P3041NXN1MMB - QorIQ P3 Quad-Core 1.2GHz MPU | NXP Semiconductors
Teilenummer: P3041NXN1MMB ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268 | $2.680,00 |
| 50 | $248 | $12.400,00 |
| 100 | $232 | $23.200,00 |
| 500 | $215 | $107.500,00 |
P3041NXN1MMB Übersicht
A microprocessor (MPU) is a single-chip CPU that fetches, decodes, and executes instructions directly from memory; in a QorIQ P3 device like the P3041NXN1MMB, the e500mc cores are paired with platform-wide coherency, DDR3/3L memory controllers, and high-speed SerDes lanes for networking, industrial, and aerospace/defense workloads. Within the broader semiconductor taxonomy, this part sits under microprocessors -> embedded processors -> integrated circuits -> semiconductors, and is engineered to replace older single-core PowerQUICC designs in next-generation networking line cards, base stations, and control-plane processors.
Key features of the P3041NXN1MMB include four e500mc cores at up to 1.2 GHz, integrated DDR3/3L controllers with ECC support, multiple 10 GbE, GbE, and PCI Express controllers, hardware encryption and pattern-match acceleration, and the proprietary non-encrypted ("NonENC") build variant that omits cryptographic acceleration for export-control-sensitive regions. The 1295-FCBGA package provides a robust thermal envelope for industrial-grade silicon while exposing the full complement of high-speed I/O.
Architecturally, the P3041NXN1MMB leverages a hierarchical datapath similar to the P4080 platform: each e500mc core has private L1 caches, while L2 is shared across cores and the Corenet coherency fabric unifies the SoC. This approach delivers high IPC while maintaining the deterministic interrupt behavior required for real-time control-plane tasks. Compared with single-core PowerQUICC III predecessors, the P3041NXN1MMB offers an order-of-magnitude throughput uplift without requiring a complete software rewrite, because the cores preserve the classic Power Architecture programming model.
Typical applications include networking line cards and control-plane processing, wireless base station baseband and L2/L3 termination, industrial control and ruggedized computing, military/aerospace embedded systems (where the NonENC build is mandated), and storage controllers in mid-range RAID or NAS arrays. The 32-bit Power Architecture and the QorIQ ecosystem also make this part attractive for long-lifecycle programs that need NXP's extended product longevity commitment.
Designers should plan the PCB layout around the 37.5x37.5 mm FCBGA footprint with high-density escape routing, allocate sufficient PCB layers for DDR3/3L byte-lane matching, and follow NXP's AN4137 layout guide for the SerDes reference clocks. Thermal analysis must account for industrial-grade ambient temperatures (-40C to +105C) under full four-core load.
This page synthesizes distributor pricing, parametric alternatives, and practical design considerations not found in the manufacturer datasheet alone.
Drop-in-Alternativen für P3041NXN1MMB – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit P3041NXN1MMB (gleiche Bauform und Footprint) – abweichend in Package, RoHS Status, Memory Controller, Operating Temperature, Maximum Core Frequency.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
P3041NXE1MMB
✅ Drop-In✓ Auf Lager
$222.75 / Stück
Datenblatt ansehen →P3041NSN1MMB
✅ Drop-In✓ Auf Lager
$274.5 / Stück
Datenblatt ansehen →P3041NSE1MMB
✅ Drop-In✓ Auf Lager
$215 / Stück
Datenblatt ansehen →P3041NXE1NNB
✅ Drop-In✓ Auf Lager
$65.5 / Stück
Datenblatt ansehen →P3041NXN1MMB Grenzwerte & elektrische Eigenschaften
| Core Architecture | PowerPC e500mc |
| Number of Cores | 4 |
| Datenbusbreite | 32-bit |
| Maximum Core Frequency | 1.2 GHz |
| Family | QorIQ P3 |
| Gehäuse | 1295-FCPBGA (FCBGA, 37.5x37.5 mm) |
| Montageart | Surface Mount (BGA) |
| Encryption Acceleration | NonENC (no SEC engine) |
| Product Variant | r1.1 silicon revision |
| Betriebstemperaturbereich | -40C to +105C |
| Memory Controller | DDR3 / DDR3L with ECC (per product brief) |
| High-Speed I/O | Multiple SerDes lanes for 10 GbE, GbE, PCIe (per family) |
| RoHS-Status | Compliant (BGA solder-ball lead-free per NXP product family) |
P3041NXN1MMB 1295-fcpbga (fcbga, 37.5x37.5 mm) Pinbelegungsleitfaden
Pinbelegung für P3041NXN1MMB (1295-fcpbga (fcbga, 37.5x37.5 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für P3041NXN1MMB.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
P3041NXN1MMB ist geeignet für 6 Anwendungs: Networking Line Card / Control-Plane Processor, Wireless Base Station Baseband & L2/L3 Termination, Industrial Control & Ruggedized Computing, Military / Aerospace Embedded Systems, Storage Controllers / RAID and NAS Arrays, Long-Lifecycle Embedded Control Systems.
