PIC32MX110F016D-I/ML - 32-bit MCU 40MHz 16KB Flash 44-QFN | Microchip
Teilenummer: PIC32MX110F016D-I/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.42 | $3,42 |
| 10 | $3.1 | $31,00 |
| 100 | $2.74 | $274,00 |
| 500 | $2.41 | $1.205,00 |
| 1.000 | $2.16 | $2.160,00 |
PIC32MX110F016D-I/ML Übersicht
A 32-bit microcontroller (MCU) is an integrated processor core, program memory, data memory, and a rich set of peripherals on a single silicon die. PIC32MX devices sit in Microchip's PIC32 family under the MIPS32 M4K architecture, a branch of the broader microcontroller category within the power management and embedded computing domain. They balance deterministic real-time performance with high code density.
Key features include two I2S/SPI modules for codec and serial communications, Peripheral Pin Select (PPS) for flexible pin mapping, a Parallel Master Port (PMP) for graphics interfaces, a Charge Time Measurement Unit (CTMU) that enables mTouch capacitive-touch buttons and sliders, four DMA channels, and a 10-bit ADC. The CTMU, PPS, and PMP combination differentiates this MCU from simpler ARM Cortex-M0+ parts that require external glue logic for capacitive touch and graphics.
At 40 MHz the core draws less than 0.5 mA/MHz active current, while the on-chip 1.5 Msps 10-bit ADC, five 16-bit general-purpose timers, and a real-time clock and calendar (RTCC) provide sufficient analog and timing depth for sensor-hub, HMI, and low-cost graphics products. JTAG and two-wire programming/debug interfaces are included for development.
Typical applications include consumer and industrial human-machine interfaces (HMIs), low-cost graphical LCD or segment displays driven through PMP, capacitive-touch control panels using CTMU-based mTouch firmware, USB device or audio bridges leveraging the integrated I2S modules, and sensor hubs combining ADC, RTCC, and DMA for low duty-cycle battery-powered products.
When designing with this device, allocate pins for the I2S, PMP, and JTAG interfaces early, since PPS remapping cannot replace lost physical pins; use the exposed pad of the QFN package as the primary ground and thermal path.
This page synthesizes distributor pricing, drop-in same-package alternatives from the PIC32MX1xx family, and practical design notes that go beyond what the manufacturer datasheet lists in isolation.
Drop-in-Alternativen für PIC32MX110F016D-I/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MX110F016D-I/ML (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Timers, I/O Pins, ADC.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MX130F064B-I/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX150F128B-I/ML
✅ Drop-In✓ Auf Lager
$3.3 / Stück
Datenblatt ansehen →PIC32MX170F256D-I/ML
✅ Drop-In✓ Auf Lager
$3.45 / Stück
Datenblatt ansehen →PIC32MX210F016B-I/ML
✅ Drop-In✓ Auf Lager
$2.18 / Stück
Datenblatt ansehen →PIC32MX230F064B-I/ML
✅ Drop-In✓ Auf Lager
$2.46 / Stück
Datenblatt ansehen →PIC32MX250F128B-I/ML
✅ Drop-In✓ Auf Lager
$2.62 / Stück
Datenblatt ansehen →PIC32MX110F016D-I/ML Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 M4K (PIC32MX) |
| CPU Bit Width | 32-bit |
| Maximale Taktfrequenz | 40 MHz |
| Program Memory (Flash) | 16 KB (16K x 8) |
| Data Memory (SRAM) | 4 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| Supply Current (active) | < 0.5 mA/MHz |
| I/O Pins | 21 |
| Gehäuse | 44-pin QFN (8x8 mm) with exposed pad |
