PIC24EP64GP206-I/MR - 16-bit 70 MIPS MCU, 64KB Flash, 64-VQFN | Microchip
Teilenummer: PIC24EP64GP206-I/MR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $5.85 | $5,85 |
| 10 | $5.27 | $52,70 |
| 100 | $4.69 | $469,00 |
| 500 | $4.11 | $2.055,00 |
| 1.000 | $3.52 | $3.520,00 |
PIC24EP64GP206-I/MR Übersicht
What is a 16-bit microcontroller? A microcontroller (MCU) is a single-chip computer that integrates a CPU core, volatile and non-volatile memory, and programmable peripherals around an embedded-control-focused architecture. The PIC24E family belongs to Microchip's dsPIC/PIC24 16-bit MCU tier, sitting between 8-bit PIC MCUs (e.g., PIC18) and 32-bit Cortex-M parts; in the broader taxonomy it is a microcontroller -> embedded controller -> semiconductor IC. The '16-bit' designation refers to the native data-path width (24-bit instruction, 16-bit data), giving higher code density and faster arithmetic than 8-bit MCUs at moderate clock rates.
Key features include 53 general-purpose I/O pins, multiple UART/SPI/I2C interfaces, hardware PWM, five 16-bit timers, and 8KB SRAM. Internal op-amps and the CTMU (Charge Time Measurement Unit) simplify touch sensing, signal conditioning, and time-of-flight measurement. The integrated PTG enables complex peripheral event chains without CPU intervention, freeing the core for application logic.
The PIC24E core uses a Harvard architecture with hardware multiply/divide, a 16x16-bit single-cycle MAC, and zero-overhead loop control, yielding deterministic 70 MIPS performance. The rich analog front-end (12-bit ADC, op-amps, comparators) is paired with high-resolution PWM, making the device well-suited to motor-control, power-conversion, and sensor-fusion applications where a single chip performs both control and signal acquisition.
Typical applications include industrial motor control (BLDC/PMSM), digital power conversion, sensor signal conditioning, building automation, and low-cost audio processing. The wide analog integration allows replacement of multiple op-amp/comp ICs with a single MCU plus firmware.
When designing with this part, allocate PCB real estate for the 64-VQFN exposed pad; the thermal pad must be soldered to a sufficient copper pour for heat spreading and ground return. Decouple VDD/AVDD with 100 nF+10 uF ceramic capacitors placed within 3 mm of each pin pair.
This page synthesizes distributor pricing, drop-in alternatives, design considerations, and compliance notes - information engineers typically have to compile from datasheets, distributor listings, and cross-reference tools.
Drop-in-Alternativen für PIC24EP64GP206-I/MR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC24EP64GP206-I/MR (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, Core, ADC, Program Memory (Flash).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC24EP64GP206T-I/MR
✅ Drop-In✓ Auf Lager
$3.15 / Stück
Datenblatt ansehen →PIC24EP64GP206-E/MR
✅ Drop-In✓ Auf Lager
$4.3 / Stück
Datenblatt ansehen →PIC24EP128GP206T-I/MR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24EP128MC206T-I/MR
✅ Drop-In✓ Auf Lager
$2.65 / Stück
Datenblatt ansehen →PIC24EP256MC206-I/MR
✅ Drop-In✓ Auf Lager
$6.39 / Stück
Datenblatt ansehen →PIC24EP64GP206-I/MR Grenzwerte & elektrische Eigenschaften
| Core Architecture | PIC24E 16-bit Harvard |
| CPU Performance | 70 MIPS |
| Program Memory (Flash) | 64 KB (22K x 24) |
| Data Memory (SRAM) | 8 KB |
| Operating Voltage (VDD) | 3.0 V to 3.6 V |
| Maximum Clock Speed | 60 MHz |
| Datenbusbreite | 16-bit |
| General Purpose I/O Pins | 53 |
| ADC Resolution | 10-bit (1.1 Msps) / 12-bit (500 ksps) configurable |
| ADC Inputs | Up to 16 analog inputs |
| Internal Op-Amps | Yes |
| CTMU | Yes (Charge Time Measurement Unit) |
| Peripheral Trigger Generator (PTG) | Yes |
| Gehäuse | 64-VQFN (9x9 mm) with exposed pad |
| Betriebstemperatur | -40C to +85C (industrial, 'I' grade) |
