PIC18LF25K83T-I/MX - 32KB Flash, 64MHz 8-bit MCU | Microchip
Teilenummer: PIC18LF25K83T-I/MX ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.62 | $3,62 |
| 10 | $3.25 | $32,50 |
| 100 | $2.78 | $278,00 |
| 500 | $2.45 | $1.225,00 |
| 1.000 | $2.18 | $2.180,00 |
| 3.300 | $1.96 | $6.468,00 |
PIC18LF25K83T-I/MX Übersicht
An 8-bit microcontroller (MCU) is a single-chip computer that processes data 8 bits at a time, belonging to the broader hierarchy of embedded microcontrollers -> microprocessors -> integrated circuits -> semiconductors. The PIC18 architecture is a modified Harvard RISC design with 31-level hardware stack, 8x8 hardware multiply, and vectored interrupt controller with fixed latency. PIC18 K-series devices are positioned above baseline PIC16 MCUs and below 16-bit dsPIC/PIC24 devices, targeting low-power mixed-signal applications.
Key features include 25 digital I/O lines, three 16-bit timers, four CCP/ECCP PWM modules, two UART, two I2C, three SPI (including one I2S-capable), a 12-bit ADC with up to 24 channels, 5-bit DAC, 8-bit DAC reference, and 4-wire CAN module. The XLP nanoWatt technology delivers down to 20 nA sleep current with RTCC and watchdog running, ideal for battery-powered IoT edge nodes. The 28-UQFN package provides a 6x6 mm footprint suitable for compact PCB designs.
The architecture integrates a precision 32 MHz internal oscillator (1% calibrated) plus a separate 32 kHz low-power oscillator for RTCC, eliminating external crystal requirements in many designs. The ADC2 peripheral offloads signal-conditioning tasks from the CPU through hardware averaging, oversampling, threshold comparison, and automatic accumulation, enabling 16-bit effective resolution. The DMA controller moves data between peripherals and memory without CPU intervention, freeing MIPS for application code.
Typical applications include automotive body and sensor nodes (CAN-enabled), capacitive touch user interfaces, industrial sensor conditioning, battery-powered IoT sensor endpoints, and small appliance control. The combination of CAN, ADC2, and XLP makes this MCU well suited for LIN/CAN bridge nodes and touch-button replacements for mechanical switches.
When designing with this part, ensure VDD decoupling uses a 100 nF ceramic capacitor placed within 2 mm of the package pin, and add a 10 uF bulk capacitor if the load current has high di/dt transients. Note that the 'MX' suffix denotes UQFN-28 package and the 'T' suffix denotes tape-and-reel packaging. The maximum operating temperature is 85 C (industrial grade).
This page synthesizes distributor pricing, verified drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with all data traceable to cited sources.
Drop-in-Alternativen für PIC18LF25K83T-I/MX – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC18LF25K83T-I/MX (gleiche Bauform und Footprint) – abweichend in ADC, Package, Timers, Program Memory (Flash), Core Architecture.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC18F25K83T-I/MX
✅ Drop-In✓ Auf Lager
$1.82 / Stück
Datenblatt ansehen →PIC18F26K83T-I/MX
✅ Drop-In✓ Auf Lager
$2.19 / Stück
Datenblatt ansehen →PIC18LF26K83T-I/MX
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1.45 / Stück
Datenblatt ansehen →PIC18F45K83T-I/MX
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PIC18LF45K83T-I/MX
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PIC18LF25K83T-I/MX Grenzwerte & elektrische Eigenschaften
| Core Architecture | 8-bit PIC18 (modified Harvard RISC) |
| Family | PIC18F/LF K83, XLP 18K |
| Program Memory (Flash) | 32 KB (16K x 16 words) |
| Data SRAM | 2 KB |
| Maximum CPU Frequency | 64 MHz |
| Operating Voltage Range | 1.8 V to 3.6 V |
| Digital I/O Pins | 25 |
| ADC | 12-bit ADC2 with Computation, up to 24 channels |
| DAC | 5-bit DAC, 8-bit DAC reference |
| Timers | 3 x 16-bit timers |
| PWM Channels | 4 CCP/ECCP modules |
| Communication Interfaces | 2x UART, 2x I2C, 3x SPI (one I2S), 1x CAN 2.0B |
| DMA | Yes, multi-channel DMA controller |
| Betriebstemperaturbereich | -40 C to +85 C (Industrial, 'I' suffix) |
| Gehäuse | 28-pin UQFN 6x6 mm (MX) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Programming Interface | ICSP (In-Circuit Serial Programming) |
PIC18LF25K83T-I/MX Pin-Konfiguration
