P2010NSN2MFC - QorIQ P2010 1.2GHz PowerPC e500v2 SoC | NXP
Teilenummer: P2010NSN2MFC ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $58.11 | $58,11 |
| 10 | $55.2 | $552,00 |
| 100 | $51.75 | $5.175,00 |
| 500 | $47.5 | $23.750,00 |
| 1.000 | $42.3 | $42.300,00 |
P2010NSN2MFC Übersicht
A communications processor (CPU/MPU) is a system-on-chip that integrates one or more processor cores, memory controllers, and high-speed serial peripherals on a single die for networking and embedded applications. Within the broader taxonomy, the P2010 sits in the MPU (microprocessor unit) class of microcontrollers and processors, which itself belongs to the wider category of embedded processors used in routers, switches, wireless base stations, industrial gateways, and similar network-edge equipment. The QorIQ family superseded NXP/Freescale's PowerQUICC line, and the P2010 is one of the entry/single-core members of the P-series.
Key differentiating features include its pin-compatibility with the QorIQ P1 family (P1011/P1020/P1013/P1014/P1017/P1021/P1022/P1010/P1012), its integrated ECC-capable DDR2/DDR3 controller, and a four-tier frequency scaling option that lets OEMs standardize one PCB across multiple SKUs. The exposed-pad TE-PBGA II package supports high-power thermal dissipation for the 1.2 GHz speed grade.
Architecturally, the P2010 uses the e500v2 core with double-precision FPU, hardware MMU, and a coherent fabric connecting the core to platform peripherals. The 45 nm silicon process provides a useful balance between performance and leakage for thermally constrained designs. Security is augmented by NXP's Trust Architecture and on-chip SEC engine (Lite) for crypto offload in secure boot and IPSec paths.
Typical applications include industrial routers, factory automation gateways, smart-grid concentrators, line cards for access/edge networking, and any embedded Linux / VxWorks design that needs GbE plus PCIe plus a deterministic embedded OS footprint. The part is also used in wireless backhaul and small-cell infrastructure. As the device is approaching end-of-life per NXP's product page, long-life industrial designs should evaluate the recommended replacement (NXP recommends migration to the newer QorIQ LS series for new programs).
Estimated: at 1.05 V core and 1.2 GHz, the P2010's typical power consumption is approximately 5-7 W depending on workload and I/O utilization. Designers must provide adequate copper area on the PCB top layer for the 31x31 mm BGA exposed pad to keep junction temperature below +125 °C.
This page consolidates distributor pricing, lifecycle status, drop-in compatible QorIQ family variants, and PCB-level design notes that go beyond the bare datasheet extract — content tailored for engineers evaluating the P2010NSN2MFC for new designs or migration to the recommended NXP replacement.
Drop-in-Alternativen für P2010NSN2MFC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit P2010NSN2MFC (gleiche Bauform und Footprint) – abweichend in Number of Cores, Operating Temperature, Mounting Type, PCI Express, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
P2020NSN2MFC
✅ Drop-In✓ Auf Lager
$31.2 / Stück
Datenblatt ansehen →P2010NSN2NFC
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
P2020NSN2NFC
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
P1010NSN5DFB
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
P1020NSN5DFB
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
P2010NSN2MFC Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | QorIQ P2 |
| Core Architecture | PowerPC e500v2 |
| Number of Cores | 1 |
| Datenbusbreite | 32-bit |
| Maximum Core Frequency | 1.2 GHz |
| Core Voltage | 1.05 V |
| Memory Controller | DDR2/DDR3 with ECC |
| Integrated Peripherals | Gigabit Ethernet, PCI Express, Serial RapidIO, USB |
| Gehäuse | 689-TEPBGA II (31 x 31 mm) with exposed pad |
| Package Code | BGA, 1.0 mm pitch |
| Montageart | Surface Mount |
| Betriebstemperatur | 0 °C to +125 °C |
| Process Technology | 45 nm |
| Lead Free / RoHS Status | Lead Free / RoHS Compliant |
| Packaging | Tray |
P2010NSN2MFC bga, 1.0 mm pitch Pinbelegungsleitfaden
Pinbelegung für P2010NSN2MFC (bga, 1.0 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für P2010NSN2MFC.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
P2010NSN2MFC ist geeignet für 6 Anwendungs: Industrial Ethernet Router / Gateway, Telecom Line Card / Access Switch, Wireless Small-Cell / Backhaul Baseband, Smart-Grid Concentrator / RTU, Embedded Linux / RTOS Network Appliance, Edge AI Inference Gateway (Legacy).
