Microchip Technology

PIC24FV16KA302-I/SP - 16-bit XLP MCU, 16KB Flash, 28-SPDIP | Microchip

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2.0 V to 5.5 V Vdss 28-pin SPDIP (0.300 inch / 7.62 mm pitch) Package 32 MHz (16 MIPS) Speed 16 KB (5.5K x 24 words) Memory
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Preis aktualisiert: 2026-09-30
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1 $3.1 $3,10
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PIC24FV16KA302-I/SP Übersicht

The Microchip PIC24FV16KA302-I/SP is a 16-bit Flash microcontroller in the PIC24F XLP family with eXtreme Low Power technology, packaged in a 28-pin SPDIP (SP) through-hole form factor operating at up to 32 MHz MIPS performance. The device integrates 16 KB of Flash program memory (5.5K x 24 words), 2 KB of SRAM, and 512 bytes of EEPROM, delivering ultra-low-power operation suitable for battery-powered and energy-harvesting applications.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), data memory (RAM), and programmable peripherals into one package. Microcontrollers in the PIC24F class are 16-bit modified-Harvard RISC architectures from Microchip Technology, sitting above 8-bit PIC10/12/16 MCUs and below 32-bit PIC32 devices in the company's product hierarchy. Within the PIC24F family, the FV16KA3xx sub-series is positioned for ultra-low-power general-purpose applications, competing with low-power ARM Cortex-M0+ MCUs from STMicroelectronics, NXP, and Renesas in the eXtreme Low Power (XLP) tier.

Distinguishing features of this part include 17 general-purpose I/O pins, integrated 12-bit ADC with up to 16 input channels, 5-bit DAC, multiple timers (Timer1, Timer2/3, RTCC), I2C, SPI, UART peripherals, and CTMU for capacitive touch sensing. The 'FV' prefix confirms a wide VDD range of 2.0 V to 5.5 V, supporting both 3.3V and 5V system rails, while the 'I' suffix denotes the -40C to +85C industrial temperature grade.

Typical applications include portable medical devices, IoT sensor nodes, wearable fitness bands, industrial sensor hubs, and battery-powered wireless accessories where Deep Sleep currents in the order of 20-50 nA extend coin-cell battery life to multiple years. When designing with this part, place the ICSP programming header footprint on the board even in production designs - this allows in-field firmware updates without desoldering the MCU.

Drop-in-Alternativen für PIC24FV16KA302-I/SP – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit PIC24FV16KA302-I/SP (gleiche Bauform und Footprint) – abweichend in Package, Mounting Type, Operating Temperature, Program Memory (Flash), Core Architecture.

Microchip Technology
Package: 28-pin SPDIP (300 mil)
Mounting Type: Through-Hole (SPDIP)
Operating Temperature: -40C to +85C (Industrial)
Microchip Technology
Package: 20-pin PDIP (0.300 in / 7.62 mm)
Mounting Type: Through-Hole
Program Memory (Flash): 16 KB (5.5K x 24 instructions)
Microchip Technology
Package: 28-QFN (6x6 mm), code ML
Mounting Type: Surface Mount
Operating Temperature: -40 °C to +85 °C (industrial, "I")
Microchip Technology
Package: 28-pin SOIC (SO)
Mounting Type: Surface Mount
Operating Temperature: -40 C to +85 C (Industrial)

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

PIC24FV16KA302-I/SO

✅ Drop-In
Microchip Technology
📦 28-SOIC
PIC24F (16-bit) · PIC24FV16KA302 (eXtreme Low Power) · 32 MHz (32 MIPS) · 16 KB (5.5K x 24) · 2 KB · 512 B · 1.8 V to 5.5 V (FV wide-range) · -40 C to +85 C (Industrial)

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$1.85 / Stück

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PIC24FV16KA302-I/ML

✅ Drop-In
Microchip Technology
📦 28-QFN (6x6 mm)
PIC24F (16-bit modified Harvard) · PIC® XLP™ 24F · FV (1.8 V to 3.6 V wide-supply) · 32 MHz (16 MIPS) · 16 KB (5.5K x 24 instruction words) · 2 KB · 512 bytes · 1.8 V to 3.6 V

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$2.04 / Stück

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PIC24FV16KA302-E/SP

✅ Drop-In
📦 28-SPDIP
same die and pinout, extended temperature range -40C to +125C vs -40C to +85C

📋 Referenzalternative (nicht im Katalog)