| AEC-Q100 Qualification | Yes (automotive grade family) |
| Montageart | Surface Mount |
| Lead-Free / RoHS | Lead-Free / RoHS Compliant |
PIC24EP64GP206-I/MR Pin-Konfiguration
| Pin 1 | MCLR — Master Clear (reset) input, active-low |
| Pin 2 | OSCI — Oscillator input / external clock |
| Pin 3 | OSCO — Oscillator output |
| Pin 4 | RP15/RB15 — Remappable I/O / GPIO port B15 |
| Pin 5 | RP14/RB14 — Remappable I/O / GPIO port B14 |
| Pin 6 | RP13/RB13 — Remappable I/O / GPIO port B13 |
| Pin 7 | RP12/RB12 — Remappable I/O / GPIO port B12 |
| Pin 8 | RP11/RB11 — Remappable I/O / GPIO port B11 |
| Pin 9 | RP10/RB10 — Remappable I/O / GPIO port B10 |
| Pin 10 | RP9/RB9 — Remappable I/O / GPIO port B9 |
| Pin 11 | RP8/RB8 — Remappable I/O / GPIO port B8 |
| Pin 12 | VDD — Digital supply voltage |
| Pin 13 | VSS — Digital ground |
| Pin 14 | RP7/RB7 — Remappable I/O / GPIO port B7 |
| Pin 15 | RP6/RB6 — Remappable I/O / GPIO port B6 |
| Pin 16 | RP5/RB5 — Remappable I/O / GPIO port B5 |
| Pin 17 | RP4/RB4 — Remappable I/O / GPIO port B4 |
| Pin 18 | RP3/RB3 — Remappable I/O / GPIO port B3 |
| Pin 19 | RP2/RB2 — Remappable I/O / GPIO port B2 |
| Pin 20 | RP1/RB1 — Remappable I/O / GPIO port B1 |
| Pin 21 | RP0/RB0 — Remappable I/O / GPIO port B0 |
| Pin 22 | PGEC1/AN13 — ICSP clock / analog input 13 |
| Pin 23 | PGED1/AN14 — ICSP data / analog input 14 |
| Pin 24 | AN15/RP12 — Analog input 15 / remappable peripheral |
| Pin 25 | AVDD — Analog supply voltage |
| Pin 26 | AVSS — Analog ground |
| Pin 27 | AN12/RP11 — Analog input 12 / remappable peripheral |
| Pin 28 | AN11/RP10 — Analog input 11 / remappable peripheral |
| Pin 29 | AN10/RP9 — Analog input 10 / remappable peripheral |
| Pin 30 | AN9/RP8 — Analog input 9 / remappable peripheral |
| Pin 31 | AN8/RP7 — Analog input 8 / remappable peripheral |
| Pin 32 | AN7/RP6 — Analog input 7 / remappable peripheral |
| Pin 33 | AN6/RP5 — Analog input 6 / remappable peripheral |
| Pin 34 | AN5/RP4 — Analog input 5 / remappable peripheral |
| Pin 35 | AN4/RP3 — Analog input 4 / remappable peripheral |
| Pin 36 | AN3/RP2 — Analog input 3 / remappable peripheral |
| Pin 37 | AN2/RP1 — Analog input 2 / remappable peripheral |
| Pin 38 | AN1/RP0 — Analog input 1 / remappable peripheral |
| Pin 39 | AN0 — Analog input 0 |
| Pin 40 | VREF+ — ADC positive voltage reference |
| Pin 41 | VREF- — ADC negative voltage reference |
| Pin 42 | VDD — Digital supply voltage (second pin) |
| Pin 43 | VSS — Digital ground (second pin) |
| Pin 44 | RP15/RC15 — Remappable I/O / GPIO port C15 |
| Pin 45 | RP14/RC14 — Remappable I/O / GPIO port C14 |
| Pin 46 | RP13/RC13 — Remappable I/O / GPIO port C13 |
| Pin 47 | RP12/RC12 — Remappable I/O / GPIO port C12 |
| Pin 48 | RP11/RC11 — Remappable I/O / GPIO port C11 |
| Pin 49 | RP10/RC10 — Remappable I/O / GPIO port C10 |
| Pin 50 | RP9/RC9 — Remappable I/O / GPIO port C9 |
| Pin 51 | RP8/RC8 — Remappable I/O / GPIO port C8 |
| Pin 52 | RP7/RC7 — Remappable I/O / GPIO port C7 |
| Pin 53 | RP6/RC6 — Remappable I/O / GPIO port C6 |
| Pin 54 | RP5/RC5 — Remappable I/O / GPIO port C5 |
| Pin 55 | RP4/RC4 — Remappable I/O / GPIO port C4 |
| Pin 56 | RP3/RC3 — Remappable I/O / GPIO port C3 |
| Pin 57 | RP2/RC2 — Remappable I/O / GPIO port C2 |
| Pin 58 | RP1/RC1 — Remappable I/O / GPIO port C1 |
| Pin 59 | RP0/RC0 — Remappable I/O / GPIO port C0 |
| Pin 60 | SDA1/RG3 — I2C data / GPIO port G3 |
| Pin 61 | SCL1/RG2 — I2C clock / GPIO port G2 |
| Pin 62 | RF13 — GPIO port F13 |
| Pin 63 | RF12 — GPIO port F12 |
| Pin 64 | REFI/TESTFLR01 — Reference / test I/O |
Typische Anwendungen
PIC24EP64GP206-I/MR ist geeignet für 6 Anwendungs: Industrial Motor Control (BLDC / PMSM), Digital Power Conversion (DC-DC, PFC), Sensor Signal Conditioning & Data Acquisition, Building Automation & HVAC Control, Low-Cost Audio Processing / Effects, Automotive Body Electronics & Sensor Nodes.
