PIC16F18346T-I/GZ - 8-Bit 32MHz XLP MCU 28KB Flash | Microchip
Teilenummer: PIC16F18346T-I/GZ ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1.62 | $1,62 |
| 10 | $1.46 | $14,60 |
| 100 | $1.3 | $130,00 |
| 500 | $1.18 | $590,00 |
| 1.000 | $1.05 | $1.050,00 |
| 3.000 | $0.92 | $2.760,00 |
PIC16F18346T-I/GZ Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, and programmable peripherals such as timers, ADC, communication interfaces, and GPIO. The 8-bit PIC MCU family uses a RISC-based Harvard architecture with a 14-bit instruction word optimized for deterministic execution and small code footprint. XLP (eXtreme Low Power) variants add sleep currents in the nanoampere range and aggressive power-management peripherals, enabling battery-powered designs that can run for years on a single cell.
Key features include Functional Safety (FuSa) capability, 256B of EEPROM data memory, a 10-bit ADC, a 5-bit DAC, two configurable serial communication modules that can operate as either SPI or I2C, and Microchip's Peripheral Pin Select (PPS) feature that allows digital peripherals (CLC, CWG, CCP, PWM, and communications) to be remapped to a wide range of physical pins. This pin remapping significantly simplifies PCB layout and BOM flexibility when routing mixed-signal designs.
Architecturally, the PIC16F18346 combines a C compiler-friendly enhanced mid-range core with Core Independent Peripherals (CIPs) such as the Configurable Logic Cell (CLC), Complementary Waveform Generator (CWG), and Numerically Controlled Oscillator (NCO), allowing functions like waveform synthesis, signal conditioning, and timing to run without CPU intervention. With 2KB of SRAM and 28KB of Flash, the device targets mid-complexity embedded firmware applications.
Typical applications include IoT sensor nodes, wearable health and fitness devices, battery-powered remote controls, low-power wireless sensor endpoints, industrial control modules, and consumer appliances. The XLP technology with deep-sleep currents below 1 uA makes the PIC16F18346T-I/GZ especially well suited to applications that spend most of their life in standby and wake only periodically to acquire data or transmit telemetry.
When designing with this MCU, prioritize use of the PPS feature to free critical pins from peripheral constraints and to enable last-minute PCB changes without firmware rewrites. Always populate a decoupling capacitor network (100 nF plus a bulk cap) within a few millimeters of the VDD pin, and tie the exposed pad to a clean ground plane for thermal dissipation and EMI performance. For programming, Microchip's MPLAB X IDE with XC8 compiler is the standard toolchain.
This page synthesizes distributor pricing, drop-in same-package alternatives from the PIC16F183xx family, and practical design notes that complement (but do not replace) the manufacturer datasheet.
Drop-in-Alternativen für PIC16F18346T-I/GZ – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC16F18346T-I/GZ (gleiche Bauform und Footprint) – abweichend in ADC, Package, Core Architecture, Operating Temperature, Program Memory (Flash).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC16F18345T-I/GZ
✅ Drop-In✓ Auf Lager
$2.04 / Stück
Datenblatt ansehen →PIC16F18346-E/GZ
✅ Drop-In✓ Auf Lager
$1.28 / Stück
Datenblatt ansehen →PIC16LF18346T-I/GZ
✅ Drop-In✓ Auf Lager
$1.52 / Stück
Datenblatt ansehen →PIC16F1829-I/GZ
✅ Drop-In✓ Auf Lager
$1.31 / Stück
Datenblatt ansehen →PIC16F18346T-I/GZ Grenzwerte & elektrische Eigenschaften
| Core Architecture | 8-bit PIC enhanced mid-range (RISC, Harvard, 14-bit instruction word) |
