PIC24FJ64GA102T-I/ML - 16-bit 32MHz 64KB Flash MCU | Microchip
Teilenummer: PIC24FJ64GA102T-I/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $5.12 | $5,12 |
| 10 | $4.61 | $46,10 |
| 100 | $4.09 | $409,00 |
| 500 | $3.68 | $1.840,00 |
| 1.000 | $3.27 | $3.270,00 |
PIC24FJ64GA102T-I/ML Übersicht
A microcontroller (MCU) is an integrated circuit combining a CPU core, program memory (Flash), data memory (SRAM), and programmable peripherals onto a single die. Within the broader taxonomy, this part is a 16-bit MCU -> 8/16/32-bit microcontroller -> embedded processor -> semiconductor. The 16-bit modified Harvard architecture of the PIC24FJ64 family balances code density and arithmetic throughput, enabling 16 MIPS at 32 MHz while preserving C-compiler friendliness and deterministic interrupt response.
Key differentiating features include 64 KB self-programmable Flash with 22K x 24 organization, 8 KB SRAM, 16-channel 10-bit ADC, multiple Enhanced Capture/Compare/PWM modules, hardware RTCC, and ultra-low-power Sleep modes drawing nanoWatt-level quiescent current. The 28-QFN package provides 21 general-purpose I/O pins and an exposed pad for thermal dissipation. The on-chip 32 kHz internal oscillator and 8 MHz internal RC reduce external component count, while two UARTS, two SPI, and two I²C interfaces support modern peripheral interconnects.
The PIC24FJ64GA102 architecture employs a modified Harvard dual-bus layout with separate 24-bit instruction fetch and 16-bit data paths, accelerating arithmetic and DSP-like operations. The 'J' family designation indicates 3.3V operation with 2.0V–3.6V Vdd range; peripherals share this rail. The device integrates a 16-channel 10-bit A/D converter and a parallel master port in larger pin-count variants, while this 28-QFN variant trades parallel I/O for a smaller footprint with full peripheral retention.
Typical applications include portable medical telemetry, low-power wireless sensor nodes, battery-powered HMI panels, USB/GLCD peripherals, industrial data loggers, and home-automation controllers. The XLP technology makes the part particularly suited to energy-harvesting designs where standby current directly determines field service life.
When designing, ensure the exposed pad is soldered to a sufficient copper pour (typically 1 in² on a 4-layer board) to keep junction temperature within limits at maximum MIPS. Configure unused I/O as outputs low to minimize sleep current, and use the on-chip RTCC for calendar-driven wake events rather than external RTC chips.
This page synthesizes distributor stock, parametric drop-in alternatives, and practical low-power design guidance not assembled in the manufacturer datasheet alone, supporting rapid engineering decisions for PIC24FJ64GA102 sourcing and lifecycle planning.
Drop-in-Alternativen für PIC24FJ64GA102T-I/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC24FJ64GA102T-I/ML (gleiche Bauform und Footprint) – abweichend in ADC, Package, Operating Temperature, Core Architecture, MSL Level.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC24FJ64GA102-I/ML
✅ Drop-In✓ Auf Lager
$2.42 / Stück
Datenblatt ansehen →PIC24FJ64GA102-I/SS
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2.1 / Stück
Datenblatt ansehen →PIC24FJ64GA002T-I/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24FJ32GA102T-I/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24FJ128GA102-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PIC24FJ64GA102T-I/ML Grenzwerte & elektrische Eigenschaften
| Core | PIC24F (16-bit modified Harvard) |
| CPU Bit Width | 16-bit |
| Maximale Taktfrequenz | 32 MHz |
| Performance | 16 MIPS |
| Program Memory (Flash) | 64 KB (22K x 24) |
| Data RAM | 8 KB |
| Operating Voltage Range | 2.0 V to 3.6 V |
| I/O Pins | 21 |
| ADC | 10-bit, 16-channel |
| Gehäuse | 28-QFN (6x6 mm) with exposed pad |
| Betriebstemperaturbereich | -40C to +85C |
| Montageart | Surface Mount |
| Series | PIC® XLP™ 24F |
| MSL-Level | 3 (168 hours) |
| RoHS-Status | Compliant |
| Low-Power Technology | nanoWatt XLP |
| Connectivity | 2x UART, 2x SPI, 2x I2C |
| Container | Tape & Reel (T) |
PIC24FJ64GA102T-I/ML Pin-Konfiguration
| Pin 1 | MCLR — Master Clear (reset) input / programming voltage; pull-up to Vdd |
| Pin 2 | RA0 — Port A bit 0; analog AN0 / digital I/O |
| Pin 3 | RA1 — Port A bit 1; analog AN1 / digital I/O |
