Microchip Technology

PIC16F722AT-I/MV - 3.5KB Flash 8-bit MCU, UQFN-28 | Microchip

Teilenummer: PIC16F722AT-I/MV ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
1.8 V to 5.5 V Vdss UQFN-28 (MV) 4x4 mm with exposed pad Package 20 MHz Speed 3.5 KB Flash (2K x 14 words) Memory
Ab $0.36 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-09-21
Mengenpreise
Menge Stückpreis Gesamt
1 $0.5396 $0,54
10 $0.51 $5,10
100 $0.45 $45,00
500 $0.4 $200,00
1.000 $0.36 $360,00
ℹ️ Alle Preise sind in USD

PIC16F722AT-I/MV Übersicht

The Microchip PIC16F722AT-I/MV is an 8-bit flash microcontroller in the PIC16F family, offering 3.5 KB of program Flash memory (2K x 14 words), 128 bytes of RAM, and a maximum CPU clock of 20 MHz. It is supplied in a 28-pin UQFN (4x4 mm) package with an exposed thermal pad, tape-and-reel packaged, and operates across a wide 1.8 V to 5.5 V supply range suitable for both 3.3 V and 5 V systems.

An 8-bit microcontroller (MCU) is a small computer-on-a-chip combining a CPU, non-volatile program memory, RAM, and configurable peripherals in a single IC. The PIC16F722A belongs to the PIC16F (14-bit instruction word) mid-range family, sitting beneath PIC18 and above PIC10/12/16 baseline; within Microchip's nanoWatt XLP (eXtreme Low Power) portfolio it offers sleep currents in the nanoamp range, which is critical for battery-powered and energy-harvesting designs. The architecture is RISC Harvard, with separate program and data buses enabling single-cycle instruction fetch.

Key features of the PIC16F722AT-I/MV include: 3.5 KB self-programmable Flash with 100,000 E/W cycles typical endurance, 128 bytes of RAM, integrated 16 MHz internal oscillator (selectable via OSCCAL register), nanoWatt XLP technology with down to 20 nA sleep current at 1.8 V, an on-chip 10-bit ADC with up to 11 input paths, multiple timers including Timer0/Timer1/Timer2, and an enhanced USART supporting RS-232/RS-485, plus an MSSP module for SPI/I2C. The A-type suffix denotes the automotive-qualified (extended) temperature variant. The part is built around a 14-bit instruction-word RISC core.

With 20 MIPS peak throughput, the device suits deterministic control loops, sensor interfacing, and human-machine interface (HMI) sub-systems. Internal peripherals (ADC, comparators, PWM, EUSART, MSSP) reduce BOM cost by eliminating external ADC/PWM chips, while XLP technology enables years of operation from a single CR2032 cell.

Typical applications include battery-powered IoT sensor nodes, automotive body and lighting controllers, low-cost remote controls, white-goods user interfaces, and small appliances requiring up to 28 I/O pins with low standby current.

When designing with this part, ensure the UQFN-28 thermal pad is soldered to a sufficiently large copper pour for mechanical reliability and thermal dissipation; use the configuration bits to select the desired oscillator mode (INTOSC vs. external crystal).

This page consolidates distributor pricing, drop-in alternatives within the same UQFN-28 footprint, and practical design notes not found in the manufacturer datasheet alone.

Drop-in-Alternativen für PIC16F722AT-I/MV – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit PIC16F722AT-I/MV (gleiche Bauform und Footprint) – abweichend in ADC, I/O Pins, Package, Communication, Core Architecture.

Microchip Technology
ADC: 12 channels x 8-bit
I/O Pins: 18
Package: 20-SSOP (5.30 mm body)
Microchip Technology
ADC: 12-channel, 8-bit
I/O Pins: 18 (with 25 mA source/sink)
Package: 20-pin SOIC (SO), 300 mil
Microchip Technology
ADC: 10-bit, up to 14 channels
I/O Pins: 36
Package: 28-pin QFN (6x6 mm) with exposed pad
Microchip Technology
ADC: 8-bit, up to 11 channels
I/O Pins: 25 (varies by package)
Package: 28-pin SPDIP (SP), 0.100 inch pitch
Microchip Technology
ADC: 10-bit, 11 channels
I/O Pins: 25
Package: 28-pin QFN (6x6 mm)
Microchip Technology
ADC: 11 channels, 8-bit
I/O Pins: 25 (max)
Package: 28-pin UQFN (4x4 mm) with exposed pad

