PIC24F32KA302T-I/SS - 32MHz XLP MCU | Microchip
Teilenummer: PIC24F32KA302T-I/SS ✓ AktivPIC24F32KA302T-I/SS Übersicht
A PIC XLP microcontroller is a 16-bit RISC-based embedded controller optimized for energy efficiency rather than maximum compute throughput. The PIC24F32KA302 family combines conventional microcontroller functions with low-power peripherals such as DSBOR, DSWDT, and an RTCC that can continue operating in Deep Sleep mode. This places it within the broader hierarchy of embedded controller, microcontroller, semiconductor, and power-conscious IoT control systems.
Key features include 16 MIPS execution, a 12-bit ADC, and CTMU support for capacitive measurement. The 32 KB Flash program memory provides 11K x 24 words for application firmware, while 2 KB of SRAM supports working data and the 512-byte EEPROM preserves parameters without using Flash wear. The industrial-temperature option supports operation from -40°C to +85°C, while the 28-SSOP package keeps the footprint compatible with conventional surface-mount assembly.
The device combines a high-performance 16-bit core with peripherals designed to reduce external component count. CTMU can support touch sensing and other capacitive measurement circuits, the ADC handles analog inputs, and DSBOR, DSWDT, and RTCC support low-power system behavior. The manufacturer describes the family as featuring eXtreme Low Power consumption for applications constrained by battery energy or available thermal budget.
Typical uses include battery-operated sensors, compact industrial monitors, capacitive-control panels, wearable accessories, and low-power IoT nodes. In a sensor terminal, the MCU can sample an analog input, manage a capacitive interface, maintain timing through the RTCC, and enter Deep Sleep between measurement events. Its 16-bit architecture and 16 MIPS performance provide a practical balance between responsive control and reduced switching activity.
Design attention should focus on decoupling, ADC grounding, clock configuration, and low-power sequencing. Place the required input and output capacitors close to the appropriate supply pins, route analog and digital return currents carefully, and verify the external crystal or oscillator network against the electrical characteristics in the manufacturer datasheet. Budget wake-up and acquisition time whenever the firmware relies on periodic Deep Sleep operation.
This page organizes the PIC24F32KA302T-I/SS specifications, qualified same-package alternatives, application guidance, and design notes into an engineering-focused selection reference. It also identifies the functional differences among closely related 28-pin SSOP orderable variants to help designers distinguish temperature grades, packaging codes, and reel-format choices before approving a replacement.
Drop-in-Alternativen für PIC24F32KA302T-I/SS – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC24F32KA302T-I/SS (gleiche Bauform und Footprint) – abweichend in Package, CTMU, Operating Temperature, Mounting Type, ADC.
PIC24F32KA302-I/SS
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →PIC24F32KA302T-E/SSVAO
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24F32KA302-E/SSVAO
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24F32KA302-I/SP
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →PIC24F32KA302T-I/SS Grenzwerte & elektrische Eigenschaften
| Architecture | 16-bit PIC RISC |
| Maximum CPU Frequency | 32 MHz |
| Instruction Throughput | 16 MIPS |
| Program Memory | 32 KB Flash (11K x 24 words) |
| RAM | 2 KB |
| EEPROM | 512 bytes |
| ADC Resolution | 12 bits |
| CTMU Support | Yes |
| Gehäuse | 28-pin SSOP |
| Montageart | Surface mount |
| Betriebstemperatur | -40°C to +85°C |
| Temperature Grade | Industrial |
| Low-Power Technology | PIC XLP |
| Deep Sleep Peripheral | DSBOR |
| Deep Sleep Watchdog | DSWDT |
| Real-Time Clock | RTCC |
| Versorgungsspannung | 3.3 V |
PIC24F32KA302T-I/SS 28-pin ssop Pinbelegungsleitfaden
Pinbelegung für PIC24F32KA302T-I/SS (28-pin ssop-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PIC24F32KA302T-I/SS.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PIC24F32KA302T-I/SS ist geeignet für 6 Anwendungs: Battery-Powered Sensor Nodes, Capacitive Touch Control Panels, Compact Industrial Monitoring, Low-Power IoT Control Modules, Real-Time-Clock Data Loggers, Wearable and Portable Accessories.
Battery-Powered Sensor Nodes
The PIC24F32KA302T-I/SS fits battery-powered sensor nodes because its 32 MHz 16-bit core provides 16 MIPS of processing while DSBOR, DSWDT, and RTCC support low-power and Deep Sleep operation. The microcontroller can acquire a 12-bit ADC reading, condition the result, store calibration data in 512 bytes of EEPROM, and sleep until the next sampling event. This combination reduces external logic while preserving enough processing performance for sensor conditioning, threshold evaluation, and local status reporting.
Empfohlen
Capacitive Touch Control Panels
The PIC24F32KA302T-I/SS supports capacitive touch interfaces through its integrated CTMU and 12-bit ADC. A single microcontroller can scan electrodes, apply calibration, reject baseline drift, and implement debounce or gesture logic without a dedicated touch controller. At up to 16 MIPS, the 16-bit core can process several channels while XLP peripherals help the device remain inactive during idle periods, making the device suitable for compact keypads, appliance controls, and access panels.
