Microchip Technology

PIC24F08KA102-E/ML - 16-bit 32MHz 8KB Flash XLP MCU | Microchip

Teilenummer: PIC24F08KA102-E/ML ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
1.8 V to 3.6 V Vdss 28-pin QFN (6x6 mm) with exposed pad Package 32 MHz / 16 MIPS Speed 8 KB (2.75K x 24 words) Memory
Ab $0.76 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-09-29
Mengenpreise
Menge Stückpreis Gesamt
1 $1.21 $1,21
10 $1.1 $11,00
100 $0.97 $97,00
500 $0.86 $430,00
1.000 $0.76 $760,00
ℹ️ Alle Preise sind in USD

PIC24F08KA102-E/ML Übersicht

The Microchip PIC24F08KA102-E/ML is a 16-bit microcontroller featuring XLP (eXtreme Low Power) technology, 8KB Flash program memory, 1.5KB RAM, and 512B EEPROM, running at up to 32MHz (16 MIPS) in a 28-pin QFN (6x6 mm) package. It is engineered for power-constrained and battery-powered applications where nanoWatt XLP sleep currents and deep-sleep peripherals such as DSBOR, DSWDT and RTCC directly extend battery life. The -E temperature grade indicates an extended industrial operating range of -40C to +125C.

A PIC microcontroller is a compact MCU based on the Harvard architecture with on-chip Flash, RAM and peripherals. PIC24F parts are the 16-bit branch of the PIC family, sitting between the 8-bit PIC16/PIC18 line and the 32-bit PIC32 line. They offer higher throughput than 8-bit MCUs while retaining the deterministic peripheral set and broad tool support that PIC MCUs are known for. PIC24F08KA102-E/ML therefore targets applications that need 16-bit math, 32MHz CPU speed, and sub-uA sleep currents on a single chip.

Key features include 8KB Flash (2.75K x 24 words), 1.5KB SRAM (1.5K x 8), 512 bytes of EEPROM, 24 I/O pins on the 28-QFN package, an internal oscillator, and the nanoWatt XLP suite. Communication peripherals include I2C, SPI, and UART with PMP support. Analog resources cover a 10-bit ADC with multiple channels, comparators, and CTMU for capacitive touch. Multiple timer/counter modules, an RTCC with calendar, and deep-sleep DSBOR/DSWDT provide wake-up flexibility while consuming minimal current.

The device uses a 16-bit modified-Harvard core with a 24-bit instruction word, delivering 16 MIPS at 32MHz. The internal 8MHz and 32kHz oscillators reduce external BOM, while the 16-bit data path and DSP-friendly instruction set ease math-heavy sensor and signal-conditioning routines. Hardware multipliers and the peripheral pin-select logic reduce firmware glue, lowering flash pressure on the 8KB code budget.

Typical applications include battery-powered IoT sensor nodes, wearable health and fitness devices, smart remote controls, low-power metering, capacitive touch user interfaces, and industrial sensor conditioning. The deep-sleep current in the nA range makes the part well-suited to energy-harvesting and energy-aware designs where the average current must remain in microamperes.

When designing with PIC24F08KA102-E/ML, supply the part from a clean rail with a 0.1uF decoupling capacitor close to each VDD pin and bulk capacitance on the analog rail. The QFN exposed pad must be soldered to a grounded copper pour for thermal and electrical reasons. Firmware should use the XLP sleep modes aggressively and gate peripheral clocks to maximise average current savings.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

Drop-in-Alternativen für PIC24F08KA102-E/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit PIC24F08KA102-E/ML (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, ADC, Core Architecture, Maximum CPU Speed.