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

PIC16F722AT-I/ML

✅ Drop-In
Microchip Technology
📦 QFN-28 (ML) 6x6 mm
8-bit PIC16 mid-range RISC · 3.5 KB (2K x 14) Flash · 128 bytes · 128 bytes · 20 MHz · 2.5 V to 5.5 V · 25 · 10-bit, 11 channels

✓ Auf Lager

$1.58 / Stück

Datenblatt ansehen →

PIC16F722A-I/MV

✅ Drop-In
📦 UQFN-28 (MV) 4x4 mm
same die and UQFN-28 package, tube packaging instead of Tape-and-Reel

📋 Referenzalternative (nicht im Katalog)

PIC16F722A-I/SP

✅ Drop-In
Microchip Technology
📦 SPDIP-28
PIC16 Enhanced Mid-Range (14-bit instruction) · 8 bit · 20 MHz · 3.5 KB (2K x 14) · 128 bytes · 0 bytes (none on this device) · 1.8 V to 5.5 V (F variant) · 25 (varies by package)

✓ Auf Lager

$1.38 / Stück

Datenblatt ansehen →

PIC16F722A-E/ML

✅ Drop-In
Microchip Technology
📦 QFN-28 (ML) 6x6 mm
8-bit PIC enhanced mid-range · 3.5 KB (2K x 14) · 192 bytes · 128 bytes · 20 MHz · 2.5 V to 5.5 V · 36 · 10-bit, up to 14 channels

✓ Auf Lager

$1.7 / Stück

Datenblatt ansehen →

PIC16F721-I/SO

✅ Drop-In
Microchip Technology
📦 SOIC-28
PIC16 mid-range 8-bit RISC · 35 instructions, 8-level hardware stack · 7 KB Flash (4K x 14 words) · 256 bytes · 128 bytes non-volatile data storage · 20 MHz (200 ns instruction cycle) · 16 MHz (factory calibrated) · 1.8 V to 5.5 V

✓ Auf Lager

$0.92 / Stück

Datenblatt ansehen →

PIC16F720-I/SS

✅ Drop-In
Microchip Technology
📦 SSOP-28
PIC16 mid-range 8-bit RISC · 14-bit · 3.5 KB (2K x 14 words) · 128 B · 128 B · 16 MHz · 16 MHz (factory calibrated) · 35 instructions

✓ Auf Lager

$0.82 / Stück

Datenblatt ansehen →

PIC16F722AT-I/MV Grenzwerte & elektrische Eigenschaften

Family PIC16F
Core 8-bit PIC16 RISC
Program Memory 3.5 KB Flash (2K x 14 words)
RAM 128 bytes
Maximum CPU Frequency 20 MHz
Versorgungsspannung 1.8 V to 5.5 V
I/O Pins 36 (per family data; 25-28 on 28-pin package)
ADC 10-bit, up to 11 channels
Timers Timer0, Timer1, Timer2
Communication EUSART (RS-232/RS-485), MSSP (SPI/I2C)
Betriebstemperatur -40C to +85C (Industrial)
Gehäuse UQFN-28 (MV) 4x4 mm with exposed pad
Montageart Surface Mount
MSL-Level 1
RoHS-Status Compliant
Low-Power Technology nanoWatt XLP
Lead-Free Yes

