PIC16F18445-I/GZ - 8-Bit XLP MCU 14KB Flash 20-UQFN | Microchip
Teilenummer: PIC16F18445-I/GZ ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1.65 | $1,65 |
| 10 | $1.48 | $14,80 |
| 100 | $1.22 | $122,00 |
| 500 | $1.05 | $525,00 |
| 1.000 | $0.92 | $920,00 |
| 3.000 | $0.78 | $2.340,00 |
PIC16F18445-I/GZ Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), working memory (RAM), and a set of on-chip peripherals such as timers, communication interfaces, ADCs, and GPIO. The PIC16F18445 belongs to the mid-range PIC16F1xxx enhanced family that introduces Core Independent Peripherals (CIPs), allowing complex functions such as signal generation, waveform measurement, and motor control to run in hardware without CPU intervention. Within the broader taxonomy, this part sits at: 8-bit microcontroller → PIC16 family → XLP low-power → functional-safety-capable sub-family → semiconductor device.
Key headline specifications include 14 KB Flash program memory (8K x 14 words), 1 KB RAM, 256 bytes of EEPROM data memory, 12-bit ADC with Computation (ADCC), two 10-bit PWMs, an on-chip 5-/8-bit DAC, a Comparator, a Complementary Waveform Generator (CWG), and serial interfaces comprising EUSART, SPI, and I²C. The XLP sleep current can drop below 50 nA in Retention mode, allowing battery-powered products to extend operating life on a single coin cell.
The PIC16F18445 integrates the CIP blocks (CWG, NCO, DSM, configurable logic cells, and zero-cross detect) that let designers implement closed-loop SMPS, lighting control, and sensor signal conditioning entirely in silicon. The 12-bit ADCC provides averaging, burst averaging, oversampling, and hardware accumulation, offloading the core from low-level signal processing and enabling precision sensor measurement at low MIPS.
Typical applications include IoT sensor nodes, battery-powered thermostats, LED lighting controllers, consumer appliances, automotive body and sensor ECUs (with FuSa documentation), industrial control boards, and wearable health devices. The 4x4 mm UQFN footprint also suits space-constrained designs such as USB-C accessories and small motor-control PCBs.
When designing with this part, allocate at least one decoupling 100 nF X7R capacitor adjacent to each VDD/VSS pair and follow Microchip's recommended ground plane layout to keep radiated EMI low. Developers can use the MPLAB X IDE with the free XC8 compiler and PICkit 4 / Snap programmer for in-circuit debug.
This page combines distributor pricing, drop-in alternatives, and practical design notes that complement, but do not replace, the manufacturer datasheet and family reference manual.
Drop-in-Alternativen für PIC16F18445-I/GZ – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC16F18445-I/GZ (gleiche Bauform und Footprint) – abweichend in ADC, Package, DAC, Program Memory (Flash), Core Architecture.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC16F18444-I/GZ
✅ Drop-In✓ Auf Lager
$0.99 / Stück
Datenblatt ansehen →PIC16F18345-I/GZ
✅ Drop-In✓ Auf Lager
$0.97 / Stück
Datenblatt ansehen →PIC16F18445-I/GZ-MEAS
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC16F15345-I/GZ
✅ Drop-In✓ Auf Lager
$0.65 / Stück
Datenblatt ansehen →PIC16F18446-I/GZ
✅ Drop-In✓ Auf Lager
$1.1 / Stück
Datenblatt ansehen →PIC16F18445-E/GZ
✅ Drop-In✓ Auf Lager
$1.02 / Stück
Datenblatt ansehen →PIC16F18445-I/GZ Grenzwerte & elektrische Eigenschaften
| Core Architecture | PIC16 8-bit enhanced mid-range |
| CPU Speed | 32 MHz (8 MIPS) |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| Data RAM | 1 KB |
| EEPROM | 256 bytes |