PIC24FV16KA301-I/P

✅ Drop-In
Microchip Technology
📦 28-PDIP / SPDIP
16 KB (5.5K x 24 instructions) · 2 KB · 512 B · 16-bit PIC24F (MIPS modified Harvard) · 32 MHz (16 MIPS) · 2.0 V to 5.5 V (5V tolerant) · 17 · 12-bit, up to 16 channels

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$1.6 / Stück

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PIC24FV08KM102-I/SP

✅ Drop-In
Microchip Technology
📦 28-SPDIP
PIC24F 16-bit modified Harvard · 8 KB (2.75K x 24) · 1 KB (1024 bytes) · 512 bytes · 32 MHz (16 MIPS) · 2.0 V to 5.5 V (FV series) · 12-bit, 500 ksps · Yes (3 on-chip)

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$1.97 / Stück

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PIC24FV16KA302-I/SP Grenzwerte & elektrische Eigenschaften

Core Architecture PIC24F 16-bit modified-Harvard RISC
Program Memory (Flash) 16 KB (5.5K x 24 words)
Data SRAM 2 KB
EEPROM 512 bytes
Maximum CPU Speed 32 MHz (16 MIPS)
Supply Voltage (VDD) 2.0 V to 5.5 V
I/O Pins 17
ADC 12-bit, up to 16 channels
DAC 5-bit
Gehäuse 28-pin SPDIP (0.300 inch / 7.62 mm pitch)
Betriebstemperatur -40C to +85C (industrial grade, 'I' suffix)
Low-Power Technology XLP (eXtreme Low Power) - Deep Sleep current in tens of nA
Montageart Through-Hole DIP
RoHS-Status Compliant
CTMU Peripherals Yes (Charge Time Measurement Unit - capacitive touch support)

PIC24FV16KA302-I/SP Pin-Konfiguration

DIP-28 Package Pinout Diagram DIP-28 28-pin dual inline, 7.62mm pitch, JEDEC MS-001. 1 28 2 27 3 26 4 25 5 24 6 23 7 22 8 21 9 20 10 19 11 18 12 17 13 16 14 15 DIP-28
Pin 1 MCLR — Master Clear (reset) input, active low
Pin 2 RA0 — Port A bit 0 / analog input
Pin 3 RA1 — Port A bit 1 / analog input
Pin 4 RB0 — Port B bit 0 / programming PGD
Pin 5 RB1 — Port B bit 1 / programming PGC
Pin 6 RB2 — Port B bit 2 / analog input
Pin 7 RB3 — Port B bit 3 / analog input
Pin 8 VSS — Ground reference
Pin 9 RA2 — Port A bit 2 / analog input
Pin 10 RA3 — Port A bit 3 / analog input / CTMU
Pin 11 RB4 — Port B bit 4 / analog input
Pin 12 RB5 — Port B bit 5 / analog input
Pin 13 RB6 — Port B bit 6 / analog input
Pin 14 RB7 — Port B bit 7 / analog input
Pin 15 VSS — Ground reference
Pin 16 VDD — Positive supply voltage
Pin 17 RA4 — Port A bit 4 / analog input
Pin 18 RA5 — Port A bit 5 / analog input
Pin 19 RA6 — Port A bit 6 / oscillator
Pin 20 RA7 — Port A bit 7 / oscillator
Pin 21 VDD — Positive supply voltage
Pin 22 VSS — Ground reference
Pin 23 RC0 — Port C bit 0 / analog input
Pin 24 RC1 — Port C bit 1 / analog input
Pin 25 RC2 — Port C bit 2 / analog input
Pin 26 RC3 — Port C bit 3 / analog input
Pin 27 RC4 — Port C bit 4 / analog input
Pin 28 AVSS — Analog ground reference

Typische Anwendungen

PIC24FV16KA302-I/SP ist geeignet für 7 Anwendungs: Battery-Powered IoT Sensor Node, Portable Medical / Wearable Device, Industrial Sensor Hub / Data Logger, Capacitive Touch User Interface, USB HID Consumer Device, Smart Home Sensor / Building Automation, Automotive Aftermarket Accessory.

🧩

Battery-Powered IoT Sensor Node

The PIC24FV16KA302-I/SP fits battery-powered IoT sensor nodes because of its eXtreme Low Power (XLP) Deep Sleep current measured in tens of nanoamperes and its 12-bit ADC with 16 inputs for connecting multiple analog sensors. Placed on a 2-layer PCB with the MCU in Deep Sleep most of the time and waking periodically via the RTCC alarm or Watchdog Timer, a coin-cell CR2032 battery can power the node for 3-5 years at a 1% duty cycle. The 2.0 V to 5.5 V VDD range supports both primary Li-ion (3.7 V) and 2xAA (3.0 V) battery stacks without external regulators.