| Family | PIC XLP 16F (Functional Safety / FuSa series) |
| Maximum CPU Frequency | 32 MHz |
| Program Flash Memory | 28 KB (16K x 14 words) |
| Data SRAM | 2 KB |
| Data EEPROM | 256 B |
| Supply Voltage (VDD) | 2.3 V to 5.5 V |
| ADC | 10-bit |
| DAC | 5-bit |
| Communication Peripherals | 2x (SPI / I2C selectable) |
| Peripheral Pin Select (PPS) | Yes |
| Core Independent Peripherals | CLC, CWG, NCO, CCP, PWM |
| Functional Safety (FuSa) | Yes |
| Betriebstemperatur | -40 C to +85 C (Industrial, 'I') |
| Gehäuse | 20-pin UQFN (4x4 mm) with exposed pad (GZ) |
| Montageart | Surface Mount |
| Lead-Free / RoHS | Lead-free, RoHS compliant |
| Programming / Debug Interface | ICSP (In-Circuit Serial Programming), 4-wire PDI |
| Qualification | Functional Safety (FuSa) capable |
PIC16F18346T-I/GZ Pin-Konfiguration
| Pin 1 | RA5 — Bidirectional I/O with analog and interrupt capability; PPS-mappable |
| Pin 2 | RA4 — Bidirectional I/O with analog and interrupt capability; PPS-mappable |
| Pin 3 | RA3 — Bidirectional I/O with analog and interrupt capability; PPS-mappable |
| Pin 4 | RA2 — Bidirectional I/O with analog and interrupt capability; PPS-mappable |
| Pin 5 | RA1 — Bidirectional I/O with analog and interrupt capability; PPS-mappable |
| Pin 6 | RA0 — Bidirectional I/O with analog and interrupt capability; PPS-mappable |
| Pin 7 | VDD — Positive supply voltage (2.3V to 5.5V) |
| Pin 8 | VSS — Ground reference |
| Pin 9 | RB7 — Bidirectional I/O with interrupt capability; PPS-mappable; ICSPDAT |
| Pin 10 | RB6 — Bidirectional I/O with interrupt capability; PPS-mappable; ICSPCLK |
| Pin 11 | RB5 — Bidirectional I/O with interrupt capability; PPS-mappable |
| Pin 12 | RB4 — Bidirectional I/O with interrupt capability; PPS-mappable |
| Pin 13 | RC7 — Bidirectional I/O with analog and interrupt capability; PPS-mappable |
| Pin 14 | RC6 — Bidirectional I/O with analog and interrupt capability; PPS-mappable |
| Pin 15 | RC5 — Bidirectional I/O with analog and interrupt capability; PPS-mappable |
| Pin 16 | RC4 — Bidirectional I/O with analog and interrupt capability; PPS-mappable |
| Pin 17 | RC3 — Bidirectional I/O with analog and interrupt capability; PPS-mappable |
| Pin 18 | RC2 — Bidirectional I/O with analog and interrupt capability; PPS-mappable |
| Pin 19 | RC1 — Bidirectional I/O with analog and interrupt capability; PPS-mappable |
| Pin 20 | RC0 — Bidirectional I/O with analog and interrupt capability; PPS-mappable |
Typische Anwendungen
PIC16F18346T-I/GZ ist geeignet für 6 Anwendungs: Battery-Powered IoT Sensor Node, Wearable Health and Fitness Device, Industrial Control Module, Remote Control and Human-Machine Interface (HMI), Consumer Appliance and Smart Home Device, Low-Power Wireless Sensor Endpoint.
Battery-Powered IoT Sensor Node
The PIC16F18346T-I/GZ is purpose-built for battery-powered IoT sensor nodes where multi-year lifetime on a single coin cell is essential. Its XLP architecture delivers sub-1uA deep-sleep current at 3V per the PIC16(L)F18326/18346 datasheet, while the integrated 10-bit ADC and 5-bit DAC support direct sensor interfacing for temperature, humidity, and gas sensors. The Core Independent Peripherals (CLC, NCO) can wake the device, perform signal conditioning, and return to sleep without CPU intervention, drastically reducing average current. The 32 MHz core and 28 KB Flash are sufficient for local processing, sensor-fusion routines, and lightweight LoRaWAN or sub-GHz protocol drivers. Recommended companion MPNs: PIC16F18345T-I/GZ (lower Flash sibling), PIC16F18346-E/GZ (tube-packed variant).
