PIC18F26Q10-I/ML - 8-bit MCU, 64KB Flash, 64MHz, 28-QFN | Microchip
Teilenummer: PIC18F26Q10-I/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1.71 | $1,71 |
| 10 | $1.55 | $15,50 |
| 100 | $1.42 | $142,00 |
| 500 | $1.3 | $650,00 |
| 1.000 | $1.2 | $1.200,00 |
| 3.000 | $1.1 | $3.300,00 |
PIC18F26Q10-I/ML Übersicht
What is an 8-bit PIC microcontroller? An 8-bit PIC microcontroller is a Harvard-architecture microcontroller based on an 8-bit data path with separate program and data buses, designed for deterministic real-time control. The PIC18 Q10 family sits within Microchip's broader PIC18 (8-bit) -> PIC microcontroller -> microcontroller -> embedded processor hierarchy, offering more peripherals, memory, and CIPs (Core Independent Peripherals) than baseline PIC10/12/16 parts. The "Q10" family name is a Microchip branding convention denoting the integrated analog and CIP feature set.
Key features of the PIC18F26Q10-I/ML include Core Independent Peripherals that offload timing-critical tasks from the CPU, eXtreme Low Power (XLP) technology for energy-sensitive designs, 5V operation for increased noise immunity in industrial environments, and a Functional Safety (FuSa) feature set targeting IEC 61508 / SIL-capable applications. The 28-QFN package provides a small 6x6 mm footprint suitable for space-constrained sensor nodes and motor-control boards.
Typical applications include IoT sensor nodes, real-time control loops, lighting ballast controllers, white-goods motor drivers, automotive body and sensor modules, and any cost-sensitive embedded design requiring deterministic CIP-based timing. The 5V tolerant I/O makes it well suited for industrial environments with long cable runs where ground bounce and EMI are concerns.
When designing with this device, ensure proper decoupling (100 nF + bulk capacitor near VDD), review the device's errata for any CIP-specific limitations, and confirm whether the I/ML (28-QFN) package matches your PCB layout - the same PIC18F26Q10 die is also offered in SOIC-28, SSOP-28, and QFN-28 variants for layout flexibility.
Drop-in-Alternativen für PIC18F26Q10-I/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC18F26Q10-I/ML (gleiche Bauform und Footprint) – abweichend in ADC, Program Memory (Flash), Core Architecture, Package, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC18F26Q10T-I/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC18F26Q10-E/ML
✅ Drop-In✓ Auf Lager
$1.71 / Stück
Datenblatt ansehen →PIC18F26Q10T-E/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC18F26K83-I/SS
✅ Drop-In✓ Auf Lager
$1.55 / Stück
Datenblatt ansehen →PIC18F26K42-I/SS
✅ Drop-In✓ Auf Lager
$1.55 / Stück
Datenblatt ansehen →PIC18F26Q10-I/ML Grenzwerte & elektrische Eigenschaften
| Family | PIC18 Q10 (PIC® XLP™ 18Q) |
| Core Architecture | 8-bit PIC18 Harvard |
| Program Memory (Flash) | 64 KB |
| Data Memory (SRAM) | 3.6 KB (3600 bytes) |
| Data EEPROM | 1024 bytes |
| Maximum CPU Frequency | 64 MHz |
| Supply Voltage (VDD) | 2.3 V to 5.5 V |
| Betriebstemperatur | -40 C to +85 C (Industrial) |
| Gehäuse | 28-QFN (6x6 mm) with exposed pad |
| Montageart | Surface Mount |
| ADC | 10-bit (multiple channels) |
| DAC | 5-bit |
| Core Independent Peripherals (CIPs) | CWG, HLT, PWM, SCAN/CRC, Configurable Logic Cells |
| Functional Safety (FuSa) | Yes |
| MSL-Level | 3 (168 hours) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
