PIC24FV08KM102T-I/ML - 16-Bit 32MHz 8KB Flash MCU 28-QFN | Microchip
Teilenummer: PIC24FV08KM102T-I/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2.85 | $2,85 |
| 10 | $2.56 | $25,60 |
| 100 | $2.1 | $210,00 |
| 500 | $1.74 | $870,00 |
| 1.000 | $1.52 | $1.520,00 |
PIC24FV08KM102T-I/ML Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, working RAM, and a configurable set of peripherals such as UART, I2C, SPI, ADC, timers, and PWM channels. Within the broader taxonomy, this part belongs to: microcontroller -> 16-bit MCU -> PIC24F family -> nanoWatt XLP low-power tier. The PIC24FV series extends the platform with 2.0 V–5.5 V support for both battery-powered and 5 V industrial designs, while the XLP nanoWatt technology targets sleep currents measured in nanoamps for energy-harvesting and always-on applications.
Key features include 32 MIPS CPU throughput, eXtreme low-power (XLP) sleep modes (typical <100 nA), 16-bit wide instructions, two I2C/SPI/UART selectable serial interfaces, five 16-bit timers, and a configurable logic cell (CLC) that allows on-the-fly digital glue logic without external gates. The 12-bit ADC with hardware averaging delivers up to 19 analog channels for sensor acquisition. The device also provides a charge time measurement unit (CTMU) for capacitive touch sensing.
From an architectural perspective, the PIC24F core is a modified Harvard machine with a 16-bit data path and 24-bit instruction word, enabling compact code density for C and assembly. The 8 KB Flash is organized as 2.75K x 24 (instruction-word addressing), and the single-cycle 32 MHz operation yields 32 MIPS of computational throughput.
Typical applications include portable medical monitors, low-power IoT sensor nodes, 5 V industrial controllers, automotive body and accessory modules (non-safety), capacitive touch user interfaces, and battery-powered consumer electronics. The wide 2.0–5.5 V range lets the same part operate directly from a single Li-ion cell or a 5 V industrial rail.
When migrating between PIC24F and PIC24FV variants, note that the FV designation adds 2.0 V minimum Vdd operation; the F variant (non-FV) typically requires 3.0 V. Use the silicon errata document for revisions and the device-specific programming spec for in-circuit serial programming (ICSP) pinouts. For production, program the part with MPLAB X IDE and a PICkit 5, MPLAB ICD 5, or Curiosity development board. Estimated: VDD decoupling requires a 100 nF ceramic cap within 3 mm of each VDD/VSS pair plus a 1 uF bulk cap on the rail.
Drop-in-Alternativen für PIC24FV08KM102T-I/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC24FV08KM102T-I/ML (gleiche Bauform und Footprint) – abweichend in ADC, Package, Comparators, Core Architecture, DAC.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC24FV08KM102-I/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24FV08KM102-I/SP
✅ Drop-In✓ Auf Lager
$1.97 / Stück
Datenblatt ansehen →PIC24FV08KM202-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1.72 / Stück
Datenblatt ansehen →PIC24FV08KM101-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PIC24FJ64GA002-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2.45 / Stück
Datenblatt ansehen →PIC24FJ32GA002-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PIC24FV08KM102T-I/ML Grenzwerte & elektrische Eigenschaften
| Core | PIC24F 16-bit, modified Harvard |
| Family | PIC® XLP™ 24F |
| Instruction Set | 16-bit data / 24-bit instruction word |
| Maximum CPU Speed | 32 MIPS at 32 MHz |
| Program Memory (Flash) | 8 KB (2.75K x 24) |
| RAM | 1 KB |
| EEPROM | 512 B |
| Operating Voltage (VDD) | 2.0 V to 5.5 V (FV series) |
| Betriebstemperatur | -40C to +85C (Industrial) |
| Gehäuse | 28-QFN (6x6 mm) with exposed thermal pad, /ML |
| Montageart | Surface Mount |
| ADC | 12-bit, up to 19 channels, 10-bit mode available |
| Comparators | Yes (on-chip) |
| Configurable Logic Cell (CLC) | Yes |
| Timers | Five 16-bit timers |
| PWM Modules | MCCP and SCCP (Capture/Compare/PWM) |
| Serial Interfaces | Up to 2x I2C/SPI, UART |
| Charge Time Measurement Unit (CTMU) | Yes (cap-touch support) |
| Low-Power Mode | XLP nanoWatt (sleep current typical <100 nA) |
| MSL-Level | 3 |
| RoHS-Status | Compliant |