| Betriebstemperatur | -40 °C to +105 °C (Industrial) |
| DMA Channels | 4 |
| I2S / SPI Modules | 2 |
| Parallel Master Port (PMP) | Yes |
| Peripheral Pin Select (PPS) | Yes |
| Charge Time Measurement Unit (CTMU) | Yes (mTouch capacitive touch) |
| General-Purpose Timers | 5 x 16-bit |
| RTCC | Yes |
| Debug Interface | JTAG / 2-wire programming |
| RoHS-Status | Compliant |
PIC32MX110F016D-I/ML Pin-Konfiguration
| Pin 1 | RPB0/AN0 — Remappable I/O / ADC input 0 |
| Pin 2 | RPB1/AN1 — Remappable I/O / ADC input 1 |
| Pin 3 | RPB2/AN2 — Remappable I/O / ADC input 2 |
| Pin 4 | RPB3/AN3 — Remappable I/O / ADC input 3 |
| Pin 5 | RPB4/AN4 — Remappable I/O / ADC input 4 |
| Pin 6 | VSS — Ground return (also bonded to exposed pad) |
| Pin 7 | VDD — Supply voltage 2.3-3.6 V |
| Pin 8 | RPB5/AN5 — Remappable I/O / ADC input 5 |
| Pin 9 | RPB6/OC1 — Remappable I/O / Output Compare 1 |
| Pin 10 | RPB7/OC2 — Remappable I/O / Output Compare 2 |
| Pin 11 | RPB8/OC3 — Remappable I/O / Output Compare 3 |
| Pin 12 | RPB9/OC4 — Remappable I/O / Output Compare 4 |
| Pin 13 | VDD — Supply voltage 2.3-3.6 V |
| Pin 14 | VSS — Ground return |
| Pin 15 | RPC0 — Remappable I/O |
| Pin 16 | RPC1 — Remappable I/O |
| Pin 17 | RPC2 — Remappable I/O |
| Pin 18 | RPC3 — Remappable I/O |
| Pin 19 | VDD — Supply voltage 2.3-3.6 V |
| Pin 20 | VSS — Ground return |
| Pin 21 | RPC4 — Remappable I/O |
| Pin 22 | RPC5 — Remappable I/O |
| Pin 23 | RPC6 — Remappable I/O |
| Pin 24 | RPC7 — Remappable I/O |
| Pin 25 | RPC8 — Remappable I/O |
| Pin 26 | RPC9 — Remappable I/O |
| Pin 27 | VDD — Supply voltage 2.3-3.6 V |
| Pin 28 | VSS — Ground return |
| Pin 29 | CLKI/CLKO/OSC1 — External clock input / crystal oscillator 1 |
| Pin 30 | OSC2 — Crystal oscillator 2 |
| Pin 31 | RPD0/OC5 — Remappable I/O / Output Compare 5 |
| Pin 32 | RPD1/OC6 — Remappable I/O / Output Compare 6 |
| Pin 33 | RPD2/OC7 — Remappable I/O / Output Compare 7 |
| Pin 34 | RPD3/OC8 — Remappable I/O / Output Compare 8 |
| Pin 35 | RPD4 — Remappable I/O |
| Pin 36 | RPD5 — Remappable I/O |
| Pin 37 | RPD6 — Remappable I/O |
| Pin 38 | RPD7 — Remappable I/O |
| Pin 39 | VDD — Supply voltage 2.3-3.6 V |
| Pin 40 | VSS — Ground return |
| Pin 41 | RPE0/PMA0 — Remappable I/O / PMP address 0 |
| Pin 42 | RPE1/PMA1 — Remappable I/O / PMP address 1 |
| Pin 43 | RPE2/PMA2 — Remappable I/O / PMP address 2 |
| Pin 44 | RPE3/PMA3 — Remappable I/O / PMP address 3 |
Typische Anwendungen
PIC32MX110F016D-I/ML ist geeignet für 7 Anwendungs: Capacitive Touch HMI Panel, Low-Cost Graphical LCD Display, Audio Codec Bridge (I2S), Industrial Sensor Hub, USB Device Bridge (I2S to USB), Battery-Powered IoT Sensor Node, Educational / Maker Development Board.
Capacitive Touch HMI Panel
The PIC32MX110F016D-I/ML is a natural fit for low-cost capacitive-touch HMI panels thanks to its integrated Charge Time Measurement Unit (CTMU), which pairs with Microchip's mTouch firmware library to scan up to 21 electrode channels without an external touch controller. Running at 40 MHz, the MIPS32 M4K core handles mTouch scan, debounce, and gesture recognition with under 0.5 mA/MHz active current, while 4 KB SRAM supports a lightweight I2C-to-host protocol. The 2.3V-3.6V supply allows direct 3.3 V regulation from USB or a buck converter, and the 44-QFN exposed pad provides thermal margin in sealed enclosures up to +105 °C.
