PIC16F18877-I/P - 8-bit 32MHz 56KB Flash XLP MCU | Microchip
Teilenummer: PIC16F18877-I/P ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.51 | $3,51 |
| 10 | $3.16 | $31,60 |
| 100 | $2.81 | $281,00 |
| 500 | $2.52 | $1.260,00 |
| 1.000 | $2.25 | $2.250,00 |
PIC16F18877-I/P Übersicht
A PIC microcontroller is a Harvard-architecture 8-bit RISC microprocessor with on-chip Flash, RAM, EEPROM, and integrated peripherals, widely used in embedded control. Within the Microchip taxonomy, the PIC16F18877 sits as PIC → PIC16 → PIC16F1xxx → enhanced mid-range core with CIP block, positioned above baseline PIC10/12/14 devices and below 16-bit dsPIC and 32-bit SAM microcontrollers. The eXtreme Low Power (XLP) technology targets battery-powered applications where nanoWatt sleep currents extend operating life.
Key features of this MCU include 32 MHz internal oscillator operation, a 14-channel 10-bit ADC, multiple UART/I²C/SPI interfaces, Configurable Logic Cells (CLC), Complementary Waveform Generator (CWG), Numerically Controlled Oscillator (NCO), and built-in CRC/SCAN with Hardware Limit Timer (HLT) for functional-safety compliance. The 40-pin PDIP gives designers generous I/O for human-machine interface panels and sensor-front-end designs. A peripheral pin-select block remaps digital peripherals to a wide choice of I/O pins.
Architecturally, the device uses an enhanced mid-range 8-bit core with a 14-bit instruction word, giving 32K × 14 Flash organization, plus a hardware multiplier, multiple interrupt sources, and zero-crossing detect, making it suitable for mixed-signal IoT endpoints. The FuSa documentation package helps designers targeting IEC 61508 SIL-aware systems. Wide operating voltage (typically 1.8 V–5.5 V) further broadens the application envelope.
Typical applications include IoT sensor nodes, wearable health devices, low-power remote controls, HVAC controllers, industrial sensor conditioning, and consumer white goods. The combination of CIP offloads and XLP sleep modes lets sensor-fusion and power-management tasks run autonomously without waking the CPU. The Functional Safety collateral is particularly valuable for white-goods and appliance-control designs moving toward IEC 60335-1 / IEC 60730-1 compliance.
When designing with this part, place a 0.1 µF decoupling capacitor adjacent to each VDD pin and ensure the MCLR pin is pulled high through a 10 kΩ resistor for normal operation. Configure unused I/O pins as outputs (with the input path disabled) to minimize sleep current, and verify the low-power mode entry sequence to keep nanoWatt XLP sleep achievable.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, enabling faster component selection and BOM consolidation.
Drop-in-Alternativen für PIC16F18877-I/P – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC16F18877-I/P (gleiche Bauform und Footprint) – abweichend in ADC, Package, Core Architecture, Timers, Program Memory (Flash).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC16F18877-E/PT
✅ Drop-In✓ Auf Lager
$1.08 / Stück
Datenblatt ansehen →PIC16F18876-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1.48 / Stück
Datenblatt ansehen →PIC16F18857-I/P
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PIC16F18875-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1.22 / Stück
Datenblatt ansehen →PIC18F46K22-I/P
✅ Drop-In✓ Auf Lager
$2.61 / Stück
Datenblatt ansehen →ATMEGA328P-AUR
✅ Drop-In✓ Auf Lager
$2.18 / Stück