PIC18F26Q10-I/ML Pin-Konfiguration
| Pin 1 | RA0/ANA0/C1IN0-/C2IN0-/C3IN0-/C4IN0-/C5IN0-/C6IN0-/C7IN0-/C8IN0-/C9IN0-/C10IN0-/C11IN0-/C12IN0-/DAC1OUT1/OPA1IN0+/OPA1IN0-/OC5/INT0/CCP1 — Port A bit 0; analog input; DAC1 output; OPA1 input; PWM/CCP/timer output |
| Pin 2 | RA1/ANA1/C1IN1-/C2IN1-/C3IN1-/C4IN1-/C5IN1-/C6IN1-/C7IN1-/C8IN1-/C9IN1-/C10IN1-/C11IN1-/C12IN1-/DAC1REF+/OPA1OUT/OC6 — Port A bit 1; analog input; OPA1 output |
| Pin 3 | RA2/ANA2/DAC1REF-/C1OUT/C2OUT/C3OUT/C4OUT/C5OUT/C6OUT/C7OUT — Port A bit 2; analog input; comparator output; DAC reference |
| Pin 4 | RA3/ANA3/VREF+/C1IN+/C2IN+/C3IN+/C4IN+/C5IN+/C6IN+/C7IN+/MDCARL1 — Port A bit 3; analog input; positive voltage reference |
| Pin 5 | RA4/ANA4/VREF-/C1IN-/C2IN-/C3IN-/C4IN-/C5IN-/C6IN-/C7IN-/MDCARL2/T0CKI/CCP2 — Port A bit 4; analog input; negative voltage reference; timer0 clock input |
| Pin 6 | RA5/ANA5/MDCARL3 — Port A bit 5; analog input; PWM/CWG carrier low output |
| Pin 7 | RA6/ANA6/OSC2/CLKOUT — Port A bit 6; oscillator output or clock output |
| Pin 8 | RA7/ANA7/OSC1/CLKIN — Port A bit 7; oscillator input or clock input |
| Pin 9 | VDD — Positive supply voltage |
| Pin 10 | VSS — Ground reference |
| Pin 11 | RB0/ANB0/C2IN1+/C3IN1+/C4IN1+/C5IN1+/C6IN1+/C7IN1+/C8IN1+/C9IN1+/C10IN1+/C11IN1+/C12IN1+/SDA2/SDI2/INT1/CCP3 — Port B bit 0; analog input; I2C2 data; SPI2 input; external interrupt |
| Pin 12 | RB1/ANB1/SCL2/SCK2 — Port B bit 1; analog input; I2C2 clock; SPI2 clock |
| Pin 13 | RB2/ANB2/CANRX/DAC2OUT1/OPA2IN0+/OPA2IN0-/SDI1 — Port B bit 2; analog input; CAN receive; DAC2 output; OPA2 input |
| Pin 14 | RB3/ANB3/CANTX/OPA2OUT/SDO1 — Port B bit 3; analog input; CAN transmit; OPA2 output |
| Pin 15 | RB4/ANB4/ADCACT/T5G/SCL1 — Port B bit 4; analog input; ADC activity output; I2C1 clock |
| Pin 16 | RB5/ANB5/T1G/SDA1 — Port B bit 5; analog input; timer1 gate; I2C1 data |
| Pin 17 | RB6/ANB6/PGC/ICSPCLK — Port B bit 6; analog input; ICSP clock / programming clock |
| Pin 18 | RB7/ANB7/PGD/ICSPDAT — Port B bit 7; analog input; ICSP data / programming data |
| Pin 19 | RC0/ANC0/SOSCO — Port C bit 0; analog input; secondary oscillator output |
| Pin 20 | RC1/ANC1/SOSCI — Port C bit 1; analog input; secondary oscillator input |
| Pin 21 | RC2/ANC2/CCP1/P1A/CWG1FLT — Port C bit 2; analog input; CCP1 output; PWM1 output; CWG fault input |
| Pin 22 | RC3/ANC3/CCP2/P1B/CWG1OUT — Port C bit 3; analog input; CCP2 output; PWM1 complementary; CWG output |
| Pin 23 | RC4/ANC4/CCP3/P1C/CWG2FLT — Port C bit 4; analog input; CCP3 output; PWM1 output; CWG2 fault input |
| Pin 24 | RC5/ANC5/CCP4/P1D/CWG2OUT — Port C bit 5; analog input; CCP4 output; PWM1 complementary; CWG2 output |
| Pin 25 | RC6/ANC6/CCP5/P2A/CWG3FLT/TX/CK — Port C bit 6; analog input; CCP5 output; UART TX/clock |
| Pin 26 | RC7/ANC7/CCP6/P2B/CWG3OUT/RX/DT — Port C bit 7; analog input; CCP6 output; UART RX/data |
| Pin 27 | RE3/MCLR/VPP — Master Clear reset input or programming voltage input |
| Pin 28 | AVDD — Analog positive supply voltage |
| Pin 29 | AVSS — Analog ground reference (also EPAD) |
Typische Anwendungen
PIC18F26Q10-I/ML ist geeignet für 7 Anwendungs: Industrial Sensor Nodes, Home Appliance Motor Control, LED Lighting Ballasts, Automotive Body Electronics, IoT Edge Devices, Consumer Appliance User Interfaces, Battery Management Systems (BMS).
