers select the right QorIQ tier for their target performance budget.
Drop-in-Alternativen für P2010NSE2KHC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit P2010NSE2KHC (gleiche Bauform und Footprint) – abweichend in Core Architecture, USB, Package, Ethernet, Maximum Core Frequency.
P2020NSE2KHC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P2010NSE2MHC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1011NSE2FFB
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →P2010NXE2KHC
✅ Drop-In ⚠️ Spezifikationen ungeprüftPreis auf Anfrage
Datenblatt ansehen →P2020NXE2KHC
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
P2010NSE2KHC Grenzwerte & elektrische Eigenschaften
| Core Processor | PowerPC e500v2 |
| Number of Cores | 1 |
| Core Architecture | 32-Bit Power Architecture |
| Maximum Core Frequency | 1.2 GHz |
| Co-Processors / DSP | Security; SEC 3.3 |
| RAM Controller | DDR2, DDR3 with ECC |
| Ethernet | 10/100/1000 Mbps (GbE) |
| PCIe | PCI Express Gen 1 |
| Serial RapidIO | Yes |
| USB | USB 2.0 |
| Process Technology | 45 nm |
| Betriebstemperaturbereich | 0 C to 125 C (junction) |
| Gehäuse | 689-TEBGA II (31x31 mm) with exposed thermal pad |
| Montageart | Surface Mount |
| RoHS-Status | RoHS Compliant |
| Lead-Free Status | Lead Free |
| Silicon Revision | Rev 2.1 |
| Series | QorIQ P2 |
| Graphics Acceleration | No |
P2010NSE2KHC 689-tebga ii (31x31 mm) with exposed thermal pad Pinbelegungsleitfaden
Pinbelegung für P2010NSE2KHC (689-tebga ii (31x31 mm) with exposed thermal pad-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für P2010NSE2KHC.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
P2010NSE2KHC ist geeignet für 6 Anwendungs: Entry-Level Edge Router, Industrial Communications Gateway, Single-Board Computer for Rail/Energy, Networked Imaging/MFP Controller Board, Secure Communications Appliance, Wireless Backhaul / Small-Cell Baseband.
Entry-Level Edge Router
The P2010NSE2KHC fits entry-level edge router designs because its single e500v2 core at 1.2 GHz can sustain line-rate forwarding on a single GbE or aggregated GbE pair while the integrated SEC 3.3 engine accelerates IPsec and SSL/TLS termination. Placed on a router main board alongside external PHY and a DDR3 ECC SODIMM, it provides deterministic forwarding with hardware-assisted encryption at sub-15W power. The two PCIe Gen 1 lanes can be used to attach additional GbE controllers or hardware accelerators, and the 689-TEBGA II footprint lets the same PCB accept the dual-core P2020 for higher-load installations without re-laying the board.
Empfohlen
Industrial Communications Gateway
The P2010NSE2KHC is well matched to industrial gateway products because its 0 C to 125 C junction temperature envelope permits operation in outdoor enclosures and on factory floors without additional conditioning. The GbE and USB 2.0 interfaces allow the gateway to bridge Modbus/TCP networks to fieldbus and USB peripherals, while the integrated SEC engine secures MQTT or OPC UA traffic to cloud brokers. Mounting the exposed thermal pad to a copper pour with thermal vias keeps the junction within spec, and the same PCB accepts the P1011NXE2KHC extended-grade part for -40 C to 105 C deployments with no layout change.
Empfohlen
Single-Board Computer for Rail/Energy
The P2010NSE2KHC suits railway and energy embedded SBCs thanks to its wide junction temperature range, long-life product availability from NXP's embedded roadmap, and the SEC 3.3 engine that accelerates VPN tunnels used in substation automation. The 689-TEBGA II package's 31x31 mm footprint balances board area against pin density and exposes a pad that simplifies thermal management on a fan-less chassis. Designers can pair it with DDR3 ECC memory for SEU tolerance in rail signalling environments, and reuse the same PCB between -40 C to 85 C and -40 C to 105 C options by selecting NXE vs NSE temperature grades.
Empfohlen
Networked Imaging/MFP Controller Board
The P2010NSE2KHC is used in networked MFP controllers because its e500v2 core can handle compressed-page-image rasterization at speed while GbE and USB 2.0 host/OTG carry print data and scanner streams. The two PCIe Gen 1 lanes accept accelerator cards for JPEG and JBIG pipelines, and the SEC engine secures SMB/TLS printing to the cloud. The 689-TEBGA II package's high pin count lets the controller attach DDR3 EC, NAND, NOR and peripherals without external bridge chips; pairing the part with a pin-compatible dual-core P2020 is the standard upgrade path when print volumes exceed baseline.
Empfohlen
Secure Communications Appliance
The P2010NSE2KHC powers secure communications appliances because its SEC 3.3 hardware block delivers bulk encryption at line rate, freeing the e500v2 core for protocol processing, key management and policy enforcement. Combined with the integrated GbE and the SERDES-capable PCIe lanes, the appliance can sustain IPsec site-to-site VPNs and TLS inspection on multiple flows. The same 689-TEBGA II footprint accepts the P2020 dual-core variant for installations that need concurrent control and data-plane operations without PCB redesign.
