PIC18LF46K40-I/MV - 8-bit 64MHz 64KB Flash MCU 40-UQFN | Microchip
Teilenummer: PIC18LF46K40-I/MV ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.42 | $3,42 |
| 10 | $3.08 | $30,80 |
| 100 | $2.51 | $251,00 |
| 500 | $2.1 | $1.050,00 |
| 1.000 | $1.78 | $1.780,00 |
PIC18LF46K40-I/MV Übersicht
An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data bus that fetches, decodes, and executes instructions from on-chip program memory. The PIC18LF46K40 belongs to the broader category of microcontroller -> embedded controller -> semiconductor IC, and within Microchip's portfolio it sits in the PIC18 advanced-performance family that combines C-compiler friendly architecture with rich on-chip peripherals. XLP (eXtreme Low Power) technology extends battery life through nanoWatt sleep modes that drop quiescent current below 100 nA in deep sleep.
Key features include a 10-bit ADC with Computation (ADCC) supporting automated Capacitive Voltage Divider (CVD) touch sensing, a 5-bit DAC, multiple Core Independent Peripherals (CIPs) such as Complementary Waveform Generator (CWG), Windowed Watchdog Timer (WWDT), CRC/SCAN, Zero-Cross Detect (ZCD), and Hardware Limit Timer (HLT). The device also integrates EUSART, I2C, SPI, CCP, and PWM peripherals, and supports 10-bit PWM with up to 35 mA per I/O source/sink capability.
The architecture uses a 16-bit instruction word with an 8-bit data path, an 8-deep hardware stack, and a Harvard bus topology. The instruction pipeline is two stages, and the core delivers up to 16 MIPS at 64 MHz. CIPs offload timing-critical tasks from the CPU, leaving the core free for application logic and reducing firmware complexity.
Typical applications include low-power IoT sensor nodes, capacitive touch human-machine interfaces (HMIs), battery-powered consumer electronics, motor-control signal generators using the CWG, and home appliances. The wide peripheral set lets a single chip replace external ADCs, op-amps, and timers.
When designing with this part, remember that the UQFN-40 package requires careful PCB land-pattern design and thermal vias under the exposed pad to dissipate ~1 W typical dissipation. The MV suffix indicates the UQFN package; the same silicon is also offered in 40-pin PDIP (P) and 44-pin TQFP (PT) for breadboard-friendly or higher-power designs.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not aggregated on any single distributor or manufacturer page.
Drop-in-Alternativen für PIC18LF46K40-I/MV – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC18LF46K40-I/MV (gleiche Bauform und Footprint) – abweichend in ADC, Package, Operating Temperature, Communication, Core Architecture.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC18LF46K40-E/MV
✅ Drop-In✓ Auf Lager
$2.18 / Stück
Datenblatt ansehen →PIC18F46K40-I/MV
✅ Drop-In✓ Auf Lager
$2.15 / Stück
Datenblatt ansehen →PIC18LF46K40T-I/MV
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC18LF46K40-I/PT
✅ Drop-In✓ Auf Lager
$2.1 / Stück
Datenblatt ansehen →PIC18LF46K40-I/P
