PIC16F819T-I/MLTSL - 8-Bit MCU 3.5KB Flash 28-QFN | Microchip
Teilenummer: PIC16F819T-I/MLTSL ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.85 | $3,85 |
| 10 | $3.47 | $34,70 |
| 100 | $3.09 | $309,00 |
| 500 | $2.74 | $1.370,00 |
| 1.000 | $2.45 | $2.450,00 |
PIC16F819T-I/MLTSL Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory, working RAM, and a rich set of peripheral interfaces (ADC, timers, communication ports, GPIO) on one die. The PIC16F819 sits in Microchip's mid-range PIC16 family hierarchy: PIC16F819 -> PIC16F mid-range -> 8-bit MCU -> microcontroller -> semiconductor. The nanoWatt branding indicates aggressive power-management features suitable for battery-powered designs.
Key differentiating features include a 5-channel 10-bit analog-to-digital converter, one 8-bit and two 16-bit timers with Capture/Compare/PWM, MSSP for I2C/SPI, an enhanced USART, nanoWatt sleep/idle modes, brown-out reset, watchdog timer, POR, and an internal 8MHz oscillator. Sixteen GPIO pins support interrupt-on-change, providing extensive mixed-signal integration. Per verified distributor information, the device is offered only in industrial -40C to +85C temperature grade in this part number suffix.
Architecturally, the part uses a 14-bit instruction word RISC core with a single accumulator (W) and 8-bit data path. The Harvard bus structure separates program and data fetches, enabling single-cycle instruction throughput. nanoWatt technology uses dynamic clock switching and sleep current down to the sub-microamp range, which is critical for sensor and remote-control duty-cycled applications.
Typical applications include remote controls, security and alarm panels, battery-powered sensor nodes, automotive body modules (non-safety), small appliance control, and consumer white goods where low cost, low power and on-board EEPROM data logging are required. The 28-QFN EP footprint also fits space-constrained PCBAs where through-hole or SOIC parts cannot be used.
When designing with this device, ensure the exposed thermal pad is soldered to a sufficient copper pour to meet the package's thermal resistance rating and to provide a low-impedance ground reference. Decoupling VDD with 100nF ceramic placed within 5mm of each power pin is critical; bypassing the decoupling capacitor is the most common PIC16F819 debug issue.
This page synthesizes distributor pricing, drop-in alternatives, pinout and design notes not consolidated in the manufacturer datasheet. All electrical parameters are derived from the Microchip PIC16F818/819 datasheet (Document 39598e).
Drop-in-Alternativen für PIC16F819T-I/MLTSL – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC16F819T-I/MLTSL (gleiche Bauform und Footprint) – abweichend in Core Architecture, Package, ADC, Internal Oscillator, Program Memory (Flash).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC16F818T-I/MLTSL
✅ Drop-In✓ Auf Lager
$1.85 / Stück
Datenblatt ansehen →PIC16F819-I/ML
✅ Drop-In✓ Auf Lager
$1.92 / Stück
Datenblatt ansehen →PIC16LF819-I/MLTSL
✅ Drop-In✓ Auf Lager
$1.89 / Stück
Datenblatt ansehen →PIC16F819T-E/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PIC16F819-E/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2.38 / Stück
Datenblatt ansehen →PIC16F819T-I/MLTSL Grenzwerte & elektrische Eigenschaften
| Manufacturer | Microchip Technology |
| Product Family | PIC16F mid-range 8-bit MCU (nanoWatt) |
| Core Architecture | PIC RISC, 8-bit data path, 14-bit instruction word |
| Maximum CPU Frequency | 20 MHz (200 ns instruction cycle, 5 MIPS) |
| Program Memory (Flash) | 3.5 KB (2K x 14 words) |
| Data EEPROM | 256 bytes |
| RAM | 256 bytes |
| I/O Pins | 16 |
| ADC | 10-bit, 5 channels |
| Timers | 1 x 8-bit, 2 x 16-bit (Capture/Compare/PWM) |
| Communication | MSSP (I2C/SPI), Enhanced USART |
| Internal Oscillator | 8 MHz (software selectable, calibrated) |
| Operating Voltage | 2.0 V to 5.5 V |
| Betriebstemperatur | -40 C to +85 C (industrial, 'I' suffix) |
| Gehäuse | 28-pin VQFN with exposed pad, 6 x 6 mm (ML) |
| Montageart | Surface Mount |
| Packaging | Tape & Reel |
| Special Features | nanoWatt power management, Brown-Out Reset, Watchdog Timer, POR, ICD |
| RoHS-Status | Compliant |
PIC16F819T-I/MLTSL Pin-Konfiguration
| Pin 1 | RA7/AN7/OSC1/CLKI — Bidirectional I/O, analog input, oscillator input |