Datenblatt ansehen →PIC16F18877-I/P Grenzwerte & elektrische Eigenschaften
| Core Architecture | 8-bit PIC enhanced mid-range |
| CPU Speed | 32 MHz |
| Program Memory (Flash) | 56 KB (32K x 14 words) |
| Data SRAM | 4 KB |
| Data EEPROM | 256 B |
| Gehäuse | 40-pin PDIP (through-hole) |
| Operating Temperature Grade | Industrial, -40 °C to +85 °C |
| Pin-Anzahl | 40 |
| ADC | 10-bit, 14 channels |
| Communication Interfaces | UART, I²C, SPI |
| Core Independent Peripherals (CIPs) | CLC, CWG, NCO, CRC/SCAN, HLT, PWM |
| Low-Power Technology | XLP (eXtreme Low Power) |
| Functional Safety | FuSa documentation package (IEC 61508/IEC 60730-1 collateral) |
| Operating Voltage Range | 1.8 V to 5.5 V (typical) |
| Montageart | Through-hole (THT) |
| RoHS-Status | Compliant |
| Lead Free | Yes |
| MSL-Level | Not applicable (through-hole) |
PIC16F18877-I/P Pin-Konfiguration
| Pin 1 | RE3/MCLR/VPP — Digital input; MCLR reset (active-low) / programming voltage |
| Pin 2 | RA0/AN0 — Bidirectional I/O; analog channel 0 |
| Pin 3 | RA1/AN1 — Bidirectional I/O; analog channel 1 |
| Pin 4 | RA2/AN2 — Bidirectional I/O; analog channel 2 |
| Pin 5 | RA3/AN3/VREF+ — Bidirectional I/O; analog channel 3 / ADC VREF+ |
| Pin 6 | RA4/AN4/T0CKI — Bidirectional I/O; analog channel 4; Timer0 clock |
| Pin 7 | RA5/AN5/SS — Bidirectional I/O; analog channel 5; SPI SS |
| Pin 8 | RE0/AN6 — Bidirectional I/O; analog channel 6 |
| Pin 9 | RE1/AN7 — Bidirectional I/O; analog channel 7 |
| Pin 10 | RE2/AN8 — Bidirectional I/O; analog channel 8 |
| Pin 11 | VDD — Positive supply |
| Pin 12 | VSS — Ground |
| Pin 13 | RA7/OSC1/CLKI — Bidirectional I/O; crystal oscillator input |
| Pin 14 | RA6/OSC2/CLKO — Bidirectional I/O; crystal oscillator output |
| Pin 15 | RC0/SOSCO — Bidirectional I/O; secondary oscillator output |
| Pin 16 | RC1/SOSCI — Bidirectional I/O; secondary oscillator input |
| Pin 17 | RC2/AN11 — Bidirectional I/O; analog channel 11 |
| Pin 18 | RC3/AN12 — Bidirectional I/O; analog channel 12 |
| Pin 19 | RC4/AN10 — Bidirectional I/O; analog channel 10 |
| Pin 20 | RC5/AN13 — Bidirectional I/O; analog channel 13 |
| Pin 21 | RC6 — Bidirectional I/O; USART TX / CCP |
| Pin 22 | RC7 — Bidirectional I/O; USART RX / CCP |
| Pin 23 | RB0/AN12 — Bidirectional I/O; analog channel; interrupt-on-change |
| Pin 24 | RB1/AN10 — Bidirectional I/O; analog channel; interrupt-on-change |
| Pin 25 | RB2/AN8 — Bidirectional I/O; analog channel; interrupt-on-change |
| Pin 26 | RB3/AN9 — Bidirectional I/O; analog channel; interrupt-on-change |
| Pin 27 | RB4/AN11 — Bidirectional I/O; analog channel; interrupt-on-change |
| Pin 28 | RB5/AN13 — Bidirectional I/O; analog channel; interrupt-on-change |
| Pin 29 | RB6/ICSCLK — Bidirectional I/O; ICD clock; interrupt-on-change |
| Pin 30 | RB7/ICSDAT — Bidirectional I/O; ICD data; interrupt-on-change |
| Pin 31 | RD0 — Bidirectional I/O |
| Pin 32 | RD1 — Bidirectional I/O |
| Pin 33 | RD2 — Bidirectional I/O |
| Pin 34 | RD3 — Bidirectional I/O |
| Pin 35 | RD4 — Bidirectional I/O |
| Pin 36 | RD5 — Bidirectional I/O |
| Pin 37 | RD6 — Bidirectional I/O |
| Pin 38 | RD7 — Bidirectional I/O |
| Pin 39 | VSS — Ground |
| Pin 40 | VDD — Positive supply |
Typische Anwendungen
PIC16F18877-I/P ist geeignet für 7 Anwendungs: IoT Sensor Node Controller, Wearable Health Monitor, HVAC Climate Controller, White-Goods Appliance Control, Industrial Sensor Conditioning Hub, Low-Power Remote Control / HMI, Consumer White-Goods Connectivity Module.
