PIC18LF24K22-E/SS - 16KB Flash 8-bit MCU | Microchip | SSOP-28
Teilenummer: PIC18LF24K22-E/SS ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.85 | $3,85 |
| 10 | $3.5 | $35,00 |
| 100 | $2.95 | $295,00 |
| 500 | $2.65 | $1.325,00 |
| 1.000 | $2.4 | $2.400,00 |
PIC18LF24K22-E/SS Übersicht
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile program memory (Flash), data memory (RAM), EEPROM, and a set of peripherals such as timers, ADC, comparators, and communication interfaces onto one die. The PIC18LF family uses a modified Harvard RISC architecture that executes most instructions in one instruction cycle and reaches up to 16 MIPS throughput; the LF prefix indicates a wide operating voltage range that supports low-voltage (LF) operation, which makes the part suitable for battery-powered applications.
Key features include a 48 MHz maximum oscillator input with a 16 MIPS core, nanoWatt XLP extreme-low-power technology for sleep currents in the nanoamp range, an on-chip 10-bit ADC with up to 17 channels, multiple Enhanced USART, MSSP (I2C/SPI), and capture/compare/PWM peripherals. The 256-byte EEPROM supports endurance of up to 1,000,000 erase/write cycles per Microchip datasheet characterization.
The PIC18LF24K22-E/SS uses Microchip's nanoWatt XLP technology that delivers typical sleep currents below 100 nA with retention and features such as ultra-low-power wake-up, system clock gating, and peripheral disable. The wide 1.8V to 3.6V VDD range combined with internal oscillator choices enables battery- or energy-harvesting designs that previously required an external oscillator.
Typical applications include low-battery sensor nodes, portable consumer devices, industrial control panels, USB HID peripherals, and home-automation or IoT endpoints. The combination of XLP sleep current, ADC, PWM, and a rich mix of serial interfaces makes it a flexible general-purpose 8-bit controller for both mains- and battery-powered products.
When designing with this device, ensure that the configured system clock (HS, XT, EC, internal LF-INTOSC) matches the selected VDD range and that the MCLR pin is properly biased (POR) for current voltage. Use ICSP programming on dedicated PGD/PGC pairs to retain the device in-circuit during firmware updates.
This page synthesizes distributor pricing, drop-in alternatives within the PIC18LF K22 family, and practical design notes that complement, but are not a substitute for, the manufacturer datasheet.
Drop-in-Alternativen für PIC18LF24K22-E/SS – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC18LF24K22-E/SS (gleiche Bauform und Footprint) – abweichend in Core Architecture, MSL Level, Operating Temperature, Package, ADC.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC18LF24K22-I/SS
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC18LF24K22T-I/SS
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC18F24K22-I/SS
✅ Drop-In✓ Auf Lager
$1.32 / Stück
Datenblatt ansehen →PIC18LF25K22-I/SS
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC18LF23K22-I/SS
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC18LF24K22-E/SS Grenzwerte & elektrische Eigenschaften
| Device Family | PIC18LF XLP 18K |
| Core Architecture | 8-bit PIC RISC (modified Harvard) |
| Program Memory (Flash) | 16 KB (8K x 16) |
| Data RAM | 768 bytes |
| Data EEPROM | 256 bytes |
| Maximum CPU Speed | 48 MHz (16 MIPS) |
| Operating Voltage Range | 1.8 V to 3.6 V |
| I/O Pins | 24 |
| ADC | 10-bit, up to 17 channels |
| Comparators | 2 |
| Timers | 8-bit/16-bit with CCP and ECCP |
| Communication | 2x EUSART, 2x MSSP (I2C/SPI) |
| Gehäuse | 28-SSOP (5.30 mm body width) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40 to +125 °C (E = Extended) |
| Low-Power Technology | nanoWatt XLP |
| MSL-Level | 1 |
| RoHS-Status | Compliant |
| Programming | ICSP (In-Circuit Serial Programming) |
PIC18LF24K22-E/SS Pin-Konfiguration
| Pin 1 | RA0/AN0/C1IN0- — Digital I/O / Analog input 0 / Comparator 1 inverting input |
| Pin 2 | RA1/AN1/C1IN1-/C2IN3- — Digital I/O / Analog input 1 / Comparator inputs |
| Pin 3 | RA2/AN2/C2IN1-/VREF- — Digital I/O / Analog input 2 / Comparator / ADC VREF- |
| Pin 4 | RA3/AN3/C1IN1+/VREF+ — Digital I/O / Analog input 3 / Comparator / ADC VREF+ |
| Pin 5 | RA4/C1OUT/T0CKI/SRNQ — Digital I/O / Comparator 1 output / Timer0 clock / SR latch |