| Pin 1 | RA0/AN0 — Digital I/O / Analog input channel 0 |
| Pin 2 | RA1/AN1 — Digital I/O / Analog input channel 1 |
| Pin 3 | RA2/AN2 — Digital I/O / Analog input channel 2 |
| Pin 4 | RA3/AN3 — Digital I/O / Analog input channel 3 |
| Pin 5 | RA4/AN4 — Digital I/O / Analog input channel 4 |
| Pin 6 | RA5/AN5 — Digital I/O / Analog input channel 5 |
| Pin 7 | RA6/AN6 — Digital I/O / Analog input channel 6 |
| Pin 8 | RA7/AN7 — Digital I/O / Analog input channel 7 |
| Pin 9 | VSS — Ground reference |
| Pin 10 | VDD — Positive power supply 1.8V-3.6V |
| Pin 11 | RB0/AN8 — Digital I/O / Analog input channel 8 / IOC |
| Pin 12 | RB1/AN9 — Digital I/O / Analog input channel 9 / IOC |
| Pin 13 | RB2/AN10 — Digital I/O / Analog input channel 10 / IOC |
| Pin 14 | RB3/AN11 — Digital I/O / Analog input channel 11 / IOC |
| Pin 15 | RB4/AN12 — Digital I/O / Analog input channel 12 / IOC |
| Pin 16 | RB5/AN13 — Digital I/O / Analog input channel 13 / IOC |
| Pin 17 | RB6/AN14/PGC — Digital I/O / Analog input / ICSP clock |
| Pin 18 | RB7/AN15/PGD — Digital I/O / Analog input / ICSP data |
| Pin 19 | RC0 — Digital I/O |
| Pin 20 | RC1 — Digital I/O |
| Pin 21 | RC2 — Digital I/O |
| Pin 22 | RC3 — Digital I/O |
| Pin 23 | RC4 — Digital I/O |
| Pin 24 | RC5 — Digital I/O |
| Pin 25 | RC6 — Digital I/O / TX |
| Pin 26 | RC7 — Digital I/O / RX |
| Pin 27 | RE3/MCLR — Digital input / Master Clear (reset) |
| Pin 28 | AVDD — Analog positive power supply |
Typische Anwendungen
PIC18LF25K83T-I/MX ist geeignet für 6 Anwendungs: Automotive CAN Sensor Node, Capacitive Touch User Interface, Battery-Powered IoT Sensor Endpoint, Industrial Sensor Conditioning Module, Small Appliance Control Board, LIN Bus Slave Node.
Automotive CAN Sensor Node
The PIC18LF25K83T-I/MX is purpose-built for automotive CAN sensor nodes and body-electronics ECUs. Its integrated CAN 2.0B controller (up to 1 Mbps) eliminates the need for an external transceiver's protocol logic, while the wide 1.8V-3.6V operation supports direct connection to 3.3V-regulated battery rails. The 12-bit ADC2 with CVD automates sensor signal conditioning for thermistor and pressure-sensor front ends. XLP nanoWatt technology with 20 nA sleep current extends ignition-off battery life beyond OEM quiescent-current budgets, making it well suited for always-on body modules.
Empfohlen
Capacitive Touch User Interface
The PIC18LF25K83T-I/MX excels in capacitive touch interfaces thanks to the ADC2 (12-bit ADC with Computation) peripheral that automates Capacitive Voltage Divider (CVD) sensing with hardware averaging, oversampling, and threshold comparison. Up to 24 ADC input channels allow a single MCU to scan 16+ touch electrodes, sliders, and proximity sensors simultaneously. The DMA controller offloads touch-scan data movement, freeing CPU cycles for gesture decoding. Combined with XLP nanoWatt sleep currents, the design supports battery-powered remote controls and sealed-PCB appliance interfaces where mechanical buttons are unsuitable.
Empfohlen
Battery-Powered IoT Sensor Endpoint
The PIC18LF25K83T-I/MX is optimized for battery-powered IoT sensor endpoints where every microamp matters. Its wide 1.8V-3.6V input range supports direct connection to single-cell Li-ion or 2x AA batteries without boost converters. XLP nanoWatt technology delivers 20 nA sleep current with RTCC and watchdog active, enabling multi-year coin-cell operation. The 64 MHz core runs 16 MIPS for sensor-fusion math, while DMA moves sensor data to RAM without waking the CPU. The DMA controller paired with ADC2 makes this MCU ideal for low-duty-cycle periodic-sampling sensor nodes.
Empfohlen
Industrial Sensor Conditioning Module
The PIC18LF25K83T-I/MX suits 4-20 mA loop-powered industrial sensor conditioning modules. The 12-bit ADC2 with 24 channels digitizes multiple bridge, RTD, and 4-20 mA current-sense inputs, while the 5-bit DAC generates excitation voltages. The integrated CAN or UART interface transmits conditioned data to a central PLC, and the wide-voltage 1.8V-3.6V range tolerates loop-powered supply variations. The industrial -40 C to +85 C temperature rating meets most factory-floor requirements, and the 28-UQFN 6x6 mm footprint supports compact DIN-rail-mounted module designs.