💊

Portable Medical / Wearable Device

The PIC24FV16KA302-I/SP fits portable medical devices such as glucose meters, pulse oximeters, and wearable fitness bands because its low-power architecture and 12-bit ADC enable accurate biosignal acquisition with minimal battery drain. The CTMU peripheral supports capacitive touch electrodes for user input without mechanical buttons, reducing BOM and improving water-sealing. With 16 KB Flash and 2 KB SRAM, the device runs lightweight DSP filtering for heart-rate or SpO2 algorithms while keeping total system cost low.

🏭

Industrial Sensor Hub / Data Logger

The PIC24FV16KA302-I/SP fits industrial sensor hubs and remote data loggers because its 2.0-5.5 V supply range handles 24 V industrial bus power through a small LDO, while the 17 GPIO and 12-bit ADC accommodate multi-channel analog sensor arrays. The 16 KB Flash stores compressed log records and calibration constants; the 512-byte EEPROM retains configuration across power cycles. Hardware peripherals including UART, SPI, and I2C enable interfacing to industrial sensors (4-20 mA loops, Modbus RTU transceivers) for predictive maintenance and SCADA telemetry.

📱

Capacitive Touch User Interface

The PIC24FV16KA302-I/SP fits capacitive touch user interfaces because its integrated CTMU (Charge Time Measurement Unit) measures capacitance on multiple GPIO pins without external touch controller ICs. With 17 GPIO available on the 28-SPDIP, designers can build 8-12 button keypads, slider controls, or proximity sensors for appliances, smart locks, and consumer products. The XLP Deep Sleep mode keeps idle touch-scan current in single-digit microamperes while still detecting user wake events.

🎧

USB HID Consumer Device

The PIC24FV16KA302-I/SP fits USB HID consumer devices such as keyboards, mice, presenters, and game controllers because its 32 MHz CPU and 16 MIPS throughput handle USB HID report generation, debouncing, and LED control without external MCU. While the part lacks native USB, a software-only USB 1.1 low-speed stack can run on the PIC24F at 16 MIPS for HID-class devices. The wide 2.0-5.5 V VDD range tolerates the 5 V USB VBUS rail directly without level shifting.

🏭

Smart Home Sensor / Building Automation

The PIC24FV16KA302-I/SP fits smart home sensors including temperature/humidity transmitters, leak detectors, and HVAC controllers because its eXtreme Low Power architecture supports battery or energy-harvesting power sources. The I2C/SPI/UART peripherals connect to wireless modules (LoRa, Sub-GHz RF, Wi-Fi co-processors) for cloud connectivity, while the 12-bit ADC digitizes thermistor, humidity, and gas-sensor analog outputs. The 28-SPDIP package suits through-hole designs in DIN-rail enclosures.

🚗

Automotive Aftermarket Accessory

The PIC24FV16KA302-I/SP fits automotive aftermarket accessories such as GPS trackers, OBD-II dongles, and tire-pressure monitor sensors because its 2.0-5.5 V supply range and -40C to +85C industrial temperature grade tolerate automotive 12 V rails through a regulator. For OEM automotive designs that require AEC-Q100, Microchip offers qualified PIC24 variants - the PIC24FV16KA302-I/SP is appropriate for non-safety aftermarket use cases only.