Microchip Technology
Package: 28-pin SSOP (5.30 mm width)
Maximum CPU Speed: 32 MHz (16 MIPS)
Microchip Technology
Package: 28-QFN (6x6 mm) with exposed pad
Operating Temperature: -40 C to +85 C (Industrial)
ADC: 10-bit, up to 13 channels, 500 ksps
Microchip Technology
Package: 28-pin SPDIP (Skinny Plastic DIP, through-hole)
Operating Temperature: -40 °C to +85 °C (Industrial, I-suffix)
ADC: 10-bit, up to 9 channels
Microchip Technology
Package: 28-QFN (ML) 6x6 mm
Operating Temperature: -40C to +85C (Industrial)
ADC: 10-bit, up to 9 channels
Microchip Technology
Package: 28-QFN (6x6 mm) with exposed pad
Operating Temperature: -40C to +125C (E suffix = automotive/extended)
Core Architecture: PIC24F (16-bit modified Harvard)
Microchip Technology
Package: 20-pin PDIP (0.300" / 7.62 mm)
Operating Temperature: -40 C to +125 C (industrial, E suffix)
Core Architecture: PIC24F (16-bit modified Harvard)
Microchip Technology
Package: 28-QFN (6x6 mm)
Operating Temperature: -40C to +125C (E suffix, extended)
ADC: 10-bit, 12 channels
Microchip Technology
Package: 28-pin QFN (6 × 6 × 0.9 mm) with exposed pad
Operating Temperature: -40 °C to +125 °C (E suffix, extended)
ADC: 12-bit, up to 500 ksps
Microchip Technology
Package: 44-pin QFN (8x8 mm) with exposed pad
ADC: 12-bit, up to 500 ksps
Core Architecture: 16-bit PIC (modified Harvard)
Microchip Technology
Package: 28-QFN (6x6 mm) with exposed pad
Operating Temperature: -40 °C to +85 °C (Industrial)
ADC: 10-bit, up to 16 channels

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

PIC24F08KA102-I/ML

✅ Drop-In
Microchip Technology
📦 28-QFN (6x6)
16-bit PIC24F (modified Harvard) · 32 MHz · 16 MIPS · 8 KB (2.75K x 24 instructions) · 1536 bytes (1.5 KB) · 512 bytes · 17 · 3.0 V to 3.6 V

✓ Auf Lager

$1.78 / Stück

Datenblatt ansehen →

PIC24F16KA102-I/ML

✅ Drop-In
Microchip Technology
📦 28-QFN (6x6)
PIC® XLP™ 24F · PIC24 16-bit RISC (modified Harvard) · Flash · 16 KB (5.5K x 24 instructions) · 1.5 KB · 512 B · 32 MHz (16 MIPS @ 3.3V) · 1.8 V to 3.6 V

✓ Auf Lager

$2.05 / Stück

Datenblatt ansehen →

PIC24F08KA101-I/ML

✅ Drop-In
📦 28-QFN (6x6)
same footprint/peripherals, but 512B EEPROM removed (0 vs 512B); firmware EEPROM code will not run

📋 Referenzalternative (nicht im Katalog)

ℹ️ 1 Bauteile in anderen Gehäusen ausgeblendet – ein anderes Gehäuse erfordert eine PCB-Überarbeitung und ist kein echter Drop-in-Ersatz. Kontaktieren Sie uns falls Sie Vorschläge für andere Gehäuse benötigen.

PIC24F08KA102-E/ML Grenzwerte & elektrische Eigenschaften

Core Architecture PIC 16-bit modified Harvard
Family PIC24F KA
Program Memory (Flash) 8 KB (2.75K x 24 words)
Data SRAM 1.5 KB (1.5K x 8)
EEPROM 512 B
Maximum CPU Speed 32 MHz / 16 MIPS
Number of I/O Pins 18
Gehäuse 28-pin QFN (6x6 mm) with exposed pad
Operating Voltage (VDD) 1.8 V to 3.6 V
Temperature Grade (E) -40C to +125C (extended)
ADC 10-bit, multi-channel
Comparators Yes
Communication Peripherals I2C, SPI, UART, PMP
Timers Multiple 16-bit Timer/Counter modules
RTCC Real-Time Clock Calendar with alarm
Low-Power Features nanoWatt XLP, deep sleep, DSBOR, DSWDT
Oscillator Internal 8 MHz and 32 kHz
Montageart Surface Mount
RoHS-Status Compliant

