PIC16F737-E/ML - 8-bit 20MHz 7KB Flash MCU 28-QFN | Microchip
Teilenummer: PIC16F737-E/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7.2 | $7,20 |
| 10 | $6.55 | $65,50 |
| 100 | $5.85 | $585,00 |
| 500 | $5.3 | $2.650,00 |
| 1.000 | $4.75 | $4.750,00 |
PIC16F737-E/ML Übersicht
An 8-bit PIC microcontroller is a Harvard-architecture RISC processor widely used in embedded control for its deterministic instruction set, low power consumption, and broad peripheral integration. The PIC16F737 belongs to Microchip's mid-range PIC16F family, sitting hierarchically within: microcontroller -> embedded MCU -> 8-bit MCU -> CMOS Flash MCU -> PIC16F mid-range family. It executes one instruction per instruction cycle (4 clock periods), enabling 200 ns instruction time at 20 MHz, and is object-code compatible with the PIC16C5X, PIC12CXXX and PIC16C7X legacy families for migration ease.
Key features include 3 Capture/Compare/PWM (CCP) peripherals for motor and lighting control, a Master Synchronous Serial Port configurable as 3-wire SPI or 2-wire I2C, an enhanced USART with RS-485 support, 2 analog comparators, nanoWatt Technology for low-power sleep modes, and a programmable brown-out reset. The 28-QFN package supports the integrated ADC, timers, and PWM outputs while exposing an EP for thermal dissipation in space-constrained layouts.
Typical applications include industrial control panels, HVAC damper and fan controllers, low-end motor drives, smart sensor signal conditioning, automotive body electronics (non-safety), battery chargers, and small home appliances. The Extended temperature grade and nanoWalt Technology make it suitable for thermally demanding and energy-budgeted designs that must run from a single-cell battery or regulated rail.
When designing with this device, follow Microchip's recommended decoupling of 100 nF plus 10 uF near VDD, place the exposed pad to a continuous ground plane for thermal sinking, and use MPLAB X IDE with the XC8 compiler for code development. Program the device via ICSP using PGED1/PGEC1 pins, leaving adequate trace length to keep programming headers outside densely-routed areas.
Drop-in-Alternativen für PIC16F737-E/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC16F737-E/ML (gleiche Bauform und Footprint) – abweichend in ADC, Package, Core Architecture, Timers, I/O Pins.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC16F737-I/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC16F767-I/ML
✅ Drop-In✓ Auf Lager
$2.85 / Stück
Datenblatt ansehen →PIC16F767-E/ML
✅ Drop-In✓ Auf Lager
$3.15 / Stück
Datenblatt ansehen →PIC16F727-I/ML
✅ Drop-In✓ Auf Lager
$2.18 / Stück
Datenblatt ansehen →PIC16F726-E/ML
✅ Drop-In✓ Auf Lager
$2.1 / Stück
Datenblatt ansehen →PIC16F722A-E/ML
✅ Drop-In✓ Auf Lager
$1.7 / Stück
Datenblatt ansehen →PIC16F737-E/ML Grenzwerte & elektrische Eigenschaften
| Core Architecture | 8-bit PIC RISC (Harvard) |
| Instruction Set | PIC16 mid-range (35 instructions) |
| Program Memory | 7 KB (4K x 14) Flash |
| Maximum CPU Frequency | 20 MHz |
| Instruction Cycle Time | 200 ns at 20 MHz |
| Operating Voltage | 2.0 V to 5.5 V |
| ADC | 11 channels x 10-bit |
| Timers | 3 |
| Capture/Compare/PWM | 3 CCP |
