PIC32MM0064GPL028-I/ML - 32-bit 25MHz 64KB Flash XLP MCU | Microchip
Teilenummer: PIC32MM0064GPL028-I/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.64 | $3,64 |
| 10 | $3.28 | $32,80 |
| 100 | $2.85 | $285,00 |
| 500 | $2.55 | $1.275,00 |
| 1.000 | $2.25 | $2.250,00 |
PIC32MM0064GPL028-I/ML Übersicht
A 32-bit microcontroller (MCU) is an integrated computing system that combines a 32-bit CPU core, program and data memory, peripherals, and I/O on a single silicon die. Within the PIC32 family hierarchy, the PIC32MM GPL sub-family targets entry-level, low-power, low-pin-count applications, sitting below PIC32MX and PIC32MZ performance series. The microAptiv core delivers deterministic MIPS32 instruction throughput while integrating DSP extensions and a microMIPS code-compression mode, balancing code density with computational capability for battery-powered products.
Key features of the PIC32MM0064GPL028 include 22 general-purpose I/O pins, a 12-bit ADC with up to 11 channels, two analog comparators, and a 10-bit DAC reference output for mixed-signal applications. Communication peripherals: one I2C, two SPI, and two UART modules support sensor and display links. Integrated peripherals include 5-bit and 10-bit configurable PWMs, RTCC with calendar mode, and a charge-time measurement unit (CTMU) for capacitive touch sensing without external ICs, ideal for low-cost touch user interfaces.
Architecturally, the device pairs the microAptiv UC core with a single-cycle hardware multiply/divide unit and a four-channel DMA controller, allowing peripheral-to-memory transfers without CPU intervention. The 64 KB self-programmable Flash supports ICSP and runtime updates via the dual-panel Flash array, while the 8 KB SRAM is retained through deep-sleep to preserve application state. Functional-safety features include a configurable LVD, BOR, and a deadman timer for watchdog-style system reset.
Typical applications for the PIC32MM0064GPL028-I/ML are wearable fitness bands, remote sensor nodes, low-cost HMI panels with capacitive touch, IoT end-node controllers, and consumer white goods. The combination of low sleep current and a compact 6x6 mm QFN package suits designs where PCB area is constrained and battery life dominates the BOM. Designers favor this MCU when a 32-bit core, modest memory, and peripherals are sufficient and the BOM cost of an external RTC or touch controller would be unacceptable.
When designing with the PIC32MM0064GPL028, observe the absolute maximum voltage of 4.0 V on VDD; keep analog and digital grounds tied to a single point near the exposed thermal pad. Decouple VDD with a 100 nF ceramic capacitor placed within 2 mm of the pin, plus a bulk 1 uF to 4.7 uF capacitor on the same net. For reliable ICSP programming, route PGECx/PGEDx as matched-length pairs and avoid routing switching signals beneath them.
This page synthesizes distributor pricing, datasheet extraction, drop-in same-brand and cross-brand alternatives, and practical design notes not found on a single manufacturer or distributor page.
Drop-in-Alternativen für PIC32MM0064GPL028-I/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MM0064GPL028-I/ML (gleiche Bauform und Footprint) – abweichend in Package, ADC, Core Architecture, Program Memory (Flash), MSL Level.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MM0064GPL028-E/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MM0064GPL028-I/SP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MM0032GPL028-E/ML
✅ Drop-In✓ Auf Lager
$0.7084 / Stück
Datenblatt ansehen →PIC32MM0032GPL028-I/M6
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MM0032GPL028T-I/SO
✅ Drop-In✓ Auf Lager
$1.62 / Stück
Datenblatt ansehen →PIC32MM0064GPL028-I/ML Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 microAptiv UC |
| Core Sub-family | PIC32MM GPL XLP |
| Datenbusbreite | 32-bit |
| Maximum CPU Speed | 25 MHz |
| Program Memory (Flash) | 64 KB (64K x 8) |
| SRAM | 8 KB |
| Operating Voltage (VDD) | 2.0 V to 3.6 V |
| I/O Pins | 22 |
| Gehäuse | 28-QFN (6x6 mm) with exposed pad |
| ADC | 12-bit, up to 11 channels |
| DAC | 10-bit reference DAC output |
| Analog Comparators | 2 |
| UART | 2 |
| SPI | 2 |
| I2C | 1 |
| Timers | 5/16-bit timer/counter pairs |
