PIC16F18313-E/RFVAO - 8-bit MCU, 3.5KB Flash, XLP | Microchip
Teilenummer: PIC16F18313-E/RFVAO ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0.95 | $0,95 |
| 10 | $0.86 | $8,60 |
| 100 | $0.74 | $74,00 |
| 500 | $0.62 | $310,00 |
| 1.000 | $0.55 | $550,00 |
PIC16F18313-E/RFVAO Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU, program memory (Flash), data memory (RAM), non-volatile storage (EEPROM), and peripheral blocks such as timers, ADCs, and communication interfaces. The PIC16F18313 sits in the hierarchy: 8-bit microcontroller -> RISC MCU -> embedded controller -> semiconductor. XLP variants add nanoWatt sleep modes that allow typical run currents in the tens of microamps and sleep currents below 1 uA, enabling multi-year coin-cell operation in IoT edge nodes.
Key features include a 10-bit ADC with computation (ADC2), a 5-bit DAC, two I2C/SPI interfaces, Complementary Waveform Generator (CWG), Configurable Logic Cell (CLC), and zero-cross detection. PPS remaps digital peripherals to any I/O pin, freeing PCB routing. The HVSON-8 package has an exposed thermal pad that must be soldered to the ground plane for rated thermal and electrical performance.
Architecture-wise, the PIC16F18313 uses a 14-bit instruction word, an 8-level hardware stack, and a single-cycle instruction pipeline at 32 MHz. The device supports in-circuit debugging via ICD 3 or PICkit 4 over the two-pin ICSP interface and is programmable with MPLAB X IDE, MCC, and XC8 compilers.
Typical applications include automotive body and sensor nodes, IoT battery sensors, low-power wireless sensor nodes, consumer appliance controllers, LED lighting controllers, and small motor control stages. The wide 1.8-5.5 V range supports direct connection to single-cell Li-ion, 2xAA, and 3.3 V or 5 V rails without external level shifters.
When designing with this device, place a 100 nF decoupling capacitor as close as possible to VDD, tie MCLR through a 10 kohm pull-up to VDD, and provide a 4.7 kohm pull-up on SCL/SDA for I2C. The VAO suffix denotes the automotive grade temperature range and packaging option, so confirm PPAP and AEC-Q100 documentation before deployment in automotive systems.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet to help engineers compare PIC16F18313-E/RFVAO against competing 8-bit MCUs.
Drop-in-Alternativen für PIC16F18313-E/RFVAO – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC16F18313-E/RFVAO (gleiche Bauform und Footprint) – abweichend in Package, ADC, Core Architecture, Operating Temperature, I/O Pins.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC16F18313-E/RF
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC16F18313-I/RF
✅ Drop-In✓ Auf Lager
$0.66 / Stück
Datenblatt ansehen →PIC16LF18313-E/RFVAO
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC16F18323-E/RF
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PIC16F18313-E/RFVAO Grenzwerte & elektrische Eigenschaften
| Core | PIC16 8-bit RISC |
| CPU Speed | 32 MHz (8 MIPS) |
| Program Memory (Flash) | 3.5 KB (2K x 14 words) |
| Data RAM | 256 bytes |
| Data EEPROM | 256 bytes |
| Operating Voltage (VDD) | 1.8 V to 5.5 V |
| I/O Pins | 6 (with Peripheral Pin Select) |
| ADC | 10-bit, 5-channel with Computation (ADC2) |
| DAC | 5-bit, 1-channel |
| Timers | 4 x 8-bit / 16-bit, 1 x WDT |
| PWM | 10-bit PWM, CCP, CWG |
| Communication | I2C, SPI, UART (EUSART) |
| Configurable Logic Cell | CLC peripheral |
| Gehäuse | 8-pin UDFN / HVSON (3x3 mm) |
| Betriebstemperatur | -40C to +125C (E suffix, VAO automotive option) |
| Low-Power Technology | eXtreme Low Power (XLP) |
| RoHS-Status | Compliant |
PIC16F18313-E/RFVAO Pin-Konfiguration
| Pin 1 | RA5 — Bidirectional I/O with PPS; analog input capable |
| Pin 2 | RA4 — Bidirectional I/O with PPS; analog input capable |
| Pin 3 | RA3/MCLR — RA3 I/O or Master Clear reset (MCLR) input |
| Pin 4 | VDD — Positive supply (1.8 V to 5.5 V) |
| Pin 5 | VSS — Ground reference |
| Pin 6 | RA0 — Bidirectional I/O with PPS; analog input capable |
| Pin 7 | RA1 — Bidirectional I/O with PPS; analog input capable |
| Pin 8 | RA2 — Bidirectional I/O with PPS; analog input capable |
Typische Anwendungen
PIC16F18313-E/RFVAO ist geeignet für 6 Anwendungs: Automotive Body and Sensor Nodes, IoT Battery Sensor Edge Nodes, Consumer Appliance Control, LED Lighting Controllers, Low-Power Wireless Sensor Hubs, Small DC Motor and Fan Control.
Automotive Body and Sensor Nodes
The PIC16F18313-E/RFVAO fits automotive sensor nodes through its AEC-Q100 grade qualification and wide -40C to +125C operating range, supported by the 1.8-5.5 V VDD that interfaces directly with 12 V-derived 5 V body rails. With 6 PPS-mappable I/O pins, the device can drive seat-occupancy sensors, door-zone switches, and interior ambient-light modules while leaving room for ICSP debug. The 3.5 KB Flash and 256 B RAM host state-machine plus LIN-like firmware, and XLP sleep currents under 1 uA let quiescent modules survive key-off periods without draining the battery.