Empfohlen
Wearable Health and Fitness Device
Wearable health and fitness devices demand extremely low quiescent current, mixed-signal sensor integration, and small PCB footprint - all delivered by the PIC16F18346T-I/GZ. The 20-pin UQFN (4x4 mm) package with exposed pad fits inside wristbands and patches, while the 10-bit ADC and 5-bit DAC can directly bias and digitize signals from optical heart-rate, skin-temperature, and motion sensors. Functional Safety (FuSa) hardware makes the device suitable for medical-grade fitness products that benefit from IEC 60730 Class B self-test routines. The Peripheral Pin Select feature lets PCB designers route analog and digital signals to virtually any pin, simplifying mixed-signal layout in dense wearable designs.
Empfohlen
Industrial Control Module
Industrial control modules running on 24V-bus-derived 5V or 3.3V rails benefit from the PIC16F18346T-I/GZ's 2.3V-5.5V wide supply range and 32 MHz processing headroom. The 10-bit ADC can read 4-20 mA loop signals through a current-sense resistor, while the two SPI/I2C modules interface to digital sensors, EEPROMs, and display drivers. The Functional Safety features (windowed WDT, hardware CRC, dual-bank Flash) enable IEC 60730 Class B compliance for white-goods and HVAC control boards. The exposed thermal pad of the UQFN package provides robust thermal performance under continuous CPU load typical of motor-control and process-control applications.
Empfohlen
Remote Control and Human-Machine Interface (HMI)
The PIC16F18346T-I/GZ is a strong fit for handheld remote controls and low-cost HMI panels where long battery life, capacitive-touch sensing, and IR or RF transmission are required. Its Core Independent Peripherals such as the CLC and PWM can synthesize 36-40 kHz IR carrier signals without CPU load, freeing the 32 MHz core to handle button-scanning, battery monitoring, and protocol encoding. The 28 KB Flash accommodates rich IR/RF code libraries (NEC, RC5, BLE proprietary, Sub-GHz). PPS allows designers to remap TX/RX functions to any GPIO, simplifying PCB layout under tight mechanical constraints.
Empfohlen
Consumer Appliance and Smart Home Device
Smart-home devices such as connected thermostats, lighting controllers, and small appliances benefit from the PIC16F18346T-I/GZ's combination of low-power operation, integrated peripherals, and Functional Safety features. The 10-bit ADC reads potentiometers, light sensors, and current shunts for HVAC control loops, while the SPI/I2C ports interface to Wi-Fi or BLE modules for cloud connectivity. The XLP technology allows the device to wake only on user input or scheduled events, extending battery life in battery-backed thermostats and portable appliances. AEC-Q100-grade sibling parts (such as the PIC16F18346T-I/SSVAO) are available for harsher automotive-cabin environments.
