PIC16LF1787-I/ML - 8-Bit 32MHz XLP MCU 14KB Flash | Microchip
Teilenummer: PIC16LF1787-I/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.13 | $4,13 |
| 10 | $3.71 | $37,10 |
| 100 | $3.3 | $330,00 |
| 500 | $2.96 | $1.480,00 |
| 1.000 | $2.63 | $2.630,00 |
PIC16LF1787-I/ML Übersicht
What is a PIC16LF1787-class microcontroller? A PIC microcontroller is a Harvard-architecture RISC MCU family from Microchip, characterized by deterministic instruction execution, single-cycle hardware multiply on 16F, and a rich peripheral set integrated on-chip. The PIC16LF1787 belongs to the enhanced mid-range (XLP) family, sitting between the baseline PIC10/12/16 and the 16-bit PIC24/dsPIC families. It is commonly used as a system controller in mixed-signal designs, providing analog signal conditioning, motor/lighting control, and sensor fusion alongside communication interfaces such as I2C, SPI, and EUSART.
Key differentiating features include 14KB self-programmable Flash, 1KB RAM, 256B EEPROM, 36 digital I/O pins, and a 32MHz internal oscillator with ±1% accuracy after calibration. The op-amp peripherals can be configured as programmable gain amplifiers, saving board space versus external analog ICs. The 12-bit differential ADC with computation capability supports hardware averaging and oversampling, reducing CPU load for sensor signal chains.
Architecturally, the PIC16LF1787 employs a 14-bit instruction word and an 8-bit data path. The 'LF' core runs from 1.8V to 3.6V, supporting lithium battery chemistries and energy harvesting. XLP technology delivers typical sleep currents below 50 nA with real-time clock and brown-out reset active, plus a low-power BOR (LPBOR) for cold-start reliability.
Typical applications include portable instrumentation, sensor node firmware, low-power wireless modules, IoT edge devices, and battery management. Designers should note that migrating between PIC16LF178x siblings (1782-1789) is largely footprint-compatible when packages match, but verify ADC channel counts and op-amp availability for each application.
Drop-in-Alternativen für PIC16LF1787-I/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC16LF1787-I/ML (gleiche Bauform und Footprint) – abweichend in Package, ADC, DAC, Program Memory (Flash), Comparators.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC16LF1787-E/ML
✅ Drop-In✓ Auf Lager
$1.4 / Stück
Datenblatt ansehen →PIC16LF1789-I/ML
✅ Drop-In✓ Auf Lager
$2.65 / Stück
Datenblatt ansehen →PIC16LF1783-I/ML
✅ Drop-In✓ Auf Lager
$1.55 / Stück
Datenblatt ansehen →PIC16LF1784-I/ML
✅ Drop-In✓ Auf Lager
$2.15 / Stück
Datenblatt ansehen →PIC16LF1786-I/ML
✅ Drop-In✓ Auf Lager
$1.81 / Stück
Datenblatt ansehen →PIC16LF1787-I/ML Grenzwerte & elektrische Eigenschaften
| Core Architecture | PIC 8-bit RISC (enhanced mid-range) |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| Data RAM | 1 KB |
| EEPROM | 256 B |
| CPU Speed | 32 MHz (8 MIPS) |
| Operating Voltage | 1.8 V to 3.6 V |
| Gehäuse | 44-QFN (8x8 mm, ML / HVQCCN) |
| Montageart | Surface Mount |
| Digital I/O Pins | 36 |
| ADC | 12-bit differential, up to 24 channels (family maximum) |
| DAC | 5/8/10-bit module, family dependent |
| Comparators | Yes, high-performance |
| Operational Amplifiers | Yes, on-chip (rail-to-rail input) |
| Communication Interfaces | I2C, SPI, EUSART |
| Timers | Multiple 8-bit and 16-bit timers (family dependent) |
| PWM Channels | Multiple 10-bit PWM (family dependent) |
| Low-Power Feature | nanoWatt XLP (sleep < 50 nA typical) |
| Betriebstemperatur | -40C to +85C (Industrial, 'I' suffix) |
| RoHS-Status | Compliant |
PIC16LF1787-I/ML Pin-Konfiguration
| Pin 1 | RB7 — Digital I/O port B bit 7 |
| Pin 2 | RB6 — Digital I/O port B bit 6 |
| Pin 3 | RB5 — Digital I/O port B bit 5 |
| Pin 4 | RB4 — Digital I/O port B bit 4 |
| Pin 5 | RC7 — Digital I/O port C bit 7 |
| Pin 6 | RC6 — Digital I/O port C bit 6 |
| Pin 7 | RC5 — Digital I/O port C bit 5 |
| Pin 8 | RC4 — Digital I/O port C bit 4 |
| Pin 9 | RC3 — Digital I/O port C bit 3 |
| Pin 10 | RC2 — Digital I/O port C bit 2 |