Networking Line Card / Control-Plane Processor
The P3041NXN1MMB fits networking line-card and control-plane designs because it combines four e500mc cores at 1.2 GHz with the QorIQ Corenet fabric and high-speed SerDes for 10 GbE and PCIe. In a typical line card the part terminates L2/L3 protocols, runs routing daemons, and bridges Ethernet ports via its integrated 10G SerDes, while the NonENC build simplifies export-control paperwork for global deployment. Its 32-bit Power Architecture core runs mature networking stacks (Linux, VxWorks, NetBSD) and supports hardware ECC on the DDR3 controller for carrier-grade reliability. Designers should budget thermal headroom for all four cores under peak load and follow NXP's AN4137 layout guide for the SerDes lanes.
Empfohlen
Wireless Base Station Baseband & L2/L3 Termination
In wireless base stations the P3041NXN1MMB acts as a baseband and L2/L3 termination processor, leveraging the deterministic interrupt behavior of the e500mc core and the high-throughput DDR3/3L controller with ECC. The 1295-FCBGA exposes enough SerDes to connect to CPRI fronthaul links, Ethernet backhaul, and PCIe-attached DSP/FPGA accelerators. With four cores at 1.2 GHz the device handles LTE/5G-NR control-plane and user-plane tasks in parallel, while the industrial -40C to +105C grade supports outdoor cabinet deployments. The NonENC variant is chosen when cryptographic acceleration is handled in an external accelerator ASIC instead of the integrated SEC engine.
Empfohlen
Industrial Control & Ruggedized Computing
The P3041NXN1MMB serves industrial control and ruggedized computing platforms where its -40C to +105C temperature range, long product longevity commitment from NXP, and deterministic real-time behavior make it ideal for harsh-environment PLCs, substation controllers, and ruggedized servers. The e500mc core runs deterministic real-time operating systems (VxWorks, Green Hills INTEGRITY, QNX Neutrino) under full industrial -40C to +105C load, while the Corenet fabric unifies deterministic I/O with general-purpose Ethernet. Designers pair the MPU with industrial-grade DDR3L memory with ECC and ruggedized power supplies. The 1295-FCBGA's exposed thermal lid enables direct conduction-cooled heatsink attachment for sealed enclosures.
Empfohlen
Military / Aerospace Embedded Systems
Aerospace and defense programs adopt the P3041NXN1MMB for its NonENC build (no SEC engine) which simplifies ITAR and EAR-export compliance, plus the long lifecycle support that military programs demand. The part runs avionics databuses (MIL-STD-1553, ARINC 429) via external transceivers and the integrated SerDes, while the four 32-bit e500mc cores handle flight-control and mission-computer workloads with deterministic interrupt latency. The 1295-FCBGA is compatible with conduction-cooling cold plates used in avionics bays, and the -40C to +105C temperature grade covers DO-160 environmental conditions. The Power Architecture toolchain (Wind River VxWorks, Green Hills) is MILS-certifiable for many defense programs.
Empfohlen
Storage Controllers / RAID and NAS Arrays
Mid-range storage controllers and NAS arrays adopt the P3041NXN1MMB to deliver high IOPS while retaining the mature Power Architecture software ecosystem. The four e500mc cores handle RAID parity computation, iSCSI or NFS termination, and metadata journaling in parallel, while the integrated PCIe and 10 GbE SerDes connect to the disk shelf and the storage fabric. ECC-protected DDR3L memory preserves data integrity, and the -40C to +105C temperature grade supports harsher server-room environments. The NonENC build is preferred when encryption is handled by dedicated AES-NI-style co-processors at the storage back-end.