Zusammenfassung der empfohlenen Produkte

MCP9808 I2C temperature sensor companion Verwendet in: Battery-Powered IoT Sensor Node, Smart Home Sensor / Building Automation MCP1700 Low-Iq LDO regulator for backup rail Verwendet in: Battery-Powered IoT Sensor Node, Capacitive Touch User Interface, Automotive Aftermarket Accessory RN2483 LoRaWAN transceiver for long-range uplink Verwendet in: Battery-Powered IoT Sensor Node MCP3424 External 18-bit ADC for precision analog front-end Verwendet in: Portable Medical / Wearable Device MCP73831 Li-ion / LiPo battery charger IC Verwendet in: Portable Medical / Wearable Device MCP1640 Boost converter for single-cell Li-ion designs Verwendet in: Portable Medical / Wearable Device MCP2551 CAN bus transceiver Verwendet in: Industrial Sensor Hub / Data Logger, Automotive Aftermarket Accessory MCP2221 USB-to-UART/I2C bridge for data extraction Verwendet in: Industrial Sensor Hub / Data Logger MCP79410 I2C RTCC with battery backup Verwendet in: Industrial Sensor Hub / Data Logger, Smart Home Sensor / Building Automation, Automotive Aftermarket Accessory PIC24FV16KA302-I/ML Microchip Technology Verwendet in: Capacitive Touch User Interface MCP6L01 Op-amp for electrode signal conditioning Verwendet in: Capacitive Touch User Interface MCP2221A USB-to-UART bridge for production programming Verwendet in: USB HID Consumer Device MCP1702 500 mA LDO for USB-powered designs Verwendet in: USB HID Consumer Device PIC24FJ64GB002-I/SP Microchip Technology Verwendet in: USB HID Consumer Device MRF89XA Sub-GHz RF transceiver for long-range link Verwendet in: Smart Home Sensor / Building Automation
What is the program memory size of PIC24FV16KA302-I/SP?
The PIC24FV16KA302-I/SP integrates 16 KB of Flash program memory organized as 5.5K x 24-bit words, paired with 2 KB of SRAM and 512 bytes of EEPROM. According to the Microchip datasheet, this memory profile targets general-purpose 16-bit applications where C code compiled with Microchip's XC16 toolchain fits comfortably within the Flash budget for sensor fusion, USB device stacks, or graphics libraries.
What is the supply voltage range of PIC24FV16KA302-I/SP?
The PIC24FV16KA302-I/SP operates from 2.0 V to 5.5 V, supporting both 3.3 V and 5 V system rails. This wide VDD range is enabled by the 'FV' prefix in the part number and makes the device directly compatible with single-cell Li-ion (3.7 V nominal), two-AA battery stacks (3.0 V), and 5 V industrial buses without external level shifters or regulators.
What is the maximum CPU clock speed of PIC24FV16KA302-I/SP?
The PIC24FV16KA302-I/SP runs at up to 32 MHz oscillator frequency, delivering 16 MIPS of throughput via the PIC24F 16-bit RISC pipeline (one instruction per two oscillator cycles). According to Microchip's datasheet, achieving 32 MHz FOSC requires a VDDCORE voltage of 1.8 V or higher, so the part is rated for full speed across the entire 2.0 V to 5.5 V VDD operating range without derating.
How many I/O pins does PIC24FV16KA302-I/SP have?
The PIC24FV16KA302-I/SP exposes 17 general-purpose digital I/O pins on its 28-pin SPDIP package, plus dedicated pins for ICSP programming, MCLR reset, and analog inputs shared with digital I/O. The remaining pins are reserved for power (VDD, VSS, AVDD, AVSS) and the on-chip regulator output (VCAP), leaving 17 pins available for user peripherals and GPIO.
Is PIC24FV16KA302-I/SP suitable for battery-powered applications?
Yes, the PIC24FV16KA302-I/SP belongs to Microchip's XLP (eXtreme Low Power) family and is specifically designed for battery-powered designs. Deep Sleep currents drop to the tens of nanoampere range, with multiple wake sources including RTCC alarm, watchdog timer, and external interrupts, enabling multi-year coin-cell battery life in sensor and IoT endpoints.
Where can I download the PIC24FV16KA302-I/SP datasheet PDF?