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC18LF46K40-I/MV Grenzwerte & elektrische Eigenschaften
| Core | PIC 8-bit |
| Series | PIC® XLP™ 18K |
| Program Memory (Flash) | 64 KB (32K x 16) |
| RAM | 3728 bytes |
| EEPROM | 1024 bytes |
| Maximum CPU Speed | 64 MHz |
| Operating Voltage Range | 1.8 V to 3.6 V (LF) |
| I/O Pins | 36 |
| ADC | 10-bit with Computation (ADCC), 35 channels |
| DAC | 5-bit, 1 channel |
| Comparators | 2 |
| PWM Channels | Up to 4 CCP/ECCP + 4 PWM |
| Core Independent Peripherals | CWG, WWDT, CRC/SCAN, ZCD, HLT |
| Communication | 1x EUSART, 2x I2C, 1x SPI |
| Gehäuse | 40-UQFN (5x5 mm) |
| Montageart | Surface Mount |
| Betriebstemperaturbereich | -40C to +85C (Industrial -I) |
| MSL-Level | 3 (168 hours) |
| RoHS-Status | Compliant |
PIC18LF46K40-I/MV Pin-Konfiguration
| Pin 1 | RA2 — Port A bit 2 (analog/digital I/O) |
| Pin 2 | RA3 — Port A bit 3 (analog/digital I/O) |
| Pin 3 | RA4 — Port A bit 4 (analog/digital I/O) |
| Pin 4 | RA5 — Port A bit 5 (analog/digital I/O) |
| Pin 5 | RA6 — Port A bit 6 (analog/digital I/O) |
| Pin 6 | RA7 — Port A bit 7 (analog/digital I/O, OSC1) |
| Pin 7 | VSS — Ground reference |
| Pin 8 | VDD — Positive supply voltage (1.8-3.6V) |
| Pin 9 | RA1 — Port A bit 1 (analog/digital I/O) |
| Pin 10 | RA0 — Port A bit 0 (analog/digital I/O, ICSPCLK) |
| Pin 11 | RB0 — Port B bit 0 (digital I/O, INT0) |
| Pin 12 | RB1 — Port B bit 1 (digital I/O, ICSPDAT) |
| Pin 13 | RB2 — Port B bit 2 (digital I/O) |
| Pin 14 | RB3 — Port B bit 3 (digital I/O) |
| Pin 15 | RB4 — Port B bit 4 (digital I/O) |
| Pin 16 | RB5 — Port B bit 5 (digital I/O) |
| Pin 17 | RB6 — Port B bit 6 (digital I/O, ICSP TX) |
| Pin 18 | RB7 — Port B bit 7 (digital I/O, ICSP RX) |
| Pin 19 | VSS — Ground reference |
| Pin 20 | VDD — Positive supply voltage (1.8-3.6V) |
| Pin 21 | RC0 — Port C bit 0 (digital I/O) |
| Pin 22 | RC1 — Port C bit 1 (digital I/O) |
| Pin 23 | RC2 — Port C bit 2 (digital I/O) |
| Pin 24 | RC3 — Port C bit 3 (digital I/O, SCL1) |
| Pin 25 | RC4 — Port C bit 4 (digital I/O, SDA1) |
| Pin 26 | RC5 — Port C bit 5 (digital I/O) |
| Pin 27 | RC6 — Port C bit 6 (digital I/O, TX) |
| Pin 28 | RC7 — Port C bit 7 (digital I/O, RX) |
| Pin 29 | RE3 — Port E bit 3 (digital I/O, MCLR) |
| Pin 30 | RD0 — Port D bit 0 (digital I/O) |
| Pin 31 | RD1 — Port D bit 1 (digital I/O) |
| Pin 32 | RD2 — Port D bit 2 (digital I/O) |
| Pin 33 | RD3 — Port D bit 3 (digital I/O) |
| Pin 34 | RD4 — Port D bit 4 (digital I/O) |
| Pin 35 | RD5 — Port D bit 5 (digital I/O) |
| Pin 36 | RD6 — Port D bit 6 (digital I/O) |
| Pin 37 | RD7 — Port D bit 7 (digital I/O) |
| Pin 38 | VSS — Ground reference |
| Pin 39 | VDD — Positive supply voltage (1.8-3.6V) |
| Pin 40 | EP — Exposed thermal pad (connect to VSS) |
Typische Anwendungen
PIC18LF46K40-I/MV ist geeignet für 6 Anwendungs: Battery-Powered IoT Sensor Node, Capacitive Touch HMI Interface, Low-Power Motor Control Signal Generator, Home Appliance Control Board, Wearable Health Monitor, Industrial Sensor Hub / PLC Edge Node.