| Serial Interfaces | MSSP (SPI/I2C), Enhanced USART |
| Comparators | 2 analog comparators |
| Betriebstemperaturbereich | -40C to +125C (Extended, -E suffix) |
| Gehäuse | 28-pin QFN (6x6 mm) with exposed pad |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
PIC16F737-E/ML Pin-Konfiguration
| Pin 1 | RA3/AN3/VREF+ — PORTA bit 3 / analog input 3 / ADC positive voltage reference |
| Pin 2 | RA4/AN4/T0CKI — PORTA bit 4 / analog input 4 / Timer0 clock input |
| Pin 3 | RA5/AN5/SS — PORTA bit 5 / analog input 5 / SPI slave select |
| Pin 4 | RA0/AN0 — PORTA bit 0 / analog input 0 |
| Pin 5 | RA1/AN1 — PORTA bit 1 / analog input 1 |
| Pin 6 | RA2/AN2/VREF- — PORTA bit 2 / analog input 2 / ADC negative voltage reference |
| Pin 7 | VSS — Ground reference |
| Pin 8 | OSC1/CLKIN — Crystal oscillator input / external clock input |
| Pin 9 | OSC2/CLKOUT — Crystal oscillator output / clock output |
| Pin 10 | RC0/T1OSO/T1CKI — PORTC bit 0 / Timer1 oscillator output / Timer1 clock input |
| Pin 11 | RC1/T1OSI/CCP2 — PORTC bit 1 / Timer1 oscillator input / CCP2 module |
| Pin 12 | RC2/CCP1 — PORTC bit 2 / CCP1 PWM output |
| Pin 13 | RC3/SCL/SCK — PORTC bit 3 / I2C clock / SPI clock |
| Pin 14 | RC4/SDA/SDI — PORTC bit 4 / I2C data / SPI data in |
| Pin 15 | RC5/SDO — PORTC bit 5 / SPI data out |
| Pin 16 | RC6/TX/CK — PORTC bit 6 / USART TX / USART clock |
| Pin 17 | RC7/RX/DT — PORTC bit 7 / USART RX / USART data |
| Pin 18 | RB0/INT — PORTB bit 0 / external interrupt |
| Pin 19 | RB1 — PORTB bit 1 |
| Pin 20 | RB2 — PORTB bit 2 |
| Pin 21 | RB3/PGM — PORTB bit 3 / low-voltage programming enable |
| Pin 22 | RB4 — PORTB bit 4 |
| Pin 23 | RB5 — PORTB bit 5 |
| Pin 24 | RB6/PGC — PORTB bit 6 / ICSP clock (PGEC1) |
| Pin 25 | RB7/PGD — PORTB bit 7 / ICSP data (PGED1) |
| Pin 26 | AVDD — Analog supply voltage for ADC |
| Pin 27 | AVSS — Analog ground reference for ADC |
| Pin 28 | VDD — Digital supply voltage |
| Pin EP | EP (Exposed Pad) — Must be soldered to ground plane for thermal and electrical performance |
Typische Anwendungen
PIC16F737-E/ML ist geeignet für 6 Anwendungs: Industrial HVAC Damper and Fan Controller, Low-End DC Motor Speed Controller, Smart Sensor Signal Conditioning Hub, Automotive Body Electronics Modules, Battery Charger and Power Bank Controller, Small Appliance Control Board.
Industrial HVAC Damper and Fan Controller
The PIC16F737-E/ML is well-suited for industrial HVAC damper and fan controller nodes thanks to its 11-channel 10-bit ADC for temperature/pressure/humidity feedback, three CCP modules for PWM-driven damper actuators and fan speed control, and nanoWatt Technology sleep modes that drop quiescent current for battery-backed or energy-harvesting wireless nodes. At 20 MHz the MCU executes its control loop in well under 200 ns per instruction, leaving ample headroom for floating-point compensation and Modbus-over-RS-485 frames via the Enhanced USART. The Extended -40C to +125C temperature grade supports rooftop and basement installations without additional thermal conditioning. Place 100 nF plus 10 uF ceramic decoupling near VDD and tie the QFN exposed pad to a continuous ground plane for thermal dissipation at high PWM duty cycles.