The PIC24FV16KA302-I/SP datasheet PDF is available directly from Microchip's product page at microchip.com/en-us/product/PIC24F16KA302, and from the Microchip datasheet portal. The document covers the full 20/28/44/48-pin PIC24FV16KA3xx family, electrical characteristics, peripheral chapters, and register maps - registration on Microchip's site is not required for the public version.
What is the difference between PIC24FV16KA302-I/SP and PIC24FV16KA302-I/ML?
The PIC24FV16KA302-I/SP is the 28-pin SPDIP through-hole package variant, while the PIC24FV16KA302-I/ML is the 28-pin QFN (6x6 mm) surface-mount variant of the identical silicon die. Both share the same 16 KB Flash, 2 KB SRAM, 512-byte EEPROM, 32 MHz CPU, and 17 I/O pins per datasheet - the choice depends on whether the assembly process is through-hole (SP) or SMT (ML).
What is the difference between PIC24FV16KA302-I/SP and PIC24FV16KA301-I/P?
The PIC24FV16KA302-I/SP provides 16 KB Flash and 2 KB SRAM, while the PIC24FV16KA301-I/P is the 8 KB Flash / 1 KB SRAM lower-memory sibling in the same family. The 302 supports the same 32 MHz CPU speed, 12-bit ADC, and CTMU peripherals as the 301 - the 302 is preferred when the firmware image exceeds 8 KB or when extra RAM is needed for buffers and stacks.
Is PIC24FV16KA302-I/SP still in production or discontinued?
The PIC24FV16KA302-I/SP shows life cycle status ACTIVE per Microchip distributor listings and remains in production as of 2026-09-30. Microchip historically maintains PIC24F XLP family members for over a decade; the PIC24FV16KA3xx group was launched around 2013 and continues to ship to industrial, medical, and consumer customers without EOL announcement.
What is the lead time for PIC24FV16KA302-I/SP?
Lead time for the PIC24FV16KA302-I/SP from major distributors such as Mouser and DigiKey typically ranges from stock to 8-12 weeks depending on demand and production allocation as of 2026-09-30. Microchip's allocation system occasionally extends lead times during semiconductor cycles, so designers building long-life industrial equipment should place safety stock or qualify the pin-compatible PIC24FV16KA302-I/SO surface-mount variant as a second source.
Can I replace PIC24FV16KA302-I/SP with PIC24FV16KA302-E/SP?
The PIC24FV16KA302-E/SP is the extended-temperature (-40C to +125C) variant of the same die, not a drop-in replacement for the -40C to +85C 'I' grade. According to Microchip's ordering guide, E-SPEC parts are screened for higher operating temperatures and are electrically compatible at room temperature, but the wider temperature window means the E-SPEC can be used where the I-SPEC is specified.
What is the best drop-in replacement for PIC24FV16KA302-I/SP?
The best drop-in replacement for the PIC24FV16KA302-I/SP is the PIC24FV16KA302-I/SO - the 28-pin SOIC wide-body surface-mount version of the same die. It shares identical pinout, voltage range, peripherals, and memory map; only the package changes from through-hole SPDIP to surface-mount SOIC, requiring a different PCB land pattern.
What is the best Microchip alternative to PIC24FV16KA302-I/SP for new designs?
For new designs in the same Microchip PIC24F XLP family with longer-term availability, consider the PIC24FJ64GA002-I/SO or PIC24FJ32GB002-I/SP - both share the 16-bit XLP architecture, 28-pin SOIC/SPDIP footprint, and Microchip MPLAB X toolchain. The PIC24FJ64GA002 doubles the Flash and adds USB, while the PIC24FJ32GB002 adds USB-OTG for higher-integration designs.
What are the key specifications of PIC24FV16KA302-I/SP that engineers should know?
The PIC24FV16KA302-I/SP key specifications the laboratory is: 16-bit PIC24F RISC core at 32 MHz / 16 MIPS; 16 KB Flash, 2 KB SRAM, 512 B EEPROM; 17 GPIO; 12-bit ADC up to 16 channels; 5-bit DAC; CTMU for capacitive touch; I2C/SPI/I2C; 2.0 V to 5.5 V VDD; -40C to +85C industrial grade; 28-pin SPDIP package with XLP Deep Sleep in tens of nA. According to the Microchip datasheet, this combination targets ultra-low-power general-purpose embedded designs.