| Pin 6 | RA5/AN4/C2OUT/SRQ — Digital I/O / Analog input 4 / Comparator 2 output / SR latch |
| Pin 7 | RA6/OSC2/CLKOUT — Digital I/O / Oscillator output / Clock output |
| Pin 8 | RA7/OSC1/CLKIN — Digital I/O / Oscillator input / External clock |
| Pin 9 | VSS — Ground reference |
| Pin 10 | VDD — Positive power supply |
| Pin 11 | RB0/AN12/INT0/FLT0/SRI — Digital I/O / Analog 12 / External interrupt 0 / PWM fault |
| Pin 12 | RB1/AN10/C1IN3-/P1C — Digital I/O / Analog 10 / ECCP 1 channel |
| Pin 13 | RB2/AN8/C2IN2-/P1B — Digital I/O / Analog 8 / ECCP 1 channel |
| Pin 14 | RB3/AN9/C1IN2-/C2IN2+/P1C — Digital I/O / Analog 9 / ECCP 1 channel |
| Pin 15 | RB4/AN11/SDA/SDI/SRI — Digital I/O / Analog 11 / I2C SDA / SPI SDI |
| Pin 16 | RB5/AN13/SCL/SCK/SRQ — Digital I/O / Analog 13 / I2C SCL / SPI SCK |
| Pin 17 | RB6/PGC — Digital I/O / ICSP clock |
| Pin 18 | RB7/PGD — Digital I/O / ICSP data |
| Pin 19 | VSS — Ground reference |
| Pin 20 | VDD — Positive power supply |
| Pin 21 | RC0/P2A/SOSCO — Digital I/O / ECCP 2 channel / SOSC oscillator out |
| Pin 22 | RC1/P2B/SOSCI — Digital I/O / ECCP 2 channel / SOSC oscillator in |
| Pin 23 | RC2/AN14/P2D/P1D/CCP1 — Digital I/O / Analog 14 / ECCP channel |
| Pin 24 | RC3/AN15/P2C/P1C — Digital I/O / Analog 15 / ECCP channel |
| Pin 25 | RC4/P1B/T3CKI — Digital I/O / ECCP channel / Timer3 clock |
| Pin 26 | RC5/P1A/CCP2 — Digital I/O / ECCP channel |
| Pin 27 | RC6/TX/CK/AN17 — Digital I/O / EUSART TX / EUSART CK / Analog 17 |
| Pin 28 | RC7/RX/DT/AN16 — Digital I/O / EUSART RX / EUSART DT / Analog 16 |
Typische Anwendungen
PIC18LF24K22-E/SS ist geeignet für 7 Anwendungs: Battery-Powered Sensor Node, USB HID Peripheral, Industrial Control Panel, Home Automation / IoT Endpoint, Portable Consumer Device, Automotive Body Electronics (AEC-Q100), Energy Harvesting Wireless Switch.
Battery-Powered Sensor Node
The PIC18LF24K22-E/SS suits battery-powered sensor nodes because its 1.8-3.6V VDD range pairs with nanoWatt XLP sleep currents of ~9 nA typical to extend coin-cell or 2xAA lifetime beyond years. With a 48 MHz HFINTOSC and 16 MIPS throughput, the MCU can wake, sample sensors via its 10-bit ADC across 17 channels, transmit via the EUSART, and re-enter XLP sleep in under a millisecond. The 256-byte EEPROM lets the node store calibration constants across resets without external memory.
Empfohlen
USB HID Peripheral
The PIC18LF24K22-E/SS is well-suited to low-speed USB Human Interface Device applications when paired with an external USB transceiver. Its 16 MIPS throughput handles HID report generation, and the 16 KB Flash holds a full HID descriptor plus custom firmware. The 10-bit ADC captures analog control inputs (pots, sliders) while 2 EUSARTs handle debug and external modules. Designers note that this part does not include an integrated USB peripheral; for native USB choose PIC18F14K50.
Empfohlen
Industrial Control Panel
The PIC18LF24K22-E/SS supports industrial control panels because its -40 to +125 °C E temperature grade and 1.8-3.6V operating range meet harsh-environment requirements. Its Enhanced Capture/Compare/PWM modules drive motor control signals, while its 10-bit ADC reads back panel sensors. The wide VDD range tolerates regulated 24V-to-3.3V industrial rails with proper power supply design. ICSP allows in-field firmware updates via dedicated programming lines.
Empfohlen
Home Automation / IoT Endpoint
The PIC18LF24K22-E/SS fits home automation endpoints because its nanoWatt XLP technology delivers ~9 nA sleep current for battery-powered wireless sensor nodes that report temperature, humidity, or motion. The MSSP (I2C/SPI) peripherals interface to sensors and radios, while 2 EUSARTs can bridge to a host controller or external Wi-Fi/BLE module. The 16 KB Flash supports Zigbee or LoRaWAN stack variants from Microchip's MLA library.
Empfohlen
Portable Consumer Device
The PIC18LF24K22-E/SS fits portable consumer electronics such as fitness bands, e-readers, or remote controls because the 1.8-3.6V VDD range allows direct Li-ion battery connection and the nanoWatt XLP technology minimizes sleep current. The 24 I/O pins support 41-segment LCD/LED display drives, while the 16 MIPS CPU handles UI updates and BLE stack integration. The 28-SSOP package is thin enough for wearable form factors.