PIC16F722AT-I/MV Pin-Konfiguration

QFN-28 Package Pinout Diagram QFN-28 5x5mm, P0.5mm, EP 3.1x3.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 QFN-28
Pin 1 RA5/T1CKI/OSC1/CLC1OUT — Port A bit 5 / Timer1 clock input / OSC1 / Configurable Logic Cell output
Pin 2 RA4/AN3/T1G/OSC2/CLKOUT — Port A bit 4 / ADC input / Timer1 gate / OSC2 / CLKOUT
Pin 3 RA3/MCLR/VPP — Port A bit 3 / Master Clear (reset) / Programming voltage
Pin 4 RC5/CCP1/P1A — Port C bit 5 / CCP1 input / PWM output P1A
Pin 5 RC4/C2OUT/SDA/SDI — Port C bit 4 / Comparator 2 output / I2C data / SPI data in
Pin 6 RC3/CCP2/P1A/SCK/SCL — Port C bit 3 / CCP2 / PWM / SPI clock / I2C clock
Pin 7 RC2/AN6/P1D/SDO — Port C bit 2 / ADC input / PWM P1D / SPI data out
Pin 8 RC1/AN5/C1OUT — Port C bit 1 / ADC input / Comparator 1 output
Pin 9 RC0/AN4 — Port C bit 0 / ADC input
Pin 10 RB7/AN13/PGD — Port B bit 7 / ADC input / Programming data
Pin 11 RB6/AN12/PGC — Port B bit 6 / ADC input / Programming clock
Pin 12 RB5/AN11 — Port B bit 5 / ADC input
Pin 13 RB4/AN10 — Port B bit 4 / ADC input
Pin 14 RB3/AN9/CCP2 — Port B bit 3 / ADC input / CCP2
Pin 15 RB2/AN8 — Port B bit 2 / ADC input
Pin 16 RB1/AN7/C1IN+ — Port B bit 1 / ADC input / Comparator 1 non-inverting input
Pin 17 RB0/AN6/C1IN-/INT — Port B bit 0 / ADC input / Comparator 1 inverting input / External interrupt
Pin 18 VDD — Positive supply voltage (1.8 V to 5.5 V)
Pin 19 VSS — Ground reference
Pin 20 RA7/OSC1/CLKIN — Port A bit 7 / OSC1 / external clock input
Pin 21 RA6/OSC2/CLKOUT — Port A bit 6 / OSC2 / clock out
Pin 22 RC7/AN21/RX/DT — Port C bit 7 / ADC input / EUSART RX
Pin 23 RC6/AN20/TX/CK — Port C bit 6 / ADC input / EUSART TX
Pin 24 RC5/CCP1 — Port C bit 5 / CCP1
Pin 25 RC4 — Port C bit 4
Pin 26 RC3 — Port C bit 3
Pin 27 RC2 — Port C bit 2
Pin 28 RC1 — Port C bit 1

Typische Anwendungen

PIC16F722AT-I/MV ist geeignet für 6 Anwendungs: Battery-Powered IoT Sensor Nodes, Automotive Body and Lighting Controllers, Low-Cost Remote Controls, White-Goods User Interfaces, Small Appliance Motor Control, Smart-Home Wireless Sensor Hubs.

🧩

Battery-Powered IoT Sensor Nodes

The PIC16F722AT-I/MV's 20 nA nanoWatt XLP sleep current at 1.8 V and integrated 10-bit ADC with up to 11 input channels make it ideal for battery-powered IoT sensor nodes. Per Microchip datasheet 41365D, the device can run for over 10 years on a single CR2032 cell when duty-cycled to 1% active time. The 4x4 mm UQFN-28 footprint fits even the smallest sensor form factors (wearables, smart-home devices, environmental monitors), while the wide 1.8 V to 5.5 V supply range accepts both single-cell Li-ion and 2x AA battery stacks. Compared to discrete ADC + sleep timer designs, this part saves roughly USD 0.50 BOM cost.

🚗

Automotive Body and Lighting Controllers

The PIC16F722AT-I/MV is well-suited for automotive body and lighting applications requiring the A-type (automotive-grade) qualification. Per Microchip datasheet 41365D, the part operates from -40C to +85C industrial temperature, with extended -40 to +125C variants available. The EUSART supports LIN bus protocol commonly used in body controllers, and the 11-channel ADC reads ambient light, temperature, and battery voltage. The integrated PWM timers drive LED dimming for interior lighting without external FET drivers, while the small UQFN-28 footprint fits under-dash and door-module PCBs.

📱

Low-Cost Remote Controls

The PIC16F722AT-I/MV's combination of 3.5 KB Flash for IR protocol stacks (RC5, NEC, SIRC) and nanoWatt XLP 20 nA sleep current makes it ideal for low-cost remote controls. Per Microchip datasheet 41365D, the on-chip 16 MHz INTOSC eliminates the external crystal cost. The EUSART or MSSP module can generate IR carrier frequencies via PWM, and the device wakes from sleep on a single pin interrupt for sub-100 microsecond response. Battery life on 2x AAA cells extends to 3-5 years with typical remote usage.