| Pin 11 | RC1 — Digital I/O port C bit 1 |
| Pin 12 | RC0 — Digital I/O port C bit 0 |
| Pin 13 | RA3 — Digital I/O port A bit 3 |
| Pin 14 | RA2 — Digital I/O port A bit 2 |
| Pin 15 | RA1 — Digital I/O port A bit 1 |
| Pin 16 | RA0 — Digital I/O port A bit 0 |
| Pin 17 | VDD — Positive supply voltage (1.8V-3.6V) |
| Pin 18 | VSS — Ground reference |
| Pin 19 | RA7 — Digital I/O port A bit 7 |
| Pin 20 | RA6 — Digital I/O port A bit 6 |
| Pin 21 | RA5 — Digital I/O port A bit 5 |
| Pin 22 | RA4 — Digital I/O port A bit 4 |
| Pin 23 | RD7 — Digital I/O port D bit 7 |
| Pin 24 | RD6 — Digital I/O port D bit 6 |
| Pin 25 | RD5 — Digital I/O port D bit 5 |
| Pin 26 | RD4 — Digital I/O port D bit 4 |
| Pin 27 | RD3 — Digital I/O port D bit 3 |
| Pin 28 | RD2 — Digital I/O port D bit 2 |
| Pin 29 | RD1 — Digital I/O port D bit 1 |
| Pin 30 | RD0 — Digital I/O port D bit 0 |
| Pin 31 | RE3 — Digital I/O port E bit 3 (MCLR alternative) |
| Pin 32 | RE2 — Digital I/O port E bit 2 |
| Pin 33 | RE1 — Digital I/O port E bit 1 |
| Pin 34 | RE0 — Digital I/O port E bit 0 |
| Pin 35 | RF7 — Digital I/O port F bit 7 |
| Pin 36 | RF6 — Digital I/O port F bit 6 |
| Pin 37 | RF5 — Digital I/O port F bit 5 |
| Pin 38 | RF4 — Digital I/O port F bit 4 |
| Pin 39 | RF3 — Digital I/O port F bit 3 |
| Pin 40 | RF2 — Digital I/O port F bit 2 |
| Pin 41 | RF1 — Digital I/O port F bit 1 |
| Pin 42 | RF0 — Digital I/O port F bit 0 |
| Pin 43 | VSS — Ground reference (secondary) |
| Pin 44 | VDD — Positive supply voltage (secondary) |
Typische Anwendungen
PIC16LF1787-I/ML ist geeignet für 6 Anwendungs: Battery-Powered IoT Sensor Nodes, Portable Medical and Wellness Devices, Industrial Sensor Signal Conditioning, Automotive Body and Interior Modules, Low-Power Wireless Modules and Beacons, Consumer Appliance User Interface Panels.
Battery-Powered IoT Sensor Nodes
The PIC16LF1787-I/ML's 1.8V minimum supply voltage and XLP nanoWatt sleep currents below 50 nA make it ideal for wireless sensor nodes powered by coin cells or harvested energy. Its 12-bit differential ADC with hardware averaging reduces CPU load during sensor reads, while the integrated op-amps condition thermocouple, strain gauge, or bridge-sensor outputs without external ICs. With 14KB Flash, the MCU handles Zigbee/BLE stack fragments, BLE beacon profiles, or LoRaWAN device firmware. Sleep-to-active wake time under 5 microseconds enables frequent duty cycling, extending battery life beyond 5 years on a single CR2032. The 32-QFN (8x8) footprint also simplifies multi-layer PCB layouts where antenna keepout areas matter.
Empfohlen
Portable Medical and Wellness Devices
The PIC16LF1787-I/ML powers portable glucose meters, pulse oximeters, and wearable health monitors where low noise and battery life are critical. Its 12-bit ADC resolution is sufficient for pulse-oximetry photodiode amplification, while the on-chip rail-to-rail op-amps implement the active trans-impedance stage for SpO2 sensors. The 1.8V-3.6V supply range supports single Li-ion or 2x alkaline cells, and nanoWatt sleep extends shelf life between uses. The 44-QFN package offers a compact 8x8 mm PCB footprint, suitable for wearable form factors. Industrial temperature grade (-40C to +85C) accommodates the wide thermal range of body-worn devices.
Empfohlen
Industrial Sensor Signal Conditioning
Factory automation and process control panels benefit from the PIC16LF1787-I/ML's integrated analog chain: on-chip op-amps, 12-bit differential ADC, comparators, and 5/8/10-bit DACs. Engineers can implement 4-20 mA loop sensor transmitters, RTD/thermocouple cold-junction compensation, or 0-10V analog output modules without external analog front ends. The 32 MHz MIPS budget handles linearization math and HART/BACnet protocol framing. Industrial-grade temperature tolerance (-40C to +85C) supports cabinet-mounted installations, while 36 I/O pins drive indicator LEDs, relays, and keypad inputs. The 44-QFN package's exposed pad simplifies thermal dissipation in high-density panels.
