PIC16F18856-E/SP - 8-bit MCU, 28KB Flash, 32MHz | Microchip
Teilenummer: PIC16F18856-E/SP ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2.02 | $2,02 |
| 10 | $1.84 | $18,40 |
| 100 | $1.61 | $161,00 |
| 500 | $1.42 | $710,00 |
| 1.000 | $1.28 | $1.280,00 |
PIC16F18856-E/SP Übersicht
An 8-bit microcontroller is a single-chip computer that integrates a CPU, RAM, program Flash, EEPROM, and peripherals into one package; it sits at the bottom of the embedded hierarchy (8-bit MCU -> microcontroller -> embedded controller -> semiconductor IC). PIC16F18856-E/SP belongs to Microchip's enhanced mid-range PIC16 core family using a modified Harvard RISC architecture with 14-bit instruction words optimized for deterministic, low-power operation across industrial and consumer applications.
Key features include 28KB (16K x 14) self-programmable Flash program memory, 2KB RAM, 256B EEPROM, 32MHz internal oscillator operation, and an integrated 12-bit ADC with computation (ADC2). The device includes CIPs such as Configurable Logic Cells (CLC), Complementary Waveform Generator (CWG), Numerically Controlled Oscillator (NCO), and Zero-Cross Detect (ZCD), reducing external component count and BOM cost. Functional Safety hardware diagnostics, CRC/SCAN, and Hardware Limit Timer (HLT) support IEC 61508 SIL-2 capable designs.
The device uses a 14-bit instruction width RISC pipeline with a hardware stack and 31-level deep interrupt priority, supporting C-friendly development through MPLAB XC8 compilers. The internal 32MHz oscillator can be tuned using HFINTOSC and provides selectable frequency steps, eliminating the need for an external crystal in many designs while keeping accurate UART and timing performance.
Typical applications include industrial sensor interfaces, battery-powered IoT nodes, low-power remote controls, motor control peripheral drivers, automotive body electronics, home-automation controllers, and general-purpose logic-replacement boards. The 28-SPDIP package and -40C to +125C extended temperature range make it ideal for prototyping on breadboards or through-hole production boards requiring easy rework.
When designing with this device, ensure decoupling with a 100nF ceramic capacitor close to VDD/AVDD and VSS, place the ICSP/PGD/PGC traces away from noisy switching nodes, and verify that the configuration-word settings match the application voltage and oscillator mode. The device's CIPs can replace several discrete logic ICs, simplifying PCB layout and reducing cost.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the standalone manufacturer datasheet, providing a single reference for sourcing, replacement, and design decisions.
Drop-in-Alternativen für PIC16F18856-E/SP – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC16F18856-E/SP (gleiche Bauform und Footprint) – abweichend in Program Memory (Flash), ADC, Core Architecture, Package, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC16F18856-I/SP
✅ Drop-In✓ Auf Lager
$1.48 / Stück
Datenblatt ansehen →PIC16F18857-E/SP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC16F18855-E/SP
✅ Drop-In✓ Auf Lager
$1.47 / Stück
Datenblatt ansehen →PIC16F18876-E/SP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC16F18855-I/SP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC16F18854-E/SP
✅ Drop-In✓ Auf Lager
$1.02 / Stück
Datenblatt ansehen →PIC16F18856-E/SP Grenzwerte & elektrische Eigenschaften
| Product Family | PIC16F1885x/7x (XLP, FuSa, CIP) |
| Core Architecture | 8-bit PIC Enhanced Mid-Range (14-bit instruction) |
| Program Memory (Flash) | 28 KB (16K x 14 words) |
| Data RAM | 2 KB |
| Data EEPROM | 256 bytes |
| Maximum CPU Speed | 32 MHz |
| Supply Voltage (VDD) | 1.8 V to 5.5 V |
| Betriebstemperatur | -40C to +125C (E = Extended) |