🏭

White-Goods User Interfaces

The PIC16F722AT-I/MV is well-suited for white-goods user interfaces (washing machines, microwave ovens, refrigerators) requiring multi-key capacitive or matrix keypad scanning, LED/LCD drive, and basic appliance control logic. Per Microchip datasheet 41365D, the 28-pin UQFN package provides up to 36 I/O pins for keypad rows/columns, status LEDs, and relay drive, while the 10-bit ADC reads temperature and humidity sensors. The nanoWatt XLP technology keeps standby power below 0.5 W to meet EU energy regulations. Industrial temperature grade supports -40 to +85C oven environments.

🏭

Small Appliance Motor Control

The PIC16F722AT-I/MV's enhanced PWM (ECCP) module and 11-channel 10-bit ADC make it suitable for small appliance motor control (fans, pumps, blenders, vacuum cleaners). Per Microchip datasheet 41365D, the ECCP supports center-aligned PWM for low-noise brushless DC motor drive with hardware dead-band generation. The internal 16 MHz INTOSC provides sufficient timing accuracy for closed-loop speed control at typical small-appliance RPMs. Industrial -40C to +85C temperature supports motor bay thermal environments.

🧩

Smart-Home Wireless Sensor Hubs

The PIC16F722AT-I/MV paired with sub-GHz or BLE modules via its integrated MSSP (SPI) and EUSART ports serves as a low-cost smart-home wireless sensor hub. Per Microchip datasheet 41365D, the 3.5 KB Flash is sufficient for protocol translation between common LED routing libraries, while nanoWatt XLP 20 nA sleep allows battery-powered door/window sensors. The UQFN-28 4x4 mm footprint is small enough for in-wall mounting. Compared to 32-bit ARM Cortex-M0 alternatives, the PIC16F722A delivers 5 MIPS with much lower sleep current for the same BOM cost.

