PIC24F16KA102-E/ML - 32MHz 16-bit XLP MCU | Microchip
Teilenummer: PIC24F16KA102-E/ML ✓ AktivPIC24F16KA102-E/ML Übersicht
A microcontroller is a programmable semiconductor that integrates a CPU, memory, and peripherals on one device. The PIC24F16KA102 belongs to the PIC24 family of 16-bit general-purpose microcontrollers and provides a compact platform for embedded control, sensing, communications, and actuator management. Its XLP architecture supports low-power operation for systems that spend substantial time sleeping between activities.
The device combines 18 I/O pins with a 10-bit ADC, two comparators, multiple timers, and two watchdog timers. The ADC provides nine channels for analog measurement, while the comparators support thresholding and basic signal conditioning. XLP features include deep sleep, DSBOR, DSWDT, and RTCC, giving firmware several mechanisms for reducing current consumption while maintaining timing, supervision, and real-time-clock functionality.
The PIC24F16KA102-E/ML uses a PIC24 RISC core operating at up to 32 MHz and provides 16 MIPS of performance at 3.3 V according to the manufacturer family documentation. Program memory is organized as 16 KB, or 5.5K by 24 bits, while the data-memory configuration includes 1.5 KB of RAM and 512 bytes of EEPROM. This combination is suitable for compact control products requiring program space for networking, control logic, and peripheral handling.
Typical applications include battery-operated sensor nodes, industrial monitoring modules, building controls, compact instruments, and portable measurement equipment. The combination of 18 I/O, nine ADC channels, comparators, watchdog supervision, and XLP sleep modes supports designs that gather analog inputs, make local decisions, and remain powered efficiently between user interactions.
PCB design should preserve the exposed-pad thermal and electrical requirements of the 28-QFN package. Decoupling capacitors should be placed close to the appropriate supply pins, and the exposed pad should be connected to the appropriate plane using the manufacturer’s land-pattern and thermal-layout guidance. Firmware should also configure the intended clock, watchdog, and low-power modes for the operating environment.
This product page combines manufacturer specifications, package details, application guidance, and drop-in replacement analysis to support faster engineering decisions. It is intended to help designers evaluate the PIC24F16KA102-E/ML for low-power embedded systems while confirming footprint compatibility, memory requirements, peripheral availability, and sourcing availability.
Drop-in-Alternativen für PIC24F16KA102-E/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC24F16KA102-E/ML (gleiche Bauform und Footprint) – abweichend in Package, Program Memory Size, Timers, EEPROM Size, ADC.
PIC24F16KA102-I/ML
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →PIC24F16KA102T-I/ML
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →PIC24F16KA102-E/SP
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →PIC24F16KA102-E/ML Grenzwerte & elektrische Eigenschaften
| Product Type | 16-bit RISC microcontroller |
| Maximum Operating Frequency | 32 MHz |
| Performance | 16 MIPS at 3.3 V |
| Program Memory Size | 16 KB (5.5K x 24 bits) |
| RAM Size | 1.5 KB |
| EEPROM Size | 512 bytes |
| Number of I/O Pins | 18 pins |
| ADC Resolution | 10 bits |
| ADC Channels | 9 channels |
| Comparator Count | 2 comparators |
| Watchdog Timer Count | 2 watchdog timers |
| Timers | Multiple timers |
| Process Technology | CMOS |
| Low-Power Technology | XLP eXtreme Low Power |
| Low-Power Features | Deep sleep mode, DSBOR, DSWDT, and RTCC |
| Internal Oscillator | Yes |
| Gehäuse | 28-QFN (6 x 6 mm), exposed pad |
| Montageart | Surface mount |
| Packaging | Tube |
PIC24F16KA102-E/ML 28-qfn (6 x 6 mm), exposed pad Pinbelegungsleitfaden
Pinbelegung für PIC24F16KA102-E/ML (28-qfn (6 x 6 mm), exposed pad-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PIC24F16KA102-E/ML.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PIC24F16KA102-E/ML ist geeignet für 6 Anwendungs: Battery-Powered Sensor Node, Industrial Monitoring Module, Building Control and Automation, Portable Measurement Instrument, Energy-Harvesting Controller, Compact Control and Actuator Hub.
Battery-Powered Sensor Node
The PIC24F16KA102-E/ML fits compact battery-powered sensor nodes because it combines XLP low-power operation with 18 I/O pins and a nine-channel, 10-bit ADC. The microcontroller can acquire several analog sensor readings, process them locally, and enter deep sleep between measurement intervals, reducing the energy burden of continuously powered designs. Its 16 KB Flash and 1.5 KB RAM are sufficient for moderate sensor fusion, local filtering, and communication routines. Firmware should use the watchdog timers, DSWDT, and brown-out features to supervise long unattended operating periods.
Empfohlen
Industrial Monitoring Module
For industrial monitoring equipment, the PIC24F16KA102-E/ML provides 18 I/O pins alongside nine ADC channels, two comparators, multiple timers, and two watchdog timers. The ADC channels can supervise pressure, temperature, level, or analog process signals, while the comparators can perform local threshold detection without continuous CPU intervention. Its 32 MHz maximum operating speed allows responsive control logic, and XLP modes help modules that remain connected to long-lived battery or energy-harvesting systems. The industrial “E” ordering grade supports designs intended for extended operating environments.