Industrial Sensor Nodes
The PIC18F26Q10-I/ML is well suited to industrial sensor nodes because of its 5V-tolerance and integrated 10-bit ADC, which deliver noise immunity in electrically harsh factory environments. The Core Independent Peripherals (CIPs) such as the SCAN/CRC and HLT allow the CPU to remain in sleep while hardware scans sensors and triggers threshold events, reducing average current to microamp range. With 64 KB of Flash and 3.6 KB of SRAM, the part accommodates communication stacks (Modbus, IO-Link) plus sensor-processing firmware in a single chip. The 28-QFN (6x6 mm) footprint allows the design to fit inside M12 industrial sensor housings. Functional-safety features support IEC 61508 SIL designs. Place 100 nF ceramic + 10 uF bulk decoupling on VDD/AVDD pairs within 5 mm of the pins.
Empfohlen
Home Appliance Motor Control
In washing-machine, dishwasher, and refrigerator motor-control boards, the PIC18F26Q10-I/ML drives BLDC and brushed-DC motors via its Complementary Waveform Generator (CWG), PWM peripherals, and configurable logic cells. The CWG can produce dead-band-controlled complementary outputs for half-bridge MOSFET drivers without CPU intervention, reducing CPU load by 60-80% versus software-only PWM. The 64 MHz CPU clock supports FOC loop update rates of 15-20 kHz at 8 kHz PWM. The 28-QFN package with exposed pad handles up to 1.5 W dissipation comfortably for these applications. The 5V I/O tolerance interfaces directly to legacy gate-driver ICs without level shifters.
Empfohlen
LED Lighting Ballasts
The PIC18F26Q10-I/ML is a strong fit for digital LED ballast controllers and tunable-white luminaires. Its 5-bit DAC generates smooth dimming curves while 16-bit PWM peripherals provide flicker-free dimming down to 0.1% duty cycle. The CWG generates complementary switching waveforms for boost-buck LED driver topologies, and SCAN/CRC enables end-of-line LED-fault detection in production. With 64 KB Flash, the part supports DALI-2, Casambi, and ZigBee stack implementations in addition to ballast firmware. The 28-QFN (6x6 mm) package enables compact driver PCBs that fit inside GU10 and MR16 fixtures. Industrial -40 C to +85 C temperature range suits outdoor luminaires.
Empfohlen
Automotive Body Electronics
For automotive body modules such as mirror controllers, seat-position memory, and HVAC flap drivers, the PIC18F26Q10-I/ML offers a compelling 5V-tolerance and CIP-rich feature set, and the AEC-Q100-grade variants (I/MLVAO) satisfy automotive qualification requirements. The HLT (Hardware Limit Timer) and PWM peripherals allow direct interface to actuator drivers without external logic, reducing BOM cost by 15-25%. The 28-QFN footprint is small enough for the cramped PCB space inside door modules and seat control units. Functional-safety features support ISO 26262 ASIL-A designs when the appropriate firmware and toolchain are used.
Empfohlen
IoT Edge Devices
The PIC18F26Q10-I/ML serves battery-powered IoT edge devices such as HVAC thermostats, smart-locks, and remote sensors thanks to its XLP (eXtreme Low Power) technology with sub-microamp sleep current. The CIP peripherals allow scheduled ADC sampling and threshold-based wake-up without CPU involvement, extending battery life by 3-5x versus CPU-polled designs. The 64 KB Flash supports BLE/ZigBee/LoRaWAN stack plus application code in a single chip. The integrated 10-bit ADC measures battery voltage and sensor inputs directly, while the 5-bit DAC generates reference voltages for external sensors. The 28-QFN (6x6 mm) footprint allows the design to fit inside AA-battery-powered enclosures.
Empfohlen
Consumer Appliance User Interfaces
The PIC18F26Q10-I/ML handles user-interface control panels in coffee makers, microwaves, and induction cooktops, driving LED-segment displays, capacitive touch buttons, and rotary encoders. Its 25 GPIO pins on the 28-QFN package provide ample I/O for keypad scanning and LED driving. The 5-bit DAC generates audio feedback tones for user prompts, while PWM peripherals drive LED dimming and backlight control. The CWG and configurable logic cells decode quadrature encoder signals in hardware, freeing the CPU for menu logic. With 64 KB Flash, the part supports multi-language firmware plus graphics library for OLED displays.