Empfohlen
Long-Lifecycle Embedded Control Systems
Programs requiring 10 to 15 years of supply continuity - such as railway signaling, energy grid SCADA, and medical imaging - select the P3041NXN1MMB because of NXP's product longevity commitment for the QorIQ P3 family. The four e500mc cores deliver multi-decade deterministic throughput, the 32-bit Power Architecture binary compatibility preserves firmware investment across program lifecycles, and the industrial temperature grade covers unattended outdoor cabinets. The 1295-FCBGA package is supported by NXP's reference designs, validation reports, and BSDL/IBIS models that simplify long-term design refreshes. The NonENC build also avoids export-control re-classifications during the program lifetime.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für P3041NXN1MMB – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | P3041NXE1MMB | P3041NSN1MMB | P3041NSE1MMB | P3041NXE1NNB |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1295-FCPBGA (37.5x37.5 mm) | 1295-FCPBGA (37.5x37.5 mm) - same | 1295-FCPBGA (37.5x37.5 mm) - same | 1295-FCPBGA (37.5x37.5 mm) - same | 1295-FCPBGA (37.5x37.5 mm) - same |
| Core Architecture | PowerPC e500mc | PowerPC e500mc | PowerPC e500mc | PowerPC e500mc | PowerPC e500mc |
| Number of Cores | 4 | 4 | 4 | 4 | 4 |
| Maximum Core Frequency | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz |
| Encryption Engine (SEC) | NonENC (no SEC) | Encrypted (SEC present) | NonENC (no SEC) | Encrypted (SEC present) | Encrypted (SEC present) |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
Wichtigste Unterscheidungsmerkmale
- NonENC variant simplifies export-control compliance for global programs (vs. P3041NXE1MMB)
- M-grade industrial temperature range for harsh-environment deployment (vs. P3041NXE1NNB)
- Long-lifecycle commitment under NXP's QorIQ P3 longevity program (vs. AM3894CCYG120 (TI Sitara))
Designhinweise
At full quad-core load with all four e500mc cores active at 1.2 GHz, the P3041NXN1MMB can dissipate several watts across the 37.5x37.5 mm FCBGA. Attach a thermal interface material (TIM) and a heatsink or conduction-cooled cold plate directly to the package thermal lid, and use NXP's thermal model to verify junction temperature stays below 125C across the -40C to +105C industrial ambient range. For sealed enclosures, prefer a copper or aluminum cold plate with thermal pads rated for the same temperature range. Estimated: assume ~5-8 W typical and ~12 W worst-case at 1.2 GHz; verify against the silicon-specific thermal characterization report when available.
The 1295-FCBGA requires a high-density PCB stack-up: minimum 8 layers with 1-2-1 or 1-3-1 signal-to-plane ratio, microvia or via-in-pad escape from the BGA, and matched-length SerDes traces per the QorIQ P3 hardware specifications document (P3041EC). Follow NXP application note AN4137 for the SerDes reference-clock routing and the DDR3 byte-lane topology; non-compliance typically manifests as eye-margin failure on 10 GbE or PCIe Gen2 links. BGA pad surface finish should be ENIG or OSP to match the lead-free solder ball composition.
Do not confuse the NonENC variant (NXN1MMB) with the encrypted sibling (NXE1MMB): the silicon revision is the same, but firmware that expects SEC registers will hang or fault on the NonENC part. Also verify the operating temperature grade code (M = -40C to +105C industrial) against the deployment environment before substituting a part with a different suffix. The r1.1 silicon revision adds errata fixes versus r1.0; check the latest NXP errata document (P3041CE) before locking the BOM.
Place the DDR3/3L memory as close as possible to the MPU with matched-length, matched-impedance traces per byte lane; enable ECC by routing the additional ECC byte lane and tying unused ECC pins per the reference design. Decouple the supply rails with a combination of bulk capacitors and 100 nF / 1 nF / 10 nF ceramics at each voltage domain, and route the corenet fabric clocks with controlled-impedance, length-matched differential pairs. Use NXP's BSDL and IBIS models for SI simulation of the SerDes lanes before tape-out.
Compliance-Informationen
RoHS compliant and lead-free per NXP product family compliance statement. AEC-Q100 not applicable (this is a non-automotive MPU). REACH SVHC declaration available from NXP upon request. NonENC build variant selected to simplify ITAR/EAR export-control compliance.