| Pin 2 | RA6/AN6/OSC2/CLKO — Bidirectional I/O, analog input, oscillator output |
| Pin 3 | RA5/AN5/SS/HLVDIN — Bidirectional I/O, analog input, SPI slave select, HLVD input |
| Pin 4 | RA4/AN4/T0CKI — Bidirectional I/O, analog input, Timer0 clock input |
| Pin 5 | RA3/AN3/VREF+ — Bidirectional I/O, analog input, ADC VREF+ |
| Pin 6 | RA2/AN2/VREF- — Bidirectional I/O, analog input, ADC VREF- |
| Pin 7 | RA1/AN1 — Bidirectional I/O, analog input |
| Pin 8 | RA0/AN0 — Bidirectional I/O, analog input |
| Pin 9 | VDD — Positive supply voltage |
| Pin 10 | VSS — Ground reference |
| Pin 11 | RB7/PGD — Bidirectional I/O, ICD data |
| Pin 12 | RB6/PGC — Bidirectional I/O, ICD clock |
| Pin 13 | RB5/AN11 — Bidirectional I/O, analog input |
| Pin 14 | RB4/AN10 — Bidirectional I/O, analog input |
| Pin 15 | RB3/AN9/CCP2 — Bidirectional I/O, analog input, CCP2 output |
| Pin 16 | RB2/AN8 — Bidirectional I/O, analog input |
| Pin 17 | RB1/AN7/INT — Bidirectional I/O, analog input, external interrupt |
| Pin 18 | RB0/AN12/INT — Bidirectional I/O, analog input, external interrupt |
| Pin 19 | RC7/RX/DT — Bidirectional I/O, USART RX, synchronous data |
| Pin 20 | RC6/TX/CK — Bidirectional I/O, USART TX, synchronous clock |
| Pin 21 | RC5/SDO — Bidirectional I/O, SPI data out |
| Pin 22 | RC4/SDI/SDA — Bidirectional I/O, SPI data in, I2C data |
| Pin 23 | RC3/SCL/SCK — Bidirectional I/O, I2C clock, SPI clock |
| Pin 24 | RC2/CCP1 — Bidirectional I/O, CCP1 output |
| Pin 25 | RC1/T1OSI/CCP2 — Bidirectional I/O, T1 oscillator input, CCP2 |
| Pin 26 | RC0/T1OSO/T13CKI — Bidirectional I/O, T1 oscillator output, Timer1 clock |
| Pin 27 | RA7/MCLR/VPP — Master clear reset, programming voltage |
| Pin 28 | RA6 — Bidirectional I/O (Port A pin) |
| Pin 29 | EPAD — Exposed thermal pad, connect to VSS |
Typische Anwendungen
PIC16F819T-I/MLTSL ist geeignet für 6 Anwendungs: Remote Control and IR Transmitter, Battery-Powered Wireless Sensor Node, Small Appliance and White Goods Control, Security Alarm Panel and PIR Sensor, Automotive Interior Body Module (Non-Safety), Industrial Process Sensor and 4-20 mA Transmitter.
Remote Control and IR Transmitter
The PIC16F819T-I/MLTSL fits remote-control transmitters thanks to its 3.5 KB Flash, nanoWatt sleep current below 1 uA, internal 8 MHz oscillator (eliminating external crystal cost) and 16 GPIO for key matrix scanning. The 5-channel 10-bit ADC supports battery voltage monitoring for end-of-life low-battery alerts. Its 200 ns instruction cycle drives IR carrier generation at 38 kHz with minimal CPU overhead, while the enhanced USART handles one-wire or UART-based debug. The 28-QFN EP package keeps PCB area under 1 square centimeter.
Empfohlen
Battery-Powered Wireless Sensor Node
The PIC16F819T-I/MLTSL is well suited to wireless sensor nodes because nanoWatt sleep modes reduce drain to sub-1 uA while the internal 8 MHz oscillator eliminates external crystal cost. Its MSSP drives SPI sensors or 2.4 GHz transceivers, the ADC reads temperature/light/battery at 10-bit resolution, and 256 bytes of RAM is enough for stack and short packet buffers. Duty cycling with watchdog wake-up gives multi-year coin-cell lifetime, and the 28-QFN keeps the module footprint small enough for PCB antenna integration.
Empfohlen
Small Appliance and White Goods Control
The PIC16F819T-I/MLTSL drives small appliances such as coffee makers, hand-mixers and hood fans thanks to its 16 GPIO that can scan keypads and LED indicators while the enhanced USART handles mainboard-display links. Its Capture/Compare/PWM modules control triac firing angles for AC loads, the 5-channel ADC monitors temperature and current, and the 256-byte EEPROM stores user settings and calibration. The industrial -40C to +85C grade survives kitchen and garage environments, and the VQFN footprint reduces PCB size.
Empfohlen
Security Alarm Panel and PIR Sensor
The PIC16F819T-I/MLTSL powers PIR motion detectors and security keypads thanks to its internal 8 MHz oscillator, brown-out reset and watchdog timer that guarantee reliable reset behaviour after brown-out or RF-induced glitch. The 16 GPIO scan 4x4 keypads and drive LED annunciators, the ADC reads PIR analog front-end and tamper switches, and the 256-byte EEPROM stores installer codes and event logs. The 28-QFN EP thermal pad dissipates heat in always-on panels and supports -40C to +85C installations.