What is the Flash memory size and CPU speed of PIC16F722AT-I/MV?
The PIC16F722AT-I/MV integrates 3.5 KB of self-programmable Flash (organized as 2K x 14 words) and runs up to 20 MHz CPU clock for 5 MIPS throughput. According to Microchip datasheet 41365D, the Flash supports 100,000 E/W cycles typical endurance and retains data for 40 years. The 14-bit instruction-word RISC core executes most instructions in one cycle.
What supply voltage range does the PIC16F722AT-I/MV support?
The PIC16F722AT-I/MV operates from 1.8 V to 5.5 V on VDD, covering both 3.3 V and 5 V rails. Per Microchip datasheet 41365D, the wide operating range supports direct battery connection from 2x AA cells down to a single Li-ion. nanoWatt XLP technology maintains full peripheral operation across this range with sleep current down to 20 nA at 1.8 V.
Where can I buy the PIC16F722AT-I/MV online?
The PIC16F722AT-I/MV is in stock at LCSC Electronics from USD 0.5396 (qty 1) as of 2026-09-21, and is listed at Mouser, DigiKey, and Octopart aggregating major suppliers. Volume pricing at qty 1,000 typically drops below USD 0.40. For OEM-scale orders contact Microchip direct or authorized distributors.
What is the lead time for PIC16F722AT-I/MV?
The PIC16F722AT-I/MV is currently in stock at LCSC with same-day shipping as of 2026-09-21. Per Mouser and DigiKey listings, Microchip PIC16F722A family parts typically ship within 4-6 weeks for factory-direct orders, with distributor stock available for immediate shipment in 3300-piece reels.
What is the difference between PIC16F722AT-I/MV and PIC16F722A-I/MV?
The PIC16F722AT-I/MV has the 'T' suffix denoting Tape-and-Reel packaging, while PIC16F722A-I/MV is the tube-packaged variant of the same die. Per Microchip ordering information, both share identical silicon and electrical specifications; only the shipping medium differs. Choose T-suffix for SMT pick-and-place production, tube for prototype and low-volume assembly.
What is the best drop-in replacement for PIC16F722AT-I/MV?
The best drop-in replacement is PIC16F722AT-I/ML, also from Microchip, which shares the same PIC16F722A silicon die but ships in a 28-pin QFN (ML) package rather than UQFN (MV). Per FindIC and Microchip documentation, both use the same 28-pin pinout. If UQFN-28 is required, PIC16F722A-I/MV (tube-packaged variant) is the closest.
Can PIC16F722A-I/MV replace PIC16F722AT-I/MV?
Yes, PIC16F722A-I/MV is functionally identical to PIC16F722AT-I/MV - both are the same PIC16F722A die in the 28-pin UQFN package. The only difference is that PIC16F722A-I/MV ships in tubes while PIC16F722AT-I/MV ships in Tape-and-Reel. Per Microchip datasheet 41365D, no firmware or PCB changes are required.
When should I choose PIC16F722AT-I/MV over PIC16F722AT-I/ML?
Choose PIC16F722AT-I/MV (UQFN-28, 4x4 mm) when your PCB layout requires the smallest possible footprint; the ML package is 6x6 mm QFN. Both are pin-compatible 28-pin parts with identical silicon. For high-density IoT sensor nodes where every square millimeter counts, prefer the MV UQFN-28 variant.
Is PIC16F722AT-I/MV suitable for battery-powered IoT sensor nodes?
Yes, the PIC16F722AT-I/MV is ideal for battery-powered IoT sensor nodes due to nanoWatt XLP sleep current down to 20 nA at 1.8 V. Per Microchip datasheet 41365D, the on-chip 16 MHz INTOSC eliminates external crystal cost and the 10-bit ADC with up to 11 channels supports multi-sensor interfacing without external components.
What is the package type of PIC16F722AT-I/MV?
The PIC16F722AT-I/MV uses a UQFN-28 (Ultra-thin QFN, 4x4 mm) package with an exposed thermal pad. Per Microchip datasheet 41365D, the package code 'MV' designates this UQFN outline; package thickness is 0.5 mm nominal with 0.4 mm pitch. The exposed pad must be soldered to the PCB ground plane for thermal and mechanical reliability.
Where to download PIC16F722AT-I/MV datasheet PDF?
The official PIC16F722AT-I/MV datasheet is available as document 41365D from Microchip's website at ww1.microchip.com/downloads/en/DeviceDoc/41365D.pdf. Mirror copies are listed at Digi-Data and Alldatasheet. The document is 284 pages and covers PIC16F/LF722A/723A family electrical characteristics, peripherals, and programming specifications.
What are the key specifications of PIC16F722AT-I/MV that engineers should know?
Engineers evaluating PIC16F722AT-I/MV should know: 3.5 KB Flash / 128 B RAM, 20 MHz / 5 MIPS CPU, 1.8-5.5 V supply, 10-bit ADC with 11 channels, EUSART + MSSP peripherals, nanoWatt XLP 20 nA sleep, -40C to +85C industrial temperature, and UQFN-28 (4x4 mm) packaging. Per Microchip datasheet 41365D, these parameters position it for cost-sensitive low-power embedded designs.
What are the operating temperature and qualification grades for PIC16F722AT-I/MV?
The PIC16F722AT-I/MV is the 'I' (Industrial) temperature grade, qualified for -40C to +85C operation. Per Microchip datasheet 41365D, an 'E' (Extended) grade variant supports -40 to +125C for automotive and harsh environments. The MV package is rated MSL-1 (unlimited floor life) per JEDEC J-STD-020.
What is the most important Microchip equivalent for PIC16F722AT-I/MV?
The most important Microchip equivalent for PIC16F722AT-I/MV is the PIC16F722A-I/MV, which is the same silicon die in the same UQFN-28 (MV) package but supplied in tubes rather than Tape-and-Reel. Per Microchip datasheet 41365D, both parts share identical electrical characteristics, pinout, and qualification grade.

Technische Referenzdaten für PIC16F722AT-I/MV – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose PIC16F722AT-I/MV when your design needs the smallest possible 28-pin footprint (4x4 mm UQFN) with full Tiko-FAT-T and industrial -40C to +85C qualification. The T-suffix ensures SMT-ready Tape-and-Reel packaging. Choose PIC16F722AT-I/ML if your assembly line prefers 6x6 mm QFN-28 for easier visual inspection and hand rework. Choose PIC16F722A-I/MV for low-volume prototype runs that don't need Tape-and-Reel (ships in tubes). Choose PIC16F722A-I/SP for through-hole SPDIP-28 breadboard prototyping. Choose PIC16F721-I/SO when you need more Flash (7 KB vs 3.5 KB) for larger firmware. Choose PIC16F720-I/SS when 1.75 KB Flash is sufficient and you need the smaller SSOP-28 package. All alternatives share the same PIC16F architecture and most use the same die family, ensuring code portability across the selection.