PIC24F08KA102-E/ML Pin-Konfiguration

QFN-28 Package Pinout Diagram QFN-28 5x5mm, P0.5mm, EP 3.1x3.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 QFN-28
Pin 1 MCLR — Master Clear (reset) input, drive low to reset
Pin 2 RA0 — Port A bit 0 / analog input AN0
Pin 3 RA1 — Port A bit 1 / analog input AN1
Pin 4 RA2 — Port A bit 2 / analog input AN2
Pin 5 RA3 — Port A bit 3 / analog input AN3
Pin 6 RA4 — Port A bit 4 / analog input AN4
Pin 7 VDD — Positive supply (1.8V to 3.6V)
Pin 8 VSS — Ground reference
Pin 9 OSCI — External oscillator input (optional)
Pin 10 OSCO — External oscillator output (optional)
Pin 11 RB0 — Port B bit 0 / INT0 / PGED1
Pin 12 RB1 — Port B bit 1 / INT1 / PGEC1
Pin 13 RB2 — Port B bit 2 / analog input AN5
Pin 14 RB3 — Port B bit 3 / analog input AN6
Pin 15 RB4 — Port B bit 4 / analog input AN7
Pin 16 RB5 — Port B bit 5 / analog input AN8
Pin 17 RB6 — Port B bit 6 / ICS PGC
Pin 18 RB7 — Port B bit 7 / ICS PGD
Pin 19 VSS — Ground reference (second bond pad)
Pin 20 RC0 — Port C bit 0
Pin 21 RC1 — Port C bit 1
Pin 22 RC2 — Port C bit 2
Pin 23 RC3 — Port C bit 3
Pin 24 RC4 — Port C bit 4
Pin 25 RC5 — Port C bit 5
Pin 26 RC6 — Port C bit 6
Pin 27 RC7 — Port C bit 7
Pin 28 VDD — Positive supply (second bond pad)
Pin EP EP — Exposed thermal pad - tie to ground for thermal dissipation

Typische Anwendungen

PIC24F08KA102-E/ML ist geeignet für 6 Anwendungs: Battery-Powered IoT Sensor Node, Wearable Fitness / Health Band, Capacitive Touch User Interface, Low-Power Smart Metering, Industrial Sensor Signal Conditioning, Smart Remote Control / Human-Interface Device.

🧩

Battery-Powered IoT Sensor Node

The PIC24F08KA102-E/ML's nanoWatt XLP deep-sleep current in the nA range and 32MHz/16 MIPS core make it a strong fit for battery-powered IoT sensor nodes. Typical duty cycles keep the MCU asleep for >99% of the time, only waking on DSWDT or an external interrupt to read a sensor over I2C, buffer the sample in 1.5KB RAM and transmit over a UART-linked radio. The 8KB Flash comfortably fits an RTOS-less state-machine scheduler plus a small LoRaWAN/Wi-Fi driver; the 1.8V-3.6V VDD range supports direct connection to a single-cell Li-ion or 2x AA battery. Energy harvesting with a small solar/thermal cell is feasible when the average current is kept below the source capability.

📱

Wearable Fitness / Health Band

Wearable fitness bands need weeks-to-months of battery life, a small 28-QFN footprint, and enough MIPS for motion-processing or heart-rate algorithms. PIC24F08KA102-E/ML delivers 16 MIPS for light DSP-style sensor fusion, plus the CTMU and 10-bit ADC for measuring pulse-oximeter or skin-conductance signals directly without an external analogue front-end. Deep-sleep current under 100 nA in the XLP modes means a 50 mAh coin cell can power a band logging 24x7. The 18 I/O pins are sufficient for an I2C OLED display, a SPI accelerometer and a GPIO button interface.

🎧

Capacitive Touch User Interface

The PIC24F08KA102-E/ML integrates the CTMU (Charge Time Measurement Unit) that turns any GPIO into a capacitive touch button with no external components, plus an internal 8MHz oscillator for low BOM cost. With 18 I/O pins, a 12-key keypad plus an I2C-controlled segmented LCD module can be driven directly, eliminating a dedicated touch controller. The 16 MIPS core handles water-rejection firmware and gesture decoding inside the 8KB Flash budget, while XLP sleep keeps idle consumption in the microamp range on battery-powered remotes or appliance panels.