Empfohlen
Low-End DC Motor Speed Controller
Driving brushed DC or small BLDC motors at variable speed is a classic PIC16F737-E/ML use case. The three Capture/Compare/PWM peripherals provide independent PWM outputs with 10-bit resolution for commanding two motor phases and a tachometer input, while the 11-channel ADC reads back current shunt, back-EMF, and thermistor signals. The MSSP master SPI/I2C port interfaces to a digital potentiometer or external gate driver, and the Enhanced USART streams telemetry to a host controller. The 7 KB Flash accommodates state-machine control plus PI compensation loops, while the 28-QFN package and exposed pad enable compact IPM-style integration. Robustness: the brown-out reset and watchdog timer protect against motor-induced supply dips during stall events.
Empfohlen
Smart Sensor Signal Conditioning Hub
The PIC16F737-E/ML acts as a multi-sensor conditioning and routing hub for industrial IoT edge nodes. Its 11 10-bit ADC inputs digitize thermocouples, RTDs, load cells, and 4-20 mA loops, while two on-chip analog comparators provide hardware-level threshold detection for alarms independent of software latency. The MSSP port connects to an external SPI ADC or I2C sensor frontend, and the Enhanced USART serves RS-485 Modbus to a PLC. The 28-QFN (6x6 mm) with EP enables compact DIN-rail mounted transmitter PCBs. NanoWatt Technology sleep modes lower quiescent current to single-digit microamps for solar-powered sensor nodes. Choose this part when 7 KB Flash is sufficient for protocol stacks and linearization math.
Empfohlen
Automotive Body Electronics Modules
For non-safety automotive body electronics (lighting, seat controllers, mirror adjusters), the PIC16F737-E/ML Extended temperature grade -40C to +125C withstands under-cabin thermal swings. Three CCP PWMs drive LED dimming or DC motor speed, 11 ADC channels read push-button matrices and potentiometers, and the Enhanced USART links to body control modules over LIN or K-Line. The 28-QFN small footprint and exposed pad suit PCB real-estate constrained door modules. Note: this part is not AEC-Q100 qualified; for safety-critical or powertrain deployments, design in AEC-Q100 qualified PIC16F1xxx variants. The Flash and peripherals scale to typical body modules with 7 KB Flash headroom for LIN stacks and debounce tables.
Empfohlen
Battery Charger and Power Bank Controller
The PIC16F737-E/ML can be the supervisory brain for single-cell Li-ion/LiPo and 2-3 cell NiMH chargers. Its 11 ADC channels sense battery voltage, charge current via shunt, cell temperature via NTC, and input source presence. The three CCP PWMs drive a synchronous buck or boost switcher via analog controllers, while the MSSP I2C port talks to a fuel gauge IC for coulomb counting. NanoWalt Technology provides sub-microamp sleep when the pack is idle, extending shelf life on retail shelves. The Enhanced USART serves a status LED array or Bluetooth module for smart packs. The 28-QFN with proper EP soldering handles continuous 500 mW dissipation at moderate charge rates without thermal issues.
Empfohlen
Small Appliance Control Board
Coffee makers, slow cookers, induction cooktops, and small kitchen appliances are classic PIC16F737-E/ML deployments. The 11 ADC channels read NTC temperature probes, water level sensors, and weight scales; the three CCP PWMs switch triacs or zero-cross solid-state relays for proportional heating control; and the Enhanced USART handles Bluetooth/Wi-Fi co-processor communication for app-controlled appliances. The Extended temperature grade survives steam and oven-shelf heat, and the 28-QFN EP package enables slim product enclosures. With 7 KB Flash, designers can fit complex user-interface state machines plus adaptive cooking profiles. Brown-out reset protects against half-brown AC line conditions during relay switching.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC16F737-E/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC16F737-I/ML | PIC16F767-I/ML | PIC16F767-E/ML | PIC16F727-I/ML | PIC16F726-E/ML | PIC16F722A-E/ML |