Empfohlen
Small Appliance Control Board
The PIC18LF25K83T-I/MX drives small home appliances such as coffee machines, blenders, and air purifiers, where its combination of PWM, ADC, and UART interfaces replaces discrete analog components. Four CCP/ECCP PWM channels control brushed-DC and small BLDC motors directly, while ADC2 reads temperature and flow sensors. The 32 KB Flash supports user-interface firmware including capacitive touch buttons and segmented LCD drive. The compact 28-UQFN 6x6 mm package fits within tight appliance enclosures, and the 1.8V-3.6V range simplifies switching supply design.
Empfohlen
LIN Bus Slave Node
The PIC18LF25K83T-I/MX serves as a cost-effective LIN (Local Interconnect Network) bus slave node in body-electronics and HVAC applications. With UART plus DMA, the part handles LIN 2.x protocol frames including checksum and PID handling entirely in firmware while DMA offloads byte buffering. The wide 1.8V-3.6V operation tolerates 12V-battery transients via an external LIN transceiver. The integrated 12-bit ADC2 reads HVAC temperature and humidity sensors, and the 32 KB Flash fits LIN state-machine plus application code within a single chip, eliminating external EEPROMs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC18LF25K83T-I/MX – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC18F25K83T-I/MX | PIC18F26K83T-I/MX | PIC18LF26K83T-I/MX | PIC18F45K83T-I/MX | PIC18LF45K83T-I/MX |
|---|---|---|---|---|---|---|
| Package | 28-UQFN (MX) 6x6 mm | 28-UQFN (MX) 6x6 mm - same | 28-UQFN (MX) 6x6 mm - same | 28-UQFN (MX) 6x6 mm - same | 28-UQFN (MX) 6x6 mm - same | 28-UQFN (MX) 6x6 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 32 KB | 32 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Data SRAM | 2 KB | 2 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Operating Voltage Range | 1.8 V to 3.6 V (LF wide-V) | 2.3 V to 5.5 V (F) | 2.3 V to 5.5 V (F) | 1.8 V to 3.6 V (LF) | 2.3 V to 5.5 V (F) | 1.8 V to 3.6 V (LF) |
| Maximum CPU Frequency | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| ADC | 12-bit ADC2, 24 channels | 12-bit ADC2, 24 channels | 12-bit ADC2, 24 channels | 12-bit ADC2, 24 channels | 12-bit ADC2, 24 channels | 12-bit ADC2, 24 channels |
| CAN Bus | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) |
| Operating Temperature | -40 C to +85 C (I) | -40 C to +85 C (I) | -40 C to +85 C (I) | -40 C to +85 C (I) | -40 C to +85 C (I) | -40 C to +85 C (I) |
Wichtigste Unterscheidungsmerkmale
- Wide-voltage 1.8V-3.6V operation in 28-UQFN (vs. PIC18F25K83T-I/MX (5V F variant))
- Half the Flash of 26K83 variants (vs. PIC18F26K83T-I/MX)
- Compact 28-UQFN 6x6 mm with full peripheral set (vs. PIC18F46K83T-I/MX (44-pin TQFP))
Designhinweise
Estimated: At VDD = 3.3V, CPU active at 64 MHz, with all peripherals enabled, typical operating current is approximately 10 mA per Microchip PIC18 K83 datasheet curves. Place a 100 nF ceramic decoupling capacitor within 2 mm of the VDD pin and a 10 uF bulk capacitor at the supply entry point. The PIC18LF25K83T-I/MX requires clean 1.8V-3.6V supply; consider a ferrite bead for noise-sensitive ADC2 applications to achieve full 12-bit SNR.
The 28-UQFN MX package requires careful thermal pad soldering for production reliability. The exposed thermal pad (EP) must be soldered to a 4 mm x 4 mm copper pad on the PCB top layer with at least 4 thermal vias (0.3 mm diameter) connecting to an internal ground plane. This provides both thermal dissipation and a low-impedance ground reference for ADC2 measurements. Per IPC-7351, the land pattern uses 0.4 mm pitch pads.
Avoid routing high-frequency signals (SPI > 10 MHz, PWM > 1 MHz) adjacent to analog ADC inputs to prevent coupling noise into ADC2 measurements. The MCLR pin (RE3) on 28-UQFN must NOT be left floating; tie it to VDD through a 10 kohm resistor to prevent spurious resets. The ICSP pins (RB6/PGC and RB7/PGD) require isolation resistors in production circuits to allow in-circuit programming without disconnecting the device.
For CAN bus applications, keep the CANH and CANL traces to the external transceiver short, matched-length, and routed as a differential pair with 100 ohm characteristic impedance. Place the CAN transceiver within 5 mm of the MCU's CANTX and CANRX pins to minimize EMI susceptibility. The oscillator circuit (if external crystal is used) must be placed within 5 mm of OSCI/OSCO with a guard ring tied to ground.
Compliance-Informationen
RoHS compliant per Microchip product declaration. Lead-free NiPdAu finish. JEDEC J-STD-020 MSL3 rated. For AEC-Q100 automotive qualification, contact Microchip for Q-grade variants.