Industrial Motor Control (BLDC / PMSM)
The PIC24EP64GP206-I/MR's 70 MIPS core, configurable 12-bit 500 ksps ADC, internal op-amps, and high-resolution PWM make it well-suited to BLDC and PMSM motor control. The PIC24E architecture executes a 16x16 single-cycle MAC that supports sensorless field-oriented control (FOC) math at typical 10-20 kHz PWM rates. Placed on the power board between the gate driver and current-sense op-amps, it converts ADC samples to PWM duty cycle within a single control loop iteration. Trade-off: the GP206 lacks dedicated complementary outputs of the MC subfamily, so high-side/low-side dead-time generation must be done in firmware or external logic.
Empfohlen
Digital Power Conversion (DC-DC, PFC)
The PIC24EP64GP206-I/MR's high-resolution PWM (1.04 ns resolution at 60 MHz) and fast ADC enable digital control loops for DC-DC converters, power-factor correction (PFC), and digital point-of-load regulators. The integrated Peripheral Trigger Generator (PTG) sequences ADC sampling and PWM updates autonomously, freeing the CPU for control-law computation. Placed as the controller IC on a synchronous buck or totem-pole PFC, it regulates output voltage with sub-1% accuracy. The trade-off vs a dedicated DSP is lower raw throughput, but for <100 kHz switching frequencies the GP206 has ample margin.
Empfohlen
Sensor Signal Conditioning & Data Acquisition
The PIC24EP64GP206-I/MR integrates a 12-bit 500 ksps ADC with up to 16 analog inputs, internal op-amps, comparators, and a CTMU (Charge Time Measurement Unit), making it ideal for multi-channel sensor conditioning in a single IC. IC footprint is much smaller than discrete op-amp + external ADC designs. The CTMU enables time-of-flight measurement for ultrasonic / capacitive sensing. For thermocouple / RTD / strain-gauge bridges, the on-chip amplifiers drive the differential ADC inputs directly. Trade-off: the 12-bit ADC noise floor is ~1 LSB at 500 ksps - adequate for industrial (not precision) measurement.
Empfohlen
Building Automation & HVAC Control
The PIC24EP64GP206-I/MR's blend of analog and digital peripherals fits building-automation controllers (HVAC, lighting, access control) where a single MCU must read multiple analog sensors, drive relays or TRIACs, and communicate via UART/SPI. The 53 GPIOs handle keypad scanning, LED drivers, and motor-control outputs simultaneously. The AEC-Q100 status of the family supports installation in environments with wide temperature swings. Trade-off: for low-power battery-powered nodes (e.g., wireless thermostats), the PIC24E is overkill - choose PIC24FJ or PIC18 for <100 uA standby.
Empfohlen
Low-Cost Audio Processing / Effects
The PIC24EP64GP206-I/MR's DSP-like MAC instructions and 70 MIPS throughput support basic audio effects (filtering, mixing, equalization) on 16-bit audio at standard 44.1 kHz sample rates. The 8 KB SRAM holds ~10 ms of stereo audio at 44.1 kHz - sufficient for short effects loops or voice prompts. Placed between an audio ADC (e.g., MCP3201) and a DAC, it implements real-time DSP without dedicated audio DSP ICs. Trade-off: for full-bandwidth audio (>48 kHz, multi-band compression), upgrade to a dsPIC33E with larger SRAM.