| Operating Voltage Range | 1.8 V to 5.5 V |
| ADC | 12-bit ADCC with computation, oversampling, averaging |
| DAC | 5-bit / 8-bit selectable on-chip DAC |
| PWM Channels | 2 x 10-bit PWM |
| Comparators | On-chip analog comparator |
| CWG | Complementary Waveform Generator |
| Communication Interfaces | EUSART, SPI, I²C |
| XLP Sleep Current | < 50 nA typical (Retention mode) |
| Gehäuse | 20-pin UQFN (GZ) 4x4 mm |
| Montageart | Surface Mount |
| Betriebstemperatur | -40 °C to +85 °C (industrial, "I" grade) |
| MSL-Level | MSL1 (per JEDEC J-STD-020, package dependent) |
| RoHS-Status | Compliant |
| Functional Safety (FuSa) | Documentation package available for IEC 60730 Class B |
PIC16F18445-I/GZ Pin-Konfiguration
| Pin 1 | RA5 — Bidirectional I/O, analog input |
| Pin 2 | RA4 — Bidirectional I/O, analog input |
| Pin 3 | RA3 — Bidirectional I/O, analog input |
| Pin 4 | RA2 — Bidirectional I/O, analog input |
| Pin 5 | RA1 — Bidirectional I/O, analog input |
| Pin 6 | RA0 — Bidirectional I/O, analog input |
| Pin 7 | VSS — Ground reference |
| Pin 8 | RA7 — Bidirectional I/O, analog input |
| Pin 9 | RA6 — Bidirectional I/O, oscillator output |
| Pin 10 | RC0 — Bidirectional I/O |
| Pin 11 | RC1 — Bidirectional I/O |
| Pin 12 | RC2 — Bidirectional I/O |
| Pin 13 | RC3 — Bidirectional I/O |
| Pin 14 | RC4 — Bidirectional I/O |
| Pin 15 | RC5 — Bidirectional I/O |
| Pin 16 | RC6 — Bidirectional I/O |
| Pin 17 | RC7 — Bidirectional I/O |
| Pin 18 | VDD — Positive supply (1.8 V to 5.5 V) |
| Pin 19 | VSS — Ground reference |
| Pin 20 | MCLR — Master clear / reset input |
Typische Anwendungen
PIC16F18445-I/GZ ist geeignet für 6 Anwendungs: IoT Battery Sensor Node, Battery-Powered Thermostat, LED Lighting Controller, Consumer Appliance Control Board, Automotive Body Sensor ECU, Wearable Health Monitor.
IoT Battery Sensor Node
The PIC16F18445-I/GZ is well-suited for IoT battery sensor nodes because its XLP Retention mode sleep current drops below 50 nA while still allowing the 12-bit ADCC and EUSART to wake on a sensor event. The 14 KB Flash holds a LoRaWAN or BLE-beacon stack, and the UQFN-20 footprint fits 4x4 mm sensor modules. Pairing the part with a CR2032 coin cell yields multi-year battery life when the duty cycle stays below 0.1%.
Empfohlen
Battery-Powered Thermostat
The PIC16F18445-I/GZ drives a battery-powered thermostat by combining the on-chip 12-bit ADCC for thermistor and humidity sensing with the 5/8-bit DAC for the LCD bias voltage. The CWG and 10-bit PWM directly control a triac-driven heater load, while the EUSART links to a BLE module for remote control. Wide 1.8-5.5 V VDD operation lets the thermostat run from two AA cells for years.
Empfohlen
LED Lighting Controller
The PIC16F18445-I/GZ functions as a smart LED lighting controller by exploiting the CWG, 10-bit PWM, and configurable logic cells to produce flicker-free dimming without CPU overhead. The 12-bit ADCC monitors external current-sense and ambient-light photodiode inputs for closed-loop brightness control. I²C interfaces to a downstream LED driver IC, and XLP low-power mode keeps standby below 50 nA when the lights are off.
Empfohlen
Consumer Appliance Control Board
The PIC16F18445-I/GZ is ideal for IEC 60730 Class B consumer appliances because Microchip supplies Functional Safety (FuSa) collateral and firmware self-test libraries. The 12-bit ADCC monitors motor current and supply rails, while the CWG and EUSART drive a TRIAC and HMI display. Industrial -40 °C to +85 °C operation covers washer, dryer, and dishwasher environments without extra temperature screening.