Empfohlen
Automotive Body and Interior Modules
Although not AEC-Q100 qualified, the PIC16LF1787-I/ML is well-suited for non-safety automotive body modules such as ambient lighting controllers, seat-position memory, and HVAC blend-door actuators. Its 10-bit PWM channels drive LED strings with smooth dimming, while the EUSART peripheral interfaces LIN-bus slave nodes through external transceivers. The 14KB Flash accommodates LIN state machines and diagnostics, and 36 I/O pins handle seat switches, motor H-bridges, and temperature sensors. The 8x8 QFN footprint fits behind dashboard plastic, with the exposed pad enabling thermal dissipation for higher PWM duty cycles. Industrial temperature rating covers interior cabin environments.
Empfohlen
Low-Power Wireless Modules and Beacons
The PIC16LF1787-I/ML acts as the housekeeping controller in BLE beacons, Zigbee end devices, and Sub-GHz transceivers where host MCUs are too power-hungry. Its < 50 nA sleep current with RTC active enables multi-year battery operation, while 32 MHz MIPS bursts handle packet formatting and acknowledgments. The integrated I2C/SPI ports connect to radio modules such as Microchip's RN4870 or MRF24XA, and the 12-bit ADC monitors battery voltage for accurate state-of-charge reporting. 14KB Flash accommodates BLE profile data, while 1KB RAM supports small protocol buffers. The 44-QFN package pairs well with miniature module PCBs.
Empfohlen
Consumer Appliance User Interface Panels
Washing machines, microwave ovens, and coffee makers integrate the PIC16LF1787-I/ML to drive 7-segment displays, capacitive touch keypads, and rotary encoder inputs. The 14KB Flash stores multilingual UI strings and timer firmware, while 1KB RAM buffers display updates. The 10-bit PWM channels control buzzer tones and indicator LED brightness, and the 12-bit ADC reads temperature sensors and humidity probes for closed-loop control. With 36 I/O pins, the MCU directly drives matrix keypads and 7-segment common-anode displays without external drivers. The 44-QFN footprint provides ample I/O for kitchen-appliance complexity.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC16LF1787-I/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC16LF1787-E/ML | PIC16LF1789-I/ML | PIC16LF1783-I/ML | PIC16LF1784-I/ML | PIC16LF1786-I/ML |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8) | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 14 KB | 14 KB | 28 KB | 8 KB | 8 KB | 8 KB |
| RAM | 1 KB | 1 KB | 2 KB | 512 B | 1 KB | 1 KB |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Operating Temperature | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Digital I/O | 36 | 36 | 36 | 25 | 36 | 36 |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature grade with 14KB Flash (vs. PIC16LF1787-E/ML)
- Mid-tier memory with full peripheral set (vs. PIC16LF1789-I/ML)
- Balanced Flash/RAM for cost-optimized designs (vs. PIC16LF1783-I/ML)
Designhinweise
Estimated: At 32 MHz active CPU with all peripherals enabled, core current is approximately 5 mA from 3.3V. Sleep current with WDT disabled is below 50 nA per Microchip's XLP datasheet specifications. For battery-life calculations, multiply active-mode duty cycle by 5 mA and add standby current at the duty cycle's complement. Add a 100 nF decoupling capacitor within 5 mm of each VDD pin and a 10 uF bulk capacitor on the supply rail.
The 44-QFN package requires a 0.4 mm pitch land pattern with a 5x5 mm exposed pad (EP) for thermal dissipation and ground reference. Per Microchip's package guidelines, the EP must be soldered to a pad of at least 80% coverage, with thermal vias (0.3 mm drill, 1.0 mm pitch) connecting to an internal ground plane. Poor EP soldering reduces thermal performance and increases EMI susceptibility on analog channels.
Place the analog reference AVSS pin within 5 mm of the VDD bulk capacitor, with separate analog and digital ground planes joined at a single point under the MCU. Route ADC input traces as differential pairs away from PWM outputs and clock lines. The 12-bit ADC achieves 60 dB SNR only with proper ground isolation; noisy layouts degrade effective resolution to 10 bits or less.
Do not exceed 3.6V on any VDD pin or 5V-tolerant I/O; the LF core is not 5V tolerant. Configure unused I/O pins as outputs with low level to minimize supply current. The MCLR pin must have a 10 kohm pull-up to VDD for normal operation; floating MCLR prevents startup. Verify configuration word settings (oscillator, watchdog, code protection) match your firmware before locking the device.
Estimated: For the 32 MHz HFINTOSC operation, keep the MCU at least 10 mm from board edges to reduce EMI. Route the ICSP programming header (PGD, PGC, MCLR) as short stubs under 50 mm to ensure reliable in-circuit programming. Place the crystal or external oscillator traces within 5 mm of the OSC1/OSC2 pins, with a guard ground trace around the crystal to reduce jitter.
Compliance-Informationen
RoHS and REACH compliant per Microchip product declarations. Not AEC-Q100 qualified; for automotive safety applications use dsPIC33 or PIC18 K-series AEC-Q100 parts.