Empfohlen
Wireless Backhaul / Small-Cell Baseband
The P2010NSE2KHC is a fit for outdoor small-cell and wireless backhaul units because its integrated GbE and SERDES-capable PCIe lanes accommodate eNodeB/baseband accelerator cards and the SRIO port links to DSP farms. The 0 to 125 C junction rating plus the exposed thermal pad support fan-less outdoor enclosures. The same PCB can accept the dual-core P2020 to split baseband processing between threads without changing the layout, and the SEC engine protects backhaul links with hardware-accelerated encryption.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für P2010NSE2KHC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | P2020NSE2KHC | P2010NSE2MHC | P1011NSE2FFB | P2010NXE2KHC | P2020NXE2KHC |
|---|---|---|---|---|---|---|
| Package | 689-TEBGA II (31x31 mm) | 689-TEBGA II (31x31 mm) - same | 689-TEBGA II (31x31 mm) - same | 689-TEBGA II (31x31 mm) - same | 689-TEBGA II (31x31 mm) - same | 689-TEBGA II (31x31 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Cores / Architecture | 1 x e500v2 | 2 x e500v2 | 1 x e500v2 | 1 x e500v1 | 1 x e500v2 | 2 x e500v2 |
| Maximum Core Frequency | 1.2 GHz | 1.2 GHz | 1.0 GHz | 0.8 GHz | 1.2 GHz | 1.2 GHz |
| Security Engine (SEC) | SEC 3.3 | SEC 3.3 | SEC 3.3 | None | SEC 3.3 | SEC 3.3 |
| Operating Temperature (junction) | 0 C to 125 C | 0 C to 125 C | 0 C to 105 C | 0 C to 105 C | -40 C to 125 C | -40 C to 125 C |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| GbE Controllers | 2 | 2 | 2 | 3 | 2 | 2 |
| PCIe Gen 1 Lanes | 2 | 2 | 2 | 2 | 2 | 2 |
Wichtigste Unterscheidungsmerkmale
- Single-core 1.2 GHz e500v2 with integrated SEC 3.3 cryptography engine (vs. P1011NSE2FFB)
- Lowest-cost entry to the QorIQ P2 family with full P2020 peripheral set (vs. P2020NSE2KHC)
- Full industrial operating range up to 125 C junction temperature (vs. P2010NSE2MHC)
- Pin-compatible with the QorIQ P1 and P2 family for scalable BOM (vs. P2010NXE2KHC)
Designhinweise
The 689-TEBGA II package exposes a large thermal pad on the underside which MUST be soldered to a continuous copper pour on the top layer, augmented with an array of thermal vias (typically 0.3 mm drill, 1 mm pitch) to an inner copper plane. Estimated: at 1.2 GHz with full peripheral activity in a fan-less enclosure, the die can dissipate 8-10 W; without the recommended thermal design junction temperature may exceed the 125 C limit and trigger thermal shutdown. NXP's hardware specifications list footprint stencil openings and via counts; deviate from them only with thermal simulation.
Routing the DDR3 controller to one or two SODIMM/UDIMM sockets requires a minimum of 6 PCB layers with controlled impedance of 50 ohm single-ended (with proper VTT termination) for the address/command/control traces and 100 ohm differential for clocks; length-matching must follow NXP's DDR3 Design Guidelines for the QorIQ P2 platform. Estimated: each DDR3 byte lane should match within 25 mils to keep skew under one UI at 800 MT/s; failure to follow these guidelines causes intermittent write/read errors that pass functional test but fail in the field.
The SERDES blocks (PCIe and SRIO) require a clean reference clock with jitter below the SERDES PLL's tolerance spec. Estimated: a 100 MHz LVDS reference with cycle-to-cycle jitter under 50 ps p-p is typically required. Series-termination resistors and DC-blocking capacitors must be placed as close to the SoC balls as possible and the SERDES lane length tuned for 90 ohm differential impedance. NXP's validation platforms or IBIS-AMI models are recommended for channel simulation before tape-out.
P2010NSE2KHC needs a multi-rail power tree: a 0.95-1.05 V core voltage (VDD) provided by a high-current buck regulator, a 1.8 V auxiliary (VDD_LP), a 2.5 V analog (VDDA), and a 3.3 V I/O rail. Sequencing is critical - the NXP hardware spec mandates that the core rail rise BEFORE the I/O and analog rails. Estimated: hold-up capacitance of at least 47 uF on the core rail plus a supervisor (e.g. MAX6324) provides clean power-up and prevents latch-up. Skipping the supervisor often leads to start-up transients that stress the package's BGA balls during first production runs.
Common designer errors: (1) forgetting the POR (Power-on Reset) configuration resistors on the cfg_xxx pins, leading to a part that boots from an unexpected interface; (2) omitting the boot serial ROM or NAND so the device has no firmware at POR; (3) routing the JTAG TCK slower than spec, causing CodeWarrior debug failures; and (4) confusing the P2010 with the P2010E automotive-grade predecessor which has different peripheral mixes. Always cross-check the project's CodeWarrior configuration against the NXP board-support package for the exact silicon revision (Rev 2.1 in this part).
Compliance-Informationen
RoHS compliant and lead-free per the NXP product page and DigiKey listing (verified in Verified Web Data). AEC-Q100 not applicable - the P2010NSE2KHC is not an automotive-grade part; the automotive equivalent is P2010NXE2KHC or the P1 family P1011 variant. Reach status extracted from NXP general compliance statement; no part-specific Reach certificate located at this revision.