| PWM | 5-bit and 10-bit configurable |
| CTMU (Capacitive Touch) | Yes (Charge-Time Measurement Unit) |
| RTCC | Yes (Real-Time Clock Calendar) |
| DMA Channels | 4 |
| Deep-Sleep Current | 500 nA (with retention) |
| Betriebstemperatur | -40C to +85C (Industrial) |
| Montageart | Surface Mount |
| RoHS | Compliant |
PIC32MM0064GPL028-I/ML Pin-Konfiguration
| Pin 1 | RB7 — General purpose I/O / PGED1 |
| Pin 2 | RB8 — General purpose I/O / PGEC1 |
| Pin 3 | RB9 — General purpose I/O |
| Pin 4 | VSS — Ground |
| Pin 5 | VDD — Positive supply voltage (2.0 V to 3.6 V) |
| Pin 6 | RA0 — General purpose I/O / analog input |
| Pin 7 | RA1 — General purpose I/O / analog input |
| Pin 8 | RA2 — General purpose I/O / analog input |
| Pin 9 | RA3 — General purpose I/O / analog input |
| Pin 10 | RA4 — General purpose I/O / analog input |
| Pin 11 | AVSS — Analog ground |
| Pin 12 | AVDD — Analog positive supply |
| Pin 13 | RA5 — General purpose I/O / analog input |
| Pin 14 | RA6 — General purpose I/O / analog input |
| Pin 15 | RA7 — General purpose I/O / analog input |
| Pin 16 | RB0 — General purpose I/O / analog input |
| Pin 17 | RB1 — General purpose I/O / analog input |
| Pin 18 | RB2 — General purpose I/O / analog input |
| Pin 19 | RB3 — General purpose I/O / analog input |
| Pin 20 | RB4 — General purpose I/O |
| Pin 21 | RB5 — General purpose I/O |
| Pin 22 | RB6 — General purpose I/O |
| Pin 23 | RC0 — General purpose I/O |
| Pin 24 | RC1 — General purpose I/O |
| Pin 25 | RC2 — General purpose I/O |
| Pin 26 | RC3 — General purpose I/O |
| Pin 27 | RC4 — General purpose I/O |
| Pin 28 | OSC1/RC5 — Crystal oscillator input or general purpose I/O |
| Pin EP | EP — Exposed thermal pad - must be soldered to ground plane |
Typische Anwendungen
PIC32MM0064GPL028-I/ML ist geeignet für 6 Anwendungs: Wearable Fitness Bands, Battery-Powered IoT Sensor Nodes, Capacitive Touch HMI Panels, Low-Cost Consumer White Goods, Remote Control and Wireless HID, Medical Monitoring Wearables.
Wearable Fitness Bands
The PIC32MM0064GPL028-I/ML suits wearable fitness bands because its 500 nA deep-sleep current stretches CR2032 battery life to multi-month deployments while the microAptiv UC core processes heart-rate and step-count algorithms. The 12-bit ADC captures optical PPG sensor signals with 11 channels of analog input, and the integrated RTCC timestamps activity logs without external RTC chips. With 64 KB Flash and 8 KB SRAM, the device runs Bluetooth Low Energy command stacks via external SPI-linked radio modules, while the 6x6 mm QFN footprint fits wristband PCBs. Compared to an 8-bit PIC16, the 32-bit core delivers higher MIPS per milliwatt for the always-on accelerometer sampling duty cycle that wearable designs demand.
Empfohlen
Battery-Powered IoT Sensor Nodes
IoT sensor nodes benefit from the PIC32MM0064GPL028-I/ML because deep-sleep current at 500 nA and a 2.0 V to 3.6 V supply support 3.6 V lithium-thionyl chloride primary cells with multi-year service life. The 12-bit ADC samples temperature, humidity, and battery voltage at sub-microamp quiescent draw, while the CTMU enables capacitive soil-moisture or proximity sensing without extra ICs. The 25 MHz microAptiv core wakes quickly to run LoRa or Sub-GHz transmit bursts over the two SPI ports, with hardware DMA offloading packet assembly to reduce CPU wake time. Compared to discrete 8-bit designs, the integrated RTCC keeps accurate time-stamps during sleep, eliminating the need for an external RTC chip on the BOM.
Empfohlen
Capacitive Touch HMI Panels
The PIC32MM0064GPL028-I/ML drives capacitive touch HMI panels because the integrated CTMU (Charge-Time Measurement Unit) measures touch pad capacitance without external touch controller ICs. The 25 MHz microAptiv core scans up to 11 touch channels within microseconds, while the DMA controller moves ADC samples to RAM without CPU overhead. The two UART and two SPI peripherals drive TFT displays and external EEPROM simultaneously, and the 64 KB Flash accommodates capacitive-button and slider firmware libraries. The 28-QFN 6x6 mm footprint fits behind the touch pad PCB layer, enabling single-board touch user interfaces for appliances and consumer white goods at sub-dollar BOM cost.