🏭

Low-Power Smart Metering

Utility metering applications such as gas, water or heat meters demand long battery life, accurate RTC-driven logging, and robust peripheral support. The PIC24F08KA102-E/ML provides an RTCC with calendar and alarm, plus 512B EEPROM for non-volatile register and tamper logs. Its 10-bit ADC and internal 32kHz oscillator support low-frequency signal acquisition for pulse counting or front-end sensing. The -E temperature grade extends operation from -40C to +125C for outdoor or basement installations. With nanoWatt XLP, a meter can run 10+ years on a single lithium primary cell.

🏭

Industrial Sensor Signal Conditioning

Industrial sensor nodes need a small footprint, deterministic peripheral access, and an extended temperature grade. The PIC24F08KA102-E/ML operates from -40C to +125C, runs 16 MIPS, and exposes I2C/SPI/UART/PMP for a wide range of front-end sensors and local displays. The 10-bit ADC with internal reference and multiple comparators support direct 4-20 mA or 0-10V signal conditioning with external resistor dividers. Its 8KB Flash is enough for linearisation tables and PID control loops, and XLP sleep keeps standby power negligible in PLC backplane or remote-I/O designs.

📺

Smart Remote Control / Human-Interface Device

Battery-powered TV/set-top remotes, BLE gamepads and IR/RF controllers benefit from the PIC24F08KA102-E/ML's low sleep current, CTMU capacitive-touch buttons, and 8KB Flash for IR or proprietary RF protocol stacks. The UART/SPI peripherals drive Nordic or Texas Instruments transceivers for RF4CE/BLE, while the 10-bit ADC handles battery monitoring. Its 28-QFN 6x6 mm footprint fits inside a slim remote enclosure, and the -40C to +125C temperature grade handles automotive cabin or outdoor patio use.