Empfohlen
Low-Power Wireless Sensor Endpoint
Battery-powered wireless sensor endpoints (such as LoRa, Sub-GHz proprietary, or BLE beacons) leverage the PIC16F18346T-I/GZ's sub-1uA sleep current and Core Independent Peripherals to maximize time between battery replacements. The CLC can act as a hardware packet preamble detector, the NCO can synthesize precise timing references, and the ADC can scan multiple analog inputs - all while the main 32 MHz CPU remains in sleep. The 28 KB Flash holds wireless protocol stacks and sensor-fusion code; the 20-pin UQFN (4x4) keeps the design footprint small enough for in-line sensor packaging.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC16F18346T-I/GZ – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC16F18345T-I/GZ | PIC16F18346-E/GZ | PIC16LF18346T-I/GZ | PIC16F1829-I/GZ |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 20-pin UQFN (4x4) | 20-pin UQFN (4x4) | 20-pin UQFN (4x4) | 20-pin UQFN (4x4) | 20-pin UQFN (4x4) |
| Flash Memory | 28 KB | 14 KB | 28 KB | 28 KB | 14 KB |
| SRAM | 2 KB | 1 KB | 2 KB | 2 KB | 1 KB |
| Operating Voltage | 2.3V to 5.5V | 2.3V to 5.5V | 2.3V to 5.5V | 1.8V to 3.6V | 1.8V to 5.5V |
| Maximum CPU Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Core Independent Peripherals | CLC, CWG, NCO, CCP, PWM | CLC, CWG, NCO, CCP, PWM | CLC, CWG, NCO, CCP, PWM | CLC, CWG, NCO, CCP, PWM | Limited CIP set |
| Functional Safety (FuSa) | Yes | Yes | Yes | Yes | No |
| Packaging Format | Tape & Reel | Tape & Reel | Tube | Tape & Reel | Tape & Reel |
Wichtigste Unterscheidungsmerkmale
- Highest memory in PIC16F183xx 20-pin UQFN family (vs. PIC16F18345T-I/GZ)
- Full 5V operation with industrial temperature range (vs. PIC16LF18346T-I/GZ)
- Modern Core Independent Peripherals vs earlier-generation family (vs. PIC16F1829-I/GZ)
- Tape-and-reel packaging suited to high-volume SMT lines (vs. PIC16F18346-E/GZ)
Designhinweise
The PIC16F18346T-I/GZ supports a wide VDD range of 2.3 V to 5.5 V and offers multiple low-power modes (Sleep, Doze, Low-Power Sleep) with currents documented in the PIC16(L)F18326/18346 datasheet. Estimated: in Sleep with all peripherals disabled, current is typically under 1 uA at 3 V - always add a 100 nF decoupling capacitor within 3 mm of the VDD pin and a bulk cap (1-10 uF) at the regulator output. For battery-powered designs, switch off unused peripherals individually (PMD registers) rather than relying solely on global Sleep, since each ADC, SPI, or PWM can leak microamps if enabled.
The 20-pin UQFN (4x4) package has an exposed thermal pad on the underside that must be soldered to a clean ground plane for thermal dissipation and EMI performance. Per Microchip QFN PCB layout guidelines, place at least 8 thermal vias (0.3 mm drill, 0.5 mm pad) inside the exposed pad to the inner ground plane. Keep analog traces (ADC inputs, VREF+) short and away from switching signals such as PWM outputs or digital communication lines to minimize coupled noise. Use a separate analog ground island if the design includes mixed-signal sensor paths.
Do not forget to configure unused pins as outputs low (rather than inputs floating) to avoid parasitic current draw through the input buffer of the PIC16F18346T-I/GZ. The PIC16(L)F18326/18346 datasheet Section 11 'I/O Ports' recommends clearing the corresponding WPU bits and setting the LATx bit low. Also verify the MCLR pin is pulled high through a 10 kohm resistor; leaving MCLR floating causes unreliable reset behavior. When using PPS, ensure the same peripheral output is not mapped to two pins simultaneously, which causes contention.
At the maximum 32 MHz CPU clock with all peripherals active and 5.5 V VDD, the PIC16F18346T-I/GZ draws approximately 8 mA (estimated from typical datasheet curves), dissipating about 44 mW - well within the UQFN package thermal limits. Estimated: theta_JA of the 20-pin UQFN (4x4) is approximately 35 C/W on a JEDEC 4-layer test board, yielding a self-heating temperature rise of roughly 1.5 C. For continuous high-load applications, ensure the PCB ground plane covers the exposed pad area for additional heat spreading.
Compliance-Informationen
RoHS compliant per Microchip product page. Functional Safety (FuSa) capable for IEC 60730 Class B but not AEC-Q100 qualified; choose PIC16F18346T-I/SSVAO or PIC16F18346-E/GZVAO for automotive. REACH compliant per Microchip policy.