IoT Sensor Node Controller
The PIC16F18877-I/P serves as a low-power IoT sensor-node controller, leveraging its XLP nanoWatt sleep modes (down to sub-µA standby) and the 14-channel 10-bit ADC to sample temperature, humidity, and battery-voltage telemetry without waking the CPU heavily. The 56 KB Flash accommodates a LoRaWAN or Bluetooth Low Energy stack plus sensor-fusion logic, while the 4 KB SRAM buffers measurement bursts before uplink. CIPs like the CLC and NCO offload timing-critical tasks, and the FuSa collateral eases IEC 60730-1 appliance certification. Compared with the older PIC16F887, this part drops standby current roughly an order of magnitude and adds hardware CRC for packet integrity.
Empfohlen
Wearable Health Monitor
In wearable health monitors the PIC16F18877-I/P drives a low-power heart-rate or pulse-oximetry front end: the 14-bit instruction word executes sensor-fusion firmware efficiently, while the integrated 10-bit ADC handles biosignal conditioning and the CWG produces PWM for LED driver control. XLP idle and sleep modes extend coin-cell runtime to weeks, and the Functional Safety documentation supports medical-device risk-management files. The 40-pin PDIP simplifies hand-reworkable prototypes and small-batch clinical pilots. Recommendation: pair with the MCP1700 LDO for ultra-low-quiescent supply and the MCP73831 Li-ion charger.
Empfohlen
HVAC Climate Controller
The PIC16F18877-I/P fits HVAC climate-control boards well: 32 MHz CPU closes PID loops for blower, compressor, and valve actuation while the CWG outputs complementary PWM for triac-friendly motor drive. The 56 KB Flash holds scheduling, logging, and Modbus RTU firmware, and the HLT/CRC/SCAN CIPs satisfy IEC 60730-1 Class B software safety requirements without external watchdog components. The 40-pin PDIP package survives factory rework on legacy HVAC panels. Compared with discrete MCU+watchdog designs, the integrated CIPs shrink BOM by 4–6 parts and accelerate functional-safety certification.
Empfohlen
White-Goods Appliance Control
The PIC16F18877-I/P is purpose-built for white-goods appliance control, including washing machines, dishwashers, and induction cooktops. The integrated CRC/SCAN, Hardware Limit Timer, and Windowed Watchdog Timer give designers a software-readable class-B safety perimeter required by IEC 60335-1 / IEC 60730-1, while the eXtreme Low Power modes handle standby power regulations such as EU 2019/1782 (≤0.5 W). The 56 KB Flash accommodates motor-control, user-interface, and connectivity firmware simultaneously. The 40-PDIP footprint simplifies the through-hole motor-control PCB layouts common in mid-volume appliance manufacturing.
Empfohlen
Industrial Sensor Conditioning Hub
For industrial 4-20 mA / 0-10 V sensor-conditioning hubs the PIC16F18877-I/P provides 14 analog inputs with 10-bit resolution and a USART for RS-485 Modbus RTU output, eliminating external ADCs in cost-sensitive designs. The CLCs implement programmable digital filters on sensor pulses without CPU load, and the NCO generates precision excitation waveforms for ratiometric bridges. Operating voltage down to 1.8 V supports battery or energy-harvest supplies, and the 40-pin PDIP eases field installation and field-replacement. Compared with discrete op-amp+ADC designs, integration reduces BOM and PCB area by roughly 30 %.
Empfohlen
Low-Power Remote Control / HMI
The PIC16F18877-I/P is well-suited to low-power remote controls and small human-machine interface panels. The peripheral pin-select block routes UART, SPI, and I²C to whichever pins the UI board requires, accelerating layout reuse across product variants. The CWG drives piezo buzzers or LED backlights while the CPU sleeps, and the integrated 10-bit ADC reads potentiometers and battery-voltage sense. FuSa-aware watchdog and CRC are useful for safety-relevant HMI panels (e.g., appliance keypads). Compared with previous-generation PIC16F887, code density and CIP flexibility reduce firmware size by 25–30 %.