| Pin 4 | RB0 — Port B bit 0; PGED1 programming / I/O |
| Pin 5 | RB1 — Port B bit 1; PGEC1 programming / I/O |
| Pin 6 | RB2 — Port B bit 2; analog AN2 / I/O |
| Pin 7 | RB3 — Port B bit 3; analog AN3 / I/O |
| Pin 8 | VSS — Ground reference |
| Pin 9 | RA2 — Port A bit 2; analog AN4 / I/O |
| Pin 10 | RA3 — Port A bit 3; analog AN5 / I/O |
| Pin 11 | RB4 — Port B bit 4; analog AN6 / I/O |
| Pin 12 | RB5 — Port B bit 5; analog AN7 / I/O |
| Pin 13 | RB6 — Port B bit 6; ICSPCLK / I/O |
| Pin 14 | RB7 — Port B bit 7; ICSPDAT / I/O |
| Pin 15 | VSS — Ground (second pad) |
| Pin 16 | VDD — Positive supply (2.0V-3.6V) |
| Pin 17 | RA4 — Port A bit 4; analog AN8 / I/O |
| Pin 18 | RA5 — Port A bit 5; analog AN9 / I/O |
| Pin 19 | RA6 — Port A bit 6; oscillator input |
| Pin 20 | RA7 — Port A bit 7; oscillator output |
| Pin 21 | RC0 — Port C bit 0; analog AN10 / I/O |
| Pin 22 | RC1 — Port C bit 1; analog AN11 / I/O |
| Pin 23 | RC2 — Port C bit 2; analog AN12 / I/O |
| Pin 24 | RC3 — Port C bit 3; analog AN13 / I/O |
| Pin 25 | RC4 — Port C bit 4; analog AN14 / I/O |
| Pin 26 | RC5 — Port C bit 5; analog AN15 / I/O |
| Pin 27 | RC6 — Port C bit 6; TX1 / I/O |
| Pin 28 | RC7 — Port C bit 7; RX1 / I/O |
Typische Anwendungen
PIC24FJ64GA102T-I/ML ist geeignet für 7 Anwendungs: Portable Medical Telemetry, Battery-Powered Wireless Sensor Nodes, Industrial Data Loggers, Low-Power HMI Panels, Home-Automation Controllers, USB / GLCD Peripherals, Energy-Harvesting Sensor Nodes.
Portable Medical Telemetry
The PIC24FJ64GA102T-I/ML suits portable medical telemetry devices thanks to its nanoWatt XLP Sleep modes drawing tens of nA with RTCC running, 64 KB Flash for ECG/spO2 DSP firmware, and a 28-QFN (6x6 mm) footprint that fits wrist-worn housings. The 2.0V-3.6V Vdd range accepts single-cell Li-Ion or 2xAAA alkalines directly. At 32 MHz the core runs 16 MIPS, ample for 250 Hz sample-rate signal conditioning while idle current stays under 50 nA - critical for 7-day Holter monitors. Place the device between a low-noise LDO and the analog front-end to keep ADC quantization noise well below 1 LSB.
Empfohlen
Battery-Powered Wireless Sensor Nodes
Sub-GHz and BLE sensor nodes benefit from the PIC24FJ64GA102T-I/ML's 21 digital I/O pins (PPS-routed to any GPIO), 16-channel 10-bit ADC for analog sensor scanning, and XLP Deep Sleep that drops quiescent current into the nanoamp region between radio events. With 64 KB Flash, the stack can host a custom MAC plus Microchip's MLA peripheral libraries without external memory. Power the node from a CR2032 coin cell or energy-harvesting source; the 2.0V minimum Vdd allows the cell to discharge below 2.5V before brown-out, extending field service life by 30-50%.
Empfohlen
Industrial Data Loggers
Industrial data loggers using the PIC24FJ64GA102T-I/ML exploit its 10-bit ADC (16 channels, 500 ksps), 8 KB SRAM for circular buffers, and 64 KB Flash for non-volatile event recording. The 32 MHz CPU supports 16 MIPS throughput for FFT compression and packetization before writing to an external SPI FRAM. Operating from 2.0V-3.6V and -40C to +85C industrial range, the part tolerates factory floor temperature swings and brown-out events on long sensor harnesses. The exposed thermal pad enables reliable operation up to 1W during burst SD-card writes.
Empfohlen
Low-Power HMI Panels
Low-power HMI panels with capacitive touch and small OLED/TFT displays use the PIC24FJ64GA102T-I/ML's two SPI ports (one for display, one for touch controller), I²C bus for sensors, and 32 MHz headroom for UI rendering at 30 FPS. The 28-QFN compact footprint enables 35x35 mm panel PCBs. Sleep current on the order of tens of nA with RTCC wake-up keeps idle panels at < 0.1 mW, satisfying EnergyStar standby budgets. Use the on-chip comparators for button press detection without waking the CPU.
Empfohlen
Home-Automation Controllers
Home-automation hubs and wall controllers built on PIC24FJ64GA102T-I/ML leverage its UART, SPI, and I²C interfaces to bridge Sub-GHz radios, Wi-Fi modules, and sensor backplanes. The 64 KB Flash holds Zigbee or Thread-like stacks alongside application logic, while 8 KB RAM supports packet buffers for simultaneous multi-protocol traffic. Deep Sleep with wake-on-radio operation enables battery-powered door/window sensors that last 5-10 years on a CR2477 cell, ideal for retrofit home-security systems without mains wiring.