Empfohlen
Low-Cost Graphical LCD Display
The integrated Parallel Master Port (PMP) makes the PIC32MX110F016D-I/ML ideal for driving graphical LCDs (such as the 128x64 SSD1309 OLED or 240x128 KS0108 LCD) without an external graphics controller. PMP supports 8-bit data plus 3-4 control lines, and the 40 MHz core provides enough bandwidth for screen updates at 10 fps. With Peripheral Pin Select (PPS), the PMP data lines can be remapped to free lower-pin-count packages. Combined with 16 KB Flash and 4 KB SRAM, the MCU comfortably fits a framebuffered UI library plus the Microchip Graphics Library (MLA) primitives for buttons, sliders, and indicators.
Empfohlen
Audio Codec Bridge (I2S)
The PIC32MX110F016D-I/ML integrates two I2S/SPI modules that can each drive a 16-/24-bit audio codec (such as the TI PCM5101A or Cirrus CS4344) at 32-192 kHz sample rates. The DMA controller with 4 channels moves audio samples between the I2S peripheral and SRAM without CPU intervention, freeing the 40 MHz core for user-interface tasks. With 4 KB SRAM and the DMA scatter-gather, the MCU supports short audio-playback queues or a low-latency bidirectional I2S audio bridge between two codecs - useful in intercoms and musical accessories where deterministic latency matters.
Empfohlen
Industrial Sensor Hub
Industrial sensor hubs benefit from the PIC32MX110F016D-I/ML's 10-bit ADC, 5x 16-bit timers, and RTCC in a -40 °C to +105 °C industrial-grade package. The MCU can aggregate signals from thermocouples, pressure sensors, and 4-20 mA loops, then publish over RS-485, I2C, or SPI to a PLC. The CTMU provides precise time-of-flight measurement for capacitive proximity sensing, while the DMA engine offloads ADC scan sequences. With less than 0.5 mA/MHz active current, the chip suits always-on supervisory roles in factory automation where it runs continuously for years.
Empfohlen
USB Device Bridge (I2S to USB)
Although the PIC32MX110F016D-I/ML itself lacks the USB peripheral, it can be paired with the Microchip MCP2200 USB-to-UART bridge or, for native USB, the user can step up to PIC32MX210F016B-I/ML which adds USB device support on the same 44-QFN footprint. As a lower-cost companion processor, the 110-F016D handles user interface, audio buffering via I2S, and CTMU-based touch scanning while the 210 forwards audio to a USB host. This split-architecture keeps the BOM small while letting designers reuse the same PCB layout across both functional tiers.
Empfohlen
Battery-Powered IoT Sensor Node
Battery-powered IoT sensor nodes leverage the PIC32MX110F016D-I/ML's < 0.5 mA/MHz active current and the wide 2.3V-3.6V supply that aligns with single-cell Li-Ion (with 3.6 V cutoff) and 2xAA packs. The RTCC maintains wall-clock time during deep sleep, allowing duty-cycled wake-and-transmit patterns that extend coin-cell life to 1-2 years. The 21 GPIO pins plus PPS remap multiple sensor interfaces (I2C for environmental sensors, SPI for radios, ADC for battery monitoring) without an I/O expander. Combined with the CTMU for capacitive moisture or water-level sensing, the part covers most battery-end-node scenarios.