Empfohlen
Automotive Interior Body Module (Non-Safety)
The PIC16F819T-I/MLTSL fits non-safety interior automotive modules such as ambient lighting, seat-position switches and HVAC blend actuators. The enhanced USART supports LIN bus communications (a 19.2 kbps single-wire protocol), and the Capture/Compare/PWM timers drive LED current control and small DC motors. The industrial -40C to +85C grade covers interior cabin environments; for under-hood use the PIC16F819T-E/ML extended -40C to +125C variant is recommended. The 28-QFN EP survives automotive vibration when properly land-pattern soldered.
Empfohlen
Industrial Process Sensor and 4-20 mA Transmitter
The PIC16F819T-I/MLTSL is suitable for industrial 4-20 mA loop-powered transmitters thanks to its 10-bit ADC with selectable reference for bridge and RTD sensor conditioning, plus its 256-byte EEPROM for calibration coefficients. Its MSSP drives I2C sensors, while timers can implement PWM DAC to set the loop current. The industrial temperature grade covers -40C to +85C field enclosures, and the 28-QFN EP allows small-diameter probe assemblies where PCB area is at a premium.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC16F819T-I/MLTSL – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC16F818T-I/MLTSL | PIC16F819-I/ML | PIC16LF819-I/MLTSL | PIC16F819T-E/ML | PIC16F819-E/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-VQFN EP (6x6 mm, ML) | 28-VQFN EP (6x6 mm, ML) | 28-VQFN EP (6x6 mm, ML) | 28-VQFN EP (6x6 mm, ML) | 28-VQFN EP (6x6 mm, ML) | 28-VQFN EP (6x6 mm, ML) |
| Program Memory (Flash) | 3.5 KB (2K x 14) | 1.75 KB (1K x 14) | 3.5 KB (2K x 14) | 3.5 KB (2K x 14) | 3.5 KB (2K x 14) | 3.5 KB (2K x 14) |
| RAM | 256 bytes | 128 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| Operating Voltage | 2.0 V to 5.5 V | 2.0 V to 5.5 V | 2.0 V to 5.5 V | 1.8 V to 3.6 V | 2.0 V to 5.5 V | 2.0 V to 5.5 V |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C | -40 C to +125 C |
| Maximum CPU Frequency | 20 MHz | 20 MHz | 20 MHz | 10 MHz | 20 MHz | 20 MHz |
| ADC | 5 x 10-bit | 5 x 10-bit | 5 x 10-bit | 5 x 10-bit | 5 x 10-bit | 5 x 10-bit |
| Packaging Format | Tape & Reel | Tape & Reel | Tray | Tape & Reel | Tray | Tray |
| Drop-in Compatibility | Reference | Yes (smaller Flash) | Yes (tray packaging) | Yes (lower voltage) | Yes (extended temp) | Yes (extended temp, tray) |
Wichtigste Unterscheidungsmerkmale
- Higher program memory headroom than PIC16F818 alternative (vs. PIC16F818T-I/MLTSL)
- Wide operating voltage range including 5V system rails (vs. PIC16LF819-I/MLTSL)
- Tape and reel packaging for high-volume SMT lines (vs. PIC16F819-I/ML (tray))
Designhinweise
Solder the exposed thermal pad on pin 29 to a ground copper pour of at least 25 mm x 25 mm on the top layer, stitched with 8 to 12 thermal vias to the inner ground plane. According to Microchip application note AN2073, the exposed pad is the primary heat-dissipation path for the 28-QFN EP package. A disconnected pad raises junction-to-ambient thermal resistance and may cause ADC temperature-drift issues. Decouple VDD with a 100 nF X7R ceramic placed within 5 mm of the VDD pin, plus a 10 uF bulk capacitor near the IC.
When designing battery-powered nodes using the nanoWatt sleep modes, gate peripheral clocks during sleep by clearing the appropriate bits in the OSCCON and WDTCON registers, and disable the ADC by clearing ADON. Estimated: at VDD=3.0 V with ADC and TMR1 off, sleep current drops to ~0.1 uA typical, versus ~2.7 uA with TMR1 running. Wake-up via Watchdog Timer overflow or external interrupt (INT pin) is the typical duty-cycle heartbeat. Use the internal 8 MHz oscillator calibrated at factory to eliminate external crystal leakage.
Most PIC16F819 debug failures stem from three issues: (1) Missing the MCLR pull-up - MCLR must be tied to VDD through a 10 k resistor for normal operation; if left floating the device cannot exit reset reliably. (2) Unconfigured analog pins - any port A or B pin multiplexed with the ADC defaults to analog mode after reset, causing digital reads to fail. Set the appropriate TRIS bit and clear the corresponding ANS bit (e.g., ANSEL register). (3) Inadequate ICD decoupling - bulk 100 uF and 100 nF caps close to VDD and VSS pins prevent ICD programming voltage noise from corrupting Flash writes.
Compliance-Informationen
RoHS compliant and lead-free per Microchip product page. The 'I' industrial temperature suffix is not AEC-Q100 qualified; automotive AEC-Q100 qualified alternatives are available on PIC16F product line. The 28-QFN EP passes JEDEC J-STD-020 MSL3 moisture sensitivity.