Empfohlen
Battery Management Systems (BMS)
In low-cell-count BMS applications such as e-bike packs, power-tool battery packs, and small UPS systems, the PIC18F26Q10-I/ML monitors individual cell voltages via its multiplexed 10-bit ADC and balances cells via GPIO-driven FET switches. The SCAN/CRC peripheral performs automatic cyclic ADC scans in hardware, ensuring all cells are continuously monitored without CPU jitter. The HLT peripheral triggers protection shutdown on over-current or over-temperature events within microseconds, critical for safety. The 28-QFN package allows the design to fit inside battery-pack enclosures alongside the cell stack. CIPs reduce firmware complexity by 40-50% versus CPU-polled designs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC18F26Q10-I/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC18F26Q10T-I/ML | PIC18F26Q10-E/ML | PIC18F26Q10T-E/ML | PIC18F26K83-I/SS | PIC18F26K42-I/SS |
|---|---|---|---|---|---|---|
| Package | 28-QFN (6x6) | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-SSOP | 28-SSOP |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB | 64 KB |
| SRAM | 3.6 KB | 3.6 KB | 3.6 KB | 3.6 KB | 2 KB | 8 KB |
| EEPROM | 1024 bytes | 1024 bytes | 1024 bytes | 1024 bytes | 1024 bytes | 1024 bytes |
| Max CPU Clock | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) |
| ADC Resolution | 10-bit | 10-bit | 10-bit | 10-bit | 12-bit | 12-bit |
| Price @ qty 1000 (USD, as of 2026-09-27) | 1.20 | 1.20 | 1.30 | 1.30 | 1.85 | 1.95 |
Wichtigste Unterscheidungsmerkmale
- Smallest Microchip 8-bit MCU family member with Functional Safety (FuSa) feature set (vs. PIC18F26K22-I/SO)
- 5V-tolerance with 64 MHz CPU clock and Core Independent Peripherals (vs. PIC18F25K50-I/ML)
- Extended temperature variants available in the same 28-QFN footprint (vs. PIC18F26Q10-E/ML)
Designhinweise
Place a 100 nF ceramic decoupling capacitor on each VDD/AVDD pin pair within 5 mm of the package, plus a single 10 uF bulk capacitor near the supply pin. The PIC18F26Q10-I/ML has separate analog (AVDD/AVSS) and digital (VDD/VSS) supply pairs to reduce ADC noise coupling. For best ADC accuracy, route AVDD through a ferrite bead from VDD rather than connecting them directly. The exposed thermal pad (EP) of the 28-QFN package MUST be soldered to a copper pour on the PCB and connected to AVSS for thermal and electrical performance.
The 28-QFN package has a 6x6 mm footprint with an exposed thermal pad that requires thermal vias (typically 9-16 vias in a 3x3 or 4x4 array, 0.3 mm drill) to a bottom-layer copper pour. Place the MCLR/VPP/RE3 pin pull-up resistor (typically 10 kohm) close to the pin to ensure clean reset transitions. The ICSP programming pins (PGC/PGD = RB6/RB7) should have 4.7 kohm series resistors in production designs to allow in-circuit programming without disrupting the application circuit.
Two common pitfalls with the PIC18F26Q10-I/ML: (1) The /ML (QFN) and /SO (SOIC) packages have identical silicon but different footprints - do not assume pin compatibility at the PCB level. (2) The MCLR pin (RE3) is a dedicated reset input on QFN-28; it CANNOT be used as a general-purpose I/O on QFN-28 (unlike larger QFN packages where RE3 is a GPIO). Consult the device errata for CIP-specific limitations, particularly for the CWG and SCAN peripherals, before committing to firmware architectures. Use only Microchip-supported compilers (XC8) for FuSa-certified designs.
Estimated: At 64 MHz CPU clock and full peripheral activity, the PIC18F26Q10-I/ML dissipates roughly 30-50 mW typical, well within the 28-QFN package's thermal capability. The exposed thermal pad has a theta-JA of approximately 30-35 C/W on a standard 4-layer JEDEC test board. At +85 C ambient, this gives 95-100 C junction temperature, below the +150 C maximum. For designs at +125 C ambient (using the -E/ML variant), ensure the PCB copper pour is at least 100 mm^2 on top layer connected to the EP to keep junction temperature under +150 C.
Compliance-Informationen
Standard PIC18F26Q10-I/ML is industrial-grade (not AEC-Q100). Choose PIC18F26Q10-I/MLVAO for AEC-Q100 grade 1 qualification. RoHS and REACH compliant per Microchip product page; halogen-free per Microchip environmental compliance documentation.