Empfohlen
Building Control and Automation
The PIC24F16KA102-E/ML is suitable for compact building-control nodes that monitor sensors and operate relays, indicators, or digital actuators. Eighteen I/O pins provide practical connectivity for discrete inputs and outputs, while the 10-bit ADC supports analog inputs such as light, occupancy, temperature, and potentiometer sensing. Two comparators can handle simple threshold events, and multiple timers can coordinate periodic sampling or control intervals. Deep sleep and the RTCC help reduce power consumption in rooms or zones that are unoccupied for long periods.
Empfohlen
Portable Measurement Instrument
The PIC24F16KA102-E/ML can serve as the control core of a portable measurement instrument where display updates, sensor conditioning, user input, and battery operation share a constrained board area. The nine-channel 10-bit ADC supports multiple measurement inputs, while two comparators provide fast threshold references. At up to 32 MHz and 16 MIPS at 3.3 V, the device can combine acquisition, calculations, and user-interface updates. XLP sleep modes are valuable when the instrument must preserve battery charge between readings or measurements.
Empfohlen
Energy-Harvesting Controller
Energy-harvesting systems benefit from the PIC24F16KA102-E/ML because its XLP architecture is specifically intended for power-constrained operation. The controller can wake under a timer or external interrupt, sample available energy, operate actuators briefly, and return to a low-power state. DSBOR helps manage brown-out conditions, DSWDT provides supervision during wake cycles, and RTCC supports time-based scheduling with limited active processing. The 16 KB Flash footprint is adequate for compact energy-management algorithms while conserving board area.
Empfohlen
Compact Control and Actuator Hub
The PIC24F16KA102-E/ML can act as a compact actuator hub for pumps, valves, indicators, and local sensor loops. Its 18 I/O pins reduce the need for external digital I/O expansion, while multiple timers support periodic control, delay generation, and input capture. The two watchdog timers increase recovery confidence in unattended systems, and the comparators can implement simple safety thresholds on analog or digital signals. Its 28-QFN package permits compact placement where a 32 MHz control core, ADC, and low-power sequencing are needed together.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC24F16KA102-E/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC24F16KA102-I/ML | PIC24F16KA102T-I/ML | PIC24F16KA102-E/SP |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Maximum Operating Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Program Memory | 16 KB (5.5K x 24 bits) | 16 KB (5.5K x 24 bits) | 16 KB (5.5K x 24 bits) | 16 KB (5.5K x 24 bits) |
| RAM | 1.5 KB | 1.5 KB | 1.5 KB | 1.5 KB |
| EEPROM | 512 bytes | 512 bytes | 512 bytes | 512 bytes |
| ADC | 9-channel, 10-bit ADC | 9-channel, 10-bit ADC | 9-channel, 10-bit ADC | 9-channel, 10-bit ADC |
| Comparators | 2 comparators | 2 comparators | 2 comparators | 2 comparators |
| Low-Power Features | XLP, deep sleep, DSBOR, DSWDT, and RTCC | XLP, deep sleep, DSBOR, DSWDT, and RTCC | XLP, deep sleep, DSBOR, DSWDT, and RTCC | XLP, deep sleep, DSBOR, DSWDT, and RTCC |
| Packing | Tube | Tube | Tape and reel | Tube |
Wichtigste Unterscheidungsmerkmale
- Low-power integration in a 28-QFN device (vs. PIC24F16KA102-I/ML)
- Equivalent 32 MHz compute and memory configuration (vs. PIC24F16KA102T-I/ML)
- Focused peripheral set for compact embedded control (vs. PIC24F16KA102-E/SP)
Designhinweise
Use the Microchip 28-QFN land pattern and follow the exposed-pad connection and thermal-via guidance in the family data sheet. Place required decoupling capacitors adjacent to their power pins, provide a short ground return, and route sensitive analog inputs away from switching nodes. The exposed pad must not be treated as an optional mechanical feature because it contributes to electrical grounding and heat removal on this package.
Configure XLP sleep modes only after partitioning firmware into tasks that can be suspended and resumed safely. Disable unused peripherals and clocks before entering deep sleep, confirm that DSBOR and DSWDT settings match the battery’s discharge behavior, and avoid enabling periodic activity that would prevent the design from reaching its intended sleep current. Measure the complete board because sensor leakage and external pull networks can dominate system consumption.
Do not interchange ordering suffixes without checking every relevant field. The E, I, SP, ML, and T codes can affect temperature grade, package, or packing, and changing SP to ML requires a different physical footprint even though the device family is the same. Before approving a substitution, compare the pin table, exposed-pad geometry, electrical limits, programming configuration, and operating-temperature requirements.
Treat ADC and comparator inputs as sensitive analog nets. Route them away from digital clock, timer, and switching-supply paths, use a continuous ground reference, and terminate unused inputs according to the manufacturer’s recommendations. Because the ADC has 10-bit resolution, source impedance and acquisition-time requirements can materially affect conversion accuracy; verify the sampling configuration and source impedance against the family data sheet.
Compliance-Informationen
The manufacturer product page states that Microchip products meet the specifications contained in their individual data sheets. Specific RoHS, REACH, AEC-Q100, lead-free, halogen-free, and conflict-minerals declarations require confirmation from current regional product documentation or the supplier.