Industrial Ethernet Router / Gateway
The P2010NSN2MFC's integrated triple-speed Gigabit Ethernet MACs, hardware crypto engine, and DDR3/ECC controller make it a strong fit for industrial routers and protocol gateways. Its 1.2 GHz e500v2 core sustains multi-protocol routing stacks (Modbus TCP, EtherNet/IP, Profinet) while the SEC engine offloads IPSec/TLS handshakes. The 689-BGTE II footprint simplifies thermal design for DIN-rail enclosures, and 0 to +125 °C operation covers cabinet temperatures near motors and PLCs. A 5–7 W typical power envelope stays within passive cooling budgets.
Empfohlen
Telecom Line Card / Access Switch
Access and aggregation line cards use the P2010 for control-plane termination, OAM processing, and ACL enforcement alongside an external PHY/ASIC. The integrated PCI Express and Serial RapidIO interfaces connect directly to look-aside co-processors or fabric ASICs without an extra bridge chip. ECC-protected DDR3 storage handles routing tables and forwarding databases with deterministic access latency, critical for hot-path forwarding at 1 Gbps line rate. The 1.05 V core supply scales cleanly with NXP MC34VR500 series PMICs.
Empfohlen
Wireless Small-Cell / Backhaul Baseband
Small-cell base stations and wireless backhaul radios use the P2010 for PHY/MAC processing, encryption, and O&M backhaul traffic. The single e500v2 core at 1.2 GHz handles LTE PHY pipelines for small-cell sectors, while the SEC engine accelerates AES/SHA for radio-link security. DDR3-1600 with ECC supports the fast symbol-buffer turnaround needed for LTE TDD/FDD. Industrial temperature grade (-40 to +85 screened variants available) suits outdoor cabinet deployments.
Empfohlen
Smart-Grid Concentrator / RTU
Smart-grid concentrators aggregate data from thousands of endpoints (smart meters, sensors) over DNP3/IEC 61850. The P2010's hardware ECC and SEC engine ensure data integrity for billing-grade telemetry, while the e500v2 core runs deterministic RTOS schedulers (VxWorks, Green Hills INTEGRITY). The industrial 0 to +125 °C grade withstands substation cabinet temperatures, and the 689-BGA exposed pad enables passive heatsink mounting. Long-life-cycle programs are however migrating to LS-series parts as the P2010 reaches last-time-buy.
Empfohlen
Embedded Linux / RTOS Network Appliance
Embedded Linux and VxWorks appliances (VPN concentrators, network taps, DDoS scrubbers) run on the P2010NSN2MFC for its mature BSP ecosystem, deterministic memory subsystem, and hardware-accelerated crypto. The DDR3-ECC controller sustains long-running state tables (e.g., conntrack) without silent corruption, while the e500v2 MMU provides full virtual-memory Linux support. The 1.2 GHz speed grade is sufficient for 1–3 Gbps IPSec throughput on AES-GCM workloads offloaded to the SEC engine.
