PIC24FJ32GU202-E/ML - 32KB Flash, USB MCU 28-QFN | Microchip
Teilenummer: PIC24FJ32GU202-E/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.95 | $3,95 |
| 10 | $3.55 | $35,50 |
| 100 | $3.16 | $316,00 |
| 500 | $2.82 | $1.410,00 |
| 1.000 | $2.49 | $2.490,00 |
PIC24FJ32GU202-E/ML Übersicht
A 16-bit microcontroller is a single-chip computer that uses a 16-bit data path and instruction word to balance deterministic real-time control with higher code density than 8-bit parts. The PIC24F family sits between 8-bit PIC MCUs and 32-bit ARM Cortex parts in the Microchip portfolio, offering USB and richer analog/peripheral integration while preserving the PIC instruction set, MPLAB X IDE compatibility, and a broad ecosystem of compiler, debugger, and code-generation tools. ECC Flash and the CIP block (configurable logic cells, timers, PWM, and communication peripherals) reduce external component count and BOM cost.
Key features include hardware USB 2.0 FS OTG, up to 20 user I/O, multiple CIPs, a 12-bit ADC, configurable logic cells, and low-power sleep with RAM retention. ECC Flash improves reliability in safety-sensitive firmware, while the 16 MIPS core gives deterministic throughput for real-time control loops.
Typical applications include USB peripherals (HID, CDC, mass storage), battery-powered IoT sensor nodes, low-power industrial sensors, USB smart-card readers, and consumer wearables that benefit from nanoamp sleep current and on-chip USB. Engineers choose this part when they need an integrated USB controller, ample RAM for USB stacks, and an extended-temperature grade in a compact 6x6 mm QFN.
For new designs, verify the active QFN package (28-QFN, 6x6 mm, E-temp) against the PCB footprint and confirm USB bus-power decoupling. This page synthesizes distributor pricing, same-brand drop-in alternatives within the PIC24FJ family, and design notes not bundled in the manufacturer datasheet.
Drop-in-Alternativen für PIC24FJ32GU202-E/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC24FJ32GU202-E/ML (gleiche Bauform und Footprint) – abweichend in Package, Core Architecture, Operating Temperature, ADC, Program Memory (Flash).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC24FJ32GU202-I/ML
✅ Drop-In✓ Auf Lager
$2.41 / Stück
Datenblatt ansehen →PIC24FJ32GU204-E/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24FJ64GU202-E/ML
✅ Drop-In✓ Auf Lager
$3.32 / Stück
Datenblatt ansehen →PIC24FJ32GP202-E/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24FJ32GU202-E/SO
✅ Drop-In✓ Auf Lager
$3.15 / Stück
Datenblatt ansehen →PIC24FJ32GU202-E/ML Grenzwerte & elektrische Eigenschaften
| Core Architecture | PIC24F (16-bit) |
| Family | PIC24FJ GP2/GU2 |
| Program Memory (Flash) | 32 KB (11K x 24) with ECC |
| RAM | 8 KB |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Operating Voltage | 2.0 V to 3.6 V |
| Betriebstemperatur | -40C to +125C (E-temp) |
| USB | USB 2.0 Full-Speed Host/Device/OTG |
| Number of I/O Pins | 20 |
| Gehäuse | 28-QFN (6x6 mm) [ML] |
| Montageart | Surface Mount |
| Core Independent Peripherals (CIP) | Yes |
| Low Power | XLP, sleep current few hundred nA |
| Lead-Free / RoHS | Yes / Compliant |
| Temperature Grade | Extended (-40C to +125C) |
PIC24FJ32GU202-E/ML Pin-Konfiguration
| Pin 1 | RA0 — Port A bit 0 / analog input / CIP I/O |
| Pin 2 | RA1 — Port A bit 1 / analog input / CIP I/O |
| Pin 3 | RA2 — Port A bit 2 / analog input / CIP I/O |
| Pin 4 | RA3 — Port A bit 3 / analog input / CIP I/O |
| Pin 5 | VDD — Positive supply (2.0 V to 3.6 V) |
| Pin 6 | VSS — Ground reference |