| Programming/Debug | ICSP via MPLAB PICkit, ICD, or Curiosity |
PIC24FV08KM102T-I/ML Pin-Konfiguration
| Pin 1 | RA0 — Analog/digital I/O; AN0; CLC input |
| Pin 2 | RA1 — Analog/digital I/O; AN1; CLC input |
| Pin 3 | RA2 — Analog/digital I/O; AN2; reference voltage |
| Pin 4 | RA3 — Analog/digital I/O; AN3; VREF+ |
| Pin 5 | RA4 — Analog/digital I/O; AN4 |
| Pin 6 | AVDD — Analog power supply |
| Pin 7 | AVSS — Analog ground |
| Pin 8 | RA7 — Digital I/O; CLC output |
| Pin 9 | RA8 — Digital I/O |
| Pin 10 | RA9 — Digital I/O |
| Pin 11 | MCLR — Master clear (reset), programming voltage input |
| Pin 12 | RB0 — Digital I/O; AN8; PGD (ICSP data) |
| Pin 13 | RB1 — Digital I/O; AN9; PGC (ICSP clock) |
| Pin 14 | RB2 — Digital I/O; AN10 |
| Pin 15 | RB3 — Digital I/O; AN11 |
| Pin 16 | VSS — Digital ground |
| Pin 17 | VDD — Digital power supply (2.0V-5.5V) |
| Pin 18 | RB4 — Digital I/O; AN12 |
| Pin 19 | RB5 — Digital I/O; AN13 |
| Pin 20 | RB6 — Digital I/O; AN14; ICD PGC alternate |
| Pin 21 | RB7 — Digital I/O; AN15; ICD PGD alternate |
| Pin 22 | RC0 — Digital I/O; AN16 |
| Pin 23 | RC1 — Digital I/O; AN17 |
| Pin 24 | RC2 — Digital I/O; AN18 |
| Pin 25 | RC3 — Digital I/O; AN19 |
| Pin 26 | RC4 — Digital I/O |
| Pin 27 | OSCI — Crystal oscillator input or external clock |
| Pin 28 | OSCO — Crystal oscillator output |
Typische Anwendungen
PIC24FV08KM102T-I/ML ist geeignet für 6 Anwendungs: Portable Medical Sensor Monitor, Battery-Powered IoT Sensor Node, 5 V Industrial Control Module, Capacitive Touch User Interface, Automotive Body and Accessory Module, USB-Powered Consumer Electronics.
Portable Medical Sensor Monitor
The PIC24FV08KM102T-I/ML's 2.0–5.5 V VDD range and XLP nanoWatt sleep current below 100 nA make it ideal for portable medical monitors running from a single Li-ion or two AAA cells. The 12-bit ADC with up to 19 channels provides direct interface for temperature, SpO2 photodiode, and pressure sensors without external signal conditioning. The CLC peripheral can combine sensor triggers without external logic, reducing PCB area. According to the PIC24FJ-KM datasheet, the CTMU enables reliable touch-button user interfaces for handheld enclosures.
Empfohlen
Battery-Powered IoT Sensor Node
The PIC24FV08KM102T-I/ML fits wireless sensor nodes that spend most of their life in deep sleep. XLP nanoWatt technology delivers typical sleep currents under 100 nA with full RAM retention, extending coin-cell battery life beyond 5 years for periodic measurements. The wide 2.0–5.5 V input lets the same hardware run from 3 V coin cells, 3.6 V LiSOCl2, or harvested energy rails. The CLC peripheral can wake the MCU on sensor events without external glue logic, lowering system BOM cost.
Empfohlen
5 V Industrial Control Module
In 5 V industrial PLC I/O and HVAC controller modules, the PIC24FV08KM102T-I/ML operates directly from a 24 V-to-5 V buck output without level shifters. The 12-bit ADC delivers 19 channels of 0–3.3 V analog input for 4–20 mA loop and 0–10 V sensor interfaces. Five 16-bit timers plus MCCP/SCCP modules provide the PWM outputs needed for triac phase-angle control and servo drive. The industrial -40C to +85C temperature range supports factory-floor deployments.
Empfohlen
Capacitive Touch User Interface
The PIC24FV08KM102T-I/ML integrates a Charge Time Measurement Unit (CTMU) that enables capacitive touch buttons, sliders, and proximity sensors with no external touch controller IC required. Combined with the Configurable Logic Cell (CLC), the MCU can debounce and process touch events in hardware, freeing the CPU for HMI rendering. The 28-QFN package fits behind glass or plastic overlays in appliance front panels.
Empfohlen
Automotive Body and Accessory Module
The PIC24FV08KM102T-I/ML handles non-safety automotive body electronics such as interior lighting, seat controllers, mirror adjusters, and accessory modules. The wide 2.0–5.5 V input tolerates crank-dip transients common in 12 V automotive rails. The CLC and CTMU peripherals reduce external component count in lighting fade and capacitive door-handle designs. Note that this part is not AEC-Q100 qualified; for safety-critical designs use PIC24FV-family variants with explicit automotive grade.