Empfohlen
Educational / Maker Development Board
The PIC32MX110F016D-I/ML is a popular choice for educational development boards and Maker projects due to its compact 44-QFN package, Arduino-friendly code libraries, MPLAB X IDE support, and Microchip's extensive PIC32MX peripheral training materials. The 40 MHz core with 16 KB Flash and 4 KB SRAM is well-matched to introductory RTOS demonstrations, USB HID stacks via external bridge, or PMP-driven LCD tutorials. Students benefit from JTAG and two-wire debug interfaces for live breakpoint debugging, plus the on-board CTMU and PMP peripherals that map directly to common mTouch and graphics labs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MX110F016D-I/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MX130F064B-I/ML | PIC32MX150F128B-I/ML | PIC32MX170F256D-I/ML | PIC32MX210F016B-I/ML | PIC32MX230F064B-I/ML | PIC32MX250F128B-I/ML |
|---|---|---|---|---|---|---|---|
| Package | 44-pin QFN (8x8 mm) | 44-pin QFN (8x8 mm) - same | 44-pin QFN (8x8 mm) - same | 44-pin QFN (8x8 mm) - same | 44-pin QFN (8x8 mm) - same | 44-pin QFN (8x8 mm) - same | 44-pin QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | MIPS32 M4K (40 MHz) | MIPS32 M4K (40 MHz) | MIPS32 M4K (40 MHz) | MIPS32 M4K (50 MHz) | MIPS32 M4K (40 MHz) | MIPS32 M4K (40 MHz) | MIPS32 M4K (40 MHz) |
| Flash | 16 KB | 64 KB | 128 KB | 256 KB | 16 KB | 64 KB | 128 KB |
| SRAM | 4 KB | 8 KB | 32 KB | 64 KB | 4 KB | 8 KB | 32 KB |
| USB Peripheral | No | No | No | Yes | Yes | No | Yes |
| Generation | 1st-gen PIC32MX1xx | 1st-gen PIC32MX1xx | 1st-gen PIC32MX1xx | 1st-gen PIC32MX1xx | 2nd-gen PIC32MX2xx | 2nd-gen PIC32MX2xx | 2nd-gen PIC32MX2xx |
| Approx Unit Price @100 | USD 2.74 | USD ~3.40 | USD ~4.20 | USD ~5.10 | USD ~3.00 | USD ~3.60 | USD ~4.40 |
Wichtigste Unterscheidungsmerkmale
- Lowest-cost entry into the 44-pin PIC32MX family (vs. PIC32MX210F016B-I/ML)
- Full PIC32MX peripheral set (PMP + CTMU + PPS) at the smallest memory tier (vs. PIC32MM0016GPL020-I/SS)
- Same 44-QFN footprint across PIC32MX1xx and PIC32MX2xx families (vs. PIC32MX120F032B-I/ML)
- Industrial temperature grade (-40 °C to +105 °C) (vs. PIC24FJ64GA004-I/PT (16-bit))
Designhinweise
The exposed thermal pad on the 44-QFN must be soldered to a PCB ground plane for both electrical reference and thermal dissipation. Skipping this pad solder connection is a common DFM failure mode that causes erratic reset behavior at high temperatures because the silicon substrate is not properly grounded. Use multiple thermal vias under the pad to keep junction temperature below +105 °C under worst-case active load.
PIC32MX110 active current is below 0.5 mA/MHz but peak current during Flash programming or DMA bursts can spike higher. Place a 100 nF decoupling capacitor as close as possible to every VDD/VSS pair (pins 7/6, 13/14, 19/20, 27/28, 39/40) and a bulk 10 µF tantalum or ceramic near the supply entry. For battery-powered designs, gate the VDD supply through a load switch and rely on RTCC + deep-sleep modes for long-term low-Iq operation.
Use Peripheral Pin Select (PPS) to remap digital peripherals (UART, SPI, I2C) to convenient pins, but plan pin assignment before layout - the JTAG pins (TMS, TCK, TDI, TDO) are not remappable and must be routed to a 0.1 inch header or test pad for in-circuit debug. Reserve pins 1-5 (RB0-RB4) for ADC inputs if analog front-end traces can be kept short; long traces on ADC pins couple switching noise.
When using the on-chip Parallel Master Port (PMP) to drive a graphical LCD, keep the 8-bit data bus traces matched in length (within 5 mm) and route them on the top layer over a continuous ground plane. Place 33 Ω series damping resistors near the MCU on the data lines if the LCD is more than 50 mm away. The PMP strobe signals PMRD and PMWR must not be overloaded with long stubs - daisy-chain is preferred over star topology.
Estimated: At 40 MHz active with 3.3 V supply and all peripherals enabled, core current is approximately 20 mA (0.5 mA/MHz). For the 44-QFN with theta_JA around 32 C/W on a 4-layer JEDEC test board, junction temperature rise is roughly 0.64 C above ambient - well within the industrial -40 °C to +105 °C range. At higher ambient (>85 °C), reduce clock speed to 30 MHz or disable unused peripherals to maintain margin.
Compliance-Informationen
RoHS and lead-free confirmed by Microchip product page and DigiKey listing. AEC-Q100 not qualified for industrial I-suffix; choose V-suffix -40V variant for automotive applications. Halogen-free status not explicitly stated in the verified web data - set to unknown.