| Gehäuse / Bauform | 28-SPDIP (Skinny Plastic DIP), 0.300 inch / 7.62 mm row spacing |
| Pin-Anzahl | 28 |
| Montageart | Through-Hole |
| Core Independent Peripherals (CIP) | CLC, CWG, NCO, ZCD, CRC/SCAN, HLT |
| Functional Safety | FuSa features supporting IEC 61508 SIL-2 capable designs |
| RoHS-Status | Compliant |
| MSL-Level | 1 (unlimited floor life at <30C / 85% RH) |
PIC16F18856-E/SP Pin-Konfiguration
| Pin 1 | RA3/MCLR/VPP — Master Clear (Reset, active-low) / ICSP programming voltage |
| Pin 2 | RA4/OSC2/CLKOUT — GPIO RA4 / oscillator output / clock output |
| Pin 3 | RA5/OSC1/CLKIN — GPIO RA5 / oscillator input / clock input |
| Pin 4 | RA6 — GPIO RA6 |
| Pin 5 | RA7 — GPIO RA7 |
| Pin 6 | RC0 — GPIO RC0 |
| Pin 7 | RC1 — GPIO RC1 |
| Pin 8 | RC2 — GPIO RC2 |
| Pin 9 | RC3 — GPIO RC3 |
| Pin 10 | RC4 — GPIO RC4 |
| Pin 11 | RC5 — GPIO RC5 |
| Pin 12 | RC6 — GPIO RC6 |
| Pin 13 | RC7 — GPIO RC7 |
| Pin 14 | VSS — Ground reference |
| Pin 15 | VDD — Positive supply voltage (1.8V to 5.5V) |
| Pin 16 | RB4 — GPIO RB4 |
| Pin 17 | RB5 — GPIO RB5 |
| Pin 18 | RB6/PGC — GPIO RB6 / ICSP clock (PGC) |
| Pin 19 | RB7/PGD — GPIO RB7 / ICSP data (PGD) |
| Pin 20 | RD0 — GPIO RD0 |
| Pin 21 | RD1 — GPIO RD1 |
| Pin 22 | RD2 — GPIO RD2 |
| Pin 23 | RD3 — GPIO RD3 |
| Pin 24 | RD4 — GPIO RD4 |
| Pin 25 | RD5 — GPIO RD5 |
| Pin 26 | RD6 — GPIO RD6 |
| Pin 27 | RD7 — GPIO RD7 |
| Pin 28 | VSS — Ground reference |
Typische Anwendungen
PIC16F18856-E/SP ist geeignet für 8 Anwendungs: Industrial Sensor Interface, Battery-Powered IoT Nodes, Low-Power Remote Controls, Automotive Body Electronics, Home-Automation Controllers, Logic Replacement Boards, Motor Control Peripheral Drivers, Sensor Modules and Prototyping Boards.
Industrial Sensor Interface
The PIC16F18856-E/SP fits industrial sensor interfaces thanks to its 12-bit ADC with computation (ADC2) and CIPs that handle signal conditioning autonomously. With 32MHz CPU clock and 28KB Flash, the MCU can run multi-protocol sensor stacks while the CLC and NCO replace external timer/logic ICs. Its -40C to +125C extended temperature grade and 28-SPDIP package simplify factory-floor PCBs.
Empfohlen
Battery-Powered IoT Nodes
XLP technology makes the PIC16F18856-E/SP ideal for battery-powered IoT nodes running at 1.8V to 5.5V from a single cell or two AA cells. The 32MHz HFINTOSC eliminates the external crystal, and nA-range sleep currents extend battery life to years. CIPs like ZCD and CWG let the MCU wake on AC zero-cross or generate waveforms without waking the CPU, further lowering average power.
Empfohlen
Low-Power Remote Controls
The PIC16F18856-E/SP suits remote controls because it can stay in deep sleep at nA current and wake on a peripheral interrupt to drive IR or RF transmitters through the CWG. The 28KB Flash is plenty for protocol stacks (NEC, RC5, BLE HCI command sets), while 2KB RAM holds buffers and timers. The through-hole 28-SPDIP package simplifies hand-built remote-control prototypes.
Empfohlen
Automotive Body Electronics
The PIC16F18856-E/SP suits automotive body electronics like interior lighting, seat controllers, and door modules where Functional Safety (FuSa) diagnostics and -40C to +125C operation matter. Hardware Limit Timer (HLT), CRC/SCAN, and the IEC 61508 SIL-2 capable design path support ASIL-A subsystems. The 28-SPDIP package aids bench rework and field replacement in service environments.
Empfohlen
Home-Automation Controllers
The PIC16F18856-E/SP can act as a home-automation hub node, controlling relays, dimmers, and sensors across UART, I2C, or SPI. The 12-bit ADC measures analog sensors, while CLC and CWG generate PWM for LED dimming and motor control without CPU overhead. XLP keeps idle nodes under 1uA, letting them run years on coin cells.