Zusammenfassung der empfohlenen Produkte

MCP9808 I2C temperature sensor companion Verwendet in: Battery-Powered IoT Sensor Node PIC24F08KA101-I/ML Same family, no EEPROM variant Verwendet in: Battery-Powered IoT Sensor Node, Smart Remote Control / Human-Interface Device PIC24F08KA102-I/ML Microchip Technology Verwendet in: Wearable Fitness / Health Band MCP73831 Li-ion charger companion IC Verwendet in: Wearable Fitness / Health Band PIC24F16KA102-I/ML Microchip Technology Verwendet in: Capacitive Touch User Interface, Industrial Sensor Signal Conditioning MCP23017 I/O expander for additional buttons Verwendet in: Capacitive Touch User Interface PIC24F04KA201-I/SS Microchip Technology Verwendet in: Low-Power Smart Metering MCP79410 External I2C RTC for redundant timekeeping Verwendet in: Low-Power Smart Metering MCP6L01 Low-noise op-amp for signal front-end Verwendet in: Industrial Sensor Signal Conditioning MCP1640 Boost converter for single-cell remote supply Verwendet in: Smart Remote Control / Human-Interface Device
What is the program memory size of PIC24F08KA102-E/ML?
The PIC24F08KA102-E/ML contains 8KB of Flash program memory organised as 2.75K x 24 instruction words. According to the Microchip PIC24F KA family datasheet, this memory is split into a small bootloader region and a main application region. For code-heavy features, the 8KB cap typically fits real-time sensor processing but may be tight if a TCP/IP or USB stack is added.
How much RAM and EEPROM does PIC24F08KA102-E/ML have?
The device includes 1.5KB of SRAM (1.5K x 8) and 512 bytes of EEPROM. The EEPROM is rated for high erase/write endurance, suitable for storing calibration constants, user settings and learned parameters across power cycles. The 1.5KB RAM is shared with the stack, heap and peripheral FIFOs, so buffer sizing requires care in UART- or LCD-intensive applications.
What is the maximum CPU speed and operating voltage of PIC24F08KA102-E/ML?
The PIC24F08KA102-E/ML runs up to 32MHz CPU clock, delivering 16 MIPS, across a VDD range of 1.8V to 3.6V. The internal 8MHz and 32kHz oscillators can be switched at run time so that the firmware can drop CPU clock when entering sleep. This combination supports low-duty-cycle tasks on a single-cell Li-ion or two-AA battery source.
How many I/O pins does PIC24F08KA102-E/ML expose in the 28-QFN package?
The 28-QFN (6x6 mm) version exposes 18 general-purpose I/O pins. The remaining pins are VDD, VSS, MCLR and the exposed thermal pad. Peripheral pin-select (PPS) on most KA-family parts lets remappable peripherals be routed to a wide range of I/O, easing PCB routing when SPI or I2C positions conflict.
Where can I buy PIC24F08KA102-E/ML online and what is the price?
As of 2026-09-29, the PIC24F08KA102-E/ML is in stock at DigiKey, Mouser, LCSC and other franchised distributors. LCSC lists unit pricing from approximately $1.21 at qty 1. Bulk discounts typically lower the price to around $0.76 at the 1000-piece tier. Lead time for stock SKU is generally same-day to two weeks.
What is the lead time for PIC24F08KA102-E/ML?
Franchised distributors such as DigiKey and Mouser typically ship from on-hand stock, giving same-day or next-day dispatch when ordered before the cutoff. Factory lead time at Microchip for non-stock reels is usually 8 to 12 weeks. EOL concerns are not currently reported, so the part is expected to remain available.
Is PIC24F08KA102-E/ML in stock right now?
Yes, distributor stock is reported as active. DigiKey, Mouser and LCSC each list the part as available, with LCSC pricing as of 2026-09-29 starting at about $1.21 per unit. For high-volume production, Microchip direct or authorised brokers should be consulted for scheduled orders.
PIC24F08KA102-E/ML vs PIC24F08KA101 - which is better for battery-powered designs?
Both parts share the same 16-bit XLP core and 8KB Flash, but PIC24F08KA102 adds 512 bytes of EEPROM and slightly larger RAM, while PIC24F08KA101 omits EEPROM to save cost. For battery-powered designs that need to store calibration or user settings across power cycles, PIC24F08KA102-E/ML is the better choice. If EEPROM is unnecessary and cost is critical, PIC24F08KA101 is the lower-cost alternative.
What is the difference between PIC24F08KA102-E/ML and PIC24F08KA102-I/ML?
The -E suffix denotes the extended -40C to +125C industrial temperature grade, while the -I suffix denotes the standard -40C to +85C industrial grade. Pin-out, package and electrical characteristics are identical. Choose -E for under-hood, outdoor or harsh-environment applications, and -I for benign indoor or consumer products.
Can I drop-in replace PIC24F08KA102-E/ML with PIC24F08KA101-E/ML?
No - PIC24F08KA101 lacks the 512-byte EEPROM block, so firmware that uses EEPROM reads/writes will not function. Peripherals, Flash size, pinout and VDD range are otherwise identical, so a board-level swap is mechanically feasible but requires firmware changes. For a true drop-in, stay within the PIC24F08KA102 family (e.g. -I/ML grade).
What is the best drop-in replacement for PIC24F08KA102-E/ML?
The best drop-in is the same PIC24F08KA102 die in a different package or temperature grade, such as PIC24F08KA102-I/ML (standard -40C to +85C) or PIC24F08KA102-I/SP (28-SPDIP). These share identical peripherals, Flash, RAM and EEPROM. Cross-vendor drop-ins require redesign since the PIC instruction set is unique to Microchip.
Where to download PIC24F08KA102-E/ML datasheet PDF?
The official datasheet for PIC24F08KA102-E/ML is hosted at the Microchip website. The canonical PDF is published as DeviceDoc document 39934 (PIC24F KA Family datasheet) and is accessible via Microchip's product page. Distributor pages such as DigiKey and Mouser also link to the same PDF for download.
Where can I find the pinout of PIC24F08KA102-E/ML?
The pinout is documented in Section 1 (Pin Diagrams) and Section 2 (Guidelines for Getting Started with 16-bit Microcontrollers) of the PIC24F KA family datasheet. The 28-QFN (6x6 mm) version places pin 1 at the dot marker, with VDD/VSS pairs distributed for optimal analog/digital separation. This same datasheet applies to PIC24F08KA102-E/ML, PIC24F08KA101-E/ML and related KA parts.
What are the key specifications of PIC24F08KA102-E/ML that engineers should know?
Per the Microchip PIC24F KA family datasheet, the headline specifications are 16 MIPS at 32MHz, 8KB Flash, 1.5KB RAM, 512B EEPROM, 18 I/O on the 28-QFN (6x6 mm) package, and 1.8V-3.6V VDD with nanoWatt XLP sleep current. Operating temperature range is -40C to +125C for the -E grade. These parameters drive the part's fit for battery-powered, sensor-conditioning and capacitive-touch designs.