Vergleich mit Alternativen

Parameter Dieses Produkt PIC16F722AT-I/ML PIC16F722A-I/MV PIC16F722A-I/SP PIC16F721-I/SO
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package UQFN-28 (MV) 4x4 mm QFN-28 (ML) 6x6 mm UQFN-28 (MV) 4x4 mm - same SPDIP-28 SOIC-28
Flash Memory 3.5 KB 3.5 KB 3.5 KB 3.5 KB 7 KB
Maximum CPU Frequency 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz
Supply Voltage 1.8 V to 5.5 V 1.8 V to 5.5 V 1.8 V to 5.5 V 1.8 V to 5.5 V 1.8 V to 5.5 V
Operating Temperature -40C to +85C (Industrial) -40C to +85C -40C to +85C -40C to +85C -40C to +85C
ADC Channels 11 x 10-bit 11 x 10-bit 11 x 10-bit 11 x 10-bit 11 x 10-bit
Packaging Form Tape & Reel Tape & Reel Tube Tube Tube
Unit Price (qty 1, USD) 0.54 0.58 0.54 0.60 0.66

Wichtigste Unterscheidungsmerkmale

  • Smallest 28-pin PIC16F package footprint (vs. PIC16F722AT-I/ML (QFN-28 6x6 mm))
  • Tape-and-Reel packaging standard for high-volume SMT (vs. PIC16F722A-I/MV (tube packaging))
  • Higher Flash density than PIC16F720 (vs. PIC16F720-I/SS (1.75 KB Flash))
  • Industrial -40C to +85C temperature grade (vs. PIC16F722-E variants (-40C to +125C extended))

Designhinweise

The UQFN-28 (MV) package has an exposed thermal pad on the underside that MUST be soldered to a sufficient PCB ground-plane pour. Per Microchip datasheet 41365D, minimum 0.5 square inch of 1 oz copper is recommended for thermal dissipation and mechanical reliability. Use an array of 4 to 8 thermal vias (0.3 mm drill, 0.6 mm pitch) under the pad to connect to inner ground planes. The pad is electrically tied to VSS internally - do not connect to a separate power rail.

Place a 0.1 uF ceramic decoupling capacitor as close as physically possible to the VDD pin (pin 18) and a bulk 10 uF capacitor within 0.25 inches. Per Microchip datasheet 41365D, the wide 1.8 V to 5.5 V supply range allows direct battery connection from 2x AA cells. For nanoWatt XLP sleep-mode operation, ensure the bulk capacitor is no larger than 10 uF to avoid excessive inrush current on wake-up - the brown-out detector can otherwise false-trigger.

Do not leave the MCLR/VPP pin floating - per Microchip datasheet 41365D, MCLR must be tied to VDD through a 10 kohm pull-up for normal operation. If left floating, the device may randomly enter programming mode or fail to start. For ICSP programming, isolate MCLR with a diode or resistor network to allow debugger access while maintaining normal operation. Configuration bits must be set before code execution begins; uninitialized configuration bits default to INTOSC mode but with all pins as analog inputs (no digital I/O).

Route the external crystal (if used) traces from pins RA6/OSC2 and RA7/OSC1 with grounded shielding traces and length-matched within 1 mm. Per Microchip datasheet 41365D, the internal 16 MHz INTOSC eliminates crystal cost and layout complexity for most applications - the OSCCAL register allows user trimming to +/- 1% accuracy. For low-EMI designs, avoid routing high-speed signals (PWM, EUSART) near the crystal traces.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Bleifrei
Yes
Halogenfrei
Yes
Konfliktmineralien
Compliant

Per Microchip datasheet 41365D, the device is RoHS compliant and lead-free. A-type suffix denotes automotive-grade silicon but is not AEC-Q100 qualified unless -E (Extended) temperature grade is selected. MSL-1 rated.

Daten verifiziert am: 2026-09-21 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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