Empfohlen
IoT Battery Sensor Edge Nodes
The PIC16F18313-E/RFVAO suits coin-cell or 2xAA powered IoT sensors thanks to eXtreme Low Power (XLP) technology that drops quiescent current below 1 uA in nanoWatt sleep modes. The integrated 10-bit ADC2 with computation handles duty-cycled sensor reads without waking the CPU, while 256 B EEPROM stores calibration constants across sleep cycles. The 32 MHz core wakes in microseconds, executes the measurement, and returns to sleep, achieving multi-year battery life in BLE-paired temperature, humidity, or door/window sensor designs.
Empfohlen
Consumer Appliance Control
In small kitchen and personal-care appliances, the PIC16F18313-E/RFVAO drives user-interface LEDs, capacitive touch buttons, and motor PWM stages through its 10-bit PWM and Complementary Waveform Generator (CWG). Six PPS I/O pins route button, encoder, and LED signals without bus conflicts, and the 1.8-5.5 V range supports both 2xAA and USB-derived 5 V rails. The 3.5 KB Flash stores UI state machines and motor profiles while the CLC peripheral implements glue-logic like button debouncing and PWM interlocks in hardware, freeing CPU cycles.
Empfohlen
LED Lighting Controllers
The PIC16F18313-E/RFVAO drives multi-channel LED strings using its 10-bit PWM and CWG block, with the 5-bit DAC providing smooth dimming curves via exponential correction. Peripheral Pin Select remaps PWM outputs to any of the 6 I/O pins so the same firmware supports different PCB LED layouts, reducing SKUs. eXtreme Low Power idle states keep standby power below regulatory limits for ENERGY STAR and EU eco-design compliance in smart bulbs and accent lighting.
Empfohlen
Low-Power Wireless Sensor Hubs
The PIC16F18313-E/RFVAO serves as the host MCU for sub-GHz or BLE sensor hubs, managing UART/SPI to the radio, ADC2 sensor reads, and CLC-based wake-on-event logic. Its 256 B RAM is sufficient for short packet buffering before radio transmit, and 3.5 KB Flash hosts the radio configuration plus sensor stack. With XLP sleep below 1 uA, the MCU itself contributes negligibly to the system's idle current budget, enabling multi-year battery life in remote monitoring nodes.
Empfohlen
Small DC Motor and Fan Control
The PIC16F18313-E/RFVAO controls small brushed DC motors and fans through its Complementary Waveform Generator (CWG) for dead-band control, 10-bit PWM for speed regulation, and CLC for hardware interlocks like current-limit shutdown. The 32 MHz core executes closed-loop PID at high update rates, while 256 B EEPROM retains calibration across power cycles. With -40C to +125C support and AEC-Q100 traceability, the device is also qualified for HVAC blower and seat-ventilation modules.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC16F18313-E/RFVAO – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC16F18313-E/RF | PIC16F18313-I/RF | PIC16LF18313-E/RFVAO | PIC16F18323-E/RF |
|---|---|---|---|---|---|
| Package | 8-UDFN (3x3 mm) | 8-UDFN (3x3 mm) - same | 8-UDFN (3x3 mm) - same | 8-UDFN (3x3 mm) - same | 8-UDFN (3x3 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 3.5 KB | 3.5 KB | 3.5 KB | 3.5 KB | 7 KB |
| Data RAM | 256 B | 256 B | 256 B | 256 B | 512 B |
| Data EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B |
| Operating Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 3.6 V (LF) | 1.8 V to 5.5 V |
| Automotive Grade | Yes (AEC-Q100, VAO) | No (industrial E) | No (industrial I) | Yes (AEC-Q100, VAO) | No |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +125C |
| Approx. Unit Price (qty 1) | $0.95 | $0.85 | $0.80 | $0.95 | $1.00 |
Wichtigste Unterscheidungsmerkmale
- Automotive-grade qualification with full traceability (vs. PIC16F18313-E/RF)
- Doubled Flash and RAM in same footprint (vs. PIC16F18313-E/RF)
- Lower-voltage XLP variant for battery designs (vs. PIC16LF18313-E/RFVAO)
Designhinweise
Place a 100 nF X7R decoupling capacitor as close as physically possible to the VDD pin (pin 4) and a bulk 4.7 uF tantalum or ceramic on the same power trace. Tie VSS (pin 5) and the central thermal pad together with a low-impedance ground pour. For battery applications, switching the PIC16F18313-E/RFVAO into Sleep between measurements with XLP nanoWatt mode drops quiescent current below 1 uA, enabling multi-year coin-cell operation.
The HVSON-8 / UDFN package exposes a thermal pad underneath the IC that MUST be soldered to a PCB pad of equivalent size tied to VSS for rated thermal and electrical performance. Skip soldering the pad and you risk 20-30% higher junction temperatures, marginal ADC readings, and potential long-term reliability failures. The exposed pad also improves power dissipation, so use a thermal via array of 4-9 vias to inner ground planes.
Configure MCLR (pin 3) as MCLR with a 10 kohm pull-up to VDD for in-circuit debugging and reliable reset, or as RA3 GPIO if reset is not required. Add a 100 nF cap on MCLR if the line is long or noisy. Remember that PIC16F18313 I/O is 5 V tolerant on most pins when VDD = 5 V; check the analog/digital input voltage limits in DS40001799D before driving pins above VDD to avoid latch-up.
Compliance-Informationen
AEC-Q100 qualified per VAO suffix. RoHS and REACH compliant per Microchip product environmental compliance documentation.