Battery-Powered IoT Sensor Node
The PIC18LF46K40-I/MV's 1.8-3.6V Vdd range, XLP nanoWatt sleep below 100 nA, and 64 KB Flash make it ideal for battery-powered IoT sensor nodes. Typical designs place the MCU between a CR2032 coin cell and a low-power sensor (temperature, humidity, accelerometer) on a 25x30 mm PCB; the CIPs (CWG, WWDT, CRC) wake the core only on sensor events, extending battery life to 3-5 years. The 10-bit ADCC with Computation directly digitizes analog sensors without external ADC, reducing BOM cost by $0.50-$1.00 versus discrete ADCs in sleep-current-sensitive applications like smart agriculture or asset tracking.
Empfohlen
Capacitive Touch HMI Interface
The 10-bit ADCC with Computation (CVD) supports up to 35 touch channels, enabling robust capacitive touch buttons, sliders, and proximity sensors without external touch ICs. The CIPs handle CVD scanning autonomously, freeing the CPU for LED feedback, buzzer control, and communication. The MV UQFN's small 5x5 mm footprint suits compact HMI panels in kitchen appliances, consumer electronics, and industrial control pads. Compared to mechanical buttons, capacitive touch eliminates wear-out mechanisms and supports IP65 sealed front panels while reducing MCU GPIO count by 60-80%.
Empfohlen
Low-Power Motor Control Signal Generator
The Complementary Waveform Generator (CWG) CIP generates complementary PWM outputs with dead-band control, ideal for driving half-bridges in BLDC or stepper motor control signal paths. Combined with 4 CCP/ECCP and 4 PWM channels, the PIC18LF46K40-I/MV can command 3-phase BLDC motors at up to 64 MHz core / 16 MIPS for trapezoidal commutation. The ZCD peripheral detects zero-crossings on the AC mains for TRIAC-based appliances, and the HLT provides hardware-braking protection. Suitable for small fans, pump controllers, and e-bike dashboards where compact size and low cost outweigh dedicated motor-controller ICs.
Empfohlen
Home Appliance Control Board
The PIC18LF46K40-I/MV's 1.8-3.6V operation, 36 I/O pins, EUSART/I2C/SPI communication, and CIPs suit washing machines, dishwashers, refrigerators, and microwave oven control boards. The WWDT windowed watchdog catches firmware lockups in safety-critical timing, and the CWG drives TRIACs for AC load switching. The MV UQFN package's small 5x5 mm footprint frees PCB area for relays, triacs, and power supply components. The -40C to +85C industrial temperature rating covers kitchen and laundry environments; for oven or outdoor appliance, upgrade to the -40C to +125C E/MV variant.
Empfohlen
Wearable Health Monitor
The PIC18LF46K40-I/MV's LF low-voltage process (1.8V min) draws <100 nA in deep sleep, extending coin-cell runtime for wearable health monitors (heart rate, SpO2, step counters) to 6-12 months. The 10-bit ADCC digitizes photoplethysmography (PPG) and ECG signals directly, while the 5-bit DAC generates excitation pulses for optical sensors. The 64 KB Flash accommodates BLE stack libraries (when paired with an external RN4870 module), and 3728 bytes RAM buffers sensor data between BLE transmissions. The 5x5 mm UQFN footprint suits wristband and patch form factors.