Empfohlen
USB-Powered Consumer Electronics
USB-powered gadgets such as fitness bands, e-readers, and small appliances benefit from the PIC24FV08KM102T-I/ML's 2.0 V minimum VDD which lets the MCU run directly from a single Li-ion cell without a boost converter. The integrated UART, I2C, and SPI peripherals interface directly to BLE modules, displays, and accelerometers. XLP sleep modes keep standby current below 100 nA when the device is idle, preserving battery life between user interactions.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC24FV08KM102T-I/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC24FV08KM102-I/ML | PIC24FV08KM202-I/ML | PIC24FV08KM101-I/ML | PIC24FJ64GA002-I/ML | PIC24FJ32GA002-I/ML |
|---|---|---|---|---|---|---|
| Package | 28-QFN (6x6) /ML | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 8 KB | 8 KB | 16 KB | 8 KB | 64 KB | 32 KB |
| RAM | 1 KB | 1 KB | 2 KB | 1 KB | 8 KB | 8 KB |
| Minimum VDD | 2.0 V (FV variant) | 2.0 V | 2.0 V | 2.0 V | 3.0 V | 3.0 V |
| Maximum CPU Speed | 32 MIPS / 32 MHz | 32 MIPS / 32 MHz | 32 MIPS / 32 MHz | 32 MIPS / 32 MHz | 16 MIPS / 32 MHz | 16 MIPS / 32 MHz |
| ADC Resolution | 12-bit, 19 channels | 12-bit, 19 ch | 12-bit, 19 ch | 12-bit, fewer ch | 10-bit, 16 ch | 10-bit, 13 ch |
| CLC Peripheral | Yes | Yes | Yes | Yes | No | No |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Wichtigste Unterscheidungsmerkmale
- Wide 2.0–5.5 V VDD operation - lower minimum than PIC24FJ64GA002-I/ML (vs. PIC24FJ64GA002-I/ML)
- Configurable Logic Cell (CLC) peripheral not present in older GA-series (vs. PIC24FJ32GA002-I/ML)
- CTMU peripheral enables capacitive touch sensing on-chip (vs. PIC24FV08KM101-I/ML)
Designhinweise
The PIC24FV08KM102T-I/ML's 2.0–5.5 V VDD range requires careful decoupling: a 100 nF ceramic capacitor within 3 mm of each VDD/VSS pair plus a single 1 uF bulk capacitor on the main rail. Estimated: at 32 MHz active current ~7 mA and sleep <100 nA, the bulk capacitor must hold VDD above 1.95 V during wake-up transients to avoid brown-out reset. Use the BOR (Brown-Out Reset) configuration bit set to a threshold above your minimum operating VDD to prevent code-execution errors.
The 28-QFN package exposes its die through the EP (exposed pad), which must be soldered to a continuous PCB ground copper pour of at least 25 mm² to meet the rated thermal resistance. Estimated: at 32 MHz active current of ~7 mA at 5 V VDD, power dissipation is 35 mW which is well within the package's thermal capability, but poor EP soldering can raise junction temperature 15 C above ambient in still air. Use multiple thermal vias under the EP to spread heat into inner ground planes.
Keep the ICSP programming footprint accessible - dedicate RB0 (PGD) and RB1 (PGC) test points or header pads near the MCU. Do not place series resistors or capacitors in series with these pins because they will block ICSP communication during debugging. For PPS (Peripheral Pin Select) remapped functions, add 0 ohm jumper footprints on critical I/O lines so layout can be corrected without re-spinning the PCB.
Common pitfalls when designing with PIC24FV08KM102T-I/ML include: (1) confusing the FV (2.0V minimum) variant with the F (3.0V minimum) variant - the marking code differs, (2) omitting the AVSS pin connection - the analog ground MUST be tied to VSS even if the ADC is unused, (3) configuring PPS to a function that is not available on a particular pin - always check the pin function table in the datasheet, and (4) exceeding the absolute maximum VDD of 6.0V during hot-plug events. Add a TVS diode on the VDD rail for automotive transient protection.
Route the analog AVSS/AVDD traces together with the analog inputs to minimize ground-loop noise. Keep the ADC reference decoupling capacitor within 5 mm of the VREF+/VREF- pins. For 12-bit ADC accuracy to within ±1 LSB, the analog ground return path must not share high-current digital return currents - use a star-ground or split-plane topology with a single tie-point near the MCU's AVSS pin. Estimated: 12-bit ADC SNR is 70 dB when AGND and DGND share at MCU; 73 dB with star ground.
Compliance-Informationen
RoHS compliant per Microchip product page; lead-free /ML suffix; not AEC-Q100 qualified - select PIC24F-KM family automotive-grade variants for safety-critical automotive applications. Halogen-free status not explicitly stated in distributor listings.