Empfohlen
Edge AI Inference Gateway (Legacy)
Edge AI inference gateways for industrial vision use the P2010 as a host CPU that offloads CNN inference to a companion FPGA or ARM MPU via PCIe. While not optimized for AI workloads (no integrated NPU), the e500v2 core handles pre/post-processing, MQTT bridging, and gateway security. This is a legacy pattern — modern edge-AI nodes use NXP's i.MX 8M Plus or LS1046A, both of which integrate ML accelerators. The P2010 remains a stable legacy option for retrofits.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für P2010NSN2MFC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | P2020NSN2MFC | P2010NSN2NFC | P2020NSN2NFC | P1010NSN5DFB | P1020NSN5DFB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| Series | QorIQ P2 | QorIQ P2 | QorIQ P2 | QorIQ P2 | QorIQ P1 | QorIQ P1 |
| Number of Cores | 1 | 2 | 1 | 2 | 1 | 2 |
| Maximum Core Frequency | 1.2 GHz | 1.2 GHz | 800 MHz | 800 MHz | 533/667 MHz | 667/800 MHz |
| Core Architecture | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500 | PowerPC e500 |
| Core Voltage | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.0 V | 1.0 V |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Operating Temperature | 0 °C to +125 °C | 0 °C to +125 °C | 0 °C to +125 °C | 0 °C to +125 °C | 0 °C to +125 °C | 0 °C to +125 °C |
| Lifecycle Status | Last-time-buy (EOL) | Last-time-buy (EOL) | Last-time-buy (EOL) | Last-time-buy (EOL) | EOL (older P1) | EOL (older P1) |
Wichtigste Unterscheidungsmerkmale
- Higher single-core frequency than P1 series in pin-compatible package (vs. P1010NSN5DFB)
- Single-core die for cost-sensitive designs where P2020 is overkill (vs. P2020NSN2MFC)
- Industrial temperature grade with ECC-protected DDR3 for telco reliability (vs. P2010NSN2NFC (800 MHz))
Designhinweise
Estimated: at 1.05 V core and 1.2 GHz, the P2010NSN2MFC typical power consumption is approximately 5–7 W depending on workload and I/O utilization. The 689-TEPBGA II (31x31 mm) package has an exposed thermal pad that must be soldered to a continuous copper land on the top PCB layer with thermal vias to internal ground planes. Without sufficient copper area, the junction temperature will exceed the +125 °C limit under sustained load. Follow NXP's P2020-P2010 Hardware Specifications thermal guidelines for copper area and via count.
DDR3 routing for the P2010 requires strict length matching — address/command ±25 mil, byte lanes ±10 mil, and DQS-to-DQ ±10 mil. Use controlled-impedance microstrip or stripline layers with reference ground planes and avoid crossing DDR signals over plane splits. Differential pairs for GbE (SGMII), PCIe, and Serial RapidIO must maintain 100 Ω differential impedance with matched lengths to within 5 mil. Reference clock signals require series-termination resistors close to the source per NXP's reference design.
Common pitfalls when designing with the P2010 include: (1) failing to populate all JTAG and test-mode pull-up/pull-down resistors required by NXP's reference design, leading to bricking in production; (2) using incorrect DDR3 RDIMM/UDIMM topology — the P2010 supports only specific DIMM types and rank configurations; (3) ignoring the I/O voltage rail sequencing — VDDCORE must ramp before VDDIO; (4) omitting the SERDES reference clock termination causing jitter violations. Always review the NXP Hardware Specifications guide before tape-out.
Use NXP's MC34VR500 or similar multi-rail PMIC to supply the P2010's VDDCORE (1.05 V), VDDPLAT (1.0 V), and VDDIO (1.5/1.8 V) rails. The POR (power-on-reset) sequencing is critical — VDDCORE must stabilize before VDDIO comes up, and the SEC engine supply must reach its nominal value before firmware attempts secure boot. Add bulk capacitors (220 µF tantalum) near each SoC supply pin plus 10 µF/0.1 µF ceramics for decoupling.
Place the P2010 at the board center with all high-speed traces routed in inner stripline layers for EMI compliance. Keep SERDES lanes at least 5 mm away from noisy sources (DC-DC, clock buffers). The exposed-pad BGA land pattern must use 0.5 mm pitch solder mask-defined pads and a via-array (0.3 mm vias on 1.2 mm pitch) under the pad. Allocate top-layer copper pour over the entire 31x31 mm land area for thermal spreading.
Compliance-Informationen
RoHS compliant and lead-free per NXP product page and DigiKey listing. REACH, halogen-free, and conflict-minerals compliance not explicitly stated in verified data — marked unknown. AEC-Q100 not applicable: the P2010 is not an automotive-grade part.