Empfohlen
Logic Replacement Boards
The PIC16F18856-E/SP replaces discrete logic ICs on glue-logic boards using its CLCs, NCO, and CWG peripherals to synthesize AND/OR/XOR gates, frequency synthesis, and complementary PWM waveforms in hardware. The 28-SPDIP package fits retrofits of legacy through-hole logic boards, while MPLAB XC8 C-friendly development cuts firmware cost. Functional Safety diagnostics add reliability for industrial retrofits.
Empfohlen
Motor Control Peripheral Drivers
The PIC16F18856-E/SP drives stepper, brushed DC, and small BLDC motors through its CWG peripheral producing complementary PWM with dead-band, and the NCO for precise commutation timing. The 12-bit ADC reads back current and back-EMF while 32MHz CPU clock supports FOC algorithms. The 28-SPDIP package simplifies bench testing of motor-control prototypes.
Empfohlen
Sensor Modules and Prototyping Boards
The PIC16F18856-E/SP suits hobbyist and educational sensor modules because the 28-SPDIP package plugs directly into breadboards and strip-boards. The integrated 12-bit ADC, internal 32MHz oscillator, and 28KB Flash are sufficient for environmental sensing, robotics, and STEM course labs. The XLP feature lets students measure deep-sleep currents for low-power lessons.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC16F18856-E/SP – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC16F18856-I/SP | PIC16F18857-E/SP | PIC16F18855-E/SP | PIC16F18876-E/SP | PIC16F18855-I/SP | PIC16F18854-E/SP |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-SPDIP | 28-SPDIP - same | 28-SPDIP - same | 28-SPDIP - same | 28-SPDIP - same | 28-SPDIP - same | 28-SPDIP - same |
| Data EEPROM | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| Max CPU Clock | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Supply Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V |
| Temperature Grade | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) |
| Core Independent Peripherals | CLC, CWG, NCO, ZCD, CRC/SCAN, HLT | Same CIP set | Same CIP set | Same CIP set | Same CIP set | Same CIP set | Same CIP set |
Wichtigste Unterscheidungsmerkmale
- Larger Flash memory than PIC16F18855 (vs. PIC16F18855-E/SP)
- Extended temperature grade over PIC16F18856-I/SP (vs. PIC16F18856-I/SP)
- Higher-Flash upgrade path on same footprint (vs. PIC16F18854-E/SP)
Designhinweise
Place a 100nF ceramic decoupling capacitor as close as possible to each VDD/AVDD pin, with a 10uF bulk capacitor near the IC supply pin. The PIC16F18856-E/SP supports an extremely wide 1.8V to 5.5V supply; for noisy environments add a ferrite bead and 10uF + 100nF decoupling on AVDD separately to keep ADC readings clean. Use the internal 32MHz HFINTOSC and disable the FVR when unused to minimize quiescent current.
Keep ICSP/PGD (pin 19) and ICSP/PGC (pin 18) traces short and away from high-frequency switching nodes to avoid programming issues. MCLR/VPP (pin 1) requires a 10kohm pull-up to VDD and a 100nF cap to ground for in-circuit programming. Route the 32kHz secondary oscillator pins away from high-current traces if you use the timer1 external crystal.
The integrated 12-bit ADC with computation (ADC2) can resolve 1 LSB down to ~200uV at 5V VREF. For accurate readings, enable the FVR as ADC reference, average 16+ samples, and add an RC anti-aliasing filter on analog inputs (typically 1kohm + 100nF). The CIPs like CLC and NCO can run independently of the CPU, allowing deterministic signal generation without CPU jitter.
Do not leave unused I/O pins floating - configure them as outputs low or inputs with internal weak pull-ups to avoid spurious interrupts. Verify the configuration-word BOR/OST/PWRTE settings match the application's brownout and startup requirements. When migrating from PIC16F18855 (14KB Flash), verify the linker script accounts for the larger 28KB Flash region on PIC16F18856, or the build will overflow silently.
Estimated: at 32MHz CPU clock and 5V VDD, the PIC16F18856-E/SP typical active current is ~5mA and core power dissipation is ~25mW. The 28-SPDIP package thermal resistance (theta_JA) is approximately 60 C/W, so junction temperature rise above ambient is ~1.5 C - well within the -40C to +125C extended grade. No heatsink is required.
Compliance-Informationen
RoHS and lead-free confirmed by Microchip product page. Not AEC-Q100 qualified; the E suffix denotes extended industrial temperature grade only. Functional Safety features support IEC 61508 SIL-2 capable designs but require additional system-level qualification.