Empfohlen
Automotive Body Electronics (AEC-Q100)
The PIC18LF24K22-E/SS -E grade covers -40 to +125 °C suitable for non-safety automotive body modules such as seat controllers, mirror adjusters, or ambient lighting. For AEC-Q100 qualified automotive applications, designers should consider the PIC18F46K22-I/PT or PIC18F66K22 variants explicitly rated to AEC-Q100. The wide VDD and multiple PWM channels of the K22 family support motor and LED drive in body-electronics designs.
Empfohlen
Energy Harvesting Wireless Switch
The PIC18LF24K22-E/SS fits energy-harvesting wireless switches because its nanoWatt XLP sleep current (typically below 100 nA) allows operation from the few microjoules harvested by a piezo press or solar cell. The wide 1.8-3.6V VDD range accepts variable supercapacitor voltages, and the 16 MIPS CPU is fast enough to wake, transmit a packet via the EUSART, and re-enter sleep before the energy reservoir drains. EEPROM stores network pairing data without battery backup.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC18LF24K22-E/SS – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC18LF24K22-I/SS | PIC18LF24K22T-I/SS | PIC18F24K22-I/SS | PIC18LF25K22-I/SS | PIC18LF23K22-I/SS |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-SSOP | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same |
| Program Flash | 16 KB | 16 KB | 16 KB | 16 KB | 32 KB (+100%) | 8 KB (-50%) |
| Data RAM | 768 bytes | 768 bytes | 768 bytes | 768 bytes | 1024 bytes (+33%) | 512 bytes (-33%) |
| Operating Voltage Range | 1.8 V to 3.6 V (LF) | 1.8 V to 3.6 V (LF) | 1.8 V to 3.6 V (LF) | 2.3 V to 5.5 V (F - +1.9V wider) | 1.8 V to 3.6 V (LF) | 1.8 V to 3.6 V (LF) |
| Maximum Frequency | 48 MHz (16 MIPS) | 48 MHz (16 MIPS) | 48 MHz (16 MIPS) | 48 MHz (16 MIPS) | 48 MHz (16 MIPS) | 48 MHz (16 MIPS) |
| Operating Temperature | -40 to +125 °C (E grade) | -40 to +85 °C (I grade) | -40 to +85 °C (I grade) | -40 to +85 °C (I grade) | -40 to +85 °C (I grade) | -40 to +85 °C (I grade) |
| Low-Power Technology | nanoWatt XLP | nanoWatt XLP | nanoWatt XLP | nanoWatt XLP | nanoWatt XLP | nanoWatt XLP |
Wichtigste Unterscheidungsmerkmale
- Extended -40 to +125 °C temperature range (vs. PIC18LF24K22-I/SS)
- Wide 1.8 V to 3.6 V VDD range for battery and 3.3V systems (vs. PIC18F24K22-I/SS)
- Higher Flash density than lower-cost LF23K22 (vs. PIC18LF23K22-I/SS)
Designhinweise
Decouple VDD/VSS pairs (pins 10/9 and 20/19) with 100 nF ceramic capacitors placed within 3 mm of each VDD pin per Microchip DS40001412H. Add a bulk 1-10 uF tantalum or ceramic capacitor on the main supply rail. Use separate analog and digital supply tracks (AVDD/AVSS) when the ADC is active to minimize digital switching noise coupling into analog readings. For nanoWatt XLP designs, enable unused peripherals to their lowest-power state and disable the ADC during sleep to reach the ~9 nA sleep current figure.
Estimated: At 48 MHz / 16 MIPS full-load operation, the PIC18LF24K22-E/SS typically draws ~9 mA active current. With VDD = 3.3 V, power dissipation is ~30 mW per Microchip datasheet DS40001412H. The 28-SSOP package has thermal resistance theta_JA of approximately 80 °C/W, so the junction would only rise ~2-3 °C above ambient at room temperature. No heatsinking is required for typical 8-bit MCU loads. Designers should still verify thermal margin in -40 to +125 °C E grade applications where ambient can approach the upper limit.
Route the OSC1/OSC2 (RA7/RA6) traces short and symmetric to ground when using a crystal oscillator, placing the load capacitors within 2 mm of the OSC pins. Avoid routing digital switching signals under or near the analog AVSS/AVDD tracks to minimize ADC noise. The ICSP PGC/PGD pins (RB6/RB7) must be brought out to a programming header with no series resistors; a 10 kΩ pull-up on MCLR is recommended for normal operation. Leave RA7/OSC1 and RA6/OSC2 accessible even when using the internal oscillator, in case a crystal is needed.
Always read the device-specific silicon errata before committing to the PIC18LF24K22-E/SS - some ADC and CCP modules have documented errata that require workarounds. Do not exceed the absolute maximum VDD of 3.6 V on the LF variant; the 5 V-tolerant PIC18F24K22-I/SS must be selected if 5 V is required. The MCLR pin must never be left floating; tie to VDD through a 10 kΩ resistor to avoid spurious resets. Configure unused I/O pins as outputs and drive them low to minimize current leakage, especially in nanoWatt XLP designs.
Compliance-Informationen
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - choose AEC-Q100 qualified parts like PIC18F46K22-I/PT for automotive.