Empfohlen
Automotive Body Sensor ECU
The PIC16F18445-I/GZ (industrial grade) or PIC16F18445-E/GZ (extended automotive grade) targets body-electronics sensor ECUs such as tire-pressure monitors, seat-occupancy detectors, and ambient-light modules. The 12-bit ADCC and on-chip comparator process sensor signals, while the EUSART or SPI bridges to the vehicle LIN/CAN network. The 20-UQFN 4x4 mm package fits inside tight connector modules next to the sensor element.
Empfohlen
Wearable Health Monitor
The PIC16F18445-I/GZ powers wearable health monitors by combining XLP sleep modes below 50 nA, 12-bit ADCC for heart-rate and SpO2 photodiode readings, and a 5/8-bit DAC for low-bias LCD or LED pulse indicators. The compact UQFN-20 4x4 mm footprint suits thin wristbands, and the wide 1.8-5.5 V VDD range works with small Li-ion or coin-cell batteries. SPI or I²C interfaces attach to a Bluetooth Low Energy companion module for phone sync.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC16F18445-I/GZ – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC16F18444-I/GZ | PIC16F18345-I/GZ | PIC16F15345-I/GZ | PIC16F18446-I/GZ | PIC16F18445-E/GZ |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 20-UQFN (4x4 mm) | 20-UQFN (4x4 mm) - same | 20-UQFN (4x4 mm) - same | 20-UQFN (4x4 mm) - same | 20-UQFN (4x4 mm) - same | 20-UQFN (4x4 mm) - same |
| Flash | 14 KB | 7 KB | 14 KB | 14 KB | 28 KB | 14 KB |
| RAM | 1 KB | 512 B | 1 KB | 1 KB | 2 KB | 1 KB |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B |
| CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| 12-bit ADCC | Yes | Yes | Yes | No (10-bit ADC) | Yes | Yes |
| Functional Safety (FuSa) | Yes | Yes | No | No | Yes | Yes |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +125 °C |
Wichtigste Unterscheidungsmerkmale
- Larger Flash than same-footprint PIC16F18444-I/GZ (vs. PIC16F18444-I/GZ)
- Functional Safety collateral for IEC 60730 Class B (vs. PIC16F18345-I/GZ)
- 12-bit ADCC with computation over legacy 10-bit ADC (vs. PIC16F15345-I/GZ)
Designhinweise
Place a 100 nF X7R decoupling capacitor within 3 mm of every VDD/VSS pair and add a bulk 10 µF tantalum or ceramic on the main 3.3 V rail to support inrush during Flash erase/program. Use separate analog and digital VDD traces to keep ADCC noise below 1 LSB, and tie the AVSS pin directly to the common ground plane rather than daisy-chaining it to the digital VSS pin.
The 20-UQFN package exposes the central die paddle to VSS; ensure the PCB land pattern has a continuous thermal via array (8-12 vias, 0.3 mm drill) under the pad to sink heat and reduce ground impedance. Route high-speed traces (SPI, EUSART) on the top layer over an unbroken reference plane and avoid routing signals under the UQFN paddle to minimize coupling.
Do not exceed VDD of 5.5 V or drop below 1.8 V; both conditions can corrupt Flash during a self-write. Always issue BOR (Brown-Out Reset) configuration before enabling peripherals, and keep MCLR pulled high through a 10 kΩ resistor with a 100 nF bypass when not used. Verify programming voltage timing against the datasheet's VDD ramp specification before in-circuit serial programming (ICSP).
Compliance-Informationen
RoHS / REACH / lead-free / halogen-free compliant per Microchip product page. -I grade is industrial (-40 °C to +85 °C). For IEC 60730 Class B use the Functional Safety collateral; AEC-Q100 qualified part is PIC16F18445-E/GZ (extended grade).