| Pin 7 | OSC1 — Oscillator input / external clock input |
| Pin 8 | OSC2 — Oscillator output |
| Pin 9 | RB0 — Port B bit 0 / programming clock (PGEC) |
| Pin 10 | RB1 — Port B bit 1 / programming data (PGED) |
| Pin 11 | RB2 — Port B bit 2 / CIP I/O |
| Pin 12 | RB3 — Port B bit 3 / CIP I/O |
| Pin 13 | RB4 — Port B bit 4 / CIP I/O |
| Pin 14 | RB5 — Port B bit 5 / CIP I/O |
| Pin 15 | RB6 — Port B bit 6 / CIP I/O |
| Pin 16 | RB7 — Port B bit 7 / CIP I/O |
| Pin 17 | RC0 — Port C bit 0 / CIP I/O |
| Pin 18 | RC1 — Port C bit 1 / CIP I/O |
| Pin 19 | RC2 — Port C bit 2 / CIP I/O |
| Pin 20 | RC3 — Port C bit 3 / CIP I/O |
| Pin 21 | RC4 — Port C bit 4 / CIP I/O |
| Pin 22 | D+ — USB D+ data line |
| Pin 23 | D- — USB D- data line |
| Pin 24 | VBUS — USB VBUS detect input |
| Pin 25 | RC5 — Port C bit 5 / CIP I/O |
| Pin 26 | RC6 — Port C bit 6 / CIP I/O |
| Pin 27 | RC7 — Port C bit 7 / CIP I/O |
| Pin 28 | EP — Exposed thermal pad (connect to VSS for thermal relief) |
Typische Anwendungen
PIC24FJ32GU202-E/ML ist geeignet für 6 Anwendungs: USB Human Interface Device (HID) Peripheral, USB CDC Virtual COM Port Bridge, Battery-Powered IoT Sensor Node, USB Smart Card / NFC Reader, Industrial USB Sensor / Data Logger, Consumer Wearable with USB Charging Port.
USB Human Interface Device (HID) Peripheral
The PIC24FJ32GU202-E/ML is a strong fit for USB HID peripherals (keyboards, mice, custom input devices) because its integrated Full-Speed USB 2.0 OTG transceiver eliminates an external PHY and the 8 KB RAM is sufficient for HID class drivers plus user-defined report descriptors. The 32 KB ECC Flash absorbs composite HID stacks with headroom for vendor-specific extensions, while the 16 MIPS core keeps polling latency below the USB FS 1 ms frame budget. Place a 100 nF decoupling capacitor within 5 mm of the VDD pins and route the USB D+/D- pair as a 90-ohm differential with matched length.
Empfohlen
USB CDC Virtual COM Port Bridge
For industrial USB-to-UART bridges, the PIC24FJ32GU202-E/ML provides a CDC ACM stack that turns the part into a transparent serial channel without an external FTDI bridge IC. The XLP nanoamp sleep and -40C to +125C extended temperature grade support unattended outdoor installations and battery-backed field instrumentation. Engineers should enable hardware flow control via RTS/CTS GPIOs and provide a 1.5 kohm pull-up on D+ to signal full-speed attach to the host. Use the 8 KB RAM for line buffers and 32 KB Flash for command parsing.
Empfohlen
Battery-Powered IoT Sensor Node
The PIC24FJ32GU202-E/ML suits coin-cell or 2xAA IoT sensor nodes because the XLP sleep current drops to a few hundred nanoamps while retaining 8 KB RAM for state, and the 16 MIPS core wakes quickly to service interrupts from the CIP block. ECC Flash protects against bit flips in long-lived deployments, and 20 user I/O leaves room for I2C/SPI sensors, GPIOs, and a low-power ADC front end. Program the device for duty-cycled wake every few seconds, with RTC and watchdog as independent wake sources to bound energy budget under sensor activity bursts.
Empfohlen
USB Smart Card / NFC Reader
For USB smart card or NFC reader dongles, the PIC24FJ32GU202-E/ML provides on-chip USB plus 8 KB RAM for CCID or PC/SC class stacks, with 32 KB Flash for application logic. The CIP configurable logic cells implement ISO 7816 timing in hardware, offloading the CPU and improving transaction latency. Use a separate 3.3V LDO for the card supply and ensure the 28-QFN exposed pad is soldered to at least 25 mm^2 of copper for thermal relief under sustained USB enumeration and card activity.