Empfohlen
Consumer White-Goods Connectivity Module
Adding Wi-Fi/Bluetooth connectivity to legacy appliances is straightforward with the PIC16F18877-I/P as the host controller: it runs an AT-command parser for the wireless module while executing appliance-control loops, all in 56 KB Flash. The CRC/SCAN peripheral accelerates over-the-air (OTA) image integrity checks, and the HLT supervises communication timeouts. XLP sleep draws microamps, enabling always-on connected standby. Compared with using a Cortex-M0+ for the same task, the PIC16F18877 reduces BOM cost while still meeting IEC 60730-1 software-class-B requirements thanks to the FuSa documentation.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC16F18877-I/P – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC16F18877-E/P | PIC16F18876-I/P | PIC16F18857-I/P | PIC18F46K22-I/P |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 40-pin PDIP | 40-pin PDIP - same | 40-pin PDIP - same | 40-pin PDIP - same | 40-pin PDIP - same |
| Core / CPU Speed | 8-bit PIC / 32 MHz | 8-bit PIC / 32 MHz | 8-bit PIC / 32 MHz | 8-bit PIC / 32 MHz | 8-bit PIC18F / 64 MHz |
| Program Flash | 56 KB | 56 KB | 28 KB | 56 KB | 64 KB |
| SRAM | 4 KB | 4 KB | 4 KB | 3.5 KB | 3.86 KB |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 1 KB |
| Temperature Grade (this suffix) | -40 °C to +85 °C (I) | -40 °C to +125 °C (E) | -40 °C to +85 °C (I) | -40 °C to +85 °C (I) | -40 °C to +85 °C (I) |
| Functional Safety / CIPs | FuSa + CIP (CLC, CWG, NCO, CRC/SCAN, HLT) | FuSa + CIP | FuSa + CIP | CIP (no FuSa) | No FuSa |
| Approx. Unit Price (1 pc) | ≈ $3.51 | ≈ $3.85 | ≈ $3.10 | ≈ $3.20 | ≈ $4.20 |
Wichtigste Unterscheidungsmerkmale
- Integrated Functional Safety (FuSa) collateral at no extra BOM cost (vs. PIC18F46K22-I/P)
- Highest Flash density within the 40-PDIP PIC16F1xxx family (vs. PIC16F18876-I/P)
- 8-bit simplicity with CIP offloading rivaling 32-bit devices (vs. ATMEGA328P-AUR)
Designhinweise
Estimated: at 32 MHz operation from VDD = 5 V, the PIC16F18877 draws roughly 6 mA active; pin-conflict-free LF 32 kHz + XLP sleep can drop standby into the low-µA range. Place a 0.1 µF ceramic bypass capacitor within 5 mm of each VDD/VSS pair (40-PDIP exposes VDD on pins 11 and 40, VSS on pins 12 and 39). Add a bulk 1 µF cap near the MCU if the board uses switching regulators.
Keep the MCLR pin pulled to VDD through a 10 kΩ resistor with a 100 nF cap to ground for noise immunity; failing to debounce MCLR can trigger spurious resets in motor-drive environments. Maintain at least a 0.25-inch clearance between analog traces (RA0–RA5, RE0–RE2, RC2–RC5, RB0–RB5) and switching signals to preserve 10-bit ADC accuracy. Route the 32 kHz crystal traces short and guarded by a ground ring.
Configure unused I/O pins as outputs with the input path disabled (via WPU disabled and ANSEL = 1 → analog disabled) to minimize XLP sleep current; floating inputs can leak several µA each. Do not omit the ICSP™ ICD connector even in production: firmware updates and Functional Safety configuration bits are typically loaded through ICSP. Verify all PPS (peripheral pin select) lock registers are unlocked before code that reprograms I/O functions runs, or peripheral output will halt on reset.
Place the ICSP connector at the board edge and assign RB6/RB7 exclusively to ICSP to keep programming reliable; do not multiplex RB6/RB7 with loads that exceed 5 mA. Keep QSPI/USB lines away from RC6/RC7 if used as USART to avoid crosstalk during bootloader traffic. Use a 2-layer board with a contiguous ground plane below the 40-PDIP for EMI robustness in white-goods.
Compliance-Informationen
RoHS and lead-free confirmed by Microchip product page packaging data. AEC-Q100 not applicable (consumer/industrial MCU, not automotive). Functional Safety certification is per IEC 60730-1 (Class B) via the FuSa documentation package, not AEC-Q100.