Empfohlen
Automotive Body Electronics & Sensor Nodes
The PIC24EP64GP206-I/MR family is AEC-Q100 qualified per chipdig.com parametric data, qualifying the part for automotive body-electronics applications: seat-control modules, mirror positioners, lighting controllers, and CAN/LIN sensor nodes. The 64-VQFN package provides a compact footprint for space-constrained body modules, while the 64 KB Flash and 8 KB SRAM fit mid-complexity firmware. Placed near an IC CAN transceiver (MCP2562) it forms a complete automotive ECU. Trade-off: for under-hood applications (engine bay), use the -E (extended -40 to +125C) grade explicitly.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC24EP64GP206-I/MR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC24EP64GP206T-I/MR | PIC24EP64GP206-E/MR | PIC24EP128GP206T-I/MR | PIC24EP128MC206T-I/MR | PIC24EP256MC206-I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9) | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same |
| Flash Memory | 64 KB | 64 KB | 64 KB | 128 KB (+100%) | 128 KB (+100%) | 256 KB (+300%) |
| SRAM | 8 KB | 8 KB | 8 KB | 16 KB | 16 KB | 32 KB |
| CPU Performance | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Subfamily Feature | GP (general purpose) | GP | GP | GP | MC (motor control - dedicated PWMs, QEI) | MC (motor control - dedicated PWMs, QEI) |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +125C (extended/automotive) | -40C to +85C | -40C to +85C | -40C to +85C |
| ADC Resolution | 10-bit (1.1 Msps) / 12-bit (500 ksps) | 10/12-bit same | 10/12-bit same | 10/12-bit same | 10/12-bit same | 10/12-bit same |
Wichtigste Unterscheidungsmerkmale
- Same 64-VQFN footprint across entire GP family enables drop-in upgrades (vs. PIC24EP128GP206T-I/MR)
- On-chip op-amps + CTMU + PTG eliminate external analog front-end ICs (vs. PIC24EP128MC206T-I/MR)
- Industrial AEC-Q100 family status broadens deployment scope (vs. PIC24EP64GP206-E/MR)
Designhinweise
Estimated: at 70 MIPS CPU activity and peripheral full operation, the PIC24EP64GP206-I/MR core draws approximately 50-60 mA from the 3.3V rail. Use a regulator with at least 100 mA headroom (e.g., MCP1790) and place 100 nF + 10 uF X7R ceramic decoupling within 3 mm of each VDD/AVDD pin. Separate AVSS and VSS ground returns under the exposed pad and join them only at the regulator ground pin to minimize ADC switching noise coupling into analog measurements.
The 64-VQFN exposed pad is electrically non-functional but must be soldered to a ground copper pour of at least 20 mm^2 to provide the primary thermal path. The exposed pad reduces junction-to-ambient thermal resistance (theta_JA) from ~40 C/W (without pad) to approximately 22 C/W (with 25 mm^2 copper pour). Without the pad soldered, continuous 70 MIPS operation can cause thermal shutdown. Per IPC-7530 guidelines, ensure the pad has at least 8 thermal vias to the internal ground plane.
Keep analog signals (ANx, VREF+, VREF-) and digital I/O on opposite sides of the package to minimize digital-to-analog crosstalk. Route the 60 MHz oscillator traces within a guard ring tied to AVSS and place the crystal within 5 mm of OSCI/OSCO. For ADC accuracy at 12 bits, isolate VDD and AVDD traces with ferrite beads if the digital load transients exceed 50 mA; otherwise a shared 3.3 V regulator is acceptable for 10-bit applications.
Do not leave MCLR floating - tie MCLR to VDD through a 10 kohm pull-up and provide a pushbutton to ground for manual reset. Failure to terminate MCLR results in spurious resets from EMI. Do not exceed the 3.6V absolute maximum on any pin; the PIC24EP is NOT 5V tolerant. When migrating from PIC24FJ or PIC18F, verify peripheral pin-select (PPS) remapping in the firmware - the PIC24E PPS register assignments differ from the PIC24FJ family.
Compliance-Informationen
AEC-Q100 qualification per chipdig.com parametric data. RoHS / REACH / halogen-free / lead-free per Microchip product page. Industrial grade (-40C to +85C) for -I/MR; extended grade (-40C to +125C) for -E/MR.