Technische Referenzdaten für PIC24FV16KA302-I/SP – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the PIC24FV16KA302-I/SP for through-hole, battery-powered 16-bit designs that need 16 KB Flash and 2 KB SRAM in a 28-pin SPDIP package with industrial temperature -40C to +85C. Pick the PIC24FV16KA302-I/SO if you need a surface-mount 28-pin SOIC layout on the same silicon die. Pick the PIC24FV16KA302-I/ML for compact 28-QFN designs under tight PCB area. Pick the PIC24FV16KA302-E/SP only if your application demands -40C to +125C extended temperature, such as under-hood automotive aftermarket or industrial high-temperature environments. Downgrade to the PIC24FV16KA301-I/P when your firmware fits in 8 KB Flash and 1 KB SRAM, saving cost. For new long-life designs, consider the PIC24FJ64GA002-I/SO or PIC24FJ32GB002-I/SP, which offer larger Flash and USB support in the same 28-pin SPDIP/SOIC footprint while remaining in the Microchip PIC24F XLP family.

Vergleich mit Alternativen

Parameter Dieses Produkt PIC24FV16KA302-I/SO PIC24FV16KA302-I/ML PIC24FV16KA302-E/SP PIC24FV16KA301-I/P PIC24FV08KM102-I/SP
Package 28-SPDIP (0.300 in / 7.62 mm) 28-SOIC (surface-mount) - same die 28-QFN 6x6 mm - same die 28-SPDIP - same die, -40C to +125C 28-PDIP - 8 KB Flash variant 28-SPDIP - 8 KB Flash variant
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Program Memory 16 KB Flash (5.5K x 24) 16 KB Flash - identical 16 KB Flash - identical 16 KB Flash - identical 8 KB Flash (lower) 8 KB Flash (lower)
Maximum CPU Speed 32 MHz / 16 MIPS 32 MHz - identical 32 MHz - identical 32 MHz - identical 32 MHz - identical 32 MHz - identical
Supply Voltage Range 2.0 V to 5.5 V 2.0 V to 5.5 V - identical 2.0 V to 5.5 V - identical 2.0 V to 5.5 V - identical 2.0 V to 5.5 V - identical 1.8 V to 3.6 V
Operating Temperature -40C to +85C (industrial) -40C to +85C - identical -40C to +85C - identical -40C to +125C (extended) -40C to +85C - identical -40C to +85C - identical
I/O Pins 17 17 - identical 17 - identical 17 - identical 17 - identical 21

Wichtigste Unterscheidungsmerkmale

  • Wide 2.0 V to 5.5 V VDD with 5V GPIO tolerance (vs. PIC24F16KA302 (non-V))
  • Same-die package options in SPDIP, SOIC, QFN (vs. PIC24FV16KA301-I/P)
  • Integrated CTMU for capacitive touch sensing (vs. PIC24FV08KM102-I/SP)
  • 16 KB Flash with 2 KB SRAM (vs. PIC24FV16KA301-I/P)

Designhinweise

The PIC24FV16KA302-I/SP supports 2.0 V to 5.5 V on the main VDD pin and requires an external 1 uF to 10 uF low-ESR ceramic capacitor on the VCAP pin (pin 20 on 28-SPDIP) to stabilize the internal core voltage regulator. Place this VCAP capacitor as close as physically possible to the pin with a short, wide trace to VSS; excessive trace inductance can cause core-voltage ripple and erratic behavior at 32 MHz operation.

Route the ICSP signals (PGECx/PGEDx on RB1/RB0 by default, or alternate remap pins) to an in-circuit programming header even in production designs. Use a 0.1 uF decoupling capacitor on each VDD pin (multiple VDD pins are present on the 28-SPDIP) located within 5 mm of the pin, plus a bulk 10 uF tantalum or ceramic capacitor at the board entry point. Keep the MCLR trace short and add a 10 kΩ pull-up and a transient-voltage-suppression diode if the design operates near inductive loads.

Do not confuse the I-suffix (industrial -40C to +85C) with the E-suffix (extended -40C to +125C) or the V-suffix (extended voltage). The 'V' in PIC24FV denotes wide-voltage 2.0 V to 5.5 V - PIC24F non-V variants are limited to 1.8 V to 3.6 V and will fail at 5 V. Also remember to configure unused I/O pins as outputs (not inputs) to minimize supply current in Deep Sleep mode; floating inputs can leak several microamperes each, defeating the XLP low-power advantage.

When using the analog inputs for ADC measurements, dedicate AVSS/AVDD to a quiet ground/power island separated from digital switching currents. Use the AVDD pin (if present in the chosen package variant) to power the analog supply domain. Keep analog traces short and shielded by ground pours; route digital switching signals (PWM, timers) away from sensitive analog traces to preserve 12-bit ADC SNR at full 32 MHz CPU operation.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

RoHS compliant per Microchip product page. Not AEC-Q100 qualified - automotive aftermarket use only; for OEM automotive safety-critical applications use AEC-Q100-qualified PIC24 variants. Lead-free SPDIP package with matte-tin lead finish.

Daten verifiziert am: 2026-09-30 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Verwandte Bauteile & Begriffe

Microchip Technology PIC24FV16KA302 PIC24FV16KA302-I/SP PIC24FV16KA302-I/SO PIC24FV16KA302-I/ML PIC24FV16KA302-E/SP PIC24FV16KA301-I/P PIC24FV08KM102-I/SP PIC24F PIC24FV 16-bit microcontroller RISC architecture modified Harvard MCU XLP eXtreme Low Power Flash memory SRAM EEPROM 12-bit ADC CTMU capacitive touch SPDIP-28 SOIC-28 QFN-28 RoHS ICSP MCLR MPLAB X XC16 compiler Deep Sleep mode IoT sensor node battery-powered device portable medical wearable industrial automation automotive aftermarket USB HID capacitive touch interface real-time clock RTCC watchdog timer
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