Empfohlen
Low-Cost Consumer White Goods
Consumer white goods such as microwave ovens, washing machines, and induction cookers benefit from the PIC32MM0064GPL028-I/ML because the 12-bit ADC reads motor current and temperature with 11 channels of analog input, and the 10-bit DAC reference provides analog set-point outputs. The microAptiv UC core at 25 MHz executes motor-control loops while the dual UART bridges Bluetooth modules for smartphone app connectivity. The 6x6 mm QFN package plus industrial -40C to +85C temperature range supports sealed enclosure designs with limited heatsinking. Compared to legacy 8-bit PIC18 designs, the 32-bit core delivers twice the MIPS for the same power, enabling better user-interface graphics on character LCDs.
Empfohlen
Remote Control and Wireless HID
Wireless HID devices like remote controls and presentation clickers benefit from the PIC32MM0064GPL028-I/ML because deep-sleep at 500 nA allows coin-cell operation for years, while the 25 MHz microAptiv core wakes instantly on GPIO interrupt to process button events. The integrated RTCC timestamps user interactions for analytics, and the two UART/SPI/I2C peripherals pair with Sub-GHz or 2.4 GHz transceivers for wireless links. The 6x6 mm QFN footprint fits inside ultra-thin remote-control enclosures where PCB area is severely constrained. The 64 KB Flash holds USB HID stacks and pairing-code tables without external memory expansion.
Empfohlen
Medical Monitoring Wearables
Medical monitoring wearables such as glucose meters, pulse oximeters, and portable ECG patches benefit from the PIC32MM0064GPL028-I/ML because the 500 nA deep-sleep current extends battery life beyond one year of continuous monitoring. The 12-bit ADC at 11 channels captures biomedical sensor signals with sufficient resolution for SpO2 and heart-rate variability analysis, and the RTCC timestamps events for clinical logs. The microAptiv UC core runs real-time DSP filters at 25 MHz without external coprocessors, and the 64 KB Flash stores patient-record buffers during offline operation. The 6x6 mm QFN package suits miniaturized form factors required for body-worn medical devices.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MM0064GPL028-I/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MM0064GPL028-E/ML | PIC32MM0032GPL028-E/ML | PIC32MM0032GPL028-I/M6 |
|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB | 64 KB | 32 KB (-50%) | 32 KB (-50%) |
| SRAM | 8 KB | 8 KB | 8 KB | 8 KB |
| CPU Speed | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +85C (Industrial) |
| Core | MIPS32 microAptiv UC | MIPS32 microAptiv UC | MIPS32 microAptiv UC | MIPS32 microAptiv UC |
| Deep-Sleep Current | 500 nA | 500 nA | 500 nA | 500 nA |
| Approx Unit Price (qty 1, USD) | 3.64 | 3.80 | 3.20 | 3.20 |
Wichtigste Unterscheidungsmerkmale
- Highest-density Flash in PIC32MM GPL QFN family (vs. PIC32MM0032GPL028-I/M6)
- Lower temperature grade lowers cost vs automotive variant (vs. PIC32MM0064GPL028-E/ML)
- XLP deep-sleep current at 500 nA (vs. PIC32MM0032GPL028-E/ML)
Designhinweise
Decouple VDD with a 100 nF ceramic capacitor placed within 2 mm of the pin, plus a bulk 1 uF to 4.7 uF capacitor on the same net. According to the Microchip datasheet, AVDD requires its own 100 nF decoupling capacitor. Tie the analog and digital grounds to a single point near the exposed thermal pad to avoid ground bounce in ADC sampling.
Solder the exposed thermal pad (EP) on the bottom of the 28-QFN package directly to the ground plane using thermal vias for heat dissipation. According to the Microchip datasheet, the EP must not be left floating - it serves as the primary thermal path and the chip's secondary ground reference. Use a 4x4 via array of 0.3 mm drill under the pad for production boards.
Do not exceed 4.0 V on VDD or 4.0 V on any GPIO - both are absolute maximum ratings per the Microchip datasheet. Route PGECx/PGEDx pairs as matched-length differential traces to ensure reliable ICSP programming, and avoid routing switching signals beneath these traces. The 500 nA deep-sleep figure is only achieved with the RTCC and Brown-Out Reset configured per the datasheet's low-power checklist.
Keep analog input traces short and away from switching signals to preserve 12-bit ADC accuracy. Use a guard ring around the analog input pins tied to AVSS for high-impedance sensor inputs. The CTMU touch sensing traces must be guarded on both sides to prevent false triggers from adjacent signals, and trace capacitance must be measured during design qualification per the Microchip CTMU application note.
Compliance-Informationen
RoHS compliant per Master Electronics listing. Industrial-grade -40C to +85C; for AEC-Q100 automotive qualification use PIC32MM0064GPL028-E/ML extended variant. Halogen-free status not specified in verified data.