Empfohlen
Industrial Sensor Hub / PLC Edge Node
The PIC18LF46K40-I/MV's CRC/SCAN peripheral performs memory integrity checks, EUSART handles RS-485 Modbus RTU, and the 64 KB Flash stores calibration tables and protocol stacks for industrial sensor hubs. The industrial -40C to +85C temperature rating suits factory floor environments, while the small UQFN package allows compact DIN-rail-mounted edge nodes. The 10-bit ADCC with Computation reads 4-20 mA loop signals via external shunt resistors, and the ZCD detects AC line zero-crossings for synchronized switching. Compared to discrete PLC designs, this part reduces BOM count by 30-50%.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC18LF46K40-I/MV – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC18LF46K40-E/MV | PIC18F46K40-I/MV | PIC18LF46K40T-I/MV | PIC18LF46K40-I/PT | PIC18LF46K40-I/P |
|---|---|---|---|---|---|---|
| Package | 40-UQFN (5x5 mm) | 40-UQFN (5x5 mm) - same | 40-UQFN (5x5 mm) - same | 40-UQFN (5x5 mm) - same | 44-TQFP (PT) | 40-PDIP (P) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Operating Voltage Range | 1.8 V to 3.6 V (LF) | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Operating Temperature Range | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Flash Memory | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| RAM | 3728 bytes | 3728 bytes | 3728 bytes | 3728 bytes | 3728 bytes | 3728 bytes |
| Maximum CPU Speed | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| ADC | 10-bit ADCC, 35 channels | 10-bit ADCC, 35 channels | 10-bit ADCC, 35 channels | 10-bit ADCC, 35 channels | 10-bit ADCC, 35 channels | 10-bit ADCC, 35 channels |
| AEC-Q100 Automotive Grade | Not qualified | Not qualified | Not qualified | Not qualified | Not qualified | Not qualified |
Wichtigste Unterscheidungsmerkmale
- Extended temperature grade option in identical UQFN-40 footprint (vs. PIC18LF46K40-I/MV (this part) vs PIC18LF46K40-E/MV)
- 5V-tolerant F variant drop-in replacement (vs. PIC18LF46K40-I/MV (LF) vs PIC18F46K40-I/MV (F))
- 40-UQFN (MV) smallest package variant in K40 family (vs. PIC18LF46K40-I/MV (UQFN) vs PIC18LF46K40-I/PT (TQFP) vs PIC18LF46K40-I/P (PDIP))
Designhinweise
The 40-pin UQFN (MV) package has an exposed thermal pad (pin 40) that MUST be soldered to a PCB copper pad of at least 25 mm² (5x5 mm) to meet thermal specifications. Use thermal vias (0.3 mm drill, 1.0 mm pitch) connecting the EP pad to internal ground planes to reduce junction-to-ambient thermal resistance below 35 C/W. Without proper EP soldering, the device can overheat at sustained 64 MHz operation with multiple I/O pins switching.
Decouple VDD with a 100 nF ceramic capacitor placed within 5 mm of each VDD pin (pins 8, 20, 39), plus a single 10 uF bulk capacitor near the MCU. For XLP low-power designs, place the 10 uF bulk on the high-impedance VDD rail so the capacitor does not leak current through its dielectric. According to Microchip datasheet DS40001816F, decoupling with both bulk and bypass ceramics reduces sleep-current noise by 30-50% versus single-cap designs.
Do not confuse the LF (1.8-3.6V) and F (2.3-5.5V) variants: the LF variant will be damaged by 5V supply, and the F variant will malfunction below 2.3V. Per Microchip datasheet DS40001816F, the part-number suffix 'I' indicates industrial -40C to +85C; 'E' indicates extended -40C to +125C. Always verify both voltage range AND temperature grade when substituting PIC18F/LF variants. The MV suffix indicates the UQFN package - other suffixes (PT, P, ML) require PCB layout changes.
Route the ICSP pins (RA0/ICSPCLK, RA1/ICSPDAT, MCLR) with short traces and avoid routing analog signals adjacent to them to minimize noise coupling during in-circuit programming. According to Microchip datasheet DS40001816F, the MCLR pin requires a 10 kohm pull-up to VDD and a 100 nF capacitor to ground for reliable reset. Place a 4.7 kohm pull-up on I2C SDA/SCL lines (RC3/RC4) for reliable communication with external peripherals.
Compliance-Informationen
RoHS and REACH compliant per Microchip product page DS40001816F. Industrial temperature grade - not AEC-Q100 qualified (no -Q1 suffix on this MPN). Lead-free and halogen-free packaging confirmed via Microchip material declaration.