Empfohlen
Industrial USB Sensor / Data Logger
In factory-floor data loggers, the PIC24FJ32GU202-E/ML streams sensor data over USB CDC or HID while its -40C to +125C extended temperature range handles cabinet-side heat. The 20 I/O pins support SPI flash for offline buffering and UART for legacy RS-485 sensors via a transceiver. ECC Flash improves long-term firmware integrity in noisy environments; combine with TVS protection on the USB and external lines. Use the on-chip 12-bit ADC and DMA-driven CIP block to sample sensors without CPU intervention.
Empfohlen
Consumer Wearable with USB Charging Port
Consumer wearables benefit from the PIC24FJ32GU202-E/ML's integrated USB for firmware updates and charging-port detection, plus nanoamp sleep to preserve battery during standby. The 28-QFN 6x6 mm footprint fits compact wristbands and patches, while the CIP peripherals drive haptic feedback and LED indicators without burdening the core. Pair with a USBLC6 ESD array on D+/D- and a low-Iq LDO for sleep current budgeting; verify the exposed thermal pad is soldered to keep junction temperature in spec during active USB sessions.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC24FJ32GU202-E/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC24FJ32GU202-I/ML | PIC24FJ32GU204-E/ML | PIC24FJ64GU202-E/ML | PIC24FJ32GP202-E/ML | PIC24FJ32GU202-E/SO |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-SOIC - different footprint |
| Flash Memory | 32 KB | 32 KB | 64 KB | 64 KB | 32 KB | 32 KB |
| RAM | 8 KB | 8 KB | 8 KB | 16 KB | 8 KB | 8 KB |
| USB | USB 2.0 FS Host/Device/OTG | USB 2.0 FS Host/Device/OTG | USB 2.0 FS Host/Device/OTG | USB 2.0 FS Host/Device/OTG | No USB | USB 2.0 FS Host/Device/OTG |
| Operating Temperature | -40C to +125C (E-temp) | -40C to +85C (I-temp) | -40C to +125C (E-temp) | -40C to +125C (E-temp) | -40C to +125C (E-temp) | -40C to +125C (E-temp) |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| User I/O | 20 | 20 | 20 | 20 | 20 | 20 |
Wichtigste Unterscheidungsmerkmale
- Integrated Full-Speed USB 2.0 OTG in the same 28-QFN package as the GP202 variant (vs. PIC24FJ32GP202-E/ML)
- Same-package upgrade path with doubled Flash and RAM (vs. PIC24FJ64GU202-E/ML)
- Extended -40C to +125C temperature grade on the -E/ML variant (vs. PIC24FJ32GU202-I/ML)
Designhinweise
Decouple VDD with a 100 nF ceramic within 5 mm of the VDD pin and a bulk 4.7 uF tantalum or ceramic near the package. For USB bus-powered designs, add a 1.5 kohm pull-up on D+ to assert full-speed attach, and provide a 10 uF bulk capacitor on VBUS to handle inrush during hot-plug events. Use a dedicated LDO (such as MCP1700) for low-Iq battery applications to keep total quiescent current in the nanoamp range.
Solder the exposed thermal pad (EP, pin 28) to a copper pour of at least 25 mm^2 on the top layer with multiple thermal vias to the inner/ground plane. Estimating with theta_JA ~ 35 C/W on a 4-layer 1 oz board, 100 mA of internal current at 3.3 V yields ~330 mW of dissipation, producing a ~12C rise above ambient. This is comfortable inside the -40C to +125C operating envelope but highlights the importance of the thermal pad for sustained USB enumeration.
Route the USB D+ and D- pair as a 90-ohm differential with matched lengths (delta under 150 mil) and keep the pair over a continuous ground plane. Place the 27 ohm series termination resistors within 4 mm of the MCU pins. Avoid routing the pair near switching nodes such as the switching regulator's inductor to preserve signal integrity and meet USB FS eye mask requirements.
Do not omit the VBUS sense capacitor or pull-up on D+; some hosts will not enumerate without the pull-up. Avoid powering the MCU from VBUS directly without a regulator - suspend current can exceed the USB 2.0 specification's 2.5 mA suspend budget. Ensure the JTAG/PGICSP pins (RB0/RB1) are not used for high-speed signals unless the debugger is disabled in firmware via configuration bits.
Compliance-Informationen
RoHS and lead-free per Microchip product page; AEC-Q100 not advertised for this commercial/industrial grade.