Empfohlen
Compact Industrial Monitoring
The PIC24F32KA302T-I/SS is suitable for compact industrial monitors operating from -40°C to +85°C. Its 32 KB Flash supports local firmware, the 2 KB RAM supports working buffers, and the 12-bit ADC can monitor slowly varying analog conditions such as temperature, pressure, or supply voltage. DSBOR and DSWDT support resilient low-power operation, while the RTCC provides timing information for scheduled logging and periodic control updates.
Empfohlen
Low-Power IoT Control Modules
The PIC24F32KA302T-I/SS works as the control core in low-power IoT modules because its PIC XLP architecture combines 16-bit processing with Deep Sleep peripherals. Firmware can connect a CTMU-based input or 12-bit ADC sensor, evaluate local thresholds, update nonvolatile configuration, and then reduce activity between events. Its 28-pin SSOP package also permits a compact mixed-signal layout, although RF circuitry and communications protocols remain the responsibility of the surrounding design.
Empfohlen
Real-Time-Clock Data Loggers
The PIC24F32KA302T-I/SS fits real-time-clock data loggers that combine periodic measurements with long idle intervals. The integrated RTCC can maintain timing while the main core sleeps, and DSWDT provides a low-power watchdog function for recovery after unexpected faults. With 32 KB Flash for firmware and 512 bytes of EEPROM for configuration or counters, the device can timestamp records, manage alarms, and sequence sensor acquisition without requiring a separate real-time-clock IC.
Empfohlen
Wearable and Portable Accessories
The PIC24F32KA302T-I/SS can serve as the low-power controller in wearable accessories and portable products where processing demand is modest but battery life is critical. The 16-bit core handles button logic, capacitive sensing, and 12-bit analog measurements at up to 16 MIPS, while XLP functions reduce activity during idle periods. Its 28-pin SSOP package supports compact assemblies, although final suitability depends on the accessory's peak current, radio duty cycle, and thermal conditions.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC24F32KA302T-I/SS – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC24F32KA302-I/SS | PIC24F32KA302T-E/SSVAO | PIC24F32KA302-E/SSVAO | PIC24F32KA302-I/SP |
|---|---|---|---|---|---|
| Package | 28-pin SSOP | 28-pin SSOP | 28-pin SSOP | 28-pin SSOP | 28-pin SSOP |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Architecture | 16-bit PIC RISC | 16-bit PIC RISC | 16-bit PIC RISC | 16-bit PIC RISC | 16-bit PIC RISC |
| Maximum CPU Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Instruction Throughput | 16 MIPS | 16 MIPS | 16 MIPS | 16 MIPS | 16 MIPS |
| Flash Memory | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| RAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB |
| EEPROM | 512 bytes | 512 bytes | 512 bytes | 512 bytes | 512 bytes |
| ADC Resolution | 12 bits | 12 bits | 12 bits | 12 bits | 12 bits |
| Qualification Code | I - Industrial | I - Industrial | E - alternate qualification | E - alternate qualification | I - Industrial |
Wichtigste Unterscheidungsmerkmale
- Closest listed substitution retains identical core and memory ratings (vs. PIC24F32KA302-I/SS)
- PIC XLP integration consolidates low-power system functions (vs. PIC24F32KA302-I/SP)
- Industrial-temperature option supports wider environmental use (vs. PIC24F32KA302T-E/SSVAO)
Designhinweise
Design the supply network around the 3.3 V operating point and use the manufacturer-recommended decoupling configuration from the PIC24F32KA302 datasheet. Place bulk and high-frequency bypass capacitors close to the device's supply and ground pins, and keep the return path short to reduce transient ground potential. When Deep Sleep is used, verify that the sleep current includes leakage from the external sensor network, pull resistors, regulators, and communication circuitry rather than the microcontroller alone.
Separate analog inputs and the 12-bit ADC return path from switching nodes and high-current load returns. CTMU electrodes are especially sensitive to contamination, moisture, long traces, and nearby high-impedance nodes. Use a quiet analog ground region where appropriate, route sensor traces away from clocks and switching inductors, and test the complete sensor and analog section with production-representative cables and enclosure conditions.
Do not select a related order code solely because it is in the same PIC24F32KA302 family. The /SO and /ML options use different physical packages, while the T, E, I, SS, SP, and VAO identifiers can affect assembly format, qualification, or ordering conditions. For a PCB already designed for the 28-pin SSOP, compare the manufacturer package drawing, pin table, temperature rating, reel format, and qualification requirements before approving a substitution.
Low-power functionality depends on correct peripheral configuration as well as the sleep instruction sequence. Confirm DSBOR, DSWDT, and RTCC behavior in Deep Sleep, including wake-up sources, oscillator restart time, and peripheral retention. For battery-powered designs, measure the complete sleep-to-wake cycle at the system level and include ADC settling time before treating an RTCC timestamp as the exact instant of measurement.
Compliance-Informationen
The exact RoHS, REACH, AEC-Q100, lead-free, halogen-free, and conflict-minerals declarations for this orderable number were not stated. Confirm these attributes using the manufacturer product documentation and the current declaration files before regulatory submission.