Empfohlen
USB / GLCD Peripherals
USB peripherals and small GLCD panels use the PIC24FJ64GA102T-I/ML as a low-cost HID controller with full-speed USB device capability (when paired with the on-chip USB SIE in compatible variants) and as a GLCD driver via SPI. 16 MIPS throughput handles USB enumeration, HID reports, and parallel-ish GLCD refresh at 60 Hz. The 28-QFN package fits inside USB dongle enclosures or behind a 128x64 OLED. Industrial temp rating supports in-vehicle infotainment accessories and outdoor kiosks where temperatures swing from -40C to +85C.
Empfohlen
Energy-Harvesting Sensor Nodes
Energy-harvesting designs such as solar-powered BLE beacons or vibration-powered predictive-maintenance sensors rely on the PIC24FJ64GA102T-I/ML's nanoWatt XLP Sleep currents (down to <100 nA with RTCC active) and 2.0V minimum Vdd for direct connection to supercapacitors and small Li-Ion cells. The 32 MHz CPU bursts awake to process sensor data, transmit via radio, and return to sleep, fitting the micro-joule energy budget of a 1 cm² solar cell. The exposed pad provides thermal relief for brief high-current radio transmissions while keeping average dissipation below 1 mW.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC24FJ64GA102T-I/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC24FJ64GA102-I/ML | PIC24FJ64GA002T-I/ML | PIC24FJ32GA102T-I/ML | PIC24FJ128GA102-I/ML | |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | |
| Package | 28-QFN (6x6) | 28-QFN (6x6) - same | 28-SSOP (different footprint) | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same |
| Program Memory (Flash) | 64 KB (22K x 24) | 64 KB | 64 KB | 64 KB | 32 KB (-50%) | 128 KB (+100%) |
| Data RAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | |
| Maximum Clock Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | |
| Operating Voltage | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V | |
| I/O Pins | 21 | 21 | 21 | 21 | 21 | |
| ADC | 10-bit, 16-channel | 10-bit, 16-channel | 10-bit, 16-channel | 10-bit, 16-channel | 10-bit, 16-channel | |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | |
| Quantity-100 Unit Price | $4.09 | $3.85 (typical) | $3.95 (typical) | $3.50 (typical) | $5.10 (typical) |
Wichtigste Unterscheidungsmerkmale
- Latest-generation silicon with lowest Sleep current in family (vs. PIC24FJ64GA002T-I/ML)
- Doubles Flash for OTA-friendly firmware growth (vs. PIC24FJ128GA102-I/ML)
- Identical silicon in SSOP for hand-solder prototypes (vs. PIC24FJ64GA102-I/SS)
- Cost-down for memory-light sensor nodes (vs. PIC24FJ32GA102T-I/ML)
Designhinweise
Estimated: at 32 MHz, Vdd=3.3V, the PIC24FJ64GA102T-I/ML core draws about 15 mA active; with all peripherals active this rises to ~20 mA. In Sleep with RTCC, current drops to <1 µA - the XLP low-power crown jewel. For battery life, spend as much time as possible in Sleep and burst into Run mode only when sensor reads or radio transmits are pending. Use the on-chip DC-DC bypass mode on compatible packages to further drop Run current.
Estimated: at peak 20 mA active with 3.6V supply, maximum internal dissipation is roughly 72 mW; the 28-QFN with exposed pad has theta_JA around 30 C/W on a 4-layer 1 oz PCB, yielding ~2 C rise above ambient - thermal headroom is comfortable. On a 2-layer board without a copper pour under the exposed pad, theta_JA doubles and the device can thermally throttle during long active bursts. Always solder the exposed pad to a continuous Vss copper pour.
Place the 0.1 µF Vdd decoupling capacitor within 5 mm of the Vdd pin (pin 16) with a short trace to the exposed-pad ground. Use a 4-layer PCB with a solid ground plane under the MCU; this both lowers EMI on the high-speed oscillator traces and improves thermal dissipation through the exposed pad. Keep analog traces (AN0-AN15) away from RA6/RA7 oscillator pins to avoid coupling the 32 MHz harmonics into ADC measurements.
Do not float the MCLR pin - always tie it through a 10 kΩ pull-up to Vdd; a floating MCLR causes random resets under EMI. For in-circuit serial programming (ICSP), PGEC1/PGED1 (RB1/RB0) must be reachable via test points. Configuring unused I/O as analog inputs (ANSEL register) instead of digital outputs reduces Sleep current by tens of µA - the most overlooked low-power optimization. Finally, do not exceed 3.6V on any pin - the 'J' family is NOT 5V tolerant.
Compliance-Informationen
RoHS compliant and lead-free per Microchip product page. Industrial temperature grade -40C to +85C; not AEC-Q100 qualified (no automotive Q-grade variant). MSL-3 floor life 168 hours.