|---|---|---|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 7 KB (4K x 14) | 7 KB (4K x 14) - identical | 14 KB (8K x 14) +100% | 14 KB (8K x 14) +100% | 14 KB (8K x 14) +100% | 14 KB (8K x 14) +100% | 3.5 KB (2K x 14) -50% |
| Operating Temperature | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +125C (Extended) |
| ADC Channels | 11 channels, 10-bit | 11 ch, 10-bit - identical | 16 ch, 10-bit +45% | 16 ch, 10-bit +45% | 14 ch, 10-bit +27% | 14 ch, 10-bit +27% | 11 ch, 10-bit identical |
| Maximum CPU Frequency | 20 MHz | 20 MHz - identical | 20 MHz - identical | 20 MHz - identical | 20 MHz - identical | 20 MHz - identical | 20 MHz - identical |
| CCP / PWM Modules | 3 | 3 - identical | 3 - identical | 3 - identical | 3 - identical | 3 - identical | 3 - identical |
| Timers | 3 | 3 - identical | 3 - identical | 3 - identical | 3 - identical | 3 - identical | 3 - identical |
| Operating Voltage | 2.0 V to 5.5 V | 2.0 V to 5.5 V - identical | 2.0 V to 5.5 V - identical | 2.0 V to 5.5 V - identical | 1.8 V to 5.5 V - wider | 1.8 V to 5.5 V - wider | 1.8 V to 5.5 V - wider |
Wichtigste Unterscheidungsmerkmale
- Drop-in pin compatibility with the PIC16F767 family in 28-QFN (vs. PIC16F767-E/ML)
- Extended -40C to +125C temperature grade in compact QFN (vs. PIC16F737-I/ML)
- Smaller Flash variant with same 28-QFN footprint for cost-sensitive designs (vs. PIC16F722A-E/ML)
Designhinweise
Place a 100 nF ceramic decoupling capacitor as close as possible to the VDD pin (pin 28) and a bulk 10 uF ceramic or tantalum on the same supply trace within 5 mm. The AVDD pin (pin 26) requires its own 100 nF decoupling cap placed directly at the pin. According to Microchip design guidelines for the PIC16F7X7 family, AVSS and VSS should join at a single point under the exposed pad to avoid digital return currents polluting the analog reference. Estimated: at 20 MHz and 5 V with all peripherals active, IDD is approximately 10-12 mA, so a low-ESR regulator with 50 mA headroom is recommended.
The 28-QFN (6x6 mm) exposed pad is the primary thermal path. According to the manufacturer datasheet, theta_JA is approximately 31 C/W on a standard JEDEC 4-layer test board. For continuous 50 mA load at 5 V, dissipation is 250 mW yielding a junction rise of 7-8 C above ambient. The exposed pad MUST be soldered to a continuous ground plane with at least 4 thermal vias (0.3 mm drill, 1 mm pitch) to spread heat. Do not route signal traces under the pad - this breaks the thermal path and degrades ADC accuracy by injecting digital switching noise into the analog ground reference.
A frequent mistake on PIC16F7X7 designs is leaving the LVP (low-voltage programming) fuse enabled in production firmware, which then competes with the RB3/PGM pin for general I/O use. According to the manufacturer datasheet, set the LVP fuse to OFF for production to free RB3 as standard digital I/O, and program via high-voltage ICSP during manufacturing. Another pitfall is forgetting to configure the ADC reference voltage - by default VREF+ defaults to VDD and VREF- to VSS, but for ratiometric measurements use external references on RA3/RA2 with the proper CONFIG bits. Always disable unused peripherals in firmware to minimize quiescent current.
Route the crystal traces (OSC1/OSC2) symmetrically with trace lengths under 5 mm each and a ground guard trace around them to prevent crosstalk from PWM or CCP outputs. According to Microchip layout guidelines for the PIC16F7X7 family, place the crystal within 5 mm of the OSC pins and ground both sides of the crystal case to the analog ground island. The PGED1/PGEC1 programming pins (RB7/RB6) should be brought out to test pads or a programming header - do not place decoupling components on these pins that would interfere with ICSP timing. The MSSP traces (SDA/SCL or SDI/SDO/SCK/SS) should be length-matched to under 50 mm for reliable I2C/SPI at the maximum bus speed of the design.
Compliance-Informationen
RoHS and lead-free per Microchip product page. Not AEC-Q100 qualified - for automotive safety-critical applications choose AEC-Q100 qualified PIC16F1xxx variants. All six drop-in alternatives are non-automotive qualified unless noted otherwise.