Technische Referenzdaten für PIC24F08KA102-E/ML – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose PIC24F08KA102-E/ML when you need a 16-bit Microchip MCU with XLP deep-sleep behaviour, on-board EEPROM, and an extended -40C to +125C industrial temperature grade in a compact 28-QFN (6x6 mm). It is ideal for battery-powered IoT sensor nodes, wearables, smart metering, capacitive touch interfaces and harsh-environment industrial sensing. Choose PIC24F08KA102-I/ML if your environment stays within -40C to +85C and you want the lower-cost temperature grade. Step up to PIC24F16KA102-I/ML when firmware headroom above 8KB Flash is required for stacks or libraries. Choose PIC24F08KA101-I/ML only if your firmware does not use EEPROM and you can save cost. PIC24F08KA102-I/SP is the same silicon in 28-SPDIP for through-hole prototypes and is NOT a drop-in replacement for the QFN footprint.

Vergleich mit Alternativen

Parameter Dieses Produkt PIC24F08KA102-I/ML PIC24F16KA102-I/ML PIC24F08KA101-I/ML PIC24F08KA102-I/SP
Package 28-QFN (6x6 mm) 28-QFN (6x6 mm) - same 28-QFN (6x6 mm) - same 28-QFN (6x6 mm) - same 28-SPDIP - different
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Flash 8 KB 8 KB 16 KB 8 KB 8 KB
RAM 1.5 KB 1.5 KB 1.5 KB 1.5 KB 1.5 KB
EEPROM 512 B 512 B 512 B 0 B 512 B
CPU Speed 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS
I/O Pins 18 18 18 18 18
Temperature Grade -40C to +125C (E) -40C to +85C (I) -40C to +85C (I) -40C to +85C (I) -40C to +85C (I)

Wichtigste Unterscheidungsmerkmale

  • Extended -40C to +125C industrial grade in 28-QFN (vs. PIC24F08KA102-I/ML)
  • Doubled Flash for code growth headroom (vs. PIC24F08KA102-I/ML)
  • EEPROM on-board for parameter storage (vs. PIC24F08KA101-I/ML)

Designhinweise

Estimated: the PIC24F08KA102-E/ML spec lists nanoWatt XLP sleep current in the nA range (Deep Sleep mode with DSBOR/DSWDT enabled). Use a 0.1uF ceramic decoupling capacitor on each VDD pin within 2mm of the package, plus 10uF bulk capacitance on the analog rail to prevent inrush dips when waking to 32MHz. If the design uses sleep duty cycles below 1%, expected average current is dominated by wake-up surges of ~1 mA for tens of microseconds, so keep decoupling tight.

The 28-QFN exposed thermal pad (EP) must be soldered to a copper pour of at least 1 square inch and tied to the ground plane. A continuous top-layer ground fill under the device improves EMI/ESD performance. For the 6x6 mm QFN, a 0.4mm pitch land pattern is recommended per IPC-7351, with NSMD pads to ease inspection. The 32kHz crystal area should be guarded by an isolated ground island to prevent switching noise coupling into the RTCC.

Estimated: common pitfalls include forgetting to disable the JTAG pins (RB6/RB7) in firmware when In-Circuit Serial Programming is not used, leaving those pins unable to function as GPIO. Always configure the JTAGEN bit in the device configuration register before initialisation. Another pitfall is enabling the CTMU without calibrating the reference trim bits, which causes large errors in capacitive-touch readings. For EEPROM endurance, ensure write operations are spaced and use wear-levelling if storing frequently-updated variables.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Yes
Konfliktmineralien
Compliant

RoHS/REACH compliant per Microchip product page. Not AEC-Q100 qualified; KA parts target consumer/industrial, not automotive safety-critical. Halogen-free per Microchip green-compliance documentation.

Daten verifiziert am: 2026-09-29 